Optocoupler plastic package mold

Abstract

The utility model discloses an optocoupler plastic package mold, which relates to the technical field of plastic package molds, and comprises an upper mold and a lower mold, the upper mold and the lower mold are respectively provided with an upper mold insert and a lower mold insert, the upper mold insert corresponds to the lower mold insert, the upper mold insert and the lower mold insert respectively comprise a material opening insert and a material barrel insert, the material opening insert and the material barrel insert are arranged in the middle of the upper mold body and the middle of the lower mold body respectively, the runner inserts, the sizing material position inserts and the chip containing inserts are sequentially arranged on the two sides of the material opening insert and the two sides of the material barrel insert from inside to outside, and the upper mounting disc and the lower mounting disc are installed outside the upper mold body and the lower mold body respectively. And a sealing assembly is arranged between the upper mounting disc and the lower mounting disc. According to the utility model, the overall precision of the die can be improved, the flatness of the upper die and the lower die is improved, the phenomenon of flash and flash of products in the production process is prevented, and the quality of the products is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of plastic encapsulation molds, in particular to an optocoupler plastic encapsulation mold. Background Art

[0002] An optocoupler plastic encapsulation mold is a mold used to manufacture optocoupler plastic encapsulation parts. During the manufacturing process of an optocoupler plastic encapsulation mold, precision machining equipment is required for processes such as cutting, drilling, milling, and electrical discharge machining to ensure the accuracy and quality of the mold. Most of the upper and lower die inserts of existing optocoupler plastic encapsulation molds are integral. Since the barrel position, rubber material position, runner position, ejector pin, and chip placement position are all on one insert, and the accuracy requirements for these positions are different, and their processing methods are also different, it is inconvenient to process them, it is difficult to ensure the flatness of the mold, and it is easy to cause a large gap when the upper and lower molds are combined, with poor sealing performance, and flash and overflow are likely to occur during the production process of the product, affecting the quality of the product. Content of the Utility Model

[0003] Aiming at the deficiencies of the prior art, the utility model provides an optocoupler plastic encapsulation mold, which solves the technical problems that the inserts of existing molds are not convenient for precise processing, it is difficult to ensure the flatness of the mold, and flash and overflow are likely to occur.

[0004] To solve the above technical problems, the utility model provides the following technical solutions: an optocoupler plastic encapsulation mold, including an upper mold and a lower mold, upper die inserts and lower die inserts are respectively arranged on the upper mold and the lower mold, and the upper die inserts and the lower die inserts correspond to each other. The upper die inserts and the lower die inserts respectively include a material port insert and a barrel insert. The material port insert and the barrel insert are respectively arranged at the central positions of the upper mold and the lower mold, and runner inserts, rubber material position inserts, and chip placement inserts are sequentially arranged on both sides of the material port insert and the barrel insert from the inside to the outside. Upper mounting plates and lower mounting plates are respectively installed outside the upper mold and the lower mold, and a sealing component is arranged between the upper mounting plate and the lower mounting plate.

[0005] Furthermore, both the upper die inserts and the lower die inserts include length positioning inserts, and the length positioning inserts are arranged at both ends of the runner inserts, rubber material position inserts, chip placement inserts, material port inserts, and barrel inserts.

[0006] Furthermore, the sealing component includes an insertion frame, the insertion frame is fixedly installed at the bottom of the upper mounting plate, an insertion slot for the insertion frame to insert is opened on the lower mounting plate, and a sealing strip is fixedly connected to the outer wall of the insertion frame.

[0007] Furthermore, an expansion cavity is opened inside the sealing strip, and an airbag is fixedly connected to the inner wall of the insertion frame.

[0008] Further, through holes are formed in the insertion frame, and air inlet holes communicating with the through holes are formed in both the airbag and the expansion cavity.

[0009] Further, a plurality of evenly distributed elastic pieces are arranged on the outer edge of the upper mounting disc, the lower ends of the elastic pieces are bent, and clamping grooves for mounting the elastic pieces are formed in the outer edge of the lower mounting disc.

[0010] By means of the above technical solutions, the present utility model provides an optocoupler plastic sealing mold, which at least has the following beneficial effects:

[0011] 1. By separately arranging the material inlet position, the barrel position, the runner position, the rubber material position and the chip placement position on multiple inserts, it is convenient to process them separately, making the mold inserts and the template easier to process, improving the overall precision of the mold, enhancing the flatness of the upper and lower molds, enabling the upper and lower molds to fit tightly when combined, and ensuring the quality of the product.

[0012] 2. By providing a sealing component, the connection between the upper mold and the lower mold can be sealed, improving the sealing performance of the equipment during plastic sealing, ensuring that the plastic material does not leak from the connection during the plastic sealing process, preventing the phenomenon of flash and overflow of the product during the production process, and further optimizing the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0014] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 is a schematic diagram of the structure of the lower mold of the present utility model;

[0016] Figure 3 is a schematic diagram of the structure of the upper mold of the present utility model;

[0017] Figure 4 is a schematic diagram of the structure of the upper mounting disc of the present utility model;

[0018] Figure 5 is a sectional view of the upper mounting disc and the lower mounting disc of the present utility model.

[0019] In the figure: 1. Upper mold; 2. Lower mold; 3. Upper mounting plate; 4. Lower mounting plate; 5. Sealing assembly; 51. Insertion frame; 52. Insertion slot; 53. Airbag; 54. Through hole; 55. Sealing strip; 56. Expansion cavity; 57. Air inlet hole; 61. Gate insert; 62. Barrel insert; 63. Runner insert; 64. Rubber material position insert; 65. Chip placement insert; 66. Length positioning insert; 7. Card slot; 8. Upper mold insert; 9. Lower mold insert; 10. Elastic sheet. Specific embodiments

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0021] Most of the upper and lower mold inserts of the existing optocoupler plastic packaging molds are integral. Since the barrel position, rubber material position, runner position, ejector pin and chip placement position are all on one insert, and the accuracy requirements of these positions are different and their processing methods are also different, it is inconvenient to process them, it is difficult to ensure the flatness of the mold, and it is easy to cause a large gap when the upper and lower molds are combined, resulting in poor sealing performance. Flash and overflow are likely to occur during the production process of the product, affecting the quality of the product.

[0022] To solve the defects existing in the above mold during use, please refer to Figures 1-5, a photocoupler plastic sealing mold provided by the utility model separately sets the material inlet, the barrel, the runner, the position of the rubber material and the position for placing the chip on multiple inserts, making the mold inserts and the template easier to process, improving the overall precision of the mold, ensuring the flatness of the upper and lower molds, enabling the upper and lower molds to fit tightly when combined, and sealing the connection between the upper and lower molds to prevent flash and overflow of materials during the production process, thus ensuring the quality of the product. This mold is based on the upper mold 1 and the lower mold 2. The upper mold 1 and the lower mold 2 are respectively provided with an upper mold insert 8 and a lower mold insert 9, and the upper mold insert 8 and the lower mold insert 9 correspond to each other. The upper mold insert 8 and the lower mold insert 9 respectively include a material inlet insert 61 and a barrel insert 62. The material inlet insert 61 and the barrel insert 62 are respectively arranged at the central positions of the upper mold 1 and the lower mold 2. The material inlet insert 61 is provided with a plurality of equally spaced upper film inlets, and the barrel insert 62 is provided with a plurality of equally spaced barrels. The plurality of barrels respectively correspond to the plurality of material inlets. And on both sides of the material inlet insert 61 and the barrel insert 62, runner inserts 63, rubber material position inserts 64, and chip placement inserts 65 are sequentially arranged from the inside to the outside. The positions of the material inlet, the barrel, the runner, the rubber material, and the chip placement can be respectively set on multiple inserts, which is convenient for separately processing them and easy to grasp the processing precision.

[0023] To ensure the stability of the splicing between the runner insert 63, the rubber material position insert 64, the chip placement insert 65, the material inlet insert 61, and the barrel insert 62, a length positioning insert 66 is also provided. The length positioning insert 66 is arranged at both ends of the runner insert 63, the rubber material position insert 64, the chip placement insert 65, the material inlet insert 61, and the barrel insert 62. The above-mentioned inserts are all arranged inside the length positioning insert 66, and through the length positioning insert 66, they can be formed into a whole to prevent displacement of each insert.

[0024] Since there is a gap between the upper mold 1 and the lower mold 2 when they are combined, there may still be a phenomenon of flash and overflow of materials during the production process. To solve this technical problem, an upper mounting plate 3 and a lower mounting plate 4 are respectively installed outside the upper mold 1 and the lower mold 2. The lower surface of the upper mold 1 is flush with the lower surface of the upper mounting plate 3, and the upper surface of the lower mold 2 is flush with the upper surface of the upper mounting plate 3. A sealing component 5 is arranged between the upper mounting plate 3 and the lower mounting plate 4. The sealing component 5 is used to seal the connection between the upper mold 1 and the lower mold 2, improving the sealing performance during the plastic sealing of the equipment, ensuring that the plastic material will not leak from the connection during the plastic sealing process, and further ensuring the quality of the product.

[0025] Refer to Figure 4 and Figure 5As shown in the figure, the insertion frame 51 is fixedly installed at the bottom of the upper mounting plate 3. The insertion frame 51 is set as a rectangular frame. An insertion slot 52 for inserting the insertion frame 51 is formed on the lower mounting plate 4. The insertion slot 52 is set as a rectangular groove. A sealing strip 55 is fixedly connected to the outer wall of the insertion frame 51. When the upper mold 1 and the lower mold 2 are combined, the upper mounting plate 3 and the lower mounting plate 4 are combined. The insertion frame 51 is inserted into the insertion slot 52, and the sealing strip 55 can seal the gap between the upper mounting plate 3 and the lower mounting plate 4.

[0026] To ensure the sealing effect of the sealing strip 55, an expansion cavity 56 is formed inside the sealing strip 55. An airbag 53 is fixedly connected to the inner wall of the insertion frame 51. The airbag 53 is filled with gas. And when the airbag 53 is in an inflated state, the sum of its width and the width of the insertion frame 51 is greater than the overall width of the insertion slot 52. A through hole 54 is formed on the insertion frame 51. Air inlet holes 57 communicating with the through hole 54 are formed on both the airbag 53 and the expansion cavity 56. When the insertion frame 51 is inserted into the insertion slot 52, the airbag 53 can be driven into the insertion slot 52. At this time, the airbag 53 is squeezed by the inner wall of the insertion slot 52, and the gas in the airbag 53 can enter the expansion cavity 56 through the through hole 54 and the air inlet holes 57 to cause the sealing strip 55 to expand. The expansion of the sealing strip 55 can fill the connection between the upper mounting plate 3 and the lower mounting plate 4, thereby realizing the sealing of the gap between the upper mold 1 and the lower mold 2.

[0027] To ensure the stability when the upper mold 1 and the lower mold 2 are combined and prevent them from being misaligned, a plurality of evenly distributed elastic pieces 10 are arranged on the outer edge of the upper mounting plate 3. The elastic pieces 10 have elasticity, and the lower ends of the elastic pieces 10 are bent. A slot 7 for installing the elastic pieces 10 is formed on the outer edge of the lower mounting plate 4. During the process of installing the upper mold 1 on the lower mold 2, the outer edge of the lower mounting plate 4 squeezes the elastic pieces 10 to cause them to deform. After the upper mold 1 and the lower mold 2 are combined, the elastic pieces 10 can be reset by their own elastic force and hooked in the slot 7 to prevent the upper mold 1 and the lower mold 2 from being misaligned and ensure the stability of the plastic sealing process.

[0028] It should be noted that in this article, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0029] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optocoupler plastic encapsulation mold, comprising an upper mold (1) and a lower mold (2), characterized in that: The upper mold (1) and the lower mold (2) are respectively provided with an upper mold insert (8) and a lower mold insert (9), and the upper mold insert (8) and the lower mold insert (9) correspond to each other. The upper mold insert (8) and the lower mold insert (9) respectively include a gate insert (61) and a barrel insert (62). The gate insert (61) and the barrel insert (62) are respectively arranged at the central positions of the upper mold (1) and the lower mold (2), and on both sides of the gate insert (61) and the barrel insert (62), runner inserts (63), rubber material position inserts (64), and chip placement inserts (65) are sequentially arranged from the inside to the outside. Upper mounting plates (3) and lower mounting plates (4) are respectively installed on the outsides of the upper mold (1) and the lower mold (2), and a sealing assembly (5) is arranged between the upper mounting plate (3) and the lower mounting plate (4).

2. The optocoupler plastic package mold according to claim 1, wherein: Both the upper mold insert (8) and the lower mold insert (9) include length positioning inserts (66), and the length positioning inserts (66) are arranged at both ends of the runner insert (63), the rubber material position insert (64), the chip placement insert (65), the gate insert (61), and the barrel insert (62).

3. The optocoupler plastic package mold according to claim 1, wherein: The sealing assembly (5) includes an insertion frame (51), the insertion frame (51) is fixedly installed at the bottom of the upper mounting plate (3), an insertion slot (52) for the insertion frame (51) to insert is formed on the lower mounting plate (4), and a sealing strip (55) is fixedly connected to the outer wall of the insertion frame (51).

4. The optocoupler plastic package mold according to claim 3, wherein: An expansion cavity (56) is formed inside the sealing strip (55), and an airbag (53) is fixedly connected to the inner wall of the insertion frame (51).

5. The optocoupler plastic encapsulation mold according to claim 4, wherein: A through hole (54) is formed on the insertion frame (51), and air inlets (57) communicating with the through hole (54) are formed on both the airbag (53) and the expansion cavity (56).

6. The optocoupler plastic package mold according to claim 1, wherein: A plurality of evenly distributed elastic pieces (10) are arranged on the outer edge of the upper mounting plate (3), the lower ends of the elastic pieces (10) are bent, and a card slot (7) for installing the elastic pieces (10) is formed on the outer edge of the lower mounting plate (4).

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