Semiconductor transfer box

Abstract

The utility model relates to the related technical field of semiconductors, in particular to a semiconductor transfer box which comprises a transfer box, a box cover is rotatably connected to the rear side surface of the transfer box, a storage groove is formed in the upper surface of the box cover, a handle is rotatably connected to the inner side surface of the storage groove, and a protection mechanism is arranged on the outer side surface of the transfer box. And a storage mechanism is arranged in the transfer box. Through the arrangement of the bottom plate, the connecting grooves, the splicing blocks, the storage plates and the placement grooves, when the semiconductor transfer device is used and a semiconductor needs to be transferred, the semiconductor is firstly placed in the placement grooves above the bottom plate, and then the storage plates are clamped into the connecting grooves through the splicing blocks, so that the storage plates are mounted above the bottom plate; and then the operation is repeated to continuously mount the storage plate into the transfer box, so that the semiconductors are limited, and the semiconductors are prevented from being damaged due to collision.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor transfer box body. Background Art

[0002] Semiconductors are used in fields such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, etc. For example, diodes are devices made of semiconductors, and semiconductor individuals are relatively small. Therefore, other storage containers are needed for transportation during the transfer process. Since semiconductors are electronic components, and even a little scratch may cause them to become unusable. Therefore, a semiconductor transfer box body is particularly needed.

[0003] Because the existing semiconductor transfer boxes do not have the effects of protection and separate storage, during transportation, the inside of the box may vibrate greatly due to collisions, resulting in collisions between semiconductors and making the semiconductors unusable, which is not conducive to protecting the semiconductors inside the box. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a semiconductor transfer box body to solve the problem that because the existing semiconductor transfer boxes do not have the effects of protection and separate storage, during transportation, the inside of the box may vibrate greatly due to collisions, resulting in collisions between semiconductors and making the semiconductors unusable, which is not conducive to protecting the semiconductors inside the box as mentioned in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A semiconductor transfer box body, including a transfer box, the rear surface of the transfer box is rotatably connected with a box cover, a storage groove is opened on the upper surface of the box cover, a handle is rotatably connected to the inner surface of the storage groove, a protection mechanism is arranged on the outer surface of the transfer box, and a storage mechanism is arranged inside the transfer box;

[0006] The protection mechanism includes a limit hole, a spring, a connecting column, a first protection plate and a second protection plate. Limit holes are opened on the outer surface of the transfer box, a spring is fixedly connected inside the limit hole, one end surface of the spring is fixedly connected with a connecting column, the front end surface of the connecting column is fixedly connected with a first protection plate, and the front end surface of the connecting column is fixedly connected with a second protection plate.

[0007] Preferably, the limit holes are equidistantly distributed on the peripheral surface of the transfer box, and the connecting column and the limit hole form a telescopic structure through the spring.

[0008] Preferably, the connecting columns are equidistantly distributed on the rear side surfaces of the first protection plate and the second protection plate, and the number and position thereof match those of the limit holes.

[0009] Preferably, the storage mechanism includes a bottom plate, a connection groove, a splicing block, a storage plate and a placement groove. The inner surface of the transfer box is fixedly connected with the bottom plate. A connection groove is formed on the upper surface of the bottom plate. The inner surface of the connection groove is snap-fitted with the splicing block. The upper end surface of the splicing block is fixedly connected with the storage plate. The storage plate and the upper surface of the bottom plate are provided with placement grooves.

[0010] Preferably, the placement grooves are equidistantly arranged on the upper surface of the bottom plate, and the placement grooves are equidistantly arranged on the upper surface of the storage plate.

[0011] Preferably, the outer wall size of the bottom plate matches the inner wall size of the transfer box, and the storage plate and the bottom plate form a snap-fitting structure through the connection groove and the splicing block.

[0012] Compared with the prior art, the beneficial effect of the present utility model is as follows: for this semiconductor transfer box body, through the settings of the bottom plate, the connection groove, the splicing block, the storage plate and the placement groove, when in use, when it is necessary to transfer semiconductors, first place the semiconductors inside the placement grooves on the upper surface of the bottom plate, and then snap the storage plate into the connection groove through the splicing block, so as to install the storage plate above the bottom plate. Then repeat this operation to continue installing the storage plate inside the transfer box to form a limit for the semiconductors, preventing them from being damaged due to collision;

[0013] Through the settings of the bottom plate, the connection groove, the splicing block, the storage plate and the placement groove, when in use, when it is necessary to transfer semiconductors, first place the semiconductors inside the placement grooves on the upper surface of the bottom plate, and then snap the storage plate into the connection groove through the splicing block, so as to install the storage plate above the bottom plate. Then repeat this operation to continue installing the storage plate inside the transfer box to form a limit for the semiconductors, preventing them from being damaged due to collision. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall external structure of the present utility model;

[0015] Figure 2 is a schematic diagram of the overall sectional structure of the present utility model;

[0016] Figure 3 is a schematic diagram of the protective mechanism structure of the present utility model;

[0017] Figure 4 is a schematic diagram of the structure of the bottom plate and the connection groove of the present utility model in cooperation;

[0018] Figure 5 is a schematic diagram of the structure of the splicing block and the storage plate of the present utility model in cooperation.

[0019] In the figure: 1, transfer box; 2, box cover; 3, storage groove; 4, handle; 5, protection mechanism; 501, limit hole; 502, spring; 503, connecting column; 504, first protection plate; 505, second protection plate; 6, storage mechanism; 601, bottom plate; 602, connecting groove; 603, splicing block; 604, storage plate; 605, placement groove. Detailed implementation manner

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figures 1-5 , the present invention provides a technical solution: a semiconductor transfer box body, including a transfer box 1, the rear side surface of the transfer box 1 is rotatably connected with a box cover 2, a storage groove 3 is opened on the upper surface of the box cover 2, a handle 4 is rotatably connected to the inner surface of the storage groove 3, a protection mechanism 5 is arranged on the outer surface of the transfer box 1, and a storage mechanism 6 is arranged inside the transfer box 1;

[0022] The protection mechanism 5 includes a limit hole 501, a spring 502, a connecting column 503, a first protection plate 504 and a second protection plate 505. Limit holes 501 are opened on the outer surface of the transfer box 1, a spring 502 is fixedly connected inside the limit hole 501, one end surface of the spring 502 is fixedly connected with a connecting column 503, the front end surface of the connecting column 503 is fixedly connected with a first protection plate 504, and the front end surface of the connecting column 503 is fixedly connected with a second protection plate 505. Through the settings of the limit hole 501, the spring 502, the connecting column 503, the first protection plate 504 and the second protection plate 505, when in use, when the transfer box 1 is slightly collided, first, the external force will evenly transfer the force to each connecting column 503 through the first protection plate 504 and the second protection plate 505, and then the connecting column 503 will transfer the force to the spring 502. In this process, part of the force will be dissipated, and the remaining part of the force will be dispersed, and then return by the spring 502 storing energy, so as to reduce the collision inside the transfer box 1.

[0023] Furthermore, the storage mechanism 6 includes a bottom plate 601, a connection groove 602, a splicing block 603, a storage plate 604, and a placement groove 605. The inner surface of the transfer box 1 is fixedly connected with the bottom plate 601. A connection groove 602 is formed on the upper surface of the bottom plate 601. The inner surface of the connection groove 602 is snap-connected with the splicing block 603. The upper end surface of the splicing block 603 is fixedly connected with the storage plate 604. Placement grooves 605 are formed on the upper surfaces of the storage plate 604 and the bottom plate 601. Through the settings of the bottom plate 601, the connection groove 602, the splicing block 603, the storage plate 604, and the placement groove 605, during use, when it is necessary to transfer semiconductors, first place the semiconductors in the placement groove 605 above the bottom plate 601, and then snap the storage plate 604 into the connection groove 602 through the splicing block 603, so as to install the storage plate 604 above the bottom plate 601. Then repeat this operation to continue installing the storage plate 604 inside the transfer box 1 to limit the semiconductors and prevent them from being damaged due to collision.

[0024] Furthermore, the limiting holes 501 are equally spaced on the peripheral surfaces of the transfer box 1. The connecting columns 503 and the limiting holes 501 form a telescopic structure through the springs 502. Through the setting of the limiting holes 501, the connecting columns 503 can be retracted into the limiting holes 501 when subjected to external forces.

[0025] Furthermore, the connecting columns 503 are equally spaced on the rear surfaces of the first protection plate 504 and the second protection plate 505 and are matched with the number and positions of the limiting holes 501. Through the setting of the connecting columns 503, the first protection plate 504 and the second protection plate 505 are installed on the peripheral surfaces of the transfer box 1.

[0026] Furthermore, the placement grooves 605 are equally spaced on the upper surface of the bottom plate 601, and the placement grooves 605 are equally spaced on the upper surface of the storage plate 604. Through the setting of the placement grooves 605, the semiconductors can be separately stored.

[0027] Furthermore, the outer wall dimensions of the bottom plate 601 match the inner wall dimensions of the transfer box 1. The storage plate 604 and the bottom plate 601 form a snap connection structure through the connection groove 602 and the splicing block 603. Through the setting of the bottom plate 601, the storage plate 604 can be installed.

[0028] Working principle: When it is necessary to transfer the semiconductor, first place the semiconductor inside the placement groove 605 above the bottom plate 601, and then snap the receiving plate 604 into the connection groove 602 through the splicing block 603, so as to install the receiving plate 604 above the bottom plate 601. Then repeat this operation to continue installing the receiving plate 604 inside the transfer box 1 to form a limit for the semiconductor and prevent it from being damaged due to collision. When it is necessary to transfer the semiconductor, first place the semiconductor inside the placement groove 605 above the bottom plate 601, and then snap the receiving plate 604 into the connection groove 602 through the splicing block 603, so as to install the receiving plate 604 above the bottom plate 601. Then repeat this operation to continue installing the receiving plate 604 inside the transfer box 1 to form a limit for the semiconductor and prevent it from being damaged due to collision.

[0029] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor transfer box, comprising a transfer box (1), characterized in that: The rear side surface of the transfer box (1) is rotatably connected with a box cover (2). The upper surface of the box cover (2) is provided with a storage groove (3). The inner surface of the storage groove (3) is rotatably connected with a handle (4). A protection mechanism (5) is arranged on the outer surface of the transfer box (1), and a storage mechanism (6) is arranged inside the transfer box (1). The protection mechanism (5) includes a limit hole (501), a spring (502), a connecting column (503), a first protection plate (504) and a second protection plate (505). Limit holes (501) are opened on the outer surface of the transfer box (1). A spring (502) is fixedly connected inside the limit hole (501). One end surface of the spring (502) is fixedly connected with a connecting column (503). The front end surface of the connecting column (503) is fixedly connected with a first protection plate (504), and the front end surface of the connecting column (503) is fixedly connected with a second protection plate (505).

2. The semiconductor transfer box according to claim 1, wherein: The limit holes (501) are equidistantly distributed on the peripheral surface of the transfer box (1). The connecting column (503) and the limit hole (501) form a telescopic structure through the spring (502).

3. A semiconductor transfer box according to claim 1, characterized in that: The connecting columns (503) are equidistantly distributed on the rear side surfaces of the first protection plate (504) and the second protection plate (505), and the quantity and position are matched with those of the limit holes (501).

4. A semiconductor transfer box according to claim 1, characterized in that: The storage mechanism (6) includes a bottom plate (601), a connecting groove (602), a splicing block (603), a storage plate (604) and a placement groove (605). The inner surface of the transfer box (1) is fixedly connected with a bottom plate (601). A connecting groove (602) is opened on the upper surface of the bottom plate (601). The inner surface of the connecting groove (602) is snap-connected with a splicing block (603). The upper end surface of the splicing block (603) is fixedly connected with a storage plate (604). Placement grooves (605) are opened on the upper surface of the storage plate (604) and the upper surface of the bottom plate (601).

5. A semiconductor transfer box according to claim 4, characterized in that: The placement grooves (605) are equidistantly opened on the upper surface of the bottom plate (601), and the placement grooves (605) are equidistantly opened on the upper surface of the storage plate (604).

6. A semiconductor transfer box according to claim 4, characterized in that: The outer wall size of the bottom plate (601) is matched with the inner wall size of the transfer box (1). The storage plate (604) and the bottom plate (601) form a snap structure through the connecting groove (602) and the splicing block (603).

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