Base material batch conveying device for chip processing

Abstract

The utility model relates to the technical field of chip production equipment, in particular to a base material batch conveying device for chip processing, which comprises an optical production platform, a vertical feeding module and a horizontal feeding module are arranged on the optical production platform, a bearing plate is arranged on the vertical feeding module, a plurality of guide station grooves are horizontally arranged on the bearing plate, and the horizontal feeding module is arranged on the bearing plate. A conveying plate in sliding connection with the guide station grooves is arranged in each guide station groove, a plurality of material clamps used for clamping chip base materials are arranged on the conveying plates, and a production positioning mechanism composed of an upper plate body, a lower plate body and a fixing plate used for connecting the upper plate body and the lower plate body is arranged on one side of the bearing plate, linear grooves are formed in the opposite faces of the upper plate body and the lower plate body, a containing groove used for containing a conveying plate pushed by the horizontal feeding module is formed between the two linear grooves, and during chip machining, automatic batch conveying of chip base materials is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production equipment, in particular to a substrate batch conveying device used for chip processing. Background Art

[0002] Molecular Imprinting Technology (MIT) is the process of preparing polymers with selective binding sites for the target molecules to be detected. Its specific implementation is completed by the following method: the template molecule is connected with the functional monomer through weak interaction forces in the presence of a porogen to form a host-guest complex. After adding a crosslinker and an initiator, the monomer polymerization is initiated by light or heat, so that the host-guest complex and the crosslinker are copolymerized by free radicals around the template molecule to form a highly cross-linked rigid polymer; then, a certain method is used to elute or dissociate the template molecule from the polymer, leaving a three-dimensional hole with a specific "memory" function for the template molecule. This hole can specifically bind to the template molecule, that is, it has a specific recognition effect on the template. Molecular imprinting technology has three characteristics: structure-activity predetermination, specific recognition, and wide applicability. In addition, the raw materials are cheap and easy to obtain, the preparation conditions are mild, the reaction time is short, and it is clean and pollution-free. At the same time, it has the advantages of simple operation, resistance to harsh environments, low energy consumption, easy handling and application, uniform preparation, and good stability.

[0003] Surface Plasmon Resonance (SPR) is a physical optical phenomenon. The principle of SPR sensor to detect analytes bound to the metal surface is: when light is incident from a dense medium into a sparse medium at an angle greater than the critical angle, total internal reflection occurs at the interface. At this time, the totally reflected light does not disappear immediately, but penetrates into the sparse medium to a certain depth, and its amplitude decays exponentially with depth. This electromagnetic wave is called a vanishing wave. When the incident angle or wavelength is a certain appropriate value, the frequency and wave number of the surface plasmon are equal to the vanishing wave, and the two resonate at the interface between the metal film and the solution. The incident light is absorbed, causing the energy of the reflected light to drop sharply, and a minimum reflection intensity appears on the reflection spectrum. When the refractive index of the medium close to the surface of the metal film changes, the position of the resonance peak will be different.

[0004] In the past decade or so, the research on sensors based on the SPR principle and their applications has achieved remarkable development. Compared with conventional detection techniques, SPR sensors have the advantages of simple and fast detection process, high sensitivity, no need for labeling, maintaining molecular activity, small sample requirement, no need for sample pretreatment, and can be used to detect in turbid or even opaque solutions. They also have the outstanding advantages of fast response, small size, high mechanical strength, ability to obtain real-time data, convenient operation, strong anti-electromagnetic interference ability, and can realize remote data acquisition and continuous on-line monitoring when connected with optical fibers.

[0005] Currently, methods for fabricating chemical sensing chips by combining SPR and MIT technologies have been reported. However, there are few reports on the related equipment for mass production of chemical sensing chips to achieve industrialization of chemical sensing chips. Based on this, a device for batch conveying of substrates for chip processing is provided. Summary of the Invention

[0006] Aiming at the deficiencies of the above-mentioned existing technologies, a device for batch conveying of substrates for chip processing is provided, which realizes automatic batch conveying of chip substrates during chip processing.

[0007] To solve the above technical problems, the technical solution adopted by the present utility model is a device for batch conveying of substrates for chip processing, including an optical production platform. On the optical production platform, there are a vertical loading module and a horizontal feeding module. On the vertical loading module, there is a carrier plate. Horizontally arranged on the carrier plate are a plurality of guiding station grooves. In each guiding station groove, there is a conveying plate slidably connected to the guiding station groove. On the conveying plate, there are a plurality of material clamps for clamping chip substrates. On one side of the carrier plate, there is a production positioning mechanism composed of a corresponding upper plate body, a lower plate body, and a fixing plate for connecting the two. Linear grooves are opened on the opposite surfaces of the upper plate body and the lower plate body. An accommodating groove for accommodating the conveying plate pushed by the horizontal feeding module is formed between the two linear grooves. It also includes a controller.

[0008] For the above-mentioned device for batch conveying of substrates for chip processing, the vertical loading module includes a first bracket. At the top and bottom of the first bracket, a first driving motor and a first bearing are respectively provided. Between the first driving motor and the first bearing, there is a first lead screw for connecting the two. Along the height direction of the first bracket, a first slide rail is provided. On the first slide rail, there is a first slider. On the first slider, there is a first driving block having a first screw hole for cooperating with the first lead screw. On the surface of the first slider, there is a first driving plate. The carrier plate is arranged on the first driving plate. The first driving motor is in signal connection with the controller.

[0009] The above-mentioned substrate batch conveying device for chip processing, the horizontal feeding module includes two correspondingly arranged second brackets, and a connecting plate arranged on the tops of the two second brackets for connecting the two. A second driving motor and a second bearing are respectively arranged at both ends of the connecting plate. A second lead screw for connecting the two is arranged between the second driving motor and the second bearing. A second slide rail is arranged along the length direction of the connecting plate. A second slider is arranged on the second slide rail. A second screw hole for cooperating with the second lead screw is arranged on the second slider. A pushing block for pushing the conveying plate is arranged on the second slider. The second driving motor is in signal connection with the controller.

[0010] The above-mentioned substrate batch conveying device for chip processing, a reciprocating electric cylinder is arranged at one end of the production positioning mechanism. A blocking rod for blocking the conveying plate is arranged on the reciprocating electric cylinder. The reciprocating electric cylinder is in signal connection with the controller.

[0011] The above-mentioned substrate batch conveying device for chip processing, a positioning groove for accommodating the material clamp is arranged on the conveying plate. The material clamp includes a chip substrate bearing plate correspondingly arranged in the positioning groove. A positioning groove for accommodating the material clamp is arranged on the conveying plate. The material clamp includes a chip substrate bearing plate correspondingly arranged in the positioning groove. A bearing groove adapted to the chip substrate is opened on the chip substrate bearing plate. Fixed clamping plates and telescopic clamping plates are respectively arranged on both sides of the bearing groove. The telescopic clamping plate includes a fixed base and a sliding clamp arranged on the fixed base. A compression spring for driving the sliding clamp is arranged in the fixed base. A guiding and positioning pin is arranged between the sliding clamp and the fixed base. Connecting screws for connecting the chip substrate bearing plate and the conveying plate are arranged on both sides of the chip substrate bearing plate.

[0012] The above-mentioned substrate batch conveying device for chip processing, a discharging plate is inclinedly arranged on one side of the production positioning mechanism.

[0013] The beneficial effect of the substrate batch conveying device for chip processing of the present utility model is that the sensing chip assembly is composed of an optical prism and a metal film, a self-assembled film, and a molecularly imprinted polymer film plated thereon in sequence from bottom to top. The device realizes the automatic batch conveying of the chip substrate by arranging a vertical feeding module and a horizontal feeding module on the optical production platform and conveying the conveying plates with multiple material clamps one by one. Since multiple material clamps for clamping the chip substrate are arranged on each conveying plate. Description of the Drawings

[0014] Figure 1 is a structural schematic diagram of the present utility model;

[0015] Figure 2 is a structural schematic diagram of the horizontal feeding module;

[0016] Figure 3 It is a schematic structural diagram of the vertical feeding module;

[0017] Figure 4 It is a schematic structural diagram of the upper plate body;

[0018] Figure 5 It is a schematic structural diagram of the lower plate body;

[0019] Figure 6 It is a schematic structural diagram of a reciprocating electric cylinder arranged on the fixed plate;

[0020] Figure 7 It is a schematic structural diagram of the carrier plate;

[0021] Figure 8 It is a schematic structural diagram of the conveying plate;

[0022] Figure 9 It is a schematic structural diagram of the material clamp. Specific embodiments

[0023] The following will describe the present invention in detail with reference to the accompanying drawings and specific embodiments.

[0024] As Figures 1-9 shown, a substrate batch conveying device for chip processing includes an optical production platform 1, a vertical feeding module and a horizontal feeding module are arranged on the optical production platform. A carrier plate 2 is arranged on the vertical feeding module, and a plurality of guiding station grooves 3 are horizontally arranged on the carrier plate. A conveying plate 4 slidably connected to the guiding station groove 3 is arranged in each guiding station groove 3. A plurality of material clamps for clamping the chip substrate are arranged on the conveying plate 4. A production positioning mechanism composed of a corresponding upper plate body 5, a lower plate body 6 and a fixing plate 22 for connecting the two is arranged on one side of the carrier plate 2. Linear grooves 7 are formed on the opposite surfaces of the upper plate body 5 and the lower plate body 6, and an accommodating groove for accommodating the conveying plate 4 pushed by the horizontal feeding module is formed between the two linear grooves 7. It also includes a controller. The controller is a PLC.

[0025] The vertical feeding module includes a first bracket 8. A first driving motor 9 and a first bearing are respectively arranged at the top and bottom of the first bracket 8. A first lead screw 10 for connecting the two is arranged between the first driving motor 9 and the first bearing. A first slide rail 11 is arranged along the height direction of the first bracket 8. A first slider 12 is arranged on the first slide rail 11. A first driving block having a first screw hole for cooperating with the first lead screw is arranged on the first slider 12. A first driving plate 13 is arranged on the surface of the first slider 12. The carrier plate 2 is arranged on the first driving plate 13. The first driving motor 9 is signal-connected to the controller.

[0026] The horizontal feeding module includes two correspondingly arranged second brackets 14, and a connecting plate 15 arranged on the tops of the two second brackets 14 for connecting the two. A second driving motor 16 and a second bearing are respectively arranged at both ends of the connecting plate 15. A second lead screw 17 for connecting the two is arranged between the second driving motor 16 and the second bearing. A second slide rail is arranged along the length direction of the connecting plate 15. A second slider 18 is arranged on the second slide rail. A second screw hole for cooperating with the second lead screw 17 is arranged on the second slider 18. A pushing block 19 for pushing the conveying plate is arranged on the second slider 18. The second driving motor 16 is in signal connection with the controller.

[0027] A reciprocating electric cylinder 20 is arranged at one end of the production positioning mechanism. A blocking rod 23 for blocking the conveying plate 4 is arranged on the reciprocating electric cylinder 20. The reciprocating electric cylinder 23 is in signal connection with the controller, which is convenient for quickly positioning the conveying plate.

[0028] A positioning groove 24 for accommodating the material clamp is arranged on the conveying plate 4. The material clamp includes a chip substrate bearing plate 25 correspondingly arranged in the positioning groove 24. A bearing groove adapted to the chip substrate is opened on the chip substrate bearing plate 25. A fixed clamping plate 26 and a telescopic clamping plate are respectively arranged on both sides of the bearing groove. The telescopic clamping plate includes a fixed base 27 and a sliding clamp 28 arranged on the fixed base 27. A compression spring for driving the sliding clamp 28 is arranged in the fixed base 27. A guiding and positioning pin 29 is arranged between the sliding clamp 28 and the fixed base 27. Connecting screws for connecting the chip substrate bearing plate 25 and the conveying plate 4 are arranged on both sides of the chip substrate bearing plate 25.

[0029] The working process of a substrate batch conveying device for chip processing according to the present utility model is as follows: An operator fixes multiple groups of chip substrates to be prepared through the material clamps on the conveying plate. The vertical feeding module drives the bearing plate to move vertically to a specified position, so that the material clamps on the bearing plate are aligned with the accommodating grooves. The horizontal feeding mechanism pushes the conveying plate 4 into the accommodating grooves. A light-transmitting hole is arranged on the conveying plate 4, which is convenient for performing MIT preparation on the chip substrate.

[0030] After the production and preparation are completed, the horizontal feeding module continues to horizontally push the prepared chips to the receiving component. The receiving component is a discharge plate obliquely arranged on the optical production platform. The operator collects and transfers the successfully prepared chips to the next process to complete the entire operation process. After the horizontal feeding module horizontally pushes the prepared chips to the receiving component, the horizontal feeding module resets. The vertical feeding module drives the bearing plate to move vertically again, so that the next conveying plate on the bearing plate is aligned with the accommodating groove. The horizontal feeding module runs again, realizing the one-by-one conveying of the conveying plates. Since each conveying plate is provided with material clamps for clamping multiple chip substrates, the automatic batch production of chips is realized, and the technical problem of difficult industrialization of chip batch production is solved.

[0031] Certainly, the above description is not a limitation to the present utility model, nor is the present utility model limited to the above examples. Changes, modifications, additions or substitutions made by those of ordinary skill in the art within the scope of the essence of the present utility model shall also fall within the protection scope of the present utility model.

Claims

1. A substrate batch conveying device for chip processing, comprising an optical production platform, characterized in that: On an optical production platform, there is a vertical loading module and a horizontal feeding module. On the vertical loading module, there is a carrier plate. Horizontally arranged on the carrier plate are a plurality of guiding working slots. In each guiding working slot, there is a conveying plate slidably connected to the guiding working slot. On the conveying plate, there are a plurality of material clamps for clamping a chip substrate. On one side of the carrier plate, there is a production positioning mechanism composed of a corresponding upper plate body, a lower plate body, and a fixing plate for connecting the two. Linear slots are opened on the opposite surfaces of the upper plate body and the lower plate body. An accommodating slot for accommodating the conveying plate pushed by the horizontal feeding module is formed between the two linear slots. There is also a controller.

2. The batch conveying device for a substrate used in chip processing according to claim 1, characterized in that, The vertical loading module includes a first support. At the top and bottom of the first support, a first driving motor and a first bearing are respectively provided. Between the first driving motor and the first bearing, there is a first lead screw for connecting the two. Along the height direction of the first support, there is a first slide rail. On the first slide rail, there is a first slider. On the first slider, there is a first driving block having a first screw hole for cooperating with the first lead screw. On the surface of the first slider, there is a first driving plate. The carrier plate is arranged on the first driving plate. The first driving motor is in signal connection with the controller.

3. A batch conveying device for a substrate used in chip processing according to claim 2, characterized in that, The horizontal feeding module includes two correspondingly arranged second supports, and a connecting plate arranged on the tops of the two second supports for connecting the two. At the two ends of the connecting plate, a second driving motor and a second bearing are respectively provided. Between the second driving motor and the second bearing, there is a second lead screw for connecting the two. Along the length direction of the connecting plate, there is a second slide rail. On the second slide rail, there is a second slider. On the second slider, there is a second screw hole for cooperating with the second lead screw. On the second slider, there is a push block for pushing the conveying plate. The second driving motor is in signal connection with the controller.

4. A batch conveying device for a substrate used in chip processing according to claim 3, characterized in that, in One end of the production positioning mechanism is provided with a reciprocating electric cylinder. On the reciprocating electric cylinder, there is a blocking rod for blocking the conveying plate. The reciprocating electric cylinder is in signal connection with the controller.

5. A batch conveying device for a substrate used in chip processing according to claim 4, characterized in that, On the conveying plate, there are positioning slots for accommodating the material clamps. The material clamp includes a chip substrate carrier plate correspondingly arranged in the positioning slot. On the chip substrate carrier plate, there is a carrying slot adapted to the chip substrate. On both sides of the carrying slot, there are respectively a fixed clamping plate and a telescopic clamping plate. The telescopic clamping plate includes a fixed base and a sliding clamp arranged on the fixed base. In the fixed base, there is a compression spring for driving the sliding clamp. Between the sliding clamp and the fixed base, there is a guiding positioning pin. On both sides of the chip substrate carrier plate, there are connecting screws for connecting the chip substrate carrier plate and the conveying plate.

6. A substrate batch conveying device for chip processing according to claim 5, characterized in that, On one side of the production positioning mechanism, there is an inclined discharging plate.

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