Carrier and deposition equipment

Abstract

The utility model discloses a carrier and deposition equipment. The carrier comprises a carrier main body, a heating plate and a slide glass boat. The carrier body is provided with a mounting cavity. The heating plate is mounted on the carrier body. And the slide glass boat is detachably placed in the mounting cavity. The slide glass boat is provided with a containing cavity used for containing a substrate, and the slide glass boat is used for covering at least one face of the substrate. Wherein the heating plate is opposite to one side of the slide glass boat and is arranged at an interval, and an airflow channel is formed between the heating plate and the slide glass boat; the carrier body is provided with an air inlet and an air outlet, and the air flow channel communicates with the air inlet and the air outlet. By means of the mode, the surface needing to be coated can be conveniently heated and coated.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and particularly to a carrier and a deposition apparatus. Background Art

[0002] In the semiconductor field, a whole wafer can be cut into half wafers or multiple small wafers. There are serious surface defects on the cut surface, and surface treatment is required to reduce the charge recombination on the cut surface. In the related art, the surface defects after cutting are improved by heating the stacked wafers and then coating them for passivation. However, the related equipment heats the entire wafer. If the cut surface needs to be heated to the process temperature, a long preheating and heat conduction process is required. Summary of the Utility Model

[0003] Embodiments of the present application provide a carrier and a deposition apparatus, which can conveniently heat and coat the surface to be coated.

[0004] In a first aspect, an embodiment of the present application provides a carrier. The carrier includes a carrier body, a heating plate, and a wafer boat. The carrier body has an installation cavity. The heating plate is installed on the carrier body. The wafer boat is detachably placed in the installation cavity. The wafer boat has a receiving cavity for accommodating a wafer, and the wafer boat is used to cover at least one side of the wafer. Wherein, the heating plate is opposite to and spaced from one side of the wafer boat, and an air flow channel is formed between the heating plate and the wafer boat; the carrier body has an air inlet and an air outlet, and the air flow channel communicates with the air inlet and the air outlet.

[0005] Optionally, at least one side of the wafer boat is open for at least one side of the wafer to be exposed;

[0006] At least one side of the wafer boat with an opening is correspondingly arranged with the heating plate to form an air flow channel;

[0007] Alternatively, multiple sides of the wafer boat with openings are correspondingly arranged with the heating plate one by one to form multiple air flow channels, and the air flow channels are in parallel or in series.

[0008] Optionally, the wafer boat has a receiving cavity with one end open for accommodating a wafer. The wafers in the wafer boat are stacked, and the side to be coated of the stacked wafers is exposed to the air flow channel from the opening, and the other sides of the stacked wafers are covered by the wafer boat.

[0009] Optionally, the carrier body includes a bottom plate and stoppers. At least two stoppers are oppositely arranged on both sides of the bottom plate; the stoppers and the bottom plate enclose to form an installation cavity; the heating plate is installed on the bottom plate, and an air inlet and an air outlet are respectively formed at intervals between the heating plate and the stoppers on both sides.

[0010] Optionally, the air inlet, the air flow channel, and the air outlet are arranged on the same axis. The side of the wafer carrier facing the heating plate is exposed in the air flow channel, and the other sides of the wafer carrier are shielded by the carrier body.

[0011] Optionally, the wafer carrier, the heating plate, and the air inlet, the air flow channel, and the air outlet form a process unit, and a plurality of process units are arranged in the extending direction of the air flow channel or perpendicular to the extending direction of the air flow channel.

[0012] Optionally, two adjacent process units share the same heating plate, and the process units are symmetrically arranged with the heating plate as the axis.

[0013] Optionally, at least two electrode feeding parts are arranged at intervals in the part of the carrier body corresponding to the heating plate, and the two electrode feeding parts are electrically connected to the heating plate.

[0014] Optionally, flow equalizing plates are arranged at the air inlet and the air outlet.

[0015] Optionally, a plurality of wafer carriers are arranged in the installation cavity, and the wafer carriers and the heating plate form a plurality of air flow channels, and the air flow channels are connected in series and / or in parallel.

[0016] In a second aspect, an embodiment of the present application provides a deposition device. The deposition device includes a device main body, a door body, and the foregoing carrier. A process cavity is formed by enclosing the device main body and the door body; the carrier is detachably placed in the process cavity, and the deposition device includes an air inlet channel and an air outlet channel, and the air inlet channel is correspondingly arranged with the air inlet, and the air outlet channel is correspondingly arranged with the air outlet.

[0017] Optionally, the door body is provided with a spray array, the spray array is correspondingly arranged with the air inlet, the device main body is provided with a diversion channel, and when the door body and the device main body are closed and matched, the diversion channel communicates with the spray array, and the diversion channel and the spray array form the air inlet channel.

[0018] Optionally, a boss is formed on the door body facing the device main body, and the spray array is arranged on the boss.

[0019] Optionally, at least two electrode feeding parts are arranged at intervals in the part of the carrier body corresponding to the heating plate in the carrier, and the two electrode feeding parts are electrically connected to the heating plate;

[0020] Electrodes are arranged at intervals in the process cavity, and the electrodes are correspondingly arranged with the electrode feeding parts;

[0021] Wherein, the electrode feeding parts and the electrodes are arranged at intervals in the direction of the door body facing the device main body; the electrodes are used to feed current to the carrier.

[0022] Optionally, a plurality of carriers are arranged in the process cavity, and the air flow channels in adjacent carriers are connected in series and / or in parallel.

[0023] The beneficial effects of the present application are as follows: Different from the prior art, the vehicle can be detachably placed in the deposition equipment for thin film deposition, and the deposition equipment can feed current to the vehicle and pass process gas through the inlet and outlet of the vehicle. By arranging the heating plate opposite to and spaced from one side of the wafer boat, on the one hand, the heating plate can centrally heat one side of the wafer boat, so that the side of the substrate to be coated can be centrally heated, thereby reducing the time required for preheating and heat conduction; on the other hand, the air flow channel formed by the interval between the heating plate and the wafer boat can allow the process gas to flow through, so that the side of the wafer boat facing the heating plate can contact the process gas, so that the surface of the substrate to be coated can interact with the process gas, achieving the effect of coating passivation. Description of the Drawings

[0024] Figure 1 is a schematic structural diagram of an embodiment of the deposition equipment of the present application;

[0025] Figure 2 is Figure 1 a cross-sectional structural schematic diagram of the deposition equipment shown;

[0026] Figure 3 is Figure 1 an exploded structural schematic diagram of the vehicle in the deposition equipment shown;

[0027] Figure 4 is Figure 1 a schematic diagram of the cross-sectional structure of the deposition equipment shown;

[0028] Figure 5 is Figure 4 an enlarged structural schematic diagram of part A of the deposition equipment shown;

[0029] Figure 6 is Figure 1 a schematic diagram of the structure of the spray array in the door body of the deposition equipment shown.

[0030] Reference Signs:

[0031] Deposition equipment, 1; Equipment main body, 11; Electrode, 111; Flow guide channel, 112; Process cavity, 113; Substrate, 2; Door body, 12; Spray array, 121; Vehicle, 13; Installation cavity, 130; Bottom plate, 131; Stopper, 132; Side plate, 133; Heating plate, 134; Wafer boat, 135; Inlet, 136; Outlet, 137; Air flow channel, 138; Flow equalizing plate, 139; Electrode feeding part, 140. Detailed Embodiments

[0032] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present application.

[0033] In the field of semiconductor technology, for example, in the photovoltaic field, a whole piece of battery (i.e., a substrate, or a solar cell) can be cut into half pieces or multiple small pieces of cells. The small piece of cells has the characteristic of high component voltage. Generally, the laser cutting method is used to cut the cell, and the cutting surface forms an exposed surface. However, due to more defects on the surface of the bare silicon, the charge recombination on the surface of the bare silicon is serious, which affects the lifetime of the minority carriers and thus affects the efficiency of the battery, and further affects the power generation power of the component.

[0034] In the related art, after laser cutting the finished battery, passivation films such as alumina or silicon nitride are used to passivate the cutting surface, so as to reduce the charge recombination on the cutting surface. Generally, the passivation coating on the cutting surface is carried out by the lamination method. The cut substrates are stacked together and placed in a lamination tooling to deposit the coating on the cutting surface.

[0035] For the existing deposition equipment, due to the large number of stacked silicon wafers, the heat conduction is slow, and the reaction of the deposition process requires a sufficient temperature on the substrate. In the existing deposition equipment, preheating is carried out in the cavity before the process, usually requiring a large amount of time for preheating. And during the preheating process, the surface temperature of the cutting surface continuously conducts to the cold end part behind the cutting surface, resulting in the temperature of the cutting surface always being lower than the set temperature of the machine (i.e., the temperature preset by the process), and it takes a long time to reach the process preset temperature. Therefore, if the preheating time in the cavity is insufficient, the carrier boat will be in an uneven state, resulting in uneven coating during the deposition of the passivation film. At the same time, due to the large gap between the cutting surface and the external cavity, when the reaction source (i.e., the process gas) passes through the cutting surface, it does not pass through parallelly, resulting in the phenomenon of overcoating (the abnormal coating color phenomenon caused by the abnormal coating method), and there are also problems such as low cavity space utilization rate and complex structure.

[0036] In a vacuum coating device of the related art, when performing edge coating, the following technical problems exist: First, under the existing process conditions, due to the slow heat conduction of the wafer boat, the process chamber is relatively large, and the heating plates are distributed around the process chamber. Therefore, it takes a long time for the wafer boat to reach the process-required temperature, and the heat is unevenly distributed. If the preheating time is short, the surface of the laminated cutting surface cannot reach the process-preset temperature, resulting in poor quality of the deposited passivation film. Second, in order to meet the heating requirements, the existing process chamber is provided with an inner cavity and an outer cavity, and the structure is relatively complex. The heating plates are distributed around the inner cavity and are far from the position where coating is required, resulting in low heating efficiency. To improve the above technical problems, the present application can provide the following embodiments.

[0037] Combined with Figure 1 , an embodiment of the present application provides a deposition device 1. The deposition device 1 includes a device main body 11, a door body 12, and a carrier 13. The device main body 11 and the door body 12 enclose to form a process chamber 113. The carrier 13 is detachably placed in the process chamber 113. On the one hand, the deposition device 1 can feed current into the carrier 13, and on the other hand, it can introduce process gas into the carrier 13. The carrier 13 of the present application will be introduced exemplarily below.

[0038] Combined with Figure 2 and Figure 3 , an embodiment of the present application provides a carrier 13. The carrier 13 includes a carrier main body, a heating plate 134, and a wafer boat 135. The carrier main body has an installation cavity 130. The heating plate 134 is installed on the carrier main body. The wafer boat 135 is detachably placed in the installation cavity 130. The wafer boat 135 can be used to place the substrate 2. The wafer boat 135 has a receiving cavity for accommodating the substrate 2. The substrates 2 can be stacked in the wafer boat 135. And the wafer boat 135 allows the part of the substrate 2 that needs to be coated to be exposed. The wafer boat 135 is detachably engaged with the carrier 13. The wafer boat 135 is used to cover at least one side of the substrate 2. The wafer boat 135 can be detached from the carrier 13 to place or take out the substrate 2, and then placed into the installation cavity 130 again. The heating plate 134 can heat the part of the substrate 2 that needs to be coated, so as to heat the substrate 2 to the preset process temperature.

[0039] Wherein, the heating plate 134 is opposite to and spaced from one side of the wafer boat 135, and an air flow channel 138 is formed between the heating plate 134 and the wafer boat 135. The carrier main body has an air inlet 136 and an air outlet 137, and the air flow channel 138 communicates with the air inlet 136 and the air outlet 137. The deposition device 1 includes an air inlet channel and an air outlet channel, the air inlet channel is correspondingly arranged with the air inlet 136, and the air outlet channel is correspondingly arranged with the air outlet 137.

[0040] The heating plate 134 is disposed opposite to and spaced from the wafer boat 135. On the one hand, the heating plate 134 can concentrate the heating on one side of the wafer boat 135. The side of the substrate 2 to be coated can be exposed on the side of the wafer boat 135 opposite to the heating plate 134, so that the heating plate 134 can concentrate the heating on the side of the substrate 2 to be coated. On the other hand, the heating plate 134 can form an air flow channel 138 with the wafer boat 135 at an interval for the process gas to flow through, so that the process gas can directly flow through the surface of the substrate 2 to be coated evenly and parallelly.

[0041] In some embodiments, at least one side of the wafer boat 135 is open, and the opening can expose at least one side of the substrate 2 in the installation cavity, so that the heating plate 134 can perform targeted heating on the substrate 2. In some embodiments, at least one side of the wafer boat 135 with an opening is correspondingly arranged with the heating plate 134 to form an air flow channel 138. In other embodiments, multiple sides of the wafer boat 135 with openings are correspondingly arranged with the heating plate 134 one by one to form multiple air flow channels 138, and the air flow channels 138 are in parallel and / or in series.

[0042] In some embodiments, flow equalizing plates 139 are provided at the air inlet 136 and the air outlet 137. The flow equalizing plates 139 can increase the uniformity of the process gas entering the air flow channel 138, thereby increasing the uniformity of the coating.

[0043] In some embodiments, the air inlet 136, the air flow channel 138 and the air outlet 137 are arranged on the same axis, so that the process gas can flow through the substrate 2 in parallel. Optionally, the axis where the air inlet 136, the air flow channel 138 and the air outlet 137 are located is parallel to the side of the heating plate 134 and the wafer boat 135 facing the heating plate 134. Optionally, the axis where the air inlet 136, the air flow channel 138 and the air outlet 137 are located is parallel to the plane where the side of the substrate 2 to be coated is located.

[0044] In some embodiments, the air inlet 136 and the air outlet 137 are square, and the shapes of the air inlet 136 and the air outlet 137 are the same as the shape of the projection of the air flow channel 138. Optionally, the projections of the air inlet 136, the air flow channel 138 and the air outlet 137 coincide along the air axis. By the above method, the process gas can further flow through the substrate 2 evenly and parallelly.

[0045] In some embodiments, the air inlet 136, the air flow channel 138, and the air outlet 137 are arranged on the same axis. The side of the wafer boat 135 facing the heating plate 134 is exposed in the air flow channel 138, and the other sides of the wafer boat 135 are shielded by the carrier body. In this way, the flow of the gas in the deposition device 1 can be restricted to the air inlet 136, the air flow channel 138, and the air outlet 137, reducing the flow of process gas through other parts.

[0046] In some embodiments, the wafer boat 135 has a receiving cavity with one end open, and the receiving cavity is used to receive the substrate 2. The substrates 2 in the wafer boat 135 are stacked, and the sides of the stacked substrates 2 to be coated are exposed to the air flow channel 138 from the opening. The other surfaces of the stacked substrates 2 are covered by the wafer boat 135. The cutting surfaces of the substrates 2 need to be passivated, and the other surfaces of the substrates 2 do not need to be coated. When process gas also flows through the other surfaces, it is easy to produce unexpected coatings, such as overcoating or the atomic layer deposition coating that should have been transformed into a chemical vapor deposition coating. By providing the wafer boat 135, on the one hand, the cutting surfaces of the substrates 2 that need to be coated can be exposed; on the other hand, the surfaces of the substrates 2 that do not need to be coated can be covered, thereby reducing the flow of unnecessary process gas and improving the technical problem of overcoating.

[0047] In some embodiments, a plurality of carriers 13 are arranged in the process cavity 113, and the air flow channels 138 in adjacent carriers are connected in series and / or in parallel. A plurality of carriers 13 can be provided in the same deposition device 1, so as to passivate multiple groups of substrates 2 simultaneously. Among them, the air flow channels 138 in adjacent carriers 13 can be connected in series. The process gas can sequentially pass through the carriers 13 in the direction of the arrangement of the carriers 13. The air flow channels 138 in adjacent carriers 13 can be connected in parallel. The process gas can enter the carriers 13 separately. Optionally, part of the air flow channels 138 of the carrier 13 are connected in series and part are connected in parallel. The process gas can enter the carriers 13 with the air flow channels 138 connected in parallel separately, and then sequentially enter the carriers 13 with the air flow channels 138 connected in series.

[0048] In some embodiments, a plurality of wafer boats 135 are provided in the installation cavity. The wafer boats 135 and the heating plate 134 form a plurality of gas flow channels 138, and the gas flow channels 138 are in series and / or in parallel. A plurality of wafer boats 135 can be provided in the same carrier 13, so as to passivate multiple groups of substrates 2 simultaneously. Among them, the gas flow channels 138 formed by adjacent wafer boats 135 and the heating plate 134 can be in series. The process gas can sequentially pass through the gas flow channels 138 in the direction of the arrangement of the wafer boats 135. The gas flow channels 138 formed by adjacent wafer boats 135 and the heating plate 134 can be in parallel. The process gas can enter the gas flow channels 138 respectively. Optionally, the gas flow channels 138 can be partially in series and partially in parallel. The process gas can enter the gas flow channels 138 formed by the wafer boats 135 arranged in one direction and the heating plate respectively, and then sequentially enter the gas flow channels 138 formed by the wafer boats 135 arranged in the other direction and the heating plate 134.

[0049] In some embodiments, the carrier body includes a bottom plate 131 and stoppers 132. At least two stoppers 132 are oppositely arranged on both sides of the bottom plate 131. The stoppers 132 and the bottom plate 131 enclose to form an installation cavity 130. The stoppers 132 arranged on the opposite sides can enclose with the bottom plate 131 to form an installation cavity 130 for placing the wafer boats 135. Among them, two relatively spaced stoppers 132 can form a set of stoppers. A plurality of sets of stoppers can be arranged on the bottom plate 131 in the same direction. Both of the two opposite stoppers 132 in the set of stoppers can form an installation cavity 130 with the bottom plate 131. In other words, a carrier 13 can install and place a plurality of wafer boats 135 by setting a plurality of sets of stoppers. In some embodiments, side plates 133 are provided at the edges of the bottom plate 131. The side plates 133 can play a role in installing and fixing the wafer boats 135 or stoppers 132 at the edge portions. A plurality of side plates 133 at the edge portions can also be arranged to form sufficient space for installing the stoppers 132 and the wafer boats 135.

[0050] A plurality of wafer boats 135 can be arranged in plurality in the interval direction between the two opposite stoppers 132. A plurality of wafer boats 135 can also be arranged in plurality in the direction perpendicular to the interval of the stoppers 132. In other words, multiple sets of stoppers can be arranged in different directions to place a plurality of wafer boats 135.

[0051] Further, the heating plate 134 is installed on the bottom plate 131. An air inlet 136 and an air outlet 137 are respectively formed at intervals between the heating plate 134 and the stoppers 132 oppositely arranged on both sides of the bottom plate 131 in a stopper group. On the one hand, the heating plate 134 can be arranged at an interval and oppositely to the wafer boat 135 to form an air flow channel 138. On the other hand, the heating plate 134 can also be arranged at an interval from the stoppers 132 surrounding to form the installation cavity 130 to form the air inlet 136 and the air outlet 137. In the above manner, while the heating plate 134 is arranged at an interval from the wafer boat 135, it can also be arranged at an interval from the stoppers 132, so as to appropriately combine the functions of the stoppers 132, the installation cavity 130, the wafer boat 135 and the heating plate 134, thereby forming a channel for the process gas to pass through.

[0052] In some embodiments, the wafer boat 135, the heating plate 134, the air inlet 136, the air flow channel 138 and the air outlet 137 constitute a process unit. The air inlet 136, the air flow channel 138 and the air outlet 137 can be formed by the intervals between the aforementioned stoppers 132 and the heating plate 134, and the interval between the wafer boat 135 and the heating plate 134, and no specific limitation is made here. The definition of each element in the process unit is divided by function. The wafer boat 135 can carry the substrate 2, expose the surface of the substrate 2 to be coated, and cover the surface that does not need to be coated. The heating plate 134 can specifically heat the surface of the substrate 2 to be coated. The air inlet 136, the air flow channel 138 and the air outlet 137 can allow the process gas to pass uniformly and parallelly from the surface of the substrate 2 to be coated.

[0053] Among them, a plurality of process units are arranged in the carrier 13 in the extending direction of the air flow channel 138 or perpendicular to the extending direction of the air flow channel 138. In other words, a plurality of wafer boats 135 can be carried in one carrier 13. Specifically, the process units can be arranged repeatedly or in an array. Or, adjacent process units can be symmetrically arranged.

[0054] For example, in some embodiments, in combination with Figure 2 and Figure 3 , for two adjacent process units, they share the same heating plate 134, and the process units are symmetrically arranged with the heating plate 134 as the axis. In other words, the heating plate 134 is arranged between two adjacent process units. The heating plate 134 can specifically heat the sides of the wafer boats 135 on both sides thereof.

[0055] In some embodiments, only one side of the carrier boat 135 needs to be heated by the heating plate 134. In this case, the surfaces of the adjacent two process units where the carrier boat 135 needs to be heated can be arranged to face each other, and the heating plate 134 is arranged between the two carrier boats 135, so as to heat the sides of the adjacent two carrier boats 135 that need to be heated through one heating plate 134. It should be noted that in this case, in the two process units sharing the heating plate 134, the surfaces of the carrier boat 135 that need to be heated are arranged face to face. However, for one of the two process units sharing the heating plate 134 and the adjacent process unit on the side away from the other process unit (i.e., the two process units that are not symmetric about the heating plate 134 as the axis), the carrier boats 135 are arranged back to back, that is, the sides of the two carrier boats 135 on the side opposite to the surfaces that need to be heated are arranged to face each other. Optionally, the carrier boats 135 in the process units that are not symmetric about the heating plate 134 as the axis can be arranged to abut against each other. The process units arranged in the above manner can, on the one hand, share the heating plate 134 and improve the utilization rate of the heat of the heating plate 134. On the other hand, the side of the carrier boat 135 opposite to the side that needs to be coated can be blocked by the adjacent carrier boat 135, so as to play a shielding role, and there is no need to additionally provide components such as the side plate 133.

[0056] Among them, for the process units symmetric about the heating plate 134, since the width of the heating plate 134 is smaller than the width of the carrier boat 135, the formed air inlet 136, air outlet 137 and air flow channel 138 are not at the center of the process unit but in the part of the process unit close to the heating plate 134 in the above manner. For the two process units symmetric about the heating plate 134, the air inlets 136, air outlets 137 and air flow channels 138 in the two process units are arranged in a manner of being close to each other, and this manner also facilitates the centralized air intake of the deposition device 1 to reduce the length of the flow channel.

[0057] In some embodiments, in combination with Figure 4 and Figure 6, the door body 12 is provided with a spray array 121, and the spray array 121 is arranged corresponding to the air inlet 136. The spray array 121 can uniformly introduce the process gas from the air inlet 136. The equipment main body 11 is provided with a diversion channel 112, and the diversion channel 112 can be connected to a gas holder or a gas source to introduce the process gas into the equipment main body 11. When the door body 12 is in closed cooperation with the equipment main body 11, the diversion channel 112 is communicated with the spray array 121, and the diversion channel 112 and the spray array 121 form an air inlet channel. Among them, although the spray array 121 is provided on the door body 12, the diversion channel 112 for introducing the process gas from the outside is not provided on the door body 12 that needs to be frequently opened and closed, but the diversion channel 112 is provided on the fixed equipment main body 11. In this way, it is convenient to open and close the door body 12, and the interference of the parts connected to the gas source on the opening and closing of the door body 12 can be reduced. Optionally, the spray array 121 includes a plurality of gas outlets arranged in an array and spray channels respectively corresponding to the plurality of gas outlets. The spray channels can connect the plurality of gas outlets in parallel and / or in series to improve the uniformity of gas outlet. Further, the spray array 121 can be symmetrically arranged on the door body 12 to better correspond to the two process units symmetric about the heating plate 134 described above.

[0058] In some embodiments, in combination with Figure 4 , the door body 12 forms a convex platform towards the equipment main body 11, and the spray array 121 is arranged on the convex platform. By providing the convex platform, the spray array 121 can be closer to the carrier 13, thereby reducing the leakage of the process gas and increasing the uniformity and parallelism of the introduction of the process gas.

[0059] In some embodiments, in combination with Figure 4 and Figure 5 , at least two electrode feeding parts 140 are arranged at intervals in the part of the carrier main body corresponding to the heating plate 134 in the carrier 13, and the two electrode feeding parts 140 are electrically connected to the heating plate 134. By feeding positive and negative electrodes to the two electrode feeding parts 140, the heating plate 134 can be powered. Electrodes 111 are arranged at intervals in the process cavity 113, and the electrodes 111 are used to feed current to the carrier 13, and the electrodes 111 are arranged corresponding to the electrode feeding parts 140. The electrodes 111 can cooperate with the electrode feeding parts 140 so that after the carrier 13 is placed in the deposition equipment 1, the heating plate 134 can be powered by the deposition equipment 1.

[0060] Among them, the electrode feeding part 140 and the electrode 111 are arranged at intervals in the direction in which the door body 12 faces the device main body 11. At least two electrode feeding parts 140 are arranged at intervals in the part of the carrier main body corresponding to the heating plate 134, and the two electrode feeding parts 140 are electrically connected to the heating plate 134. One of the electrode 111 and the electrode feeding part 140 needs to be protruded and the other needs to be recessed. Through the cooperation of the two spaced electrodes 111 and the two electrode feeding parts 140, in addition to being able to feed current, it can also play a positioning role in the placement of the carrier 13. Optionally, a guiding groove can be arranged in the part of the outer side surface of the carrier 13 corresponding to the heating plate 134, and the electrode feeding part 140 is arranged in the guiding groove. And the electrode 111 protrudes from the bottom wall of the process cavity 113. In this way, during the placement process of the carrier 13, on the one hand, it can cooperate with the protruding electrode 111 through the guiding groove, so as to realize the guiding of the placement. On the other hand, it can cooperate with the two spaced electrodes 111 and the two electrode feeding parts 140 to play a positioning role in the placement of the carrier 13.

[0061] In summary, the carrier 13 can be detachably placed in the deposition device 1 for film deposition. The deposition device 1 can feed current into the carrier 13 and can introduce process gas through the gas inlet 136 and the gas outlet 137 of the carrier 13. Through this setting, one side of the heating plate 134 and the wafer boat 135 are opposite and arranged at intervals. On the one hand, the heating plate 134 can concentrate the heating on one side of the wafer boat 135, so that the side of the substrate 2 that needs to be coated can be concentratedly heated, thereby reducing the time required for preheating and heat conduction. On the other hand, the gas flow channel 138 formed by the interval between the heating plate 134 and the wafer boat 135 can allow the process gas to flow through, so that the side of the wafer boat 135 facing the heating plate 134 can be in contact with the process gas, so that the surface of the substrate 2 that needs to be coated can interact with the process gas, achieving the effect of coating passivation. The present application can realize the concentrated power heating of the cutting surface by the heating plate 134 during the process, so that it can quickly reach the process temperature, and can realize preheating outside the cavity, shortening the process time. The gas flow passing through the cutting surface is uniform and parallel, and at the same time, the heating structure of the existing deposition device can be simplified.

[0062] The above are only the embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. A vehicle, characterized in that, Comprising: A vehicle body having a mounting cavity; A heating plate mounted on the vehicle body; A wafer boat removably placed in the mounting cavity, the wafer boat having a receiving cavity for receiving a substrate, and the wafer boat being configured to cover at least one side of the substrate; Wherein, the heating plate and the wafer boat are opposite and spaced apart, and an air flow channel is formed between the heating plate and the wafer boat; the vehicle body has an air inlet and an air outlet, and the air flow channel communicates the air inlet and the air outlet.

2. The vehicle according to claim 1, wherein: At least one side of the wafer boat is open for exposing at least one side of the substrate; At least one side of the wafer boat having the opening is correspondingly arranged with the heating plate to form the air flow channel; Alternatively, a plurality of sides of the wafer boat having the opening are correspondingly arranged with the heating plate one by one to form a plurality of the air flow channels, and the air flow channels are connected in parallel or in series.

3. The vehicle according to claim 1, wherein: The substrates in the wafer boat are stacked, and the side to be coated of the stacked substrates is exposed to the air flow channel, and the other sides of the stacked substrates are covered by the wafer boat.

4. The vehicle according to claim 1, wherein: The vehicle body includes a bottom plate and stoppers, and at least two stoppers are oppositely arranged on both sides of the bottom plate; the stoppers and the bottom plate enclose to form the mounting cavity; the heating plate is mounted on the bottom plate, and the air inlet and the air outlet are respectively formed at intervals between the heating plate and the stoppers on both sides.

5. The vehicle according to claim 1, wherein: The air inlet, the air flow channel and the air outlet are arranged on the same axis, the side of the wafer boat facing the heating plate is exposed in the air flow channel, and the other sides of the wafer boat are blocked by the vehicle body.

6. The vehicle according to claim 1, wherein: The wafer boat, the heating plate, and the air inlet, the air flow channel and the air outlet constitute a process unit, and a plurality of the process units are arranged in the extending direction of the air flow channel or perpendicular to the extending direction of the air flow channel.

7. The vehicle according to claim 6, wherein: Two adjacent process units share the same heating plate, and the process units are symmetrically arranged with the heating plate as the axis.

8. The vehicle according to claim 1, wherein: At least two electrode feeding parts are spaced apart from the part of the vehicle body corresponding to the heating plate, and the two electrode feeding parts are electrically connected to the heating plate.

9. The vehicle according to claim 1, wherein: The air inlet and the air outlet are provided with flow equalizing plates.

10. The vehicle according to any one of claims 1-9, wherein: A plurality of the wafer boats are arranged in the mounting cavity, and the wafer boats and the heating plate form a plurality of the air flow channels, and the air flow channels are connected in series and / or in parallel.

11. A deposition device, characterized in that, Comprising: The device main body, the door body, and the carrier according to any one of claims 1-10; A process cavity is formed by enclosing the device main body and the door body; The carrier is detachably placed in the process cavity. The deposition device includes an air inlet channel and an air outlet channel. The air inlet channel is correspondingly arranged with the air inlet, and the air outlet channel is correspondingly arranged with the air outlet.

12. The deposition device according to claim 11, wherein: The door body is provided with a spray array, and the spray array is correspondingly arranged with the air inlet. The device main body is provided with a diversion channel. When the door body is in closed cooperation with the device main body, the diversion channel communicates with the spray array, and the diversion channel and the spray array constitute the air inlet channel.

13. The deposition device according to claim 12, wherein: A boss is formed on the door body facing the device main body, and the spray array is arranged on the boss.

14. The deposition device according to claim 11, wherein: At least two electrode feeding parts are spaced apart from each other at a part of the carrier main body corresponding to the heating plate in the carrier, and the two electrode feeding parts are electrically connected to the heating plate; Electrodes are arranged at intervals in the process cavity, and the electrodes are correspondingly arranged with the electrode feeding parts; Wherein, the electrode feeding parts and the electrodes are spaced apart in the direction of the door body facing the device main body; the electrodes are used for feeding current to the carrier.

15. The deposition device according to any one of claims 11-14, wherein: A plurality of carriers are arranged in the process cavity, and the air flow channels in adjacent carriers are in series and / or in parallel.

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