PIN structure, power module and vehicle

Abstract

The utility model relates to a PIN structure, a power module and a vehicle. The PIN structure comprises a pin body, a pin seat and a connecting piece. The needle base is connected to one side of the needle body in the axial direction of the needle body. The connecting piece is connected to the side, deviating from the needle body in the axial direction, of the needle base and protrudes out of the needle base, and the projection area of the connecting piece is smaller than that of the needle base in the axial direction. According to the PIN structure, the connection strength between the PIN structure and the ceramic substrate is improved, so that the reliability of the PIN structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a PIN needle structure, a power module and a vehicle. Background Art

[0002] In recent years, with the vigorous development of the new energy vehicle industry, power modules as the core power components of new energy vehicles have gradually received more and more attention. Generally speaking, power modules directly undertake the task of power processing and conversion in new energy vehicles. Their working environment is generally very harsh and they need to serve for a long time in a high temperature and high pressure environment. Minor damage to the module structure may cause the failure of the overall function and bring huge losses to the user. Given the important position of the power module in power control, the reliability of its overall structure has always been a hot topic of concern for industry technicians.

[0003] Pin is a connector that is often used in the production process of power modules. One end of the connector is connected to the via hole of the PCB circuit board, and the other end is connected to the ceramic substrate to achieve the transmission of electrical signals. Currently, the amount of solder coating on the connection layer between the pin and the ceramic substrate on the market is small, which makes the connection strength between the two low and reduces the reliability of the pin. Utility Model Content

[0004] The embodiments of the utility model provide a PIN needle structure and a power module, which are beneficial to improving the connection strength between the PIN needle structure and the ceramic substrate, thereby improving the reliability of the PIN needle structure.

[0005] On the one hand, according to an embodiment of the present application, a PIN needle structure is proposed, including: a needle body; a needle seat connected to one side of the needle body along its own axial direction; a connecting piece, connected to the side of the needle seat axially away from the needle body and protruding from the needle seat, and in the axial direction, the projected area of the connecting piece is smaller than the projected area of the needle seat.

[0006] According to one aspect of the embodiment of the present application, the length dimension of the connecting member in the axial direction is between 0.08 mm and 0.12 mm.

[0007] According to one aspect of the embodiment of the present application, the connector includes more than two connecting components, each connecting component is connected to the needle seat, and there is a gap between two adjacent connecting components.

[0008] According to one aspect of the embodiment of the present application, the orthographic projection of the connecting component in the axial direction includes any one of an arc-shaped structure, a circular structure, and a polygonal structure.

[0009] According to one aspect of an embodiment of the present application, the needle body includes a main body component and a buffer component, the buffer component is connected between the main body component and the needle seat, the axial length of the buffer component is adjustable, and the angle formed between two adjacent strip-shaped buffer portions is adjustable.

[0010] According to one aspect of an embodiment of the present application, the buffer component includes more than two strip buffer portions, which are connected in sequence along the axial direction, and the strip buffer portions located at both ends of the axial direction are respectively connected to the main body component and the needle seat, and the extension directions of two adjacent strip buffer portions are intersecting.

[0011] According to one aspect of an embodiment of the present application, the main body component includes a main body portion and a convex portion, the convex portion has a bottom surface and a top surface relative to each other along the axial direction, the bottom surface is connected to the main body portion, and the top surface is connected to the strip-shaped buffer portion, and in the axial direction, the projected area of the bottom surface is equal to the projected area of the main body portion, and the projected area of the top surface is smaller than the projected area of the bottom surface; and / or, the needle body also includes a transition component connected between the buffer component and the needle seat.

[0012] According to one aspect of the embodiment of the present application, the PIN needle structure further includes a blocking portion, which is sleeved on the outer peripheral surface of the needle body on the side close to the needle seat along the axial direction.

[0013] On the other hand, according to an embodiment of the present application, a power module is provided, comprising the PIN needle structure as described above.

[0014] On the other hand, according to an embodiment of the present application, a vehicle is provided, comprising the power module as described above.

[0015] The PIN needle structure, power module and vehicle proposed in the embodiments of the present application, the PIN needle structure includes a needle body, a needle seat and a connector. A connector is provided on the side of the needle seat axially away from the needle body, and the connector protrudes from the needle seat. When the PIN needle structure is connected with the ceramic substrate, the connector can be immersed in the solder to increase the thickness of the solder layer. Moreover, by setting the axial projection area of the connector to be smaller than the axial projection area of the needle seat, the needle seat and the connector can both be in contact with and connected to the solder liquid, which is beneficial to increase the contact area between the PIN needle structure and the solder liquid and the strength of the solder joint, and further beneficial to improve the reliability of the PIN needle structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic structural diagram of a PIN needle structure connected to a ceramic substrate according to an embodiment of the present application;

[0018] Figure 2 This is a schematic diagram of the structure of a PIN needle structure according to an embodiment of the present application;

[0019] Figure 3 A schematic structural diagram of a PIN needle structure according to another embodiment of the present application;

[0020] Figure 4 A schematic diagram of a partial structure of a PIN needle structure according to an embodiment of the present application;

[0021] Figure 5 A schematic diagram of a partial structure of a PIN needle structure according to another embodiment of the present application;

[0022] Figure 6 A schematic diagram of a partial structure of a PIN needle structure according to another embodiment of the present application;

[0023] Figure 7 A partial structural diagram of a PIN needle structure according to another embodiment of the present application;

[0024] Figure 8 A partial structural diagram of a PIN needle structure according to another embodiment of the present application;

[0025] Figure 9 This is a partial structural diagram of a PIN needle structure of another embodiment of the present application;

[0026] Figure 10 This is a structural schematic diagram of a PIN needle structure according to another embodiment of the present application.

[0027] in:

[0028] 100-PIN structure;

[0029] 10-needle body; 11-main body; 111-body; 112-convex part; 12-buffer part; 121-strip buffer part; 13-adapter part;

[0030] 20-needle holder;

[0031] 30-connecting piece; 31-connecting part;

[0032] 40- blocking part;

[0033] 200-ceramic substrate; 201-first copper layer; 202-ceramic layer; 203-second copper layer;

[0034] 301- solder layer; 302- substrate; 303- substrate solder layer;

[0035] 401-fixed plate; 402-auxiliary tooling;

[0036] X-axis direction. DETAILED DESCRIPTION

[0037] Aspects and exemplary embodiments of the present application will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application. In the drawings and the following description, at least some of the well-known structures and technologies are not shown in order to avoid unnecessarily obscuring the present application; and, for clarity, the dimensions of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0038] The orientation terms used in the following description are the directions shown in the figures and do not limit the PIN pin structure, power module, and vehicle of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "mounted" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0039] To better understand the present application, the following will be combined with Figures 1 to 10 The PIN pin structure, power module, and vehicle according to the embodiments of the application will be described in detail.

[0040] Currently, in the reflow soldering process of the Pin pins on the market, when the solder liquid melts, the Pin pins tend to sink under the influence of their own weight. The volume of the base part sinks into the solder liquid, and the Pin pins generate pressure on the solder liquid around the base. Part of the solder liquid originally between the base and the ceramic substrate is pressed out of the original pad, resulting in less solder liquid remaining under the base, and there are problems such as less solder connection layer coating amount between the base and the ceramic substrate and low solder joint strength. Eventually, the thickness of the solder layer is too thin, resulting in a lower connection strength between the Pin pins and the ceramic substrate, reducing the reliability of the Pin pins.

[0041] Based on this, the embodiment of the present application provides a PIN pin structure 100, which is beneficial to improving the connection strength between itself and the ceramic substrate 200, thereby being beneficial to improving the reliability of the PIN pin structure 100. The PIN pin structure 100 can be produced and sold as an independent component. At the same time, it can also be used in a power module and be a part of the power module, which can be beneficial to improving the reliability of the power module.

[0042] Please refer to Figures 1 to 3, an embodiment of the present application provides a PIN pin structure 100, which includes a pin body 10, a pin base 20, and a connecting member 30. The pin base 20 is connected to one side of the pin body 10 along its own axial direction X. The connecting member 30 is connected to the side of the pin base 20 along the axial direction X away from the pin body 10 and protrudes from the pin base 20. In the axial direction X, the projected area of the connecting member 30 is smaller than the projected area of the pin base 20.

[0043] In the PIN pin structure 100 provided by the embodiment of the present application, a connecting member 30 is provided on the side of the pin base 20 along the axial direction X away from the pin body 10, and the connecting member 30 protrudes from the pin base 20. When the PIN pin structure 100 is cooperatively connected with the ceramic substrate 200, the connecting member 30 can be fully combined with the solder to increase the thickness of the solder layer 301. Moreover, by setting the projected area of the connecting member 30 in the axial direction X to be smaller than the projected area of the pin base 20 in the axial direction X, both the pin base 20 and the connecting member 30 can be in contact connection with the solder, which is beneficial to increasing the contact area between the PIN pin structure 100 and the solder and the solder joint strength, and further beneficial to improving the reliability of the PIN pin structure 100.

[0044] Among them, the solder included in the solder layer 301 can be set as solder liquid. For the convenience of description, the following descriptions are all based on the solder being solder liquid.

[0045] Specifically, when the PIN pin structure 100 provided by the embodiment of the present application is cooperatively connected with the ceramic substrate 200, the PIN pin structure 100 is soldered to the ceramic substrate 200 through the connecting member 30. After the solder melts, the connecting member 30 will be immersed in the solder liquid and act as a support column between the pin base 20 and the ceramic substrate 200, which can effectively alleviate the problem of solder discharge caused by the large volume of the pin base 20 immersed in the solder liquid, improve the overall thickness of the solder layer, and moreover, by setting the connecting member 30, the solder liquid can be in contact with both the connecting member 30 and the pin base 20, and can also increase the contact area between the solder liquid and the PIN pin structure 100, improve the bonding strength of the solder joint, and further improve the connection strength between the PIN pin structure 100 and the ceramic substrate 200, and further beneficial to improving the reliability of the PIN pin structure 100.

[0046] In addition, the PIN pin structure 100 provided by the embodiment of the present application can improve the connection strength between the PIN pin structure 100 and the ceramic substrate 200 by setting the connecting member 30, with a simple structure, easy to process, and beneficial to improving production efficiency.

[0047] Optionally, the PIN pin structure 100 provided by the embodiments of the present application can be in the form of a split pin, that is, the pin body 10 is provided separately from the overall of the pin base 20 and the connecting member 30. The specific implementation of the split-structure PIN pin structure 100 cooperating and connecting with the ceramic substrate 200 and the PCB board is that the pin base 20 and the connecting member 30 are first fixed to the ceramic substrate 200 by soldering, and then the pin body 10 is inserted into the jack of the pin base 20 by means of a pin inserter. Mechanical connection is achieved between one side of the pin body 10 along the axial direction X and the pin base 20, and between the other side of the pin body 10 along the axial direction X and the PCB via hole respectively by means of interference fit.

[0048] Certainly, the PIN pin structure 100 provided by the embodiments of the present application can also be in the form of an integral pin, that is, the overall of the pin body 10, the pin base 20 and the connecting member 30 is integrally formed by a manufacturing process of first casting and then stamping. The specific implementation of the integral-structure PIN pin structure 100 cooperating and connecting with the ceramic substrate 200 and the PCB board is that the pin base 20 and the connecting member 30 are soldered to the ceramic substrate 200, and one side of the pin body 10 along the axial direction X away from the pin base 20 is soldered to the PCB by wave soldering.

[0049] Among them, the connecting member 30 and the pin base 20 can be set as an integrally formed structure, which is beneficial to improving the processing efficiency. Certainly, the connecting member 30 and the pin base 20 can also be provided separately and connected into a whole by welding, which is beneficial to reducing the processing difficulty and improving the use flexibility.

[0050] The pin body 10 extends along the axial direction X. Optionally, the pin body 10 can be set as Figure 2 the cylindrical structure as shown. Certainly, the pin body 10 can be set as Figure 3 the prismatic structure as shown.

[0051] Optionally, the pin base 20 can be set as a round cake structure, that is, the pin base 20 includes a top wall and a bottom wall opposite to each other along the axial direction X, and a side wall connecting between the bottom surface 1121 and the bottom surface 1121. The side wall is in a semi-circular structure, so that a smooth transition is formed between the top wall and the bottom wall. Axially along X, the diameters of the top wall and the bottom wall are equal and both are smaller than the diameter of the middle end on the side wall. By setting in this way, when the PIN pin structure 100 is connected to the ceramic substrate 200, the solder liquid can climb from the connecting member 30 and the pin base 20 to the pin body 10, avoiding the congestion of the solder liquid between the pin base 20 and the ceramic substrate 200, which is beneficial to improving the connection strength and aesthetics.

[0052] Optionally, the length dimension of the pin base 20 along the axial direction X satisfies being between 1 mm and 2 mm. Optionally, the projected area of the pin base 20 along the axial direction X is larger than the projected area of the pin body 10 along the axial direction X, which is beneficial to improving the supporting effect of the pin base 20 on the pin body 10 and also beneficial to preventing the excessive climbing of the solder liquid.

[0053] In some alternative embodiments, the length dimension of the connecting member 30 in the axial direction X is between 0.08 mm and 0.12 mm.

[0054] By setting it in this way, it is beneficial to increase the contact area between the PIN needle structure 100 and the solder liquid of the solder layer 301.

[0055] If the length dimension of the connecting member 30 in the axial direction X is designed to be too small, more solder liquid will still be squeezed out after being pressurized, and the connecting member 30 cannot achieve the function of firmly connecting with the solder liquid. If the length dimension of the connecting member 30 in the axial direction X is designed to be too large, the solder liquid cannot connect with the pin base 20, reducing the contact area between the PIN needle structure 100 and the solder liquid.

[0056] Therefore, designing the length dimension of the connecting member 30 in the axial direction X between 0.08 mm and 0.12 mm and including the two critical points of 0.08 mm and 0.12 mm can ensure that the connecting member 30 is integrally immersed in the solder liquid, make the solder liquid contact with the pin base 20, reduce the extrusion of the solder liquid under pressure at the same time, be beneficial to increasing the contact area between the PIN needle structure 100 and the solder liquid, help control the thickness of the solder material, improve the solder joint strength, and further be beneficial to improving the reliability of the PIN needle structure 100.

[0057] Exemplarily, the length dimension of the connecting member 30 in the axial direction X is set to 0.1 mm, which can better improve the reliability of the PIN needle structure 100.

[0058] Please refer to Figures 2 to 5 , in some alternative embodiments, the connecting member 30 includes more than two connecting parts 31, each connecting part 31 is connected to the pin base 20, and there is a gap between adjacent two connecting parts 31.

[0059] By setting it in this way, it is convenient to reduce the porosity of the solder layer 301 and further improve the reliability of the PIN needle structure 100.

[0060] There is a gap between adjacent two connecting parts 31. That is to say, the connecting member 30 is set as a split structure, which provides a channel for gas to escape smoothly from the solder liquid during the vacuum reflow soldering process, has a good gain effect on reducing the porosity of the solder layer 301, and improves the current-carrying capacity and heat conduction capacity of the solder layer 301.

[0061] Optionally, the number of the connecting parts 31 can be set to two, or can also be set to multiple. Optionally, the shapes of each connecting part 31 can be set to be the same. Of course, they can also be set to be different, and can be specifically set according to specific requirements.

[0062] In some optional embodiments, the orthographic projection of the connecting member 31 on the axial direction X includes any one of an arc structure, a circular structure, and a polygonal structure.

[0063] As Figure 2 shown, the orthographic projection of the connecting member 31 on the axial direction X can be an arc structure, that is, the connecting member 31 can be set as a semi-circular structure, the number of the connecting members 31 is set to two, and the two connecting members 31 are symmetrically arranged. By setting in this way, during the vacuum process, air bubbles can be discharged from the gap between the two semi-circular structures to reduce the porosity of the solder layer 301. Moreover, the arc structure can reduce stress concentration to better improve the connection effect.

[0064] Optionally, the thickness of the connecting member 31 in the semi-circular structure can be set to about 0.2 mm to avoid generating a large pressure when it is immersed in the solder.

[0065] As Figure 4 shown, the orthographic projection of the connecting member 31 on the axial direction X can also be a circular structure, that is, the connecting member 31 can be set as a cylindrical structure, the number of the connecting members 30 can be set to multiple and arranged in a symmetrical structure, which can reduce stress concentration during service and ensure connection uniformity.

[0066] As Figure 5 shown, the orthographic projection of the connecting member 31 on the axial direction X can also be a polygonal structure, that is, the connecting member 31 can be set as a prismatic structure, the number of the connecting members 30 can be set to multiple and arranged in a symmetrical structure, which is beneficial to ensure connection uniformity.

[0067] By setting the orthographic projection of the connecting member 31 on the axial direction X as any one of an arc structure, a circular structure, and a polygonal structure, it is possible to reduce the porosity of the solder layer 301 while also being beneficial to ensuring the connection effect. Of course, the structure of the connecting member 30 is not limited to this and can be set according to the usage requirements. When the service environment of the solder layer 301 is relatively mild, please also refer to Figures 6 to 9 wherein the connecting member 30 can also be set as an integrally formed structure for easy processing and assembly.

[0068] As Figure 6 shown, the connecting member 30 can be set as a polygonal frustum structure. As Figure 7 shown, the connecting member 30 can also be set as a polygonal prismatic structure. As Figure 8 shown, the connecting member 30 can also be set as a cylindrical structure. As Figure 9 shown, the connecting member 30 can also be set as an annular column structure or a cylindrical boss structure. It can be understood that the above are only examples. Of course, the connecting member 30 can also be set as other integrally formed structures, all of which can achieve the effect of improving the reliability of the PIN pin structure 100.

[0069] Please refer to Figure 10 , in some alternative embodiments, the needle body 10 includes a main body member 11 and a buffer member 12. The buffer member 12 is connected between the main body member 11 and the needle base 20, and the length of the buffer member 12 in the axial direction X is adjustable.

[0070] With this arrangement, it is beneficial to improve the load-bearing capacity of the PIN needle structure 100.

[0071] The length of the buffer member 12 in the axial direction X is adjustable, so that when the pressure on the PIN needle structure 100 is too large, the buffer member 12 can elongate or contract in the axial direction X to absorb this part of the pressure, ensuring the performance of the PIN needle structure 100 and increasing the service life of the PIN needle structure 100.

[0072] In some alternative embodiments, the buffer member 12 includes more than two strip-shaped buffer portions 121. The more than two strip-shaped buffer portions 121 are connected in sequence along the axial direction X, and the strip-shaped buffer portions 121 at both ends in the axial direction X are respectively connected to the main body member 11 and the needle base 20. The extending directions of adjacent two strip-shaped buffer portions 121 intersect, and the included angle formed between adjacent two strip-shaped buffer portions 121 is adjustable.

[0073] Optionally, the number of the strip-shaped buffer portions 121 can be set to two. Of course, it can also be set to multiple. Optionally, the included angle between adjacent two strip-shaped buffer portions 121 can be set to 80°, 90°. Of course, it can also be set to other angles, and the specific number and angle can be adjusted according to the stress borne by the PIN needle structure 100.

[0074] Exemplarily, the number of the strip-shaped buffer portions 121 is set to four, and the included angle between adjacent two strip-shaped buffer portions 121 is set to 90°, so that the PIN needle structure 100 including this structure has better load-bearing capacity and is beneficial to increasing the service life of the PIN needle structure 100.

[0075] Optionally, a circular chamfer can be provided at the connection of adjacent two strip-shaped buffer portions 121, which is beneficial to reducing stress concentration and thus increasing the service life of the PIN needle structure 100.

[0076] The adjustable included angle formed between adjacent two strip-shaped buffer portions 121 can be understood as that when the buffer member 12 elongates or shortens in the axial direction X, the included angle formed between adjacent two strip-shaped buffer portions 121 will change accordingly.

[0077] Exemplarily, when the buffer member 12 elongates in the axial direction X, the included angle formed between adjacent two strip-shaped buffer portions 121 will increase accordingly. When the buffer member 12 shortens in the axial direction X, the included angle formed between adjacent two strip-shaped buffer portions 121 will decrease accordingly.

[0078] Please continue to refer to Figure 10 In some alternative embodiments, the main body member 11 includes a body portion 111 and a convex portion 112. The convex portion 112 has an opposite bottom surface and top surface along the axial direction X. The bottom surface is connected to the body portion 111, and the top surface is connected to the strip-shaped buffer portion 121. Along the axial direction X, the projected area of the bottom surface is equal to the projected area of the body portion, and the projected area of the top surface is smaller than the projected area of the bottom surface.

[0079] By setting in this way, the main body member 11 is provided to include the body portion 111 and the convex portion 112 having a convex platform structure. After the strip-shaped buffer portion 121 is connected to the top surface of the convex portion 112, the extending direction of the strip-shaped buffer portion 121 and the extending direction of the side surface of the convex portion 112 are located in the same extending plane, which is beneficial to reducing the concentrated stress after the connection between the convex portion 112 and the strip-shaped buffer portion 121 and improving the connection effect.

[0080] Optionally, the diameter of the top surface is equal to the diameter of the strip-shaped buffer portion 121, which is convenient for connection positioning and beneficial to reducing the concentrated stress.

[0081] In some alternative embodiments, the needle body 10 further includes an adapter member 13, which is connected between the buffer member 12 and the needle base 20.

[0082] Among them, the adapter member 13 can be set to have a structure in which the diameter on the side close to the buffer member 12 along the axial direction X is smaller than the diameter on the side close to the needle base 20 along the axial direction X, which is convenient for the connection between the adapter member 13 and the buffer member 12.

[0083] Optionally, the adapter member 13 can be set to have a diameter on the side close to the buffer member 12 along the axial direction X equal to the diameter of the strip-shaped buffer portion 121, which is convenient for connection positioning and beneficial to reducing the concentrated stress.

[0084] In some alternative embodiments, the PIN needle structure 100 further includes a blocking portion 40, and the blocking portion 40 is sleeved on the outer peripheral surface of the needle body 10 on the side close to the needle base 20 along the axial direction X.

[0085] By setting in this way, it is beneficial to control the climbing height of the solder liquid, that is, it is beneficial to control the length dimension of the solder layer 301 in the axial direction X and ensure the aesthetics of the PIN needle structure 100.

[0086] Optionally, the blocking portion 40 is in a strip shape and surrounds the surface of the needle body 10, and the bandwidth is about 1 mm. The specific implementation process can be local aluminizing or spraying solder resist ink to prevent the solder liquid from climbing excessively.

[0087] When the needle body 10 is set to Figure 2 and Figure 3In the structure shown, that is, when the needle body 10 only includes the main body part 11, the blocking portion 40 can be arranged on the outer peripheral surface of the main body part 11 close to the needle seat 20 along the axial direction X. When the needle body 10 is configured to include the main body part 11 and the buffer part 12, the blocking portion 40 can be arranged on the outer peripheral surface of the buffer part 12 ... Figure 10 In the structure shown, that is, when the needle body 10 includes the main body component 11, the buffer component 12 and the adapter component 13, the blocking portion 40 can be arranged on the outer peripheral surface of the adapter component 13 along the axial direction X close to the needle seat 20.

[0088] Optionally, the needle body 10, the needle seat 20, the connector 30 and the blocking portion 40 are coaxially arranged to ensure center consistency and avoid the risk of deviation and tilting. In addition, except for the blocking portion 40, the surface of the PIN needle structure 100 can be gold-plated or nickel-plated to facilitate reflow soldering with the ceramic substrate 200 and the PCB board.

[0089] The PIN needle structure 100 provided in the embodiment of the present application can adjust the thickness of the solder layer 301 and reduce the void rate of the solder layer 301 by setting the connector 30 on the needle seat 20, thereby improving the reliability of the PIN needle structure 100 during service.

[0090] On the other hand, according to an embodiment of the present application, a power module is provided, including the PIN needle structure 100 provided in the above embodiments.

[0091] The power module provided in the embodiment of the present application further includes a PCB board and a ceramic substrate 200 . The PIN needle structure 100 is first connected to the ceramic substrate 200 and then connected to the PCB board to form a power module.

[0092] The ceramic substrate 200 includes a ceramic layer 202 in the middle and a first copper layer 201 and a second copper layer 203 on both sides of the ceramic layer 202 along the axial direction X. The first copper layer 201 is used to connect the PIN needle structure 100. The second copper layer 203 is connected to the substrate 302 through a substrate solder layer 303 on a side away from the first copper layer 201 in the axial direction X.

[0093] The specific implementation process of connecting the PIN pin structure 100 with the ceramic substrate 200 is to arrange multiple PIN pin structures 100 in the fixing plate 401 and the auxiliary tooling 402 along the axial direction X on the side away from the connector 30, arrange the solder layer 301 on the surface of the first copper layer 201, connect the PIN pin structure 100 with the solder layer 301 by using the fixing plate 401 and the auxiliary tooling 402, and then remove the fixing plate 401 and the auxiliary tooling 402 to complete the connection of the multiple PIN pin structures 100 with the ceramic substrate 200. Among them, the solder layer 301 and the substrate solder layer 303 can be set as solder liquid.

[0094] The first copper layer 201 may be represented as a copper layer coated on the upper surface of the ceramic layer 202 , and the second copper layer 203 may be represented as a copper layer coated on the lower surface of the ceramic layer 202 .

[0095] The PCB board has a plurality of via holes, and the side of the PIN needle structure 100 away from the needle seat 20 along the axial direction X is connected to the via hole of the PCB board, so that the PCB board, the PIN needle structure 100 and the ceramic substrate 200 are connected as a whole to form a power module.

[0096] Since the PIN needle structure 100 provided in the embodiment of the present application is conducive to improving the connection strength between it and the ceramic substrate 200, improving the quality of the solder layer 301, and improving the reliability of the solder layer 301, the power module provided in the embodiment of the present application is conducive to improving reliability.

[0097] Optionally, the side of the main body component 11 away from the connecting member 30 along the axial direction X is configured as a truncated cone structure, such as Figure 2 As shown, the diameter of the truncated cone structure increases uniformly from top to bottom along the axial direction X, which can play a guiding role and facilitate insertion into the via hole of the PCB board.

[0098] Optionally, the diameter of the pin body 10 is slightly smaller than the inner diameter of the via hole of the PCB board, so that when the PIN pin structure 100 and the PCB board are wave soldered, the solder liquid can crawl into the fitting gap to improve the strength of the solder joint.

[0099] On the other hand, according to an embodiment of the present application, a vehicle is provided, including a power module provided by the above embodiments.

[0100] Since the vehicle provided in the embodiment of the present application includes the power module capable of improving reliability as described above, it is helpful to improve the safety of the vehicle.

[0101] The vehicle provided in this application can be a fuel vehicle, a gas vehicle or a new energy vehicle. The new energy vehicle can be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc., and this application does not make any special limitations.

[0102] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A PIN pin structure, characterized in that, include: Needle body; A needle seat connected to one side of the needle body along its own axial direction; A connecting piece is connected to a side of the needle seat away from the needle body along the axial direction and protrudes from the needle seat. In the axial direction, a projected area of the connecting piece is smaller than a projected area of the needle seat.

2. The PIN pin structure according to claim 1, wherein The length dimension of the connecting member in the axial direction is between 0.08 mm and 0.12 mm.

3. The PIN pin structure according to claim 1, characterized in that, The connecting piece includes more than two connecting components, each of which is connected to the needle seat, and there is a gap between two adjacent connecting components.

4. The PIN pin structure according to claim 3, wherein, The orthographic projection of the connecting component in the axial direction includes any one of an arc-shaped structure, a circular structure, and a polygonal structure.

5. The PIN pin structure according to any one of claims 1 to 4, characterized in that, The needle body comprises a main body component and a buffer component. The buffer component is connected between the main body component and the needle seat. The length of the buffer component in the axial direction is adjustable.

6. The PIN pin structure according to claim 5, characterized in that, The buffer component includes more than two strip buffer parts, which are connected in sequence along the axial direction, and the strip buffer parts located at both ends of the axial direction are respectively connected to the main body component and the needle seat, the extension directions of two adjacent strip buffer parts are intersecting, and the angle formed between two adjacent strip buffer parts is adjustable.

7. The PIN pin structure according to claim 6, wherein The main body component includes a main body portion and a convex portion, the convex portion has a bottom surface and a top surface opposite to each other along the axial direction, the bottom surface is connected to the main body portion, the top surface is connected to the strip-shaped buffer portion, and in the axial direction, the projection area of the bottom surface is equal to the projection area of the main body portion, and the projection area of the top surface is smaller than the projection area of the bottom surface; And / or, the needle body further includes a transition component connected between the buffer component and the needle seat.

8. The PIN pin structure according to any one of claims 1 to 4, characterized in that, The PIN needle structure further comprises a blocking portion, which is sleeved on the outer peripheral surface of the needle body along the axial direction and close to the needle seat.

9. A power module, characterized in that, include: A PIN needle structure as described in any one of claims 1 to 8.

10. A vehicle, characterized in that, Comprising the power module as claimed in claim 9.

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