Image acquisition equipment

Abstract

The utility model relates to the technical field of image processing equipment, and discloses image acquisition equipment. The image acquisition device comprises a housing, a battery compartment, a heat source assembly and a heat transfer assembly. The shell has an accommodating cavity. The battery bin is arranged in the containing cavity and used for containing the battery pack. The heat source assembly comprises a heat source structure and / or a light supplementing lamp panel. The heat source structure comprises a first heat source and a light condensation piece. The first heat source is located in the containing cavity and connected with the shell. The light condensing part is positioned on one side of the first heat source and is used for condensing light outside the shell to the first heat source so as to heat the first heat source; the light supplementing lamp panel is installed on the shell. One end of the heat transfer assembly is connected with the heat source assembly, and the other end is located in the chamber of the battery chamber and used for transferring heat of the heat source assembly to the chamber to heat the battery pack. The problem that in the prior art, a camera uses the electric quantity of a battery to heat a battery pack to obtain good charging and discharging efficiency, and the design situation of a small-capacity battery pack is inconsistent is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of image processing equipment, in particular to an image acquisition device. Background Art

[0002] Image acquisition devices, such as battery cameras, are widely used due to the convenience of the power supply form. However, due to the low-temperature characteristics of the battery pack, they cannot work outdoors at low temperatures for a long time. If they are in a low-temperature environment for a long time, the charge-discharge efficiency and even the battery life of the battery pack will be affected. In order to ensure the charge-discharge efficiency of the battery pack of the camera, an electric heating module is usually designed to heat the battery pack to enable the battery pack to have better charge-discharge efficiency.

[0003] However, due to the limitations of the camera size and cost, the battery pack of the camera often cannot be made to have a very large capacity. If the power of the battery pack itself is used to supply power to the electric heating module to heat the battery compartment, the battery life of the camera will be reduced. That is to say, using the power of the battery itself to heat the battery pack to obtain better charging efficiency is contrary to the design status of a smaller-capacity battery pack. Therefore, how to ensure that the battery pack can obtain better charging efficiency without increasing the capacity of the battery pack is an urgent problem to be solved in the industry. Summary of the Utility Model

[0004] The utility model provides an image acquisition device to solve the defect that in the prior art, using the power of the battery itself to heat the battery pack to obtain better charging efficiency is contrary to the design status of a smaller-capacity battery pack in the camera.

[0005] The utility model provides an image acquisition device, including the following steps.

[0006] A housing having an accommodation cavity;

[0007] A battery compartment disposed in the accommodation cavity for accommodating a battery pack;

[0008] A heat source assembly including a heat source structure and / or a fill light board; the heat source structure includes a first heat source and a condenser; the first heat source is located in the accommodation cavity and is connected to the housing; the condenser is located on one side of the first heat source for concentrating the light outside the housing on the first heat source to raise the temperature of the first heat source; the fill light board is installed on the housing;

[0009] A heat transfer assembly, one end of the heat transfer assembly is connected to the heat source assembly, and the other end is located in the chamber of the battery compartment for transferring the heat of the heat source assembly to the chamber to heat the battery pack.

[0010] According to the image acquisition device provided by the utility model, the heat transfer assembly includes:

[0011] A first heat transfer member, connected to the heat source assembly;

[0012] A second heat transfer member, installed on the housing of the battery compartment, one end of the second heat transfer member being located in the compartment;

[0013] A connecting member, the other end of the second heat transfer member being detachably connected to the first heat transfer member through the connecting member.

[0014] The image acquisition device provided by the present utility model includes two such heat transfer assemblies. The first heat transfer member of one heat transfer assembly is connected to the first heat source, and the first heat transfer member of the other heat transfer assembly is connected to the fill light board; one end of the second heat transfer member of the two heat transfer assemblies is located in the compartment, and the other end is detachably connected to the corresponding first heat transfer member through the corresponding connecting member.

[0015] The image acquisition device provided by the present utility model further includes:

[0016] A temperature detection unit, electrically connected to the first input end of the MCU, for detecting the temperature of the compartment;

[0017] A heating selection unit, including a first switch circuit, a second switch circuit, a first electromagnetic switch and a second electromagnetic switch;

[0018] The input end of the first switch circuit is electrically connected to the first output end of the MCU; the output end of the first switch circuit is electrically connected to the first electromagnetic switch to control the on-off of the current of the first electromagnetic switch; the first electromagnetic switch is used to magnetically attract the connecting member of one heat transfer assembly, so that the corresponding first heat transfer member is connected to the corresponding second heat transfer member;

[0019] The input end of the second switch circuit is electrically connected to the second output end of the MCU; the output end of the second switch circuit is electrically connected to the second electromagnetic switch to control the on-off of the current of the second electromagnetic switch; the second electromagnetic switch is used to magnetically attract the connecting member of the other heat transfer assembly, so that the corresponding first heat transfer member is connected to the corresponding second heat transfer member.

[0020] The image acquisition device provided by the present utility model further includes:

[0021] A brightness detection unit, electrically connected to the second input end of the MCU, for detecting the brightness outside the housing.

[0022] According to the image acquisition device provided by the present utility model, a second heat source is installed in the bin; the heating selection unit further includes a third switch circuit and a control switch;

[0023] The first input end of the third switch circuit is electrically connected to the third output end of the MCU, the second input end of the third switch circuit is electrically connected to the battery pack, the output end of the third switch circuit is electrically connected to one end of the second heat source, and the other end of the second heat source is grounded; the third switch circuit is used to control the battery pack to supply power to the second heat source.

[0024] According to the image acquisition device provided by the present utility model, it further includes:

[0025] SOC, the SOC is electrically connected to the MCU to achieve hang-up protection.

[0026] According to the image acquisition device provided by the present utility model, it further includes:

[0027] A reset circuit, the input end of the reset circuit is electrically connected to the reset pin of the SOC, and the output end of the reset circuit is electrically connected to the reset pin of the MCU.

[0028] According to the image acquisition device provided by the present utility model, it further includes:

[0029] A limiting component, the second heat transfer member and the bin are in limiting cooperation through the limiting component, and the limiting component is used to adjust the depth of the second heat transfer member entering the bin.

[0030] According to the image acquisition device provided by the present utility model, the first heat source is connected to the outer shell through a heat insulation member.

[0031] For the image acquisition device provided by the present utility model, when the heat source assembly includes a heat source structure, by setting a heat source structure including a first heat source and a light condensing member, the light condensing member is located on one side of the first heat source, the light outside the outer shell can be concentrated on the first heat source, and then the first heat source is heated, so that the light source outside the outer shell can be utilized; combined with the heat transfer assembly, the heat transfer assembly can transfer the heat of the first heat source to the bin of the battery compartment to heat the battery pack, avoiding heating the battery pack with the power of the battery pack itself, and will not affect the battery life of the device.

[0032] When the heat source assembly includes a fill light board, by connecting the heat transfer assembly to the fill light board, the heat generated when the fill light board works can be utilized, and the heat of the fill light board can be transferred to the bin of the battery compartment to heat the battery pack, also avoiding heating the battery pack with the power of the battery pack itself, and will not affect the battery life of the device.

[0033] The utility model can ensure that the battery pack can obtain better charge and discharge efficiency without increasing the capacity of the battery pack, optimize the problem of waste of battery capacity in the pure electric heating of the battery pack of the current camera, and solve the problem that the existing camera uses the power of the battery itself to heat the battery pack to obtain better charge and discharge efficiency, which is contrary to the design status of a battery pack with a smaller capacity. Brief Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions in the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0035] Figure 1 It is one of the schematic structural diagrams of the image acquisition device provided by the present utility model.

[0036] Figure 2 It is another schematic structural diagram of the image acquisition device provided by the present utility model.

[0037] Figure 3 It is the schematic structural diagram of the limiting component of the image acquisition device provided by the present utility model.

[0038] Figure 4 It is the schematic structural diagram of the SOC and reset circuit of the image acquisition device provided by the present utility model.

[0039] Figure 5 It is the schematic structural diagram of the MCU and brightness detection unit of the image acquisition device provided by the present utility model.

[0040] Figure 6 It is the schematic structural diagram of the first switch circuit of the image acquisition device provided by the present utility model.

[0041] Figure 7 It is the schematic structural diagram of the second switch circuit of the image acquisition device provided by the present utility model.

[0042] Figure 8 It is the schematic structural diagram of the third switch circuit of the image acquisition device provided by the present utility model.

[0043] Reference Signs:

[0044] 100, battery compartment;

[0045] 200, heat source assembly; 210, heat source structure; 220, fill light board; 211, first heat source; 212, light condensing member;

[0046] 300, Heat transfer component; 310, First heat transfer member; 320, Second heat transfer member; 330, Connecting member; 311, Third sheet metal; 312, Fourth sheet metal; 321, First sheet metal; 322, Second sheet metal; 331, First iron sheet; 332, Second iron sheet;

[0047] 400, Limiting component; 410, Gear; 420, Rack. Detailed implementation manners

[0048] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the present utility model will be clearly and completely described below with reference to the accompanying drawings in the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0049] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the embodiments of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0050] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "connected" and "connected to" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific situations.

[0051] In the embodiments of the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0052] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0053] As Figure 1 shown, a specific embodiment of the present utility model provides an image acquisition device. The image acquisition device includes a housing (not shown in the figure), a battery compartment 100, a heat source assembly 200 and a heat transfer assembly 300.

[0054] Among them, the housing has a receiving cavity. The battery compartment 100 is arranged in the receiving cavity for accommodating a battery pack. The heat source assembly 200 includes a heat source structure 210 and / or a supplementary light board 220; the heat source structure 210 includes a first heat source 211 and a condenser 212; the first heat source 211 is located in the receiving cavity and is connected to the housing; the condenser 212 is located on one side of the first heat source 211 for concentrating the light outside the housing on the first heat source 211 to raise the temperature of the first heat source 211; the supplementary light board 220 is installed on the housing. One end of the heat transfer assembly 300 is connected to the heat source assembly 200, and the other end is located in the chamber of the battery compartment 100 for transferring the heat of the heat source assembly 200 to the chamber to heat the battery pack.

[0055] In this embodiment, when the heat source assembly 200 includes the heat source structure 210, by providing the heat source structure 210 including the first heat source 211 and the condenser 212, with the condenser 212 located on one side of the first heat source 211, the light outside the housing can be concentrated on the first heat source 211, thereby raising the temperature of the first heat source 211, and the utilization of the light source outside the housing can be achieved; combined with the heat transfer assembly 300, the heat transfer assembly 300 can transfer the heat of the first heat source 211 to the compartment of the battery compartment 100 to heat the battery pack, avoiding using the power of the battery pack itself to heat the battery pack and not affecting the battery life of the device.

[0056] When the heat source assembly 200 includes the fill light board 220, by connecting the heat transfer assembly 300 to the fill light board 220, the heat generated when the fill light board 220 operates can be utilized to transfer the heat of the fill light board 220 to the compartment of the battery compartment 100 to heat the battery pack, also avoiding using the power of the battery pack itself to heat the battery pack and not affecting the battery life of the device.

[0057] In other words, adopting the solution of this embodiment can ensure that the battery pack can obtain better charge and discharge efficiency without increasing the battery pack capacity, optimize the problem of waste of battery capacity in the pure electric heating of the battery pack of the current camera, and solve the problem in the prior art that the camera uses the power of the battery pack itself to heat the battery pack, which is contrary to the design of a battery pack with better charge and discharge efficiency and a smaller capacity.

[0058] It should be noted that the heat source assembly 200 may include at least one of the heat source structure 210 or the fill light board 220.

[0059] In some embodiments, the first heat source 211 includes a metal plate. Preferably, the first heat source 211 includes an aluminum plate or a steel plate.

[0060] In some embodiments, the first heat source 211 is connected to the housing through a heat insulation member (not shown in the figure). By providing the heat insulation member, the heat transfer of the first heat source 211 to the housing can be minimized, ensuring that the heat of the first heat source 211 is transferred to the heat transfer assembly 300 as much as possible and improving the heating speed of the compartment.

[0061] It should be noted that the heat insulation member has heat insulation properties and can be made of heat insulation materials. Exemplarily, the heat insulation member can be a rubber pad.

[0062] In some embodiments, the condenser 212 includes a convex lens, and the convex lens is installed on the housing. The convex lens can concentrate sunlight on the first heat source 211 to raise the temperature of the first heat source 211.

[0063] In some embodiments, the battery compartment 100 can be formed by enclosing with plastic plates.

[0064] As Figure 1 shown, in some embodiments, the heat transfer component 300 includes a first heat transfer member 310, a second heat transfer member 320, and a connecting member 330; the first heat transfer member 310 is connected to the heat source component 200. The second heat transfer member 320 is installed on the body of the battery compartment 100, and one end of the second heat transfer member 320 is located in the compartment. The other end of the second heat transfer member 320 is detachably connected to the first heat transfer member 310 through the connecting member 330.

[0065] In this embodiment, by providing the first heat transfer member 310 connected to the heat source component 200, providing the second heat transfer member 320 located in the compartment, and providing the connecting member 330 capable of detachably connecting the first heat transfer member 310 and the second heat transfer member 320, the heat transfer of the heat transfer component 300 to the heat source component 200 can be controlled. For example, when it is necessary to heat up the compartment, the connecting member 330 can be operated to connect the other end of the second heat transfer member 320 to the first heat transfer member 310. When it is not necessary to heat up the compartment, the connecting member 330 can be operated to separate the other end of the second heat transfer member 320 from the first heat transfer member 310.

[0066] It can be understood that the first heat transfer member 310, the second heat transfer member 320, and the connecting member 330 can all be metal plates. Preferably, the first heat transfer member 310, the second heat transfer member 320, and the connecting member 330 can all be aluminum plates, which can reduce the cost on the premise of ensuring the heat transfer effect.

[0067] As Figure 3 shown, in some embodiments, the image acquisition device further includes a limiting component 400; the second heat transfer member 320 and the body are in limiting cooperation through the limiting component 400, and the limiting component 400 is used to adjust the depth of the second heat transfer member 320 entering the body. By providing the limiting component 400, not only can the second heat transfer member 320 be stably connected to the body, but also the depth of the second heat transfer member 320 inserted into the compartment can be adjusted, thereby adjusting the contact area between the second heat transfer member 320 and the compartment and adjusting the heating rate of the compartment.

[0068] Exemplarily, the limiting component 400 includes a gear 410 and a rack 420 meshed with the gear 410; the gear 410 is rotatably connected to the body, the rack 420 extends along the depth direction of the second heat transfer member 320, and the rack 420 is installed on the second heat transfer member 320. By pushing the second heat transfer member 320, the second heat transfer member 320 drives the rack 420 to be meshed with the gear 410 to adjust the contact area between the second heat transfer member 320 and the compartment.

[0069] Exemplarily, one end of the connecting member 330 is hinged to the second heat transfer member 320, and the other end is detachably connected to the first heat transfer member 310.

[0070] As Figure 1 shown, in some embodiments, the image acquisition device includes two heat transfer assemblies 300. The first heat transfer member 310 of one heat transfer assembly 300 is connected to the first heat source 211, and the first heat transfer member 310 of the other heat transfer assembly 300 is connected to the fill light board 220. One ends of the second heat transfer members 320 of the two heat transfer assemblies 300 are both located in the chamber, and the other ends are both detachably connected to the corresponding first heat transfer members 310 through the corresponding connecting members 330.

[0071] In this embodiment, by providing two heat transfer assemblies 300, the heat of the first heat source 211 and the fill light board 220 can be respectively transferred, and the heat transfer paths can be respectively controlled. For example, during the day, the connecting member 330 of the heat transfer assembly 300 connected to the first heat source 211 can be controlled to transfer the heat of the first heat source 211 to the chamber of the battery compartment 100. For example, at night, the connecting member 330 of the heat transfer assembly 300 connected to the fill light board 220 can be controlled to transfer the heat of the fill light board 220 to the chamber of the battery compartment 100.

[0072] As Figure 1 shown, exemplarily, the first heat transfer member 310 includes a third sheet metal 311 and a fourth sheet metal 312. The fourth sheet metal 312 is connected to the first heat source 211, and the third sheet metal 311 is connected to the fill light board 220. The second heat transfer member 320 includes a first sheet metal 321 and a second sheet metal 322. The connecting member 330 includes a first iron sheet 331 and a second iron sheet 332. The first sheet metal 321 is installed on the housing, and one end of the first sheet metal 321 is located in the chamber. The other end of the first sheet metal 321 is connected to one end of the first iron sheet 331, and the other end of the first iron sheet 331 is detachably connected to the fourth sheet metal 312. The second sheet metal 322 is installed on the housing, and one end of the second sheet metal 322 is located in the chamber. The other end of the second sheet metal 322 is connected to one end of the second iron sheet 332, and the other end of the second iron sheet 332 is detachably connected to the third sheet metal 311. In this way, when the first iron sheet 331 is connected to the fourth sheet metal 312, the heat of the first heat source 211 can be transferred to the chamber of the battery compartment 100 through the first heat transfer path formed by the fourth sheet metal 312, the first iron sheet 331 and the first sheet metal 321, so as to heat the battery pack. When the second iron sheet 332 is connected to the third sheet metal 311, the heat of the fill light board 220 can be transferred to the chamber of the battery compartment 100 through the second heat transfer path formed by the third sheet metal 311, the second iron sheet 332 and the second sheet metal 322, so as to heat the battery pack.

[0073] As Figure 2As shown, in some embodiments, the image acquisition device further includes a temperature detection unit and a heating selection unit.

[0074] Among them, the temperature detection unit is electrically connected to the first input end of the MCU and is used to detect the temperature of the chamber. The heating selection unit includes a first switch circuit, a second switch circuit, a first electromagnetic switch, and a second electromagnetic switch.

[0075] The input end of the first switch circuit is electrically connected to the first output end of the MCU; the output end of the first switch circuit is electrically connected to the first electromagnetic switch to control the on / off of the current of the first electromagnetic switch; the first electromagnetic switch is used to magnetically attract a connecting member 330 of a heat transfer component 300, so that the corresponding first heat transfer member 310 is connected to the corresponding second heat transfer member 320. The input end of the second switch circuit is electrically connected to the second output end of the MCU; the output end of the second switch circuit is electrically connected to the second electromagnetic switch and is used to control the on / off of the current of the second electromagnetic switch; the second electromagnetic switch is used to magnetically attract a connecting member 330 of another heat transfer component 300, so that the corresponding first heat transfer member 310 is connected to the corresponding second heat transfer member 320.

[0076] In this embodiment, the MCU can output a first control signal through the first level signal fed back by the temperature detection unit to control the first switch circuit and the second switch circuit, so that one of the first electromagnetic switch and the second electromagnetic switch is powered on and the other is powered off, thereby realizing the selection of the heating method.

[0077] Further, the temperature detection unit includes a thermistor or a temperature sensor.

[0078] As Figure 5 and Figure 6 shown, further, the first switch circuit includes a resistor R213, a capacitor C269, a resistor R11, a triode Q12, a relay K1, and a diode D6.

[0079] The input end of the resistor R213 is electrically connected to the first output end of the MCU, and the output end of the resistor R213 is electrically connected to the base B1 of the triode Q12, one end of the capacitor C269, and one end of the resistor R11 respectively; the other end of the capacitor C269, the other end of the resistor R11, and the emitter E2 of the triode Q12 are all grounded. The resistor R213 plays a role in voltage division and also forms an RC with the capacitor C269 to play a role in filtering. In addition, the capacitor C269 also plays a role in anti-shake.

[0080] The collector C3 of the triode Q12 is electrically connected to the fifth pin of the relay K1 and the positive pole of the diode D6 respectively; the second pin of the relay K1 is electrically connected to the power supply VDD and the negative pole of the diode D6 respectively; the power supply VDD is used to supply power to the coil of the relay K1; the first pin of the relay K1 is electrically connected to the first electromagnetic switch.

[0081] When the coil of relay K1 has current and the switch of relay K1 is connected to the first pin, the first electromagnetic switch is energized, and the armature of the first electromagnetic switch adsorbs the first iron sheet 331, so that the first iron sheet 331 connects the first sheet metal 321 and the fourth sheet metal 312. The heat of the first heat source 211 will be transferred to the chamber of the battery compartment 100 through the fourth sheet metal 312, the first iron sheet 331 and the first sheet metal 321, realizing the heating of the battery pack.

[0082] When it is necessary to cut off the current of the first electromagnetic switch, the switch of relay K1 is separated from the first pin, and the current in the coil of relay K1 is released through diode D6, playing a role in protecting the coil of relay K1.

[0083] The working process of the first switch circuit in this embodiment is as follows: when IN1 is at a high level, triode Q12 conducts, and the power supply VDD energizes the second pin and the fifth pin of relay K1. The switch of relay K1 is connected to the first pin, and the current OUT1_N flows to the coil of the first electromagnetic switch, so that the armature of the first electromagnetic switch adsorbs the first iron sheet 331. When IN1 is at a low level, triode Q12 is turned off, and the power supply VDD cannot energize the second pin and the fifth pin of relay K1. The switch of relay K1 is disconnected from the first pin, and the current OUT1_N cannot flow to the coil of the first electromagnetic switch, so that the current of the first electromagnetic switch is cut off, the armature of the first electromagnetic switch cannot adsorb the first iron sheet 331, and the first iron sheet 331 is separated from the fourth sheet metal 312.

[0084] As Figure 5 and Figure 7 shown, further, the second switch circuit includes resistor R2, capacitor C1, resistor R1, triode Q1, relay K2 and diode D1.

[0085] The input end of resistor R2 is electrically connected to the second output end of the MCU. The output end of resistor R2 is respectively electrically connected to the base B1 of triode Q1, one end of capacitor C1 and one end of resistor R1; the other end of capacitor C1, the other end of resistor R1 and the emitter E2 of triode Q1 are all grounded. Resistor R2 plays a role in voltage division and also forms an RC with capacitor C1 to play a role in filtering. In addition, capacitor C1 also plays a role in anti-shake.

[0086] The collector C3 of triode Q1 is respectively electrically connected to the fifth pin of relay K2 and the positive electrode of diode D1; the second pin of relay K2 is respectively electrically connected to the power supply VDD and the negative electrode of diode D1; the power supply VDD is used to supply power to the coil of relay K2; the first pin of relay K2 is electrically connected to the second electromagnetic switch.

[0087] When the coil of relay K2 has current and the switch of relay K2 is connected to the first pin, the second electromagnetic switch is powered on, and the armature of the second electromagnetic switch attracts the second iron sheet 332, so that the second iron sheet 332 connects the third sheet metal 311 and the second sheet metal 322. The heat of the fill light board 220 will be transferred to the chamber of the battery compartment 100 through the third sheet metal 311, the second iron sheet 332 and the second sheet metal 322, realizing the heating of the battery pack.

[0088] When it is necessary to cut off the current of the second electromagnetic switch, the switch of relay K2 is separated from the first pin, and the current in the coil of relay K2 is released through diode D1, which plays a role in protecting the coil of relay K2.

[0089] The working process of the second switch circuit in this embodiment is as follows: when IN2 is at a high level, triode Q1 conducts, and the power supply VDD supplies power to the second pin and the fifth pin of relay K2. The switch of relay K2 is connected to the first pin, and the current OUT2_N flows to the coil of the second electromagnetic switch, so that the armature of the second electromagnetic switch attracts the second iron sheet 332. When IN2 is at a low level, triode Q1 is turned off, and the power supply VDD cannot supply power to the second pin and the fifth pin of relay K2. The switch of relay K2 is disconnected from the first pin, and the current OUT2_N cannot flow to the coil of the second electromagnetic switch, so that the current of the second electromagnetic switch is cut off, the armature of the second electromagnetic switch cannot attract the second iron sheet 332, and the second iron sheet 332 is separated from the third sheet metal 311.

[0090] In some embodiments, the image acquisition device further includes a brightness detection unit; the brightness detection unit is electrically connected to the second input end of the MCU and is used to detect the brightness outside the housing.

[0091] In this embodiment, the MCU can output a second control signal through the second level signal fed back by the brightness detection unit to control the first switch circuit and the second switch circuit, so that one of the first electromagnetic switch and the second electromagnetic switch is powered on and the other is powered off, thereby realizing the selection of the heating method.

[0092] As Figure 5 shown, further, the brightness detection unit includes a photosensitive resistor (not shown in the figure) and a fourth switch circuit; the fourth switch circuit includes a resistor R5, a capacitor C2, a resistor R4, a triode Q2 and a resistor R3.

[0093] The output terminals of the photoresistor are electrically connected to one end of resistor R5, one end of capacitor C2, and one end of resistor R4 respectively. The other end of resistor R5 and the other end of capacitor C2 are grounded. The other end of resistor R4 is electrically connected to the base B1 of transistor Q2. The emitter E2 of transistor Q2 is grounded. The collector 3C of transistor Q2 is electrically connected to the second input terminal of the MCU and one end of resistor R3 respectively. The other end of resistor R3 is connected to the power supply VDD.

[0094] In this embodiment, when the brightness of the photoresistor reaches the brightness threshold, it outputs a high level. Transistor Q2 conducts, and the second input terminal of the MCU receives a low-level signal. When the ambient brightness of the photoresistor does not reach the brightness threshold, it outputs a low level, transistor Q2 is turned off, and the second input terminal of the MCU receives a high-level signal.

[0095] Exemplarily, if it is daytime, that is, when the brightness of the photoresistor reaches the brightness threshold, the second output terminal of the MCU receives a low-level signal, the first output terminal of the MCU outputs a high-level signal, and the second output terminal of the MCU outputs a low-level signal. That is, IN1 is at a high level and IN2 is at a low level. At this time, transistor Q12 conducts, and the power supply VDD supplies power to the second pin and the fifth pin of relay K1. The switch of relay K1 is connected to the first pin, and the current OUT1_N flows to the coil of the first electromagnetic switch, causing the armature of the first electromagnetic switch to adsorb the first iron sheet 331. At the same time, transistor Q1 is turned off, and the power supply VDD cannot supply power to the second pin and the fifth pin of relay K2. The switch of relay K2 is disconnected from the first pin, and the current OUT2_N cannot flow to the coil of the second electromagnetic switch, causing the current of the second electromagnetic switch to be cut off. The armature of the second electromagnetic switch cannot adsorb the second iron sheet 332, and the second iron sheet 332 is separated from the third sheet metal 311, thus realizing the selection of the heating method.

[0096] If it is night, that is, when the brightness of the photoresistor does not reach the brightness threshold, the second output terminal of the MCU receives a high-level signal, the first output terminal of the MCU outputs a low-level signal, and the second output terminal of the MCU outputs a high-level signal. That is, IN1 is at a low level and IN2 is at a high level. At this time, transistor Q12 is turned off, and the power supply VDD cannot supply power to the second pin and the fifth pin of relay K1. The switch of relay K1 is disconnected from the first pin, and the current OUT1_N cannot flow to the coil of the first electromagnetic switch, causing the current of the first electromagnetic switch to be cut off. The armature of the first electromagnetic switch cannot adsorb the first iron sheet 331, and the first iron sheet 331 is separated from the fourth sheet metal 312. At the same time, transistor Q1 conducts, and the power supply VDD supplies power to the second pin and the fifth pin of relay K2. The switch of relay K2 is connected to the first pin, and the current OUT2_N flows to the coil of the second electromagnetic switch, causing the armature of the second electromagnetic switch to adsorb the second iron sheet 332. Thus, the selection of the heating method is realized.

[0097] It should be noted that in this embodiment, the specific structures of the first switch circuit and the second switch circuit are not limited, as long as they can control the on / off of the current of the electromagnetic switch.

[0098] As Figure 1 and Figure 2 shown, in some embodiments, a second heat source is installed in the chamber; the heating selection unit further includes a third switch circuit; a first input end of the third switch circuit is electrically connected to a third output end of the MCU, a second input end of the third switch circuit is electrically connected to the battery pack, an output end of the third switch circuit is electrically connected to one end of the second heat source; the other end of the second heat source is grounded; the third switch circuit is used to control the battery pack to supply power to the second heat source.

[0099] In this embodiment, when the third switch circuit is turned on, the battery pack supplies power to the second heat source, and the second heat source heats up, realizing the heating of the chamber, and then heating up the battery pack. When the third switch circuit is turned off, the battery pack cannot supply power to the second heat source, and the second heat source stops heating the chamber.

[0100] It can be understood that the second heat source includes but is not limited to a resistance wire.

[0101] It should be noted that in this embodiment, the specific structure of the third switch circuit is not limited, as long as it can control the opening or closing of the control switch.

[0102] As Figure 5 and Figure 8 shown, further, the third switch circuit includes a resistor R90, a capacitor C91, a resistor 89, a triode Q8, and a MOS transistor Q9.

[0103] The input end of the resistor R90 is electrically connected to the third output end of the MCU, the output end of the resistor R90 is respectively electrically connected to one end of the capacitor C91, one end of the resistor R89, and the base B1 of the triode Q8, and the other end of the capacitor C91, the other end of the resistor R89, and the emitter E2 of the triode Q8 are all grounded. The resistor R90 plays a role in voltage division, and also forms an RC with the capacitor C91 to play a role in filtering. The capacitor C91 also plays a role in anti-shake. The resistor 89 can give an initial default value to the triode Q8 when the signal input to the triode Q8 is uncontrollable, or when the resistor R90 is powered on.

[0104] The collector 3C of the triode Q8 is electrically connected to the source S2 of the MOS tube Q9 through the resistor R99 and to the gate G1 of the MOS tube Q9 through the resistor R87 respectively. The resistors R99 and R87 can provide a loop for the gate G1 of the MOS tube Q9. Both ends of the capacitor C55 are electrically connected to the source S2 of the MOS tube Q9 and the gate G1 of the MOS tube Q9 respectively. The capacitor C55 can control the conduction speed of the MOS tube Q9.

[0105] The source S2 of the MOS tube Q9 is also electrically connected to the battery pack, one end of the capacitor C58 and one end of the capacitor C112 respectively. The other ends of the capacitor C58 and the capacitor C112 are both grounded. Among them, the capacitance values of the capacitor C58 and the capacitor C112 are different, and they play different degrees of filtering roles respectively.

[0106] The drain D3 of the MOS tube Q9 is electrically connected to one end of the capacitor C83, one end of the capacitor C233 and one end of the second heat source respectively. The other ends of the capacitor C83, the capacitor C233 and the second heat source are all grounded. Among them, the capacitance values of the capacitor C83 and the capacitor C233 are different, and they play different degrees of filtering roles respectively.

[0107] The working process of the third switching circuit in this embodiment is as follows: when a high level is output at the third output end of the MCU, that is, when HEAT_CTPL is high, the triode Q8 conducts, and the MOS tube Q9 also conducts. The battery pack can supply power to the second heat source, and the second heat source heats up to realize the heating of the chamber. When a low level is output at the third output end of the MCU, that is, when HEAT_CTPL is low, the triode Q8 disconnects, and the MOS tube Q9 also disconnects. The battery pack cannot supply power to the second heat source.

[0108] As Figure 2 、 Figure 4 and Figure 5 shown, in some embodiments, the image acquisition device further includes an SOC; the SOC is electrically connected to the MCU to achieve hang-up protection.

[0109] Among them, the SOC is called a system-on-chip, also known as a system-on-a-chip. It is an integrated circuit with a dedicated target, which contains a complete system and all the content of the embedded software.

[0110] In this embodiment, the SOC can periodically send a high-level value to the MCU, and the MCU can confirm that the SOC is working properly based on this. When the SOC hangs, the periodic sending stops, and the MCU determines that the SOC has crashed and cuts off all heating paths to avoid overheating. The MCU can periodically send a high-level value back to the SOC, and the SOC can confirm that the MCU is working properly based on this. When the MCU hangs, the periodic sending stops, and the SOC determines that the MCU has crashed. At this time, the entire MCU system can be reset through a hard reset such as power supply. When the MCU is in a hanging or uncontrollable state, the heating selection circuit defaults to cutting off each heating path to prevent the battery pack from overheating and causing dangerous accidents during system anomalies.

[0111] Furthermore, the image acquisition device further includes a reset circuit; the input end of the reset circuit is electrically connected to the reset pin of the SOC, and the output end of the reset circuit is electrically connected to the reset pin of the MCU. By setting up the reset circuit, when the MCU hangs, the MCU can be reset to cut off each heating path, thereby preventing the battery pack from overheating and causing dangerous accidents during system anomalies.

[0112] A reset circuit is a circuit device used to restore a circuit to its initial state. In this embodiment, no specific structural form of the reset circuit is limited, as long as it can restore the MCU to its initial state.

[0113] Such as Figure 4 and Figure 5 As shown, furthermore, the reset circuit includes resistor R171, capacitor C143, resistor R176, triode Q13, and resistor 58.

[0114] The input end of resistor R171 is electrically connected to the reset pin of the SOC. The output end of resistor R171 is respectively electrically connected to one end of capacitor C143, one end of resistor R176, and the base B1 of triode Q13. The other end of capacitor C143, the other end of resistor R176, and the emitter E2 of triode Q13 are all grounded. Resistor R171 and resistor R176 are used in combination to have a voltage-dividing effect; they also form an RC with capacitor C143 to play a filtering role. When the reset pin of the SOC is uncontrollable, or rather, when the SOC is powered on, resistor R176 can give triode Q13 an initial default value. Capacitor C143 also plays a role in debouncing.

[0115] The collector of triode Q13 is respectively electrically connected to the reset pin of the MCU and one end of resistor R58, and the other end of resistor R58 is connected to power supply VDD.

[0116] The working process of the reset circuit in this embodiment is as follows: when the reset pin of the SOC outputs a high level, that is, when RST is high, the triode Q13 conducts, and the reset pin of the MCU receives a low level, that is, RST_S is low. When the reset pin of the SOC outputs a low level, that is, when RST is low, the triode Q13 disconnects, and the reset pin of the MCU receives a high level, that is, RST_S is high.

[0117] When the SOC hangs, the reset pin of the SOC outputs a high level, the reset pin of the MCU receives a low level, and the MCU is reset.

[0118] That is to say, when the SOC is in the normal state, the reset pin of the SOC outputs a low level, the reset pin of the MCU receives a high level, and the MCU does not need to be reset.

[0119] In some embodiments, the image acquisition device includes a camera, a camera or a video camera. Preferably, the image acquisition device is a camera or a camera.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An image acquisition device, characterized in that, Comprising: A housing having a receiving cavity; A battery compartment (100) disposed in the receiving cavity for receiving a battery pack; A heat source assembly (200) including a heat source structure (210) and / or a supplementary light board (220); the heat source structure (210) includes a first heat source (211) and a light condensing member (212); the first heat source (211) is located in the receiving cavity and is connected to the housing; the light condensing member (212) is located on one side of the first heat source (211) for condensing the light outside the housing onto the first heat source (211) to raise the temperature of the first heat source (211); the supplementary light board (220) is mounted on the housing; A heat transfer assembly (300), one end of the heat transfer assembly (300) is connected to the heat source assembly (200), and the other end is located in the compartment of the battery compartment (100) for transferring the heat of the heat source assembly (200) to the compartment to heat the battery pack.

2. The image acquisition device according to claim 1, wherein The heat transfer assembly (300) includes: A first heat transfer member (310) connected to the heat source assembly (200); A second heat transfer member (320) mounted on the body of the battery compartment (100), one end of the second heat transfer member (320) is located in the compartment; A connecting member (330), the other end of the second heat transfer member (320) is detachably connected to the first heat transfer member (310) through the connecting member (330).

3. The image acquisition device according to claim 2, wherein There are two such heat transfer assemblies (300), the first heat transfer member (310) of one heat transfer assembly (300) is connected to the first heat source (211), and the first heat transfer member (310) of the other heat transfer assembly (300) is connected to the supplementary light board (220); one ends of the second heat transfer members (320) of the two heat transfer assemblies (300) are both located in the compartment, and the other ends are both detachably connected to the corresponding first heat transfer members (310) through the corresponding connecting members (330).

4. The image acquisition device according to claim 3, characterized in that, Further comprising: A temperature detection unit electrically connected to the first input end of the MCU for detecting the temperature of the compartment; A heating selection unit including a first switch circuit, a second switch circuit, a first electromagnetic switch and a second electromagnetic switch; The input end of the first switch circuit is electrically connected to the first output end of the MCU; the output end of the first switch circuit is electrically connected to the first electromagnetic switch to control the on / off of the current of the first electromagnetic switch; the first electromagnetic switch is used to magnetically attract the connecting member (330) of one heat transfer assembly (300) to connect the corresponding first heat transfer member (310) and the corresponding second heat transfer member (320); The input end of the second switch circuit is electrically connected to the second output end of the MCU; the output end of the second switch circuit is electrically connected to the second electromagnetic switch, and is used to control the on / off of the current of the second electromagnetic switch; the second electromagnetic switch is used to magnetically attract the connecting member (330) of the other heat transfer component (300), so that the corresponding first heat transfer member (310) is connected to the corresponding second heat transfer member (320).

5. The image acquisition device according to claim 4, wherein It further includes: A brightness detection unit, which is electrically connected to the second input end of the MCU and is used to detect the brightness outside the housing.

6. The image acquisition device according to claim 4, wherein, A second heat source is installed in the chamber; the heating selection unit further includes a third switch circuit; The first input end of the third switch circuit is electrically connected to the third output end of the MCU, the second input end of the third switch circuit is electrically connected to the battery pack, and the output end of the third switch circuit is electrically connected to one end of the second heat source; the other end of the second heat source is grounded; the third switch circuit is used to control the battery pack to supply power to the second heat source.

7. The image acquisition device according to claim 4, characterized in that, It further includes: An SOC, which is electrically connected to the MCU to achieve hang-up protection.

8. The image acquisition device according to claim 7, wherein It further includes: A reset circuit, the input end of the reset circuit is electrically connected to the reset pin of the SOC, and the output end of the reset circuit is electrically connected to the reset pin of the MCU.

9. The image acquisition device according to claim 2, wherein It further includes: A limiting component (400), the second heat transfer member (320) and the chamber body are in limiting cooperation through the limiting component (400), and the limiting component (400) is used to adjust the depth of the second heat transfer member (320) entering the chamber body.

10. The image acquisition device according to any one of claims 1 to 9, characterized in that, The first heat source (211) is connected to the housing through a heat insulation member.

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