Split type radiator
The high-temperature and sub-high-temperature areas of the circuit board are dissipated separately through a split radiator, and heat transfer is reduced by using heat insulation parts, which solves the local high-temperature problem of the circuit board and ensures that the chips in each area are stable.
Patent Information
- Application Number
- CN202422068435.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-08-23
AI Technical Summary
In the prior art, local high-temperature hotspots in the circuit board of the energy storage room lead to a shortening of the service life of the circuit board, and the integrated radiator cannot effectively distinguish the heat dissipation needs in different areas, resulting in the overtemperature of the high-temperature area affecting the normal operation of the low-temperature area.
A split radiator is adopted, including a first heat dissipation module and a second heat dissipation module. The first module has a stronger heat dissipation ability than the second module. The two are separated by heat insulation to reduce heat transfer, and heat dissipation is performed according to the high temperature and sub-high temperature areas of the circuit board respectively.
It effectively reduces the impact of heat in the high-temperature area on the sub-high-temperature area, keeping each area of the circuit board within a suitable temperature range, ensuring the stable operation of each chip.
Smart Images
Figure CN223125186U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of radiators, and particularly to a split radiator.
Background Art
[0002] With the development of energy storage computer rooms towards integration, the heat flux density generated by them is getting higher and higher, so the heat dissipation requirements for energy storage computer rooms are also getting higher and higher. For this reason, radiators are installed at the circuit boards of energy storage computer rooms to dissipate heat from the circuit boards. The radiators have multiple heat dissipation fins, and the heat generated by the heating components of the circuit board is transferred to the heat dissipation fins; when the fluid passes through the surface of the heat dissipation fins, heat convection occurs between the fluid and the surface of the heat dissipation fins, so that the fluid can take away the heat on the heat dissipation fins, and then dissipate heat from the circuit board. However, when the heat source is relatively concentrated, local high-temperature hot spots are likely to appear on the circuit board, affecting the service life of the circuit board.
[0003] In related technologies, heat pipes or heat pipes are added to the radiator to enhance the heat dissipation effect, so as to reduce the temperature of the locally high-temperature position on the circuit board, but this causes the temperature of other positions on the circuit board to exceed the tolerable temperature, thus still affecting the service life of the circuit board.
Utility Model Content
[0004] The main purpose of this application is to provide a split radiator, aiming to set heat dissipation modules with different heat dissipation capabilities according to the heat dissipation requirements of different positions of the circuit board, and separate the two connected by a heat insulation member to reduce the possibility of heat transfer from the first heat dissipation module to the second heat dissipation module, so that the second heat dissipation module is within its preset temperature range, so that the positions on the circuit board with relatively small heat dissipation requirements can maintain a stable working state.
[0005] To achieve the above object, this application provides a split radiator, which is applied to a circuit board. The split radiator includes:
[0006] A first heat dissipation module;
[0007] A second heat dissipation module, which is detachably connected to the first heat dissipation module, and the heat dissipation capacity of the first heat dissipation module is greater than that of the second heat dissipation module;
[0008] A heat insulation member, which is arranged at the connection between the first heat dissipation module and the second heat dissipation module, and the heat insulation member is used to prevent the heat of the first heat dissipation module from being transferred to the second heat dissipation module.
[0009] In some embodiments, the first heat dissipation module includes a first substrate and a plurality of first heat dissipation fins. The plurality of first heat dissipation fins are respectively disposed on the first substrate. The second heat dissipation module includes a second substrate and a plurality of second heat dissipation fins. The plurality of second heat dissipation fins are respectively disposed on the second substrate. And the second substrate is detachably connected to the first substrate. The heat insulation member is disposed at the connection between the first substrate and the second substrate.
[0010] In some embodiments, it is defined that the total area of the plurality of first heat dissipation fins is S1, and the total area of the plurality of second heat dissipation fins is S2, satisfying the relationship S1 > S2.
[0011] In some embodiments, the first heat dissipation module further includes a first heat pipe, and the first heat pipe is disposed at the bottom of the first substrate.
[0012] In some embodiments, the first heat dissipation fins are arranged in a straight tooth shape or a special tooth shape, and the second heat dissipation fins are arranged in a straight tooth shape or a special tooth shape.
[0013] In some embodiments, the thermal conductivity coefficients of the first substrate and the second substrate are both greater than that of the heat insulation member.
[0014] In some embodiments, the first substrate is provided with a first connection side, and the second substrate is provided with a second connection side. Both the first connection side and the second connection side are arranged in a stepped shape. The second connection side is detachably connected to the first connection side, and at least part of the second connection side is spaced from the first connection side.
[0015] In some embodiments, the first heat dissipation module further includes a plurality of connection parts. The plurality of connection parts are respectively connected to the first substrate and are spaced on the first connection side. And the plurality of connection parts are respectively provided with first connection holes. The second connection side of the second substrate is provided with a plurality of second connection holes at intervals. There are a plurality of heat insulation members, and the plurality of heat insulation members are respectively disposed between each of the first connection holes and each of the second connection holes;
[0016] The split radiator further includes a plurality of fasteners, and the plurality of fasteners respectively pass through each of the first connection holes, each of the heat insulation members, and each of the second connection holes.
[0017] In some embodiments, the lower surface of the second substrate is provided with a plurality of recesses. The positions of the plurality of recesses are correspondingly arranged with the positions of the plurality of second connection holes. The plurality of connection parts respectively protrude from the first connection side and are respectively located in the plurality of recesses. The upper surface of each heat insulation member contacts the inner wall of each recess, and the lower surface of each heat insulation member contacts each connection part.
[0018] In some embodiments, the heat insulation member is made of plastic; alternatively, the heat insulation member is made of rubber.
[0019] To achieve the above object, for the split radiator proposed in the present application, the two heat dissipation modules dissipate heat from the chips at different positions on the circuit board. Since the heat dissipation capacity of the first heat dissipation module is greater than that of the second heat dissipation module, the first heat dissipation module can be correspondingly connected to the high-temperature area of the circuit board, and the second heat dissipation module can be correspondingly connected to the sub-high-temperature area of the circuit board. Because the two are in a split state and each dissipates heat from the temperature area with a matching temperature, the temperature influence of the high-temperature area on the sub-high-temperature area can be reduced. To further reduce the temperature transfer between the two heat dissipation modules, a heat insulation member is provided at the connection between the first heat dissipation module and the second heat dissipation module. With this arrangement, the first heat dissipation module and the second heat dissipation module do not directly contact, but contact the opposite two sides of the heat insulation member. Since the thermal conductivity coefficient of the heat insulation member is much smaller than that of the first heat dissipation module and the second heat dissipation module, the heat transfer from the first heat dissipation module and the second heat dissipation module to the heat insulation member is relatively slow, reducing the temperature influence of the first heat dissipation module on the second heat dissipation module, so that the sub-high-temperature area of the circuit board can be within a preset temperature range value, and each chip in this area can work stably; at the same time, each chip arranged in the high-temperature area of the circuit board can also be in a stable working state.
Description of the Drawings
[0020] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0021] Figure 1 It is a schematic diagram of the overall structure of the split radiator provided by the embodiment of the present application.
[0022] Figure 2 It is an exploded perspective view of the split radiator provided by the embodiment of the present application.
[0023] Figure 3 It is a top view of the split radiator provided by the embodiment of the present application.
[0024] Figure 4 For Figure 2 the perspective view of the first heat dissipation module in
[0025] Figure 5 For Figure 2 the perspective view of the second heat dissipation module in
[0026] Figure 6 This is a sectional partial structure diagram of the split radiator provided by the embodiment of the present application.
[0027] Figure 7 For Figure 2 Another perspective three-dimensional view of the second heat dissipation module in
[0028] Reference numerals in the drawings:
[0029] 1. First heat dissipation module; 11. First substrate; 110. First connection side; 12. First heat dissipation fins; 13. Connection part; 131. First connection hole; 14. First heat pipe; 2. Second heat dissipation module; 21. Second substrate; 210. Second connection side; 211. Second connection hole; 212. Concave position; 22. Second heat dissipation fins; 3. Heat insulation member; 4. Fastening member; 100. Split radiator.
Detailed implementation manners
[0030] For a better understanding of the technical solution of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0031] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.
[0032] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "the" and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0033] It should be understood that the term " / and" used herein is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.
[0034] In the related art, when dissipating heat from multiple chips on a circuit board, an integrated heat sink is often used. When the heat flux density of a certain chip on the circuit board is too high, heat pipes or vapor chambers are arranged on the substrate to enhance the heat conduction process, thereby reducing the temperature of the chip. However, since the temperatures that the chip regions on the circuit board can withstand are not the same, during the process of enhancing heat conduction, the temperature of the heat sink will rise, and the parts of the heat sink in contact with the circuit board are basically within the same temperature range. Then, for the chip regions that can withstand lower temperatures, the temperature of the heat sink at this time has exceeded the range value they can withstand, which will affect the operation of the chips. Exemplarily, some high-power chips can withstand a temperature of 150°C, while some low-power chips can only withstand 110°C or even lower temperatures. When using an integrated heat sink, the entire heat sink may be at a relatively high temperature (for example, 115°C), which results in a large temperature margin for high-power chips, but the low-power chips are overheated.
[0035] For this reason, referring to Figure 1 , the present application discloses a split heat sink 100 applied to a circuit board. The split heat sink 100 includes a heat insulation member 3 ( Figure 2 shown in) and a first heat dissipation module 1 and a second heat dissipation module 2 that are detachably connected. The heat dissipation capacity of the first heat dissipation module 1 is greater than that of the second heat dissipation module 2; the heat insulation member 3 is arranged at the connection between the first heat dissipation module 1 and the second heat dissipation module 2 to reduce the heat transferred from the first heat dissipation module 1 to the second heat dissipation module 2 through the heat insulation member 3.
[0036] This embodiment is described with two heat dissipation modules.
[0037] The heat sink of the present application includes two detachably connected heat dissipation modules, and the two heat dissipation modules dissipate heat from chips at different positions on the circuit board respectively. Since the heat dissipation capacity of the first heat dissipation module 1 is greater than that of the second heat dissipation module 2, the first heat dissipation module 1 can be correspondingly connected to the high-temperature area of the circuit board, and the second heat dissipation module 2 can be correspondingly connected to the sub-high-temperature area of the circuit board. And because the two are in a split state and dissipate heat from the temperature regions that match the temperature respectively, the temperature influence of the high-temperature area on the sub-high-temperature area can be reduced.
[0038] In order to further reduce the temperature transfer between the two heat dissipation modules, a heat insulation member 3 is provided at the connection between the first heat dissipation module 1 and the second heat dissipation module 2. With this arrangement, the first heat dissipation module 1 and the second heat dissipation module 2 do not come into direct contact, but are respectively in contact with the opposite two surfaces of the heat insulation member 3. Since the thermal conductivity coefficient of the heat insulation member 3 is much smaller than that of the first heat dissipation module 1 and the second heat dissipation module 2, the heat transfer from the first heat dissipation module 1 and the second heat dissipation module 2 to the heat insulation member 3 is relatively slow, increasing the thermal resistance between the two heat dissipation modules, that is, reducing the influence of the temperature of the first heat dissipation module 1 on the temperature of the second heat dissipation module 2, so that the sub-high temperature area of the circuit board can be within the preset temperature range value, and each chip in this area can work stably; at the same time, each chip arranged in the high temperature area of the circuit board can also be in a stable working state.
[0039] It can be known that the material of the heat insulation member 3 can be plastic or rubber, or other flexible materials with relatively low thermal conductivity coefficients, which are not limited here.
[0040] For ease of description, in this article, the split radiator is simply referred to as the radiator, and when the first heat dissipation module 1 and the second heat dissipation module 2 are mentioned at the same time, they are simply referred to as the two heat dissipation modules, and so on; the first direction mentioned in this article is the arrangement direction of the fins, the second direction is the height direction of the fins, and the third direction is the length direction of the fins, that is Figure 1 the X direction, Y direction and Z direction in
[0041] Refer to Figure 2 for a description of the specific structures of the first heat dissipation module 1 and the second heat dissipation module 2.
[0042] In some embodiments of the present application, the first heat dissipation module 1 includes a first substrate 11 and a plurality of first heat dissipation fins 12 provided on the first substrate 11, the second heat dissipation module 2 includes a second substrate 21 and a plurality of second heat dissipation fins 22 provided on the second substrate 21, the first substrate 11 and the second substrate 21 are detachably connected, and the heat insulation member 3 is arranged at the connection between the first substrate 11 and the second substrate 21. Among them, the total area of the plurality of first heat dissipation fins 12 is defined as S1, and the total area of the plurality of second heat dissipation fins 22 is defined as S2, satisfying the relationship S1 > S2.
[0043] In this embodiment, the first substrate 11 serves as the support structure of the first heat dissipation module 1, which is used to provide installation positions for a plurality of first heat dissipation fins 12, and each first heat dissipation fin 12 is arranged at intervals; the first substrate 11 can be detachably connected to the circuit board and is located in the high-temperature area of the circuit board. The heat generated by the chips in this area is transferred to the plurality of first heat dissipation fins 12 through the first substrate 11, and the first heat dissipation fins 12 exchange heat between the received heat and the air to reduce the temperature of the chips in this area. It can be known that the materials of the first substrate 11 and the first heat dissipation fins 12 can both be aluminum or copper, or other materials with good thermal conductivity, which are not limited herein. The first heat dissipation fins 12 are arranged at intervals along the first direction, and the intervals between two adjacent first heat dissipation fins 12 can be set to be equal, that is, the first heat dissipation fins 12 are arranged at equal intervals, so as to reduce the processing cost. The distance between two adjacent first heat dissipation fins 12 can be set according to different fin sizes and chip specifications to achieve the optimal heat exchange capacity, which is not limited herein. Of course, the first substrate 11 and the plurality of first heat dissipation fins 12 can be fixedly connected by welding, or the two can be integrally formed, which is not limited herein. Of course, in order to further improve the heat dissipation performance of the first heat dissipation module 1, a liquid cooling channel can be arranged in the first substrate 11, and the liquid cooling channel can be bent to fully contact each part of the high-temperature area of the circuit board so that the temperatures of each part in the high-temperature area are basically kept the same. In addition, a first heat pipe 14 can also be arranged, and the first heat pipe 14 is arranged at the outer bottom of the first substrate 11. The shape of the first heat pipe 14 can be bent, such as U-shaped, etc. By arranging the first heat pipe 14, the temperature uniformity of the first heat dissipation module 1 can also be improved.
[0044] It can be understood that the connection relationships, functions, and beneficial effects among the components of the second heat dissipation module 2 can all refer to the connection relationships, functions, and beneficial effects among the components of the first heat dissipation module 1, and will not be elaborated herein one by one.
[0045] It can be known that in the comparison between the first heat dissipation module 1 and the second heat dissipation module 2, since the first heat dissipation module 1 has a larger total heat dissipation fin area S1, it is more suitable for the high-temperature area of the circuit board.
[0046] At the same time, refer to Figure 2 and Figure 3 , the specific structures of the first substrate 11, the first heat dissipation fins 12, the second substrate 21, and the second heat dissipation fins 22 are described.
[0047] In some embodiments of the present application, the first substrate 11 is provided with a first connection side 110, and the second substrate 21 is provided with a second connection side 210. Both the first connection side 110 and the second connection side 210 are arranged in a stepped shape, and the second connection side 210 is detachably connected to the first connection side 110. At least part of the second connection side 210 and the first connection side 110 are arranged at intervals, that is, there is at least a gap A between the second connection side 210 and the first connection side 110. The lengths of the plurality of first heat dissipation fins 12 gradually increase along the Figure 1 +X direction in Figure 1 , and the lengths of the plurality of second heat dissipation fins 22 gradually decrease along the +X direction in
[0048] In this embodiment, along the third direction, the lengths of the plurality of first heat dissipation fins 12 are adjusted according to their positions on the first substrate 11. When the first substrate 11 is arranged in a stepped shape, the lengths of the plurality of first heat dissipation fins 12 are also arranged in a stepped shape. The lengths of the plurality of second heat dissipation fins 22 are adjusted according to their positions on the second substrate 21. When the second substrate 21 is arranged in a stepped shape, the lengths of the plurality of second heat dissipation fins 22 are also arranged in a stepped shape. In this embodiment, by setting both the first substrate 11 and the second substrate 21 as stepped structures, the mating connection between the first substrate 11 and the second substrate 21 is facilitated, so that the space can be fully utilized to arrange the fins, increasing the overall heat dissipation area and thus improving the heat exchange capacity. Of course, the first heat dissipation fins 12 and the second heat dissipation fins 22 can be straight-toothed or of different tooth shapes, which are not limited herein.
[0049] Referring to Figures 4 to 6 , the connection relationship between the heat insulation member 3, the first heat dissipation module 1 and the second heat dissipation module 2 will be described.
[0050] In some embodiments of the present application, the split radiator 100 further includes fasteners 4. The first heat dissipation module 1 further includes a plurality of connecting parts 13, which are respectively connected to the first substrate 11 and are spaced apart on the first connection side 110, and a plurality of first connection holes 131 are respectively formed in the plurality of connecting parts 13. A plurality of second connection holes 211 are provided on the second connection side 210. A plurality of heat insulation members 3 are provided, and the plurality of heat insulation members 3 are respectively disposed between each first connection hole 131 and each second connection hole 211. A plurality of fasteners 4 respectively pass through each first connection hole 131, each heat insulation member 3 and each second connection hole 211 to connect the first substrate 11 and the second substrate 21. In other embodiments, the split radiator 100 further includes fasteners 4. The second heat dissipation module 2 further includes a plurality of connecting parts 13, which are respectively connected to the second substrate 21 and are spaced apart on the second connection side 210, and a plurality of second connection holes are respectively formed in the plurality of connecting parts 13. A plurality of first connection holes are provided on the first connection side 110. A plurality of heat insulation members 3 are provided, and the plurality of heat insulation members 3 are respectively disposed between each first connection hole and each second connection hole. A plurality of fasteners 4 respectively pass through each first connection hole, each heat insulation member 3 and each second connection hole to connect the first substrate 11 and the second substrate 21.
[0051] Referring simultaneously to Figure 5 and Figure 7 , a plurality of recesses 212 are provided on the lower surface of the second substrate 21, and the positions of the plurality of recesses 212 are correspondingly arranged with the positions of the plurality of second connection holes 211. The plurality of connecting parts 13 respectively protrude from the first connection side 110, and the plurality of connecting parts 13 are respectively located in the plurality of recesses 212. The upper surface of each heat insulation member 3 contacts the inner wall of each recess 212, and the lower surface of each heat insulation member 3 contacts each connecting part 13, so as to separate the direct contact between the first substrate 11 and the second substrate 21 through the heat insulation member 3.
[0052] In this embodiment, the fasteners 4 can be screws or bolts. At this time, the heat insulation members 3 can be cylindrical in shape to match the shape of the bolts and improve the assembly efficiency. In this embodiment, the position of the heat insulation members 3 can be at the first heat dissipation fins 12 or the second heat dissipation fins 22.
[0053] In this embodiment, in combination with the solution that both the first substrate 11 and the second substrate 21 are stepped, the number of the heat insulation members 3, the fasteners 4 and the two mounting holes are all set to be multiple to further improve the connection stability between the two substrates.
[0054] In some embodiments of the present application, the number of the first heat dissipation modules 1 is multiple, and the number of the second heat dissipation modules 2 is multiple; the first heat dissipation module 1 includes a first heat pipe 14, the second heat dissipation module 2 includes a second heat pipe, the first heat pipe 14 is connected to the bottom of the plurality of first heat dissipation modules 1, and the second heat pipe is connected to the bottom of the plurality of second heat dissipation modules 2.
[0055] In this embodiment, the number of both heat dissipation modules is multiple. Multiple first heat dissipation modules 1 correspond to the high-temperature areas of the circuit board, and multiple second heat dissipation modules 2 correspond to the sub-high-temperature areas of the circuit board. The temperature of multiple first heat dissipation modules 1 is basically maintained at the same level through the first heat pipe 14, and the temperature of multiple second heat dissipation modules 2 is basically maintained at the same level through the second heat pipe, so that both groups of heat dissipation modules can work according to the corresponding temperature areas to meet the heat dissipation requirements of the chips in each area of the circuit board.
[0056] The number of the two heat dissipation modules can be increased or decreased according to the requirements of the circuit board to be cooled.
[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A split radiator, applied to a circuit board, characterized in that The split radiator includes: A first heat dissipation module; A second heat dissipation module, which is detachably connected to the first heat dissipation module, and the heat dissipation capacity of the first heat dissipation module is greater than that of the second heat dissipation module; A heat insulation member, which is disposed at the connection between the first heat dissipation module and the second heat dissipation module, and the heat insulation member is used to prevent the heat of the first heat dissipation module from being transferred to the second heat dissipation module.
2. The split radiator according to claim 1, wherein The first heat dissipation module includes a first substrate and a plurality of first heat dissipation fins, and the plurality of first heat dissipation fins are respectively disposed on the first substrate. The second heat dissipation module includes a second substrate and a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins are respectively disposed on the second substrate. The second substrate is detachably connected to the first substrate, and the heat insulation member is disposed at the connection between the first substrate and the second substrate.
3. The split radiator according to claim 2, wherein Define the total area of the plurality of first heat dissipation fins as S1, and the total area of the plurality of second heat dissipation fins as S2, satisfying the relationship S1 > S2.
4. The split radiator according to claim 2, wherein The first heat dissipation module further includes a first heat pipe, and the first heat pipe is disposed at the bottom of the first substrate.
5. The split radiator according to claim 2, wherein The first heat dissipation fins are arranged in a straight tooth shape or a different tooth shape, and the second heat dissipation fins are arranged in a straight tooth shape or a different tooth shape.
6. The split radiator according to claim 2, characterized in that, The thermal conductivity coefficients of the first substrate and the second substrate are both greater than that of the heat insulation member.
7. The split radiator according to claim 2, wherein The first substrate is provided with a first connection side, and the second substrate is provided with a second connection side. Both the first connection side and the second connection side are arranged in a stepped shape. The second connection side is detachably connected to the first connection side, and at least part of the second connection side is spaced from the first connection side.
8. The split radiator according to claim 7, wherein The first heat dissipation module further includes a plurality of connection parts, and the plurality of connection parts are respectively connected to the first substrate and are spaced on the first connection side. The plurality of connection parts are respectively provided with first connection holes. The second connection side of the second substrate is provided with a plurality of second connection holes at intervals. There are a plurality of heat insulation members, and the plurality of heat insulation members are respectively disposed between each of the first connection holes and each of the second connection holes; The split radiator further includes a plurality of fasteners, and the plurality of fasteners respectively pass through each of the first connection holes, each of the heat insulation members and each of the second connection holes.
9. The split radiator according to claim 8, wherein The lower surface of the second substrate is provided with a plurality of recesses, and the positions of the plurality of recesses are correspondingly arranged with the positions of the plurality of second connection holes. The plurality of connection parts respectively protrude from the first connection side and are respectively located in the plurality of recesses. The upper surface of each heat insulation member is in contact with the inner wall of each recess, and the lower surface of each heat insulation member is in contact with each connection part.
10. The split radiator according to any one of claims 1 to 9, characterized in that The material of the heat insulation member is plastic; or, the material of the heat insulation member is rubber.