Liquid cooling assembly

Abstract

The utility model discloses a liquid cooling assembly, and relates to the technical field of heat dissipation, the liquid cooling assembly comprises a substrate and a cover plate, and the substrate is provided with a plurality of heat dissipation columns in a protruding manner; the cover plate covers the base plate, the cover plate and the base plate define a containing cavity, and a liquid inlet and a liquid outlet which are used for being communicated with the containing cavity are formed in the cover plate; wherein the heat dissipation columns are distributed in an array gradient mode, the density of the heat dissipation columns is in an increasing trend in the direction from a liquid inlet to a liquid outlet, the technical problem that the heat exchange efficiency is reduced in the flowing process of a heat dissipation medium in an existing liquid cooling plate due to the fact that the structural design of the existing liquid cooling plate is unreasonable is solved, and the technical effect of improving the heat exchange efficiency of the liquid cooling assembly is achieved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to a liquid cooling component. Background Art

[0002] In the prior art, for the heat dissipation problems of high-power chips such as CPUs (Central Processing Units) and GPUs (Graphics Processing Units) inside servers and data centers, liquid cooling technology has gradually replaced the existing air cooling method as the mainstream solution. In particular, as the core component of the liquid cooling system, the liquid cooling plate can efficiently transfer heat to the heat dissipation medium by directly contacting the chip, and then take out the heat through the circulating flow of the heat dissipation medium, effectively reducing the operating temperature of the chip. However, the structural design of the existing liquid cooling plate is unreasonable, resulting in a reduction in the heat exchange efficiency during the flow of the heat dissipation medium in the liquid cooling plate. Summary of the Utility Model

[0003] This application provides a liquid cooling component to at least solve the problem in the related art that the unreasonable structural design of the liquid cooling plate leads to a reduction in the heat exchange efficiency during the flow of the heat dissipation medium in the liquid cooling plate.

[0004] This application provides a liquid cooling component, including a substrate and a cover plate. Among them, a plurality of heat dissipation columns are convexly arranged on the substrate; the cover plate covers the substrate and encloses a containing cavity with the substrate, and a liquid inlet and a liquid outlet for communicating with the containing cavity are opened on the cover plate; wherein, the heat dissipation columns are arranged in an array gradient, and the density of the heat dissipation columns shows an increasing trend in the direction from the liquid inlet to the liquid outlet.

[0005] In an exemplary embodiment, the liquid cooling component has a plurality of array regions, which are distributed in the direction from the liquid inlet to the liquid outlet, and each array region has a plurality of heat dissipation columns; wherein, the diameters of the heat dissipation columns in the same array region are equal; and / or, in the direction from the liquid inlet to the liquid outlet, the diameters of the heat dissipation columns in different array regions are gradually decreased.

[0006] In an exemplary embodiment, the liquid cooling component has a plurality of array regions, which are distributed in the direction from the liquid inlet to the liquid outlet, and each array region has a plurality of heat dissipation columns; wherein, the heat dissipation columns in the same array region are arranged crosswise in the length direction and / or the width direction of the substrate; and / or, the heat dissipation columns in different array regions are arranged crosswise in the length direction and / or the width direction of the substrate.

[0007] In an exemplary embodiment, at least some of the plurality of heat dissipation columns are provided with diversion holes, and the diversion holes extend along the radial direction of the heat dissipation column and penetrate through the radial two side surfaces of the heat dissipation column.

[0008] In an exemplary embodiment, the extending direction of the diversion holes is the same as the direction from the liquid inlet to the liquid outlet.

[0009] In an exemplary embodiment, at least one diversion hole is formed on the same heat dissipation column; or, at least two diversion holes are formed on the same heat dissipation column, and the at least two diversion holes are arranged at intervals along the axial direction of the heat dissipation column, and the hole axes of the at least two diversion holes are parallel to each other.

[0010] In an exemplary embodiment, the liquid cooling assembly has a plurality of array regions, the plurality of array regions are distributed along the direction from the liquid inlet to the liquid outlet, and each array region has a plurality of heat dissipation columns; wherein, the apertures of the diversion holes on the heat dissipation columns in the same array region are the same; and / or, in the direction from the liquid inlet to the liquid outlet, the apertures of the diversion holes on the heat dissipation columns in different array regions are arranged to gradually decrease.

[0011] In an exemplary embodiment, the heights of the plurality of heat dissipation columns are all equal.

[0012] In an exemplary embodiment, a liquid inlet and a liquid outlet are formed on the surface of the cover plate away from the substrate; the liquid cooling assembly further includes a liquid inlet connecting piece and a liquid outlet connecting piece, wherein, the liquid inlet connecting piece is L-shaped, so that the water inlet end and the water outlet end of the liquid inlet connecting piece are arranged at an angle, and at least the water outlet direction of the water outlet end of the liquid inlet connecting piece is perpendicular to the flowing direction of the liquid in the accommodating cavity; the liquid outlet connecting piece is L-shaped, so that the water inlet end and the water outlet end of the liquid outlet connecting piece are arranged at an angle, and at least the water inlet direction of the water inlet end of the liquid outlet connecting piece is perpendicular to the flowing direction of the liquid in the accommodating cavity.

[0013] In an exemplary embodiment, the substrate has an annular groove, and the annular groove is located on the outer peripheral side of the plurality of heat dissipation columns; at least a part of the cover plate is embedded in the annular groove and is hermetically connected to the substrate.

[0014] By arranging the heat dissipation columns in an array gradient distribution, and the density of the heat dissipation columns shows an increasing trend in the direction from the liquid inlet to the liquid outlet, in this way, the density of the heat dissipation columns at the liquid inlet is relatively sparse, and the relatively sparse heat dissipation columns have less disturbance to the heat dissipation medium. The density of the heat dissipation columns increases along the flowing direction of the heat dissipation medium in the accommodating cavity, so that the relatively dense heat dissipation columns enhance the disturbance to the heat dissipation medium, ensuring that the heat dissipation medium can maintain a relatively strong turbulent state during the flowing process in the accommodating cavity, thereby greatly improving the flow and heat transfer ability of the heat dissipation medium. Therefore, the technical problem that the heat transfer efficiency of the heat dissipation medium decreases during the flowing process in the existing liquid cooling plate due to its unreasonable structural design is solved, and the technical effect of improving the heat transfer efficiency of the liquid cooling assembly is achieved. Description of the Drawings

[0015] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a schematic exploded view of a liquid cooling component provided by an embodiment of the present application;

[0017] Figure 2 It is Figure 1 a schematic structural view of the bottom perspective of the liquid cooling component in

[0018] Among them, the above-mentioned drawings include the following reference numerals:

[0019] 10. Substrate; 11. Heat dissipation column; 111. Flow guiding hole; 12. Annular groove;

[0020] 20. Cover plate; 21. Liquid inlet; 22. Liquid outlet; 23. Reinforcing rib;

[0021] 30. Array area; 40. Liquid inlet connecting piece; 50. Liquid outlet connecting piece. Specific embodiments

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0023] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0024] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0025] The embodiments of the present application provide a liquid cooling component. In combination with the structure and working principle of the liquid cooling component, the technical terms involved in the detailed description of the device must be explained.

[0026] It should be noted that the substrate 10 is the main heat dissipation device for radiator components such as CPU and GPU chips during the operation of the liquid-cooled heat dissipation server. Under the action of an external driving force, a pressure difference is formed between the liquid inlet 21 and the liquid outlet 22 of the cover plate 20 for the heat dissipation medium, and then it flows inside the accommodation cavity. Driven by the water pump inside the CDU, the heat dissipation medium is transported to the liquid inlet connector 40 on the cover plate 20 via an external pipeline and vertically enters the accommodation cavity through the liquid inlet 21. After entering the accommodation cavity, under the combined action of the internal and external pressure differences and the flow channels, the flow direction of the heat dissipation medium changes from vertical downward to horizontal flow, and the turbulence degree of the heat dissipation medium is initially enhanced; subsequently, the heat dissipation medium flows horizontally in the impinging jet substrate layer of the array gradient heat dissipation columns 11 along the length direction of the substrate 10. During this process, the heat dissipation medium is divided into multiple fast-flowing turbulent flows after passing through the cross-arranged heat dissipation columns 11. Since the flow state and turbulence degree of the heat dissipation medium gradually reach stability as the flow distance increases during the flow in the accommodation cavity, specifically, the turbulence degree of the fluid at the liquid inlet 21 is more intense while the turbulence degree at the liquid outlet 22 is weaker. Therefore, the heat transfer and heat exchange ability of the heat dissipation medium at the liquid inlet 21 is stronger, but as the heat dissipation medium flows, its turbulence degree and heat transfer and heat exchange ability gradually weaken and reach the minimum value at the liquid outlet 22. To avoid such phenomena, the present application provides a liquid-cooled component, which is elaborated in detail as follows.

[0027] As Figure 1 and Figure 2 shown, the liquid-cooled component includes a substrate 10 and a cover plate 20. Among them, a plurality of heat dissipation columns 11 protrude from the substrate 10; the cover plate 20 covers the substrate 10 and encloses an accommodation cavity with the substrate 10, and the cover plate 20 is provided with a liquid inlet 21 and a liquid outlet 22 for communicating with the accommodation cavity; among them, the heat dissipation columns 11 are distributed in an array gradient, and the density of the heat dissipation columns 11 shows an increasing trend in the direction from the liquid inlet 21 to the liquid outlet 22.

[0028] By distributing the heat dissipation columns 11 in an array gradient and the density of the heat dissipation columns 11 shows an increasing trend in the direction from the liquid inlet 21 to the liquid outlet 22, in this way, the density of the heat dissipation columns 11 at the liquid inlet 21 is relatively sparse, and the relatively sparse heat dissipation columns 11 have less disturbance to the heat dissipation medium. The density of the heat dissipation columns 11 increases along the flow direction of the heat dissipation medium in the accommodation cavity, so that the relatively dense heat dissipation columns 11 enhance the disturbance to the heat dissipation medium, ensuring that the heat dissipation medium can maintain a relatively strong turbulent state during the flow in the accommodation cavity, thereby greatly improving the flow heat transfer and heat exchange ability of the heat dissipation medium. Therefore, it solves the technical problem that the existing liquid-cooled plate has a reduced heat transfer efficiency due to its unreasonable structural design during the flow of the heat dissipation medium in the liquid-cooled plate, and achieves the technical effect of improving the heat transfer efficiency of the liquid-cooled component.

[0029] Furthermore, in the length direction of the substrate 10, the arrangement density of the heat dissipation columns 11 is distributed in an array gradient. Specifically, the heat dissipation columns 11 at the liquid inlet 21 are arranged most sparsely, then the arrangement density of the heat dissipation columns 11 increases along the flow direction, and the density of the heat dissipation columns 11 near the liquid outlet 22 reaches the maximum value. The heat dissipation columns 11 arranged most sparsely at the liquid inlet 21 cause less disturbance to the heat dissipation medium, while the heat dissipation columns 11 with increasing arrangement density along the flow direction enhance the disturbance to the heat dissipation medium, and the heat dissipation columns 11 with the maximum density near the liquid outlet 22 cause the strongest disturbance to the heat dissipation medium. Through this design, it can be ensured that the heat dissipation medium can maintain a relatively strong turbulent state throughout the flow process in the accommodating cavity, thereby greatly improving the flow and heat transfer ability of the heat dissipation medium.

[0030] It should be noted that in this application, the length direction of the substrate 10 is the flow direction of the heat dissipation medium, and the width direction of the substrate 10 is perpendicular to the flow direction of the heat dissipation medium.

[0031] By making the density of the heat dissipation columns 11 increase in the direction from the liquid inlet 21 to the liquid outlet 22, the flow state of the heat dissipation medium is controlled, so that it maintains a relatively high degree of turbulence in the entire accommodating cavity, thereby improving the heat exchange efficiency. During the heat dissipation process of high heat flux density chips, it can significantly improve the flow and heat transfer ability of the heat dissipation medium, reduce the chip working temperature, and improve the operation stability and processing ability of the server. It is mainly aimed at fields such as high-performance computing servers, data centers, and supercomputers. Especially when the heat flux density of the chip exceeds the preset value, the liquid cooling component provided by this application can play its unique advantages, effectively cope with the heat dissipation challenges, and provide a reliable thermal management solution for high-performance computing.

[0032] Such as Figure 1As shown in the figure, the liquid cooling component has a plurality of array regions 30, which are distributed along the direction from the liquid inlet 21 to the liquid outlet 22, and each array region 30 has a plurality of heat dissipation columns 11; wherein, the diameters of the heat dissipation columns 11 in the same array region 30 are equal; and / or, in the direction from the liquid inlet 21 to the liquid outlet 22, the diameters of the heat dissipation columns 11 in different array regions 30 are set to gradually decrease. In this way, by setting the diameters of the heat dissipation columns 11 in the same array region 30 to be equal, it is ensured that the turbulent flow velocity of the heat dissipation medium flowing through the heat dissipation columns 11 in the same array region 30 in the accommodation cavity is basically the same. Further, by setting the diameters of the heat dissipation columns 11 in different array regions 30 to gradually decrease in the direction from the liquid inlet 21 to the liquid outlet 22, it is ensured that the density of the plurality of heat dissipation columns 11 shows an increasing trend in the direction from the liquid inlet 21 to the liquid outlet 22, which is beneficial to optimizing the turbulent flow reading of the heat dissipation medium in the flow direction from the liquid inlet 21 to the liquid outlet 22, thereby being beneficial to optimizing the heat exchange efficiency and the distribution of the heat dissipation medium, and further solving the problem of insufficient heat dissipation capacity of the cold plate in the prior art.

[0033] As Figure 1 As shown in the figure, the liquid cooling component has a plurality of array regions 30, which are distributed along the direction from the liquid inlet 21 to the liquid outlet 22, and each array region 30 has a plurality of heat dissipation columns 11; wherein, the heat dissipation columns 11 in the same array region 30 are arranged crosswise in the length direction of the substrate 10 and / or the width direction of the substrate 10; and / or, the heat dissipation columns 11 in different array regions 30 are arranged crosswise in the length direction of the substrate 10 and / or the width direction of the substrate 10. In this way, by arranging the heat dissipation columns 11 in the same array region 30 crosswise in the length direction of the substrate 10 and / or the width direction of the substrate 10; and / or, arranging the heat dissipation columns 11 in different array regions 30 crosswise in the length direction of the substrate 10 and / or the width direction of the substrate 10, it is ensured that each row of heat dissipation columns 11 is located at the gap between the adjacent heat dissipation columns 11 in the upper row, and in the length direction of the substrate 10, the density of the arrangement of the heat dissipation columns 11 shows an array gradient distribution, specifically, the heat dissipation columns 11 at the liquid inlet 21 are arranged most sparsely, and then the arrangement density of the heat dissipation columns 11 increases along the flow direction, and the arrangement density of the heat dissipation columns 11 near the liquid outlet 22 reaches the maximum value.

[0034] In some embodiments, the heat dissipation columns 11 in the same array region 30 are evenly distributed in the width direction of the substrate 10 and are arranged crosswise in the length direction of the substrate 10; and / or, the heat dissipation columns 11 in different array regions 30 are evenly distributed in the width direction of the substrate 10 and are arranged crosswise in the length direction of the substrate 10.

[0035] As Figure 1As shown, the liquid cooling component has three array regions 30, which are distributed along the direction from the liquid inlet 21 to the liquid outlet 22. Each array region 30 has a plurality of heat dissipation columns 11. The plurality of heat dissipation columns 11 in each array region 30 are evenly distributed in the width direction of the substrate 10 and cross - distributed in the length direction of the substrate 10. The area of each array region 30 accounts for one - third of the overall area of the substrate 10. In the direction from the liquid inlet 21 to the liquid outlet 22, the density of the heat dissipation columns 11 in each array region 30 gradually increases. That is, the number of heat dissipation columns 11 in the first array region 30, the number of heat dissipation columns 11 in the second array region 30, and the number of heat dissipation columns 11 in the third array region 30 are arranged in an increasing manner in the direction from the liquid inlet 21 to the liquid outlet 22.

[0036] Specifically, as Figure 1 shown, the distance between two adjacent heat dissipation columns 11 in each array region 30 is equal, and the spacing distance is greater than or equal to the diameter of the heat dissipation column 11.

[0037] In some embodiments, the heat dissipation column 11 is of a cylindrical structure.

[0038] It should be noted that in this application, considering that during the process of the heat dissipation medium bypassing the cylindrical heat dissipation column 11, the fluid may form a flowing "dead zone" behind the heat dissipation column 11. In the area of this "dead zone", the velocity of the fluid slows down, the degree of turbulence significantly decreases, the temperature and the turbulence exchange efficiency in the fluid decrease, and even a long - term stagnation phenomenon may occur. To avoid such phenomena, in this application, at least some of the plurality of heat dissipation columns 11 are provided with diversion holes 111, and the diversion holes 111 extend along the radial direction of the heat dissipation column 11 and penetrate through the two radial side surfaces of the heat dissipation column 11. In this way, the heat dissipation medium can jet through the diversion holes 111, further enhancing the degree of turbulence of the heat dissipation medium at the rear of the cylindrical heat dissipation column 11 and strengthening the flow - heat transfer effect of the heat dissipation medium.

[0039] Furthermore, the extending direction of the diversion hole 111 is consistent with the direction from the liquid inlet 21 to the liquid outlet 22. In this way, it is ensured that the heat dissipation medium can directly jet through the diversion hole 111 at a relatively fast speed and along a relatively short path, thereby ensuring the degree of turbulence of the heat dissipation medium and further achieving the purpose of strengthening the flow - heat transfer effect of the heat dissipation medium.

[0040] In some embodiments, at least one diversion hole 111 is provided on the same heat dissipation column 11.

[0041] Such as Figure 1As shown, at least two flow guiding holes 111 are formed in the same heat dissipation column 11, and the at least two flow guiding holes 111 are arranged at intervals along the axial direction of the heat dissipation column 11, and the hole axes of the at least two flow guiding holes 111 are parallel to each other. In this way, it is ensured that the heat dissipation medium at different heights can pass through the flow guiding holes 111 in a jet flow manner in a timely manner, so as to ensure the turbulence degree of the cooling pump, which is beneficial to the purpose of strengthening the flow and heat exchange effect of the heat dissipation medium; the specific number of the flow guiding holes 111 can be adjusted according to the heat flux density of the chip. By increasing or decreasing the number of the flow guiding holes 111, the heat dissipation requirements of chips with different heat flux densities can be adapted, and effective turbulence strengthening can be provided under any circumstances, so as to improve the heat exchange efficiency. When facing chips with different heat flux densities, the liquid cooling component can adjust the number of the flow guiding holes 111 to achieve customized heat dissipation performance, improve the operation efficiency and reliability of the server, and is applicable to high-performance computing servers, graphics workstations, etc. It can be designed individually according to the actual heat flux density of the chip to achieve the best heat dissipation effect.

[0042] Two circular flow guiding holes 111 are provided on each heat dissipation column 11, and these flow guiding holes 111 penetrate through the heat dissipation column 11, which is used to improve the flow state of the heat dissipation medium at the rear of the heat dissipation column 11, ensure that the heat dissipation medium always maintains a turbulent state during the flow process, avoid the formation of a flow "dead zone", and ensure the uniform distribution and heat exchange efficiency of the heat dissipation medium.

[0043] Furthermore, there is a specific proportional relationship between the diameter of the circular flow guiding hole 111 and the diameter of the heat dissipation column 11, and this proportion can be optimized according to the actual heat dissipation requirements to achieve the best cooling effect.

[0044] As Figure 1 shown, the liquid cooling component has multiple array regions 30, and the multiple array regions 30 are distributed along the direction from the liquid inlet 21 to the liquid outlet 22, and each array region 30 has multiple heat dissipation columns 11; wherein, the apertures of the flow guiding holes 111 on the heat dissipation columns 11 in the same array region 30 are the same; and / or, in the direction from the liquid inlet 21 to the liquid outlet 22, the apertures of the flow guiding holes 111 on the heat dissipation columns 11 in different array regions 30 are arranged to gradually decrease. In this way, while ensuring the structural strength of the heat dissipation column 11, by adjusting the aperture of the flow guiding hole 111, it is beneficial to optimize the jet effect of the heat dissipation medium, further enhance the turbulence degree behind the heat dissipation column 11, and thus enhance the heat exchange efficiency of the heat dissipation medium.

[0045] In some embodiments, under different heat flux density conditions, the ratio of the aperture of the diversion hole 111 to the diameter of the heat dissipation column 11 can also be adjusted to find the optimal heat dissipation performance, which is applicable to server environments with various heat flux density changes, such as AI training servers, deep learning servers, etc., and can be flexibly adjusted according to actual needs to achieve the optimal heat dissipation effect. For example, when the aperture of the diversion hole 111 is less than or equal to the diameter of the heat dissipation column 11, the optimal heat dissipation performance can be achieved.

[0046] As Figure 1 shown, in the direction from the liquid inlet 21 to the liquid outlet 22, the diameter of the heat dissipation column 11 in the first array region 30 is 2.5 mm, and the aperture of the diversion hole 111 on the heat dissipation column 11 in the corresponding first array region 30 is 1.5 mm; the diameter of the heat dissipation column 11 in the second array region 30 is 2 mm, and the aperture of the diversion hole 111 on the heat dissipation column 11 in the corresponding second array region 30 is 1.2 mm; the diameter of the heat dissipation column 11 in the third array region 30 is 1.5 mm, and the aperture of the diversion hole 111 on the heat dissipation column 11 in the corresponding third array region 30 is 1 mm.

[0047] In some embodiments, the heights of the plurality of heat dissipation columns 11 are all equal.

[0048] In some embodiments, the heat dissipation column 11 is made of a material with high thermal conductivity and undergoes surface treatment to reduce surface friction. By selecting a material with high thermal conductivity and optimizing the surface treatment process, the thermal conductivity performance of the heat dissipation column 11 is improved, the resistance during the flow of the heat dissipation medium is reduced, thereby improving the heat exchange efficiency and reducing the system pressure drop. Under the same conditions, the substrate 10 of the present application can provide higher heat dissipation efficiency, reduce the operating temperature of the chip, improve the operating stability and processing ability of the server, and is applicable to high-performance computing servers, data centers, supercomputers, etc. By optimizing the material of the heat dissipation column 11 and performing surface treatment on it, the overall heat dissipation performance of the liquid cooling component can be improved, the energy consumption can be reduced, the equipment life can be extended, and the system reliability can be improved. The usage process is that the heat dissipation medium is driven by a water pump inside the CDU, transported through an external pipeline to the liquid inlet connector 40 above the cover plate 20, and vertically enters the inside of the accommodation cavity through the liquid inlet 21. Then, under the combined action of the internal and external pressure differences and the flow channel, the flow direction of the flow channel changes from vertical downward to horizontal flow, and the turbulence degree of the heat dissipation medium is initially enhanced. Subsequently, the heat dissipation medium flows horizontally in the impinging jet substrate layer of the array gradient heat dissipation columns 11 along the length direction of the substrate 10, and the turbulence is further enhanced through the cross-arranged heat dissipation columns 11, and finally is discharged through the liquid outlet 22 to complete the heat dissipation process.

[0049] As Figure 1 and Figure 2As shown in the figure, a liquid inlet 21 and a liquid outlet 22 are formed on the surface of the cover plate 20 on the side away from the substrate 10; the liquid cooling assembly further includes a liquid inlet connecting member 40 and a liquid outlet connecting member 50. Among them, the liquid inlet connecting member 40 is L-shaped, so that the water inlet end and the water outlet end of the liquid inlet connecting member 40 are arranged at an angle, and at least the water outlet direction of the water outlet end of the liquid inlet connecting member 40 is perpendicular to the flowing direction of the liquid in the accommodating cavity; the liquid outlet connecting member 50 is L-shaped, so that the water inlet end and the water outlet end of the liquid outlet connecting member 50 are arranged at an angle, and at least the water inlet direction of the water inlet end of the liquid outlet connecting member 50 is perpendicular to the flowing direction of the liquid in the accommodating cavity. In this way, by optimizing the size and shape of the liquid inlet connecting member 40 and the liquid outlet connecting member 50, the initial flow conditions of the heat dissipation medium are controlled to ensure that the heat dissipation medium can form a stable flow state when entering the accommodating cavity, thereby improving the heat exchange efficiency in the subsequent flow process. The flow of the heat dissipation medium when entering and leaving the accommodating cavity is smoother, the degree of turbulence is optimized, the overall heat dissipation performance of the liquid cooling assembly is improved, and it is applicable to data centers, supercomputers, etc. By optimizing the design of the liquid inlet connecting member 40 and the liquid outlet connecting member 50, the flow performance of the heat dissipation medium can be improved, thereby reducing the system pressure drop and improving the heat dissipation efficiency.

[0050] As Figure 1 and Figure 2 shown in the figure, the substrate 10 has an annular groove 12, and the annular groove 12 is located on the outer peripheral side of a plurality of heat dissipation columns 11; at least a part of the cover plate 20 is embedded in the annular groove 12 and is hermetically connected to the substrate 10. In this way, the connection reliability at the connection between the substrate 10 and the cover plate 20 and the sealing reliability at the connection between the two are ensured.

[0051] As Figure 2 shown in the figure, at least one reinforcing rib 23 also protrudes from the surface of the cover plate 20 facing the accommodating cavity. In this embodiment, there are three reinforcing ribs 23, and the three reinforcing ribs 23 are arranged in the middle and symmetrically spaced along the length direction of the cover plate 20. The three reinforcing ribs 23 are located in the area between the liquid inlet 21 and the liquid outlet 22. The arrangement of the reinforcing ribs 23 is beneficial to improving the overall structural strength of the cover plate 20 and preventing the cover plate 20 from being deformed by external pressure.

[0052] It should be noted that in this application, the substrate 10 is the main heat dissipation device for the CPU and GPU chips during the operation of the liquid-cooled heat dissipation server. Specifically, under the action of an external driving force, a pressure difference is formed between the liquid inlet 21 and the liquid outlet 22 of the cover plate 20 for the heat dissipation medium, and then it flows inside the accommodation cavity. Driven by the water pump inside the CDU, the heat dissipation medium is transported to the liquid inlet connector 40 on the cover plate 20 via an external pipeline and vertically enters the accommodation cavity through the liquid inlet 21. After entering the accommodation cavity, under the combined action of the internal and external pressure differences and the flow channels, the flow direction of the heat dissipation medium changes from vertically downward to horizontal flow, and the turbulence degree of the heat dissipation medium is initially enhanced. 2. Subsequently, the heat dissipation medium flows horizontally along the length direction of the substrate 10 within the impinging jet substrate layer of the array gradient heat dissipation columns 11. During this process, the heat dissipation medium is divided into multiple fast-flowing turbulences after passing through the cross-arranged heat dissipation columns 11. Since the flow state and turbulence degree of the heat dissipation medium gradually reach stability as the flow distance increases during the flow in the accommodation cavity, specifically, the turbulence degree of the fluid at the liquid inlet 21 is more intense while the turbulence degree at the liquid outlet 22 is weaker. Therefore, the heat transfer capacity of the heat dissipation medium at the liquid inlet 21 is stronger, but as the heat dissipation medium flows, its turbulence degree and heat transfer capacity gradually weaken and reach the minimum value at the liquid outlet 22. To avoid such a phenomenon, along the length direction of the substrate 10, the arrangement density of the heat dissipation columns 11 is distributed in an array gradient. Specifically, the heat dissipation columns 11 at the liquid inlet 21 are arranged most sparsely, then the arrangement density of the heat dissipation columns 11 increases along the flow direction, and the density of the heat dissipation columns 11 reaches the maximum value near the liquid outlet 22. The most sparsely arranged heat dissipation columns 11 at the liquid inlet 21 have less disturbance to the heat dissipation medium, while the heat dissipation columns 11 with increasing arrangement density along the flow direction have enhanced disturbance to the heat dissipation medium, and the heat dissipation columns 11 with the maximum density near the liquid outlet 22 have the strongest disturbance to the heat dissipation medium. Through this design, it can be ensured that the heat dissipation medium can maintain a relatively strong turbulent state throughout the flow process in the accommodation cavity, thereby greatly improving the flow heat transfer capacity of the heat dissipation medium.

[0053] The impinging jet cold plate technology of the array gradient heat dissipation columns 11 proposed in this application effectively improves the turbulence degree of the heat dissipation medium, optimizes the heat exchange efficiency, and solves the problem of insufficient heat dissipation capacity of traditional cold plates by introducing the gradient distribution of the unique heat dissipation columns 11 and the design of the diversion holes 111. This technology not only has innovation in theory but also shows significant heat dissipation effects in practical applications, playing an important role in promoting the development of the high-performance computing field. Through continuous technology optimization and parameter adjustment, the cold plate technology of this application will provide more efficient and reliable heat dissipation guarantee for high-performance computing environments such as data centers and supercomputers, promoting green computing and sustainable development.

[0054] The cold plate technology of this application not only achieves a significant improvement in heat dissipation performance, but also takes into account the overall pressure drop and energy consumption of the system, ensuring the efficient operation of the system through optimized design. In the fields of AI, deep learning, and high-performance computing, the application of this technology will greatly promote technological progress and provide infinite possibilities for the future of high-performance computing. At the same time, reducing maintenance costs, operating noise, extending the service life of equipment, and improving system reliability, these advantages make the cold plate technology of this application have broad application prospects in high-performance computing environments and are expected to become the preferred choice for the next-generation high-performance computing heat dissipation solution.

[0055] Through the array gradient heat dissipation column 11 impinging jet cold plate technology provided by this application, the heat dissipation system of servers and data centers will achieve a qualitative leap. It can not only effectively meet the heat dissipation requirements of high heat flux density chips, but also reduce the energy consumption of the overall system, reduce operating noise, and improve the service life and reliability of equipment. Especially in the field of high-performance computing, the application of this technology will greatly promote technological progress and provide a solid foundation for efficient and stable data processing and analysis. At the same time, by reducing the dependence on traditional air-cooling systems, this application helps to reduce the maintenance costs of servers and reduce system failures caused by improper thermal management, providing an innovative solution for thermal management in high-performance computing environments, with important practical significance and broad application prospects.

[0056] The above has introduced in detail a liquid cooling component provided by this application. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A liquid cooling component, characterized in that, Comprising: A substrate (10) on which a plurality of heat dissipation columns (11) are protrudingly provided; A cover plate (20) which covers the substrate (10) and forms a receiving cavity with the substrate (10), and a liquid inlet (21) and a liquid outlet (22) for communicating with the receiving cavity are provided on the cover plate (20); Wherein, the heat dissipation columns (11) are distributed in an array gradient, and the density of the heat dissipation columns (11) shows an increasing trend in the direction from the liquid inlet (21) to the liquid outlet (22); The liquid cooling component has a plurality of array regions (30), the array regions (30) are distributed in the direction from the liquid inlet (21) to the liquid outlet (22), and each of the array regions (30) has a plurality of the heat dissipation columns (11); In the direction from the liquid inlet (21) to the liquid outlet (22), the diameters of the heat dissipation columns (11) in different array regions (30) are gradually decreased; At least some of the plurality of heat dissipation columns (11) are provided with diversion holes (111), and the diversion holes (111) extend along the radial direction of the heat dissipation columns (11) and penetrate through the two radial side surfaces of the heat dissipation columns (11).

2. The liquid cooling component according to claim 1, wherein The liquid cooling component has a plurality of array regions (30), the plurality of array regions (30) are distributed in the direction from the liquid inlet (21) to the liquid outlet (22), and each of the array regions (30) has a plurality of the heat dissipation columns (11); Wherein, the heat dissipation columns (11) in the same array region (30) are arranged crosswise in the length direction and / or the width direction of the substrate (10); and / or, The heat dissipation columns (11) in different array regions (30) are arranged crosswise in the length direction and / or the width direction of the substrate (10).

3. The liquid cooling component according to claim 1, wherein The extending direction of the diversion holes (111) is consistent with the direction from the liquid inlet (21) to the liquid outlet (22).

4. The liquid cooling component according to claim 1, wherein At least one of the diversion holes (111) is provided on the same heat dissipation column (11); or, At least two of the diversion holes (111) are provided on the same heat dissipation column (11), and at least two of the diversion holes (111) are arranged at intervals along the axial direction of the heat dissipation column (11), and the hole axes of at least two of the diversion holes (111) are parallel to each other.

5. The liquid cooling component according to claim 1, wherein The liquid cooling component has a plurality of array regions (30), the plurality of array regions (30) are distributed in the direction from the liquid inlet (21) to the liquid outlet (22), and each of the array regions (30) has a plurality of the heat dissipation columns (11); Wherein, the apertures of the diversion holes (111) on the heat dissipation columns (11) in the same array region (30) are the same; and / or, In the direction from the liquid inlet (21) to the liquid outlet (22), the aperture diameters of the diversion holes (111) on the heat dissipation columns (11) in different array regions (30) are set to gradually decrease.

6. The liquid cooling component according to any one of claims 1 to 5, characterized in that, The heights of the plurality of heat dissipation columns (11) are all equal.

7. The liquid cooling assembly according to any one of claims 1 to 5, characterized in that The liquid inlet (21) and the liquid outlet (22) are provided on the surface of the cover plate (20) on the side away from the substrate (10); The liquid cooling assembly further includes: A liquid inlet connector (40), the liquid inlet connector (40) is in an L shape, so that the water inlet end and the water outlet end of the liquid inlet connector (40) are arranged at an angle, and at least the water outlet direction of the water outlet end of the liquid inlet connector (40) is perpendicular to the flow direction of the liquid in the accommodation cavity; A liquid outlet connector (50), the liquid outlet connector (50) is in an L shape, so that the water inlet end and the water outlet end of the liquid outlet connector (50) are arranged at an angle, and at least the water inlet direction of the water inlet end of the liquid outlet connector (50) is perpendicular to the flow direction of the liquid in the accommodation cavity.

8. The liquid cooling assembly according to any one of claims 1 to 5, characterized in that The substrate (10) has an annular groove (12), and the annular groove (12) is located on the outer peripheral side of the plurality of heat dissipation columns (11); At least a part of the cover plate (20) is embedded in the annular groove (12) and is hermetically connected to the substrate (10).

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