Wafer printing jig

Abstract

The utility model provides a wafer printing jig, and belongs to the technical field of printing jigs. The problem that an existing wafer positioning effect is poor is solved. The wafer printing jig comprises a positioning plate, a containing groove for containing a wafer is formed in the positioning plate, at least two positioning columns are formed on the positioning plate in a protruding mode, the wafer printing jig comprises a plurality of auxiliary patch layers, and positioning holes in one-to-one correspondence with the positioning columns are formed in the auxiliary patch layers. The multiple auxiliary patch layers are arranged on the positioning plate, the positioning columns are arranged in the positioning holes, the multiple auxiliary patch layers comprise positioning pressing pieces and positioning patches which are sequentially arranged from top to bottom, and the lower end faces of the positioning patches are attached to the wafers located in the containing grooves. According to the wafer printing jig, through the design that the positioning holes are formed in the multiple auxiliary patch layers to be matched with the positioning columns on the positioning plate, the positioning stability of the wafer and the positioning patch is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of printing fixtures and relates to a wafer printing fixture. Background Art

[0002] When printing a wafer, there is a label on the upper end surface of the wafer. Usually, it is necessary to position the wafer on the lower end surface through a printing fixture and then print it through a printing machine.

[0003] For some products, the printed part on the lower end surface needs to be on the same radial straight line of the wafer as the label on the upper end surface. The existing printing structure, such as the multi-piece pure circular glass cover plate printing structure disclosed in the Chinese patent application [Authorization Publication No.: CN219133539U], includes a base and a positioning diaphragm. The base is provided with a plurality of placement grooves, and each placement groove is provided with a suction hole for connecting with a suction device. Among them, a positioning groove is provided on the side of each placement groove, and the positioning groove communicates with the placement groove. After the positioning groove communicates with the placement groove, a limiting structure for limiting the pure circular glass cover plate is formed. The shape of the positioning diaphragm is the same as that of the limiting structure, and the positioning diaphragm is used for bonding with the pure circular glass cover plate.

[0004] The positioning diaphragm of the above structure has a certain viscosity. Placing the pure circular glass cover plate directly on the positioning diaphragm will cause problems such as inaccurate positioning, wrinkles, and unevenness. During the printing process, the pure circular glass cover plate needs to be placed stably in the placement groove, which affects the printing quality of the pure circular glass cover plate. Summary of the Utility Model

[0005] The purpose of the utility model is to address the above problems existing in the prior art and propose a wafer printing fixture. The technical problem to be solved by the utility model is: how to solve the problem of poor wafer positioning effect in the prior art.

[0006] The purpose of the utility model can be achieved by the following technical solutions:

[0007] A wafer printing fixture includes a positioning plate. A placement groove for placing a wafer is provided on the positioning plate. It is characterized in that at least two positioning columns are formed by protrusions on the positioning plate. The wafer printing fixture of the present invention includes multiple layers of auxiliary patch layers. Positioning holes corresponding to the positioning columns one by one are provided on the multiple layers of auxiliary patch layers. The multiple layers of auxiliary patch layers are arranged on the positioning plate and the positioning columns are arranged in the positioning holes. The multiple layers of auxiliary patch layers include a positioning pressing sheet and a positioning patch arranged in sequence from top to bottom. The lower end surface of the positioning patch is attached to the wafer located in the placement groove.

[0008] Working principle: Place the wafer to be printed in the placement groove, with the positioning patches of the multi-layer auxiliary patch layer facing downwards. Slip the positioning pressing piece onto the positioning post and move it vertically downwards along the positioning post until the positioning patch fits against the wafer. Through the cooperation of the positioning post and the positioning hole, the positioning of the positioning patch is achieved, enabling the positioning patch to stably fit against the wafer. Through the above settings of the multi-layer auxiliary fitting layer and the positioning post, under the guidance of the positioning post, the rapid positioning of the positioning patch is realized. Furthermore, through the setting of the positioning posts on the positioning plate and by providing positioning holes on the multi-layer auxiliary patch layer, the stability of the positioning of the wafer and the positioning patch is achieved with a relatively simple structure.

[0009] In the above wafer printing fixture, three positioning posts are provided, and the three positioning posts are circumferentially distributed along the placement groove.

[0010] The setting of the positioning posts, utilizing the principle of triangular positioning, makes the positioning more stable and accurate, enhancing the stability.

[0011] In the above wafer printing fixture, a release paper sheet is attached to the lower side of the positioning patch, the release paper sheet and the positioning pressing piece are in contact with each other, and the positioning patch is located in the middle of the release paper sheet and the positioning pressing piece.

[0012] Since the positioning patch is small, the release paper sheet and the positioning pressing piece can be made to contact each other to achieve stable storage of the positioning patch, preventing the glue of the positioning patch from losing efficacy during storage. Moreover, the position setting of the positioning patch not only improves the storage stability but also enhances the positioning stability.

[0013] During use, first tear the release paper sheet from the multi-layer auxiliary fitting layer, then slip the positioning pressing piece onto the positioning post, and stably move the positioning pressing piece and the positioning patch downwards until the positioning patch adheres to the wafer, thereby achieving rapid and stable positioning of the wafer and the positioning patch.

[0014] In the above wafer printing fixture, the outer edge of the positioning patch protrudes to form an indication protrusion.

[0015] The setting of the indication protrusion enables the wafer to be removed from the positioning plate more quickly and also provides directionality during printing, improving the printing convenience and positioning stability.

[0016] In the above wafer printing fixture, the wafer printing fixture further includes a printing plate. The printing plate is provided with a printing groove into which the wafer and the positioning patch can be inserted. The side wall of the printing groove protrudes outwards to form a limiting opening, and the indication protrusion is inserted into the limiting opening.

[0017] Since the whole board needs to be relatively flat during printing, a printing board is additionally provided. The wafer is placed in the printing groove, and a limiting opening for positioning the patch is provided. The setting of the positioning patch makes it convenient to take out on the one hand, and on the other hand, the positioning patch has a directionality, which is convenient for printing and makes the printing more convenient.

[0018] Compared with the prior art, the advantages of this wafer printing fixture are as follows: Through the setting of the multi-layer auxiliary bonding layer and the positioning posts, under the guidance of the positioning posts, the rapid positioning of the positioning patch is realized. Furthermore, through the setting of the positioning posts on the positioning plate and by opening positioning holes on the multi-layer auxiliary patch layer, the stability of the positioning of the wafer and the positioning patch is achieved with a relatively simple structure. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of the multi-layer auxiliary patch layer installed in the present utility model.

[0020] Figure 2 It is an exploded view of the multi-layer auxiliary patch layer of the present utility model.

[0021] Figure 3 It is a schematic structural diagram of the positioning plate of the present utility model.

[0022] Figure 4 It is an exploded view of the positioning patch and the printing plate of the present utility model.

[0023] In the figure, 1, positioning plate; 11, placement groove; 12, positioning post; 2, multi-layer auxiliary patch layer; 21, positioning hole; 22, positioning pressing piece; 23, positioning patch; 23a, indicating protrusion; 24, release paper; 3, printing plate; 31, printing groove; 32, limiting opening. Detailed Embodiments

[0024] The following are specific embodiments of the present utility model in combination with the drawings, and the technical solutions of the present utility model will be further described, but the present utility model is not limited to these embodiments.

[0025] As Figures 1-3 shown, this wafer printing fixture includes a positioning plate 1, and a placement groove 11 for placing the wafer is opened on the positioning plate 1.

[0026] Specifically, as Figures 1-3As shown in the figure, at least two positioning posts 12 are formed by protruding on the positioning plate 1. This wafer printing fixture includes multiple auxiliary patch layers 2. Positioning holes 21 corresponding to the positioning posts 12 one by one are formed on the multiple auxiliary patch layers 2. The multiple auxiliary patch layers 2 are arranged on the positioning plate 1 and the positioning posts 12 are arranged in the positioning holes 21. The multiple auxiliary patch layers 2 include a positioning pressing sheet 22, a positioning patch 23, and a release paper sheet 24 arranged in sequence from top to bottom. Tear off the release paper sheet 24, sleeved the multiple auxiliary patch layers 2 on the positioning posts 12 and slide down along the positioning posts 12. The lower end surface of the positioning patch 23 is attached to the wafer located in the placement groove 11.

[0027] Working principle: Place the wafer to be printed in the placement groove 11, tear off the release paper sheet 24 of the multiple auxiliary patch layers 2, turn the positioning patch 23 downward, sleeve the positioning pressing sheet 22 on the positioning posts 12, and vertically move downward along the positioning posts 12 until the positioning patch 23 is attached to the wafer. Through the cooperation of the positioning posts 12 and the positioning holes 21, the positioning of the positioning patch 23 is realized, so that the positioning patch 23 can be stably attached to the wafer. Through the above settings of the multiple auxiliary attachment layers and the positioning posts 12, under the guidance of the positioning posts 12, the rapid positioning of the positioning patch 23 is realized. Furthermore, through the setting of the positioning posts 12 on the positioning plate 1 and by forming positioning holes 21 on the multiple auxiliary patch layers 2, the stability of the positioning of the wafer and the positioning patch 23 is realized through a relatively simple structure.

[0028] As Figures 1-3 shown in the figure, there are three positioning posts 12. The three positioning posts 12 are circumferentially distributed along the placement groove 11. The release paper sheet 24 and the positioning pressing sheet 22 are attached to each other. The positioning patch 23 is located in the middle of the release paper sheet 24 and the positioning pressing sheet 22. An indicating protrusion 23a is formed by the outer edge of the positioning patch 23 protruding.

[0029] As Figure 4 shown in the figure, this wafer printing fixture further includes a printing plate 3. A printing groove 31 for the wafer and the positioning patch 23 to be inserted is formed on the printing plate 3. A limiting port 32 is formed by the side wall of the printing groove 31 protruding outward. The indicating protrusion 23a is inserted into the limiting port 32.

[0030] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Those skilled in the art to which the present invention pertains can make various modifications or supplements to the described specific embodiments or use similar ways to replace them, but will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A wafer printing fixture, comprising a positioning plate (1), wherein a placement groove (11) for placing a wafer is formed on the positioning plate (1), and is characterized in that, At least two positioning posts (12) are formed by protruding on the positioning plate (1). The circular wafer printing fixture includes multiple layers of auxiliary patch layers (2). Positioning holes (21) corresponding to the positioning posts (12) one by one are formed on the multiple layers of auxiliary patch layers (2). The multiple layers of auxiliary patch layers (2) are arranged on the positioning plate (1) and the positioning posts (12) are arranged in the positioning holes (21). The multiple layers of auxiliary patch layers (2) include a positioning pressing sheet (22) and a positioning patch (23) arranged in sequence from top to bottom. The lower end surface of the positioning patch (23) is attached to the circular wafer located in the placement groove (11).

2. The wafer printing jig according to claim 1, characterized in that, There are three positioning posts (12), and the three positioning posts (12) are circumferentially distributed along the placement groove (11).

3. The wafer printing jig according to claim 1 or 2, characterized in that, A release paper sheet (24) is attached below the positioning patch (23). The release paper sheet (24) and the positioning pressing sheet (22) are attached to each other. The positioning patch (23) is located in the middle of the release paper sheet (24) and the positioning pressing sheet (22).

4. The wafer printing fixture according to claim 1 or 2, characterized in that An indicating protrusion (23a) is formed by protruding on the outer edge of the positioning patch (23).

5. The wafer printing fixture according to claim 4, wherein The circular wafer printing fixture further includes a printing plate (3). A printing groove (31) for the circular wafer and the positioning patch (23) to be embedded is formed on the printing plate (3). A limiting opening (32) is formed by protruding on the side wall of the printing groove (31). The indicating protrusion (23a) is embedded in the limiting opening (32).

Images