Polyethylene protective film for electronics
Through the combination of high-temperature resistant adhesive layer and antistatic adhesive layer, combined with permeable holes and mesh exhaust passages, the problems of antistatic sustainability and poor exhaust effect of the existing electronic protective film are solved, and the protective film effect is achieved without bubbles, dust and watermarks.
Patent Information
- Application Number
- CN202422237706.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-12
AI Technical Summary
The existing electronic protective films have shortcomings in antistatic sustainability and exhaust effects, and are prone to bubbles, dust and watermarks.
The combination of high-temperature resistant adhesive layer and anti-static adhesive layer is adopted to design through permeable holes and mesh exhaust passages to improve the weather resistance and stability of anti-static performance and optimize the exhaust effect.
The protective film is achieved without bubbles, dust and watermarks during the bonding process, and the sustainability and stability of antistatic properties are improved.
Smart Images
Figure CN223134383U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of protective films, in particular to a polyethylene protective film for electronics. Background Art
[0002] With the development of electronic technology, higher requirements are imposed on the quality and appearance of its products. Generally, a protective film is provided on the surface of the product to protect the sensitive surface from scratches, contamination or other damages, and it is required that no water marks, traces or dust are left during the use of the protective film.
[0003] In the prior art, the protective film is improved from the adhesive layer to reduce residual glue and water marks, but the antistatic persistence is not good, and the exhaust effect is also not good, and bubbles are likely to appear.
[0004] Therefore, it is necessary to improve the protective film for electronics in the prior art. Summary of the Utility Model
[0005] The purpose of the utility model is to overcome the defects existing in the prior art, and provide a polyethylene protective film for electronics. The weather resistance and heat resistance of the watermark-free adhesive layer are improved through a high-temperature resistant adhesive layer and an antistatic adhesive layer, preventing the antistatic performance of the adhesive layer from failing and having poor persistence; the antistatic inner layer of the polyethylene composite layer improves the antistatic persistence and stability of the antistatic adhesive layer through permeation holes; the setting of the mesh exhaust channels realizes the exhaust effect and improves the exhaust efficiency during the film application of the protective film, achieving no bubbles, no dust and no water marks on the product surface.
[0006] To achieve the above technical effects, the technical solution of the utility model is as follows: A polyethylene protective film for electronics, comprising:
[0007] A polyethylene composite layer, comprising an antistatic outer layer and an antistatic inner layer;
[0008] A watermark-free adhesive layer, comprising a high-temperature resistant adhesive layer and an antistatic adhesive layer sequentially connected to the antistatic inner layer;
[0009] The high-temperature resistant adhesive layer is provided with permeation holes penetrating along the layer thickness direction, the permeation holes communicate the polyethylene composite layer and the antistatic adhesive layer, and a mesh exhaust channel is arranged on the surface of the antistatic adhesive layer away from the high-temperature resistant adhesive layer.
[0010] Preferably, the depth of the mesh exhaust channel is less than the thickness of the antistatic adhesive layer.
[0011] Preferably, the polyethylene composite layer further comprises a core layer sandwiched between the antistatic outer layer and the antistatic inner layer, and the core layer is a laminated structure of LDPE / HDPE / LDPE, or LLDPE / HDPE / LLDPE, or LLDPE / HDPE / LDPE.
[0012] Preferably, the main materials of the antistatic outer layer and the antistatic inner layer are both metallocene linear low density polyethylene.
[0013] Preferably, the high temperature resistant adhesive layer is a silicone modified acrylic adhesive layer.
[0014] Preferably, the antistatic adhesive layer is a fluorinated acrylic adhesive layer.
[0015] Preferably, the HDPE layer in the core layer accounts for 50% - 70% of the total thickness of the core layer.
[0016] Preferably, the thickness ratio among the antistatic outer layer, the core layer and the antistatic inner layer is (1 - 2) : (3 - 4) : (1 - 2).
[0017] Preferably, an antistatic release film is arranged on the surface of the antistatic adhesive layer far away from the high temperature resistant adhesive layer.
[0018] The advantages and beneficial effects of the present utility model are as follows:
[0019] The polyethylene protective film for electronics has a reasonable structure. The weather resistance and heat resistance of the water - free adhesive layer are improved through the high temperature resistant adhesive layer and the antistatic adhesive layer, preventing the failure and poor persistence of the antistatic performance of the adhesive layer; and the mechanical properties of the water - free adhesive layer can be flexibly adjusted and functions can be imparted; the antistatic inner layer of the polyethylene composite layer improves the antistatic persistence and stability of the antistatic adhesive layer through the permeation holes; the arrangement of the mesh exhaust channels realizes the exhaust effect during the film - sticking of the protective film and improves the exhaust efficiency, achieving no bubbles, no dust and no water marks on the product surface. Description of the Drawings
[0020] Figure 1 is a schematic structural diagram of Embodiment 1 of the polyethylene protective film for electronics of the present utility model;
[0021] Figure 2 is a schematic structural diagram of Embodiment 2 of the polyethylene protective film for electronics of the present utility model.
[0022] In the figure: 1, polyethylene composite layer; 2, water - free adhesive layer; 3, antistatic release film; 10, core layer; 11, antistatic outer layer; 12, antistatic inner layer; 21, high temperature resistant adhesive layer; 22, antistatic adhesive layer; 200, exhaust channel. Detailed Embodiments
[0023] The following combines the drawings and embodiments to further describe the detailed embodiments of the present utility model. The following embodiments are only used to more clearly illustrate the technical solutions of the present utility model and cannot be used to limit the protection scope of the present utility model.
[0024] The terms "outer layer" and "inner layer" are for the convenience of describing the present utility model and simplifying the description with reference to the normal use state of the polyethylene protective film for electronics. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present utility model.
[0025] In addition, the terms "first", "second", etc. are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the creation of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.
[0026] A polyethylene protective film for electronics disclosed by the present utility model includes a polyethylene composite layer 1 and a watermark-free adhesive layer 2. The polyethylene composite layer 1 includes an antistatic outer layer 11 and an antistatic inner layer 12; the watermark-free adhesive layer 2 includes a high-temperature resistant adhesive layer 21 and an antistatic adhesive layer 22 that are sequentially connected to the antistatic inner layer 12; the high-temperature resistant adhesive layer 21 is provided with penetration holes (not shown) that penetrate along the layer thickness direction, and the aperture of the penetration holes is less than 0.05 μm. The penetration holes communicate the polyethylene composite layer 1 and the antistatic adhesive layer 22, and a mesh exhaust channel 200 is provided on the surface of the antistatic adhesive layer 22 away from the high-temperature resistant adhesive layer 21.
[0027] The high-temperature resistant adhesive layer 21 and the antistatic adhesive layer 22 improve the weather resistance and heat resistance of the watermark-free adhesive layer 2, preventing the antistatic performance of the adhesive layer from failing and having poor persistence; at the same thickness, the toughness of the multi-layer adhesive layer is better than that of the single-layer adhesive layer; the multi-layer adhesive layer is not restricted by the incompatibility between raw materials, and the function adjustment is more flexible; the antistatic inner layer 12 of the polyethylene composite layer 1 improves the antistatic persistence and stability of the antistatic adhesive layer 22 through the penetration holes; the setting of the mesh exhaust channel 200 realizes the exhaust effect and improves the exhaust efficiency during the film pasting of the protective film, achieving no bubbles, no dust, and no watermarks on the product surface.
[0028] Among them, the penetration holes can be formed by physical and mechanical methods, such as laser perforation; by chemical methods, such as adding calcium carbonate and decomposing to release gas during high-temperature curing of the adhesive layer. The mesh exhaust channel 200 is made by an embossing die; it can also be formed by adjusting the raw materials of the antistatic adhesive layer 22 to form an uneven structure on its surface, and an exhaust channel 200 is formed between the protrusions. The high-temperature resistant adhesive layer 21 and the antistatic adhesive layer 22 are respectively cured and formed on the release film and the release die, and then compounded to form the watermark-free adhesive layer 2; it can also be formed by forming the high-temperature resistant adhesive layer 21 on the surface of the antistatic inner layer 12 of the polyethylene composite layer 1, and then compounding the antistatic adhesive layer 22 with the high-temperature resistant adhesive layer 21.
[0029] The depth of the mesh exhaust channel 200 is less than the thickness of the antistatic adhesive layer 22, which increases the contact area between the antistatic adhesive layer 22 and the high-temperature resistant adhesive layer 21, thereby improving the adhesion between the two layers.
[0030] The polyethylene composite layer 1 further includes a core layer 10 sandwiched between the antistatic outer layer 11 and the antistatic inner layer 12. In some embodiments, the core layer 10 has a laminated structure of LDPE / HDPE / LDPE.
[0031] In some embodiments, the core layer 10 has a laminated structure of LLDPE / HDPE / LLDPE.
[0032] In some embodiments, the core layer 10 has a laminated structure of LLDPE / HDPE / LDPE.
[0033] Among them, the setting of HDPE improves the hardness of the protective film, prevents wrinkles from being generated during lamination due to poor hardness of the protective film; improves the mechanical strength and environmental stress cracking resistance, prevents the protective film from breaking during use or tearing, which has a negative impact on the use experience and protective effect; improves the barrier property of the protective film, prevents gas and water vapor from penetrating into the adhesive layer and having a negative impact on its antistatic performance and the surface appearance of the product. LLDPE has higher strength, toughness, rigidity, tear resistance and environmental stress cracking resistance. LDPE has good flexibility, ductility and transparency. The combination of the LLDPE layer and the LDPE layer with the HDPE layer optimizes the toughness of the protective film to adapt to products with irregular surfaces and curved surfaces.
[0034] The main materials of the antistatic outer layer 11 and the antistatic inner layer 12 are both metallocene linear low density polyethylene. To achieve antistatic properties, antistatic masterbatch needs to be added to the raw materials. Using mLLDPE material will increase the mechanical properties, flexibility, impact strength and film forming property of the protective film.
[0035] The high-temperature resistant adhesive layer 21 is a silicone-modified acrylic adhesive layer. Because, the silicone-containing acrylic adhesive has good high-temperature resistance and can maintain the bonding strength at a relatively high temperature; and the bond energy of the silicon-oxygen bond is greater than that of the carbon-carbon bond, the molecular chain is more stable and not easily broken, so the weather resistance of the antistatic coating is improved; the silicon-oxygen chain segment in the molecular chain can reduce the surface tension of the coating, so that it can also have good adhesion on difficult-to-bond surfaces (such as plastics), improving the connection firmness between the adhesive layer and the polyethylene composite layer; the silicone-containing component endows the adhesive with certain elasticity, which helps to buffer the strain caused by thermal expansion or mechanical stress; it has excellent water resistance and maintains good bonding performance in a humid environment, and there is no delamination between the adhesive layers or between the adhesive layer and the polyethylene composite layer.
[0036] The antistatic adhesive layer 22 is a fluorinated acrylic adhesive layer. Because fluorinated acrylic adhesives have excellent chemical resistance and can resist the erosion of various organic solvents, acids, alkalis and other chemicals; fluoropolymers have good stability and excellent weather resistance; the siloxane segments in the molecular chain can reduce the surface tension of the coating, enabling good adhesion on difficult-to-bond surfaces (such as plastics); they have good UV resistance, which helps protect the bonded area from UV damage; they have high heat resistance and maintain bonding strength at higher temperatures; they have good water resistance and can maintain good bonding performance in humid environments without residual glue after peeling; they have good antifouling properties, maintaining the cleanliness of the product surface and reducing dust. The similar materials of the high-temperature resistant adhesive layer and the antistatic adhesive layer promote the compatibility and adhesion of the two layers.
[0037] The HDPE layer in the core layer 10 accounts for 50% - 70% of the total thickness of the core layer; the thickness ratio among the antistatic outer layer 11, the core layer 10 and the antistatic inner layer 12 is (1 - 2):(3 - 4):(1 - 2). An antistatic release film 3 is provided on the surface of the antistatic adhesive layer 22 away from the high-temperature resistant adhesive layer 21.
[0038] Example 1
[0039] As Figure 1 shown, the polyethylene protective film for electronics in Example 1 includes a polyethylene composite layer 1 and a watermark-free adhesive layer 2. The polyethylene composite layer 1 includes an antistatic outer layer 11 and an antistatic inner layer 12; the watermark-free adhesive layer 2 includes a high-temperature resistant adhesive layer 21 and an antistatic adhesive layer 22 that are sequentially connected to the antistatic inner layer 12; the high-temperature resistant adhesive layer 21 is provided with penetration holes penetrating along the layer thickness direction. The penetration holes communicate the polyethylene composite layer 1 and the antistatic adhesive layer 22, and a mesh exhaust channel 200 is provided on the surface of the antistatic adhesive layer 22 away from the high-temperature resistant adhesive layer 21. The polyethylene composite layer 1 further includes a core layer 10 sandwiched between the antistatic outer layer 11 and the antistatic inner layer 12. Among them, the core layer 10 is a laminated structure of LLDPE / HDPE / LLDPE. An antistatic release film 3 is provided on the surface of the antistatic adhesive layer 22 away from the high-temperature resistant adhesive layer 21.
[0040] Example 2
[0041] As Figure 2 shown, Example 2 is based on Example 1, and the difference is that the core layer 10 is a laminated structure of LLDPE / HDPE / LDPE. Among them, the LDPE layer is close to the watermark-free adhesive layer 2. The composite of the antistatic outer layer composed of metallocene linear low-density polyethylene, the LLDPE layer, and the HDPE layer improves the mechanical properties and impact strength of the protective film and extends its service life.
[0042] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims
1. A polyethylene protective film for electronics, characterized in that, Comprising: A polyethylene composite layer, including an antistatic outer layer and an antistatic inner layer; A watermark-free adhesive layer, including a high-temperature resistant adhesive layer and an antistatic adhesive layer sequentially connected to the antistatic inner layer; The high-temperature resistant adhesive layer is provided with penetration holes penetrating along the layer thickness direction, the penetration holes communicate the polyethylene composite layer and the antistatic adhesive layer, and a mesh exhaust channel is arranged on the surface of the antistatic adhesive layer away from the high-temperature resistant adhesive layer.
2. The polyethylene protective film for electronics according to claim 1, wherein The depth of the mesh exhaust channel is less than the thickness of the antistatic adhesive layer.
3. The polyethylene protective film for electronics according to claim 1, characterized in that, The polyethylene composite layer further includes a core layer sandwiched between the antistatic outer layer and the antistatic inner layer, and the core layer is a laminated structure of LDPE / HDPE / LDPE, or LLDPE / HDPE / LLDPE, or LLDPE / HDPE / LDPE.
4. The polyethylene protective film for electronics according to claim 1 or 3, characterized in that, The main materials of the antistatic outer layer and the antistatic inner layer are both metallocene linear low density polyethylene.
5. The polyethylene protective film for electronics according to claim 1, wherein The high-temperature resistant adhesive layer is a silicone-modified acrylic adhesive layer.
6. The polyethylene protective film for electronics according to claim 1 or 5, characterized in that, The antistatic adhesive layer is a fluorinated acrylic adhesive layer.
7. The polyethylene protective film for electronics according to claim 3, wherein The HDPE layer in the core layer accounts for 50% - 70% of the total layer thickness of the core layer.
8. The polyethylene protective film for electronics according to claim 7, wherein The ratio of the layer thicknesses between the antistatic outer layer, the core layer and the antistatic inner layer is (1 - 2):(3 - 4):(1 - 2).
9. The polyethylene protective film for electronics according to claim 1, characterized in that, An antistatic release film is arranged on the surface of the antistatic adhesive layer away from the high-temperature resistant adhesive layer.