Wafer box unlocking structure
By designing a simplified wafer box unlocking structure, the wafer box can be unlocked by rotating the wafer box, solving the problems of low efficiency and chip risk in the existing technology, and achieving an efficient and low-cost unlocking process.
Patent Information
- Application Number
- CN202422584548.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-10-24
AI Technical Summary
The existing wafer box unlocking methods have problems such as low efficiency and risk of wafer breakage, complex mechanical structure and high cost.
A wafer box unlocking structure is designed, including a bottom plate and an unlocking column fixed to the bottom plate. By placing the wafer box on the bottom plate and cooperating with the unlocking column, the wafer box can be unlocked, which simplifies the operation process and reduces the flip action.
Improves the unlocking efficiency of wafer boxes, reduces the risk of wafer chips, and reduces structural complexity and cost.
Smart Images

Figure CN223136569U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor manufacturing, and more specifically, relates to a wafer cassette unlocking structure. Background Art
[0002] In the manufacturing process of semiconductor wafers, there are many processing procedures or steps, and the wafers need to be placed in different positions and different machines due to these procedures or steps. Therefore, in the wafer processing technology, the wafers must be transported from one place to another, and even stored for a period of time to cooperate with the necessary processes. The wafer cassette mainly plays the role of storing and transporting wafers in semiconductor production, and the wafer cassette can effectively reduce the risk of wafer contamination.
[0003] The wafer cassette generally includes a box body, a door body covering the box body, and a bottom lock mechanism provided on the door body. The bottom lock mechanism is used to lock the box body inside the door body. There are generally two methods for unlocking the existing 8-inch wafer cassette: First, the operator uses a screwdriver to open the bottom lock mechanism, then turns over the wafer cassette, removes the door body and then takes out the box body. This method of opening the box affects work efficiency and there is a risk of wafer fragmentation. Second, an existing box opener is used for unlocking. The unlocking column of the existing box opener is installed on a rotating plate, and the rotating plate is connected with a rotating handle. When unlocking, first align the unlocking hole of the wafer cassette with the unlocking column of the box opener, place the wafer cassette on the unlocking platform of the box opener, keep the wafer cassette stationary, and operate the rotating handle to drive the rotating plate to drive the unlocking column to rotate so as to unlock the bottom lock mechanism. However, the mechanical structure of the existing box opener is complex and expensive. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a wafer cassette unlocking structure, which can improve the efficiency of opening the wafer cassette, reduce the risk of wafer fragmentation, and has a simple structure and low cost.
[0005] To achieve the above purpose, the technical solution adopted by the utility model is: In the first aspect of the utility model, a wafer cassette unlocking structure is provided. The wafer cassette includes two unlocking holes, and the wafer cassette unlocking structure includes:
[0006] A bottom plate and two unlocking columns. The unlocking columns are fixed on the bottom plate. The bottom plate is used to support the wafer cassette, and the unlocking columns are used to cooperate with the unlocking holes. Wherein, after the unlocking holes cooperate with the unlocking columns, the bottom plate and the unlocking columns are fixed, and rotating the wafer cassette can unlock the wafer cassette.
[0007] In one embodiment, the unlocking column is a screw or a cylindrical pin with an internal thread.
[0008] In one embodiment, the bottom plate is made of aluminum alloy or stainless steel;
[0009] A first limiting structure and a first identifier are provided on the bottom plate. The first limiting structure is used to limit the placement position of the wafer cassette, and the first identifier is used to indicate the rotation direction of the wafer cassette.
[0010] In a second aspect of the present invention, a wafer cassette unlocking structure is provided. The wafer cassette includes two unlocking holes. The wafer cassette unlocking structure includes:
[0011] An upper support plate, a lower bottom plate, and two unlocking columns;
[0012] The upper support plate and the lower bottom plate are stacked, the upper support plate and the lower bottom plate are rotatably connected, the unlocking column is fixedly connected to the lower bottom plate, the unlocking column extends out of the plane where the upper support plate is located, the upper support plate is used to support the wafer cassette, and the unlocking column is used to cooperate with the unlocking hole to unlock the wafer cassette when the wafer cassette is rotated.
[0013] In an embodiment, a rotating structure is further included. The rotating structure includes an outer ring and an inner ring. The outer ring can rotate relative to the inner ring. The inner ring is fixedly connected to the lower bottom plate, the outer ring is fixedly connected to the upper support plate, and the unlocking column extends out from the inside of the inner ring.
[0014] In an embodiment, a mounting plate is provided at the top of the inner ring. The unlocking column is arranged on the mounting plate, and the upper top surface of the mounting plate is coplanar with the upper top surface of the upper support plate.
[0015] In an embodiment, the upper support plate is provided with a second limiting structure and a second identifier. The second limiting structure is used to limit the placement position of the wafer cassette, and the second identifier is used to indicate the rotation direction of the wafer cassette.
[0016] In an embodiment, the second limiting structure is a first bent portion located at the edge of the upper support plate. The side of the first bent portion away from the upper support plate inclines towards the outside of the upper support plate;
[0017] The size of the upper support plate fits the size of the bottom of the wafer cassette. The outer contour of the upper support plate is square, and the corners of the upper support plate are rounded.
[0018] In an embodiment, the second identifier is a graphic identifier or a text identifier, or the second identifier is a groove or a protrusion that cooperates with the bottom of the wafer cassette.
[0019] In an embodiment, the edge of the lower bottom plate has a second bent portion extending towards the side away from the upper support plate, and a rubber pad is provided at the bottom of the second bent portion.
[0020] The unlocking structure of the wafer cassette provided by the present utility model includes a bottom plate and two unlocking columns. The unlocking columns are fixed on the bottom plate, and the bottom plate is used to support the wafer cassette. The unlocking columns are used to cooperate with the unlocking holes of the wafer cassette. When the unlocking structure of the wafer cassette is in use, after the unlocking holes cooperate with the unlocking columns, the bottom plate and the unlocking columns remain stationary, and by rotating the wafer cassette, the wafer cassette can be unlocked. This unlocking structure of the wafer cassette has a simple structure and low cost. After the wafer cassette is properly placed on the bottom plate, the unlocking columns cooperate with the unlocking holes. The bottom plate and the unlocking columns remain stationary, and by rotating the wafer cassette, the unlocking of the wafer cassette can be achieved. Compared with the existing unlocking device in which the wafer cassette remains stationary and the rotation handle is operated to drive the rotating plate to drive the unlocking column to rotate to unlock the bottom locking mechanism, which has a complex mechanical structure and high price, the unlocking structure of this patent can improve the unlocking efficiency of the wafer cassette. After the unlocking structure of this wafer cassette unlocks the wafer cassette, it is not necessary to flip the wafer cassette, reducing the risk of wafer fragmentation.
[0021] The unlocking structure of the wafer cassette provided by the present utility model includes an upper support plate, a lower bottom plate and two unlocking columns. The upper support plate and the lower bottom plate are stacked, and the upper support plate and the lower bottom plate are rotatably connected. The unlocking columns are fixedly connected to the lower bottom plate, and the unlocking columns extend out of the plane where the upper support plate is located. The upper support plate is used to support the wafer cassette, and the unlocking columns are used to cooperate with the unlocking holes. When the wafer cassette is rotated, the wafer cassette is unlocked. When the unlocking structure of the wafer cassette is in use, the wafer cassette is placed on the upper support plate, the unlocking columns cooperate with the unlocking holes. When the wafer cassette is rotated, the lower bottom plate and the unlocking columns remain stationary, and the wafer cassette and the upper support plate rotate simultaneously to achieve the unlocking of the wafer cassette. This unlocking structure of the wafer cassette has a simple structure and low cost, and can reduce the risk of wafer fragmentation during the unlocking process. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0023] Figure 1 It is a schematic structural diagram of the unlocking structure of the wafer cassette provided in Embodiment 1 of the present utility model;
[0024] Figure 2 It is a schematic structural diagram of the wafer cassette provided in the embodiment of the present utility model;
[0025] Figure 3 It is a schematic structural diagram of the unlocking structure of the wafer cassette provided in Embodiment 2 of the present utility model from a perspective;
[0026] Figure 4Schematic diagram of the unlocking structure of the wafer cassette provided in the second embodiment of the present utility model from another perspective;
[0027] Figure 5 For Figure 3 Enlarged structural diagram of point A when the unlocking column is arranged on the lower bottom plate in
[0028] Figure 6 For Figure 3 Enlarged structural diagram of point A when the unlocking column is arranged on the mounting plate in
[0029] Figure 7 Schematic diagram of the structure during the process of placing an 8-inch wafer cassette on the upper tray.
[0030] Among them, the reference numerals in the figures are as follows:
[0031] 1 - wafer cassette; 2 - bottom plate; 3 - unlocking column; 4 - rotating structure; 11 - unlocking hole; 20 - first limiting structure; 21 - upper support plate; 22 - lower bottom plate; 41 - outer ring; 42 - inner ring; 43 - mounting plate; 211 - first bending part; 212 - second mark; 221 - second bending part. Detailed implementation manners
[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0033] In the description of the present utility model, it should be understood that the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those clearly listed steps or units, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products, or devices.
[0034] It should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model.
[0035] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. It should be understood that the term "and / or" used herein is merely a description of the relationship between associated objects, indicating that three relationships may exist. For example, A and / or B may represent three cases: A exists alone, A and B exist simultaneously, and B exists alone. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.
[0036] The unlocking structure of the wafer cassette provided by the present utility model will be described in detail below with reference to specific embodiments.
[0037] Embodiment 1:
[0038] Figure 1 It is a schematic structural diagram of the unlocking structure of the wafer cassette provided in Embodiment 1 of the present utility model. Figure 2 It is a schematic structural diagram of the wafer cassette provided in the embodiment of the present utility model. Please refer to Figure 1 and Figure 2 , the unlocking structure of the wafer cassette in this embodiment is used for unlocking the wafer cassette 1. The wafer cassette 1 includes two unlocking holes 11. The unlocking structure of the wafer cassette includes a bottom plate 2 and two unlocking columns 3. The unlocking columns 3 are fixed on the bottom plate 2. The bottom plate 2 is used to support the wafer cassette 1, and the unlocking columns 3 are used to cooperate with the unlocking holes 11. Among them, after the unlocking holes 11 cooperate with the unlocking columns 3, the bottom plate 2 remains stationary, and rotating the wafer cassette 1 can unlock the wafer cassette 1.
[0039] The wafer cassette 1 in this embodiment is introduced by taking the wafer cassette of 8-inch wafers as an example. The wafer cassette 1 includes a box body, a door body covering the box body, and a bottom lock mechanism provided on the door body. The unlocking holes 11 are located on the bottom lock mechanism. No special limitation is imposed on the specific material of the wafer cassette 1 in this embodiment.
[0040] The bottom plate 2 in this embodiment is used to support the wafer cassette 1. No special limitation is imposed on the material and size of the bottom plate 2 in this embodiment. The unlocking columns 3 are fixed on the bottom plate 2. No special limitation is imposed on the fixing method of the unlocking columns 3 and the bottom plate 2 in this embodiment. Exemplarily, the unlocking columns 3 can be detachably fixed to the bottom plate 2 for easy disassembly and replacement of the unlocking columns 3, or the unlocking columns 3 can be integrally fixed to the bottom plate 2.
[0041] Most current wafer cassette operators use a screwdriver to open the wafer cassette 1. During the unlocking process, the bottom lock mechanism of the wafer cassette 1 is placed facing upwards, that is, the bottom of the wafer cassette 1 is facing upwards. Then, a screwdriver is inserted into the unlocking hole to open the bottom lock mechanism of the wafer cassette 1. After that, the wafer cassette 1 is flipped over, the door body is moved away, and the cassette body is taken out. This way of opening the cassette affects work efficiency and greatly increases the risk of wafer fragmentation when flipping the wafer cassette 1. The wafer cassette unlocking structure of this embodiment includes a bottom plate 2 and two unlocking columns 3. The unlocking columns 3 are fixed on the bottom plate 2. When unlocking the wafer cassette 1, the bottom lock mechanism of the wafer cassette 1 is placed facing downwards on the bottom plate 2, the unlocking columns 3 are inserted into the unlocking holes 11 of the bottom lock mechanism of the wafer cassette 1, the bottom plate 2 supports the wafer cassette 1, the unlocking columns 3 and the bottom plate 2 are fixed and immovable. When rotating the wafer cassette 1, the bottom lock mechanism of the wafer cassette 1 can be unlocked. This wafer cassette unlocking structure can unlock the bottom lock mechanism of the wafer cassette 1 by rotating the wafer cassette 1. After the wafer cassette 1 is unlocked, without flipping the wafer cassette 1, the door body can be directly moved away to take out the cassette body. It improves the unlocking efficiency of the wafer cassette 1 and reduces or avoids the risk of wafer fragmentation.
[0042] The wafer cassette unlocking structure provided by the present utility model includes a bottom plate and two unlocking columns. The unlocking columns are fixed on the bottom plate. The bottom plate is used to support the wafer cassette, and the unlocking columns are used to cooperate with the unlocking holes. When rotating the wafer cassette, the wafer cassette is unlocked. This wafer cassette unlocking structure is simple in structure and convenient to manufacture, and can save manufacturing costs. After the wafer cassette is placed in place on the bottom plate, the unlocking columns cooperate with the unlocking holes, the bottom plate and the unlocking columns remain stationary, and rotating the wafer cassette can achieve the unlocking of the wafer cassette. This unlocking structure can improve the opening efficiency of the wafer cassette. After the bottom lock mechanism of the wafer cassette is opened, the door body can be directly removed to take out the cassette body, reducing or avoiding the risk of wafer fragmentation.
[0043] Optionally, the unlocking column 3 of this embodiment is a screw or a cylindrical pin. Exemplarily, the screw is fixed on the bottom plate 2 through a nut. When the unlocking column 3 is a screw, the unlocking column 3 has a simple structure and low cost. Since the end of the screw is relatively sharp and easily scratches the bottom of the wafer cassette 1, the unlocking column 3 of this embodiment is preferably a cylindrical pin with internal threads, and the cylindrical pin with internal threads is fixed on the bottom plate 2 through a screw.
[0044] Preferably, the bottom plate 2 of this embodiment is made of aluminum alloy or stainless steel. The material of the bottom plate 2 being aluminum alloy or stainless steel has high strength, strong corrosion resistance, and a long service life.
[0045] Further, a first limiting structure is provided on the bottom plate 2 of this embodiment, and the first limiting structure 20 is used to limit the placement position of the wafer cassette 1.
[0046] The body of the wafer cassette 1 generally has a wide opening and a narrow opening, and the door body covering the body is generally a transparent structure. The first limiting structure of this embodiment includes a position identifier 201 that can distinguish the wide-opening direction and the narrow-opening direction of the cassette body. By setting a position identifier 201 on the bottom plate 2 that can distinguish the wide-opening direction and the narrow-opening direction of the cassette body, it is convenient to place the wafer cassette 1 in place, so that the unlocking hole 11 on the wafer cassette 1 corresponds to the unlocking column 3 on the bottom plate 2. Because in actual on-site operation, the operator generally determines the rotational unlocking direction of the wafer cassette 1 according to the wide-opening direction and the narrow-opening direction of the crystal cassette of the wafer cassette 1. Through the position identifier 201 that distinguishes the wide-opening direction and the narrow-opening direction of the cassette body, it is convenient for the operator to clarify the rotational direction during the unlocking process of the wafer cassette, improving the efficiency of opening the cassette.
[0047] The first limiting structure 20 of this embodiment further includes a graphic identifier 202 that is the same as the outer contour of the bottom of the wafer cassette 1, or a sunken groove that is the same as the outer contour of the bottom of the wafer cassette 1, which is convenient for the operator to quickly place the wafer cassette 1 in place.
[0048] Of course, in other embodiments, a first identifier for indicating the rotational direction of the wafer cassette 1 can also be set on the bottom plate 2, which is more convenient for the operator to clarify the rotational unlocking direction of the wafer cassette.
[0049] This wafer cassette unlocking structure is simple in structure. After the wafer cassette is placed in place on the bottom plate 2, when the wafer cassette is rotated, the unlocking column 3 and the unlocking hole 11 cooperate to unlock the wafer cassette. This unlocking structure can improve the efficiency of opening the wafer cassette 1 and reduce the risk of wafer fragmentation.
[0050] Embodiment Two:
[0051] Figure 3 It is a schematic structural diagram of the wafer cassette unlocking structure provided by the second embodiment of the present invention from one perspective. Figure 4 It is a schematic structural diagram of the wafer cassette unlocking structure provided by the second embodiment of the present invention from another perspective. Please refer to Figures 2 - 4 , this embodiment provides another wafer cassette unlocking structure for unlocking the wafer cassette 1. The wafer cassette 1 includes two unlocking holes 11. The wafer cassette unlocking structure includes an upper support plate 21, a lower bottom plate 22, and two unlocking columns 3.
[0052] The upper support plate 21 and the lower bottom plate 22 are stacked, and the upper support plate 21 and the lower bottom plate 22 are rotatably connected. The unlocking column 3 is fixedly connected to the lower bottom plate 22, and the unlocking column 3 extends out of the plane where the upper support plate 21 is located. The upper support plate 21 is used to support the wafer cassette 1, and the unlocking column 3 is used to cooperate with the unlocking hole 11 to unlock the wafer cassette 1 when the wafer cassette 1 is rotated.
[0053] The difference between the wafer cassette unlocking structure of this embodiment and that of the first embodiment is that the wafer cassette unlocking structure of this embodiment further includes an upper support plate 21. The upper support plate 21 and the lower bottom plate 22 are rotatably connected. When rotating the wafer cassette 1, the upper support plate 21 supports the wafer cassette 1, and the wafer cassette 1 and the upper support plate 21 rotate simultaneously. Compared with the first embodiment, this embodiment reduces the friction force during the rotation of the wafer cassette 1 and improves the stability of the wafer cassette 1 during the unlocking process. Moreover, since the wafer cassette 1 and the upper support plate 21 rotate simultaneously when rotating the wafer cassette 1 in this embodiment, there is no relative sliding between the wafer cassette 1 and the upper support plate 21, and no relative friction will be generated between the wafer cassette 1 and the upper support plate 21, reducing or avoiding the particulate impurity pollution of the wafer cassette 1 caused by the relative friction between the wafer cassette 1 and the upper support plate 21.
[0054] In this embodiment, the materials of the upper support plate 21 and the lower bottom plate 22 are both aluminum alloy or stainless steel. Aluminum alloy or stainless steel has high strength, strong corrosion resistance, and high service life.
[0055] Figure 5 For Figure 3 the enlarged schematic view of the structure at point A when the unlocking column is arranged on the lower bottom plate, please refer to Figure 3 、 Figure 5 Specifically, the wafer cassette unlocking structure of this embodiment further includes a rotating structure 4. The rotating structure 4 includes an outer ring 41 and an inner ring 42. The outer ring 41 can rotate relative to the inner ring 42. The inner ring 42 is fixedly connected to the lower bottom plate 22, the outer ring 41 is fixedly connected to the upper support plate 21, and the unlocking column extends out from the inside of the inner ring 41.
[0056] This embodiment realizes the rotatable connection between the upper support plate 21 and the lower bottom plate 22 through the rotating structure 3. Exemplarily, the structure between the outer ring 41 and the inner ring 42 in this embodiment is an existing bearing structure, or other structures that can realize the rotation of the outer ring 41 and the inner ring 42. For example, the outer ring 41 has a convex tooth structure on the side close to the inner ring 42, and the inner ring 42 has a slot that cooperates with the convex tooth structure. By applying an external force to the outer ring 41, the outer ring 41 rotates relative to the inner ring 42.
[0057] Figure 6 For Figure 3 the enlarged schematic view of the structure at point A when the unlocking column is arranged on the mounting plate, please refer to Figure 3 、 Figure 6, Further, in this embodiment, a mounting plate 43 is provided at the top of the inner ring 42, the unlocking column 3 is disposed on the mounting plate 43, and the upper top surface of the mounting plate 43 is coplanar with the upper top surface of the upper supporting plate 21. In this embodiment, by providing the mounting plate 43 at the top of the inner ring 42, with the upper top surface of the mounting plate 43 being coplanar with the upper top surface of the upper supporting plate 21 and the unlocking column 3 being disposed on the mounting plate 43, the height of the unlocking column 3 is reduced compared to directly fixing the unlocking column 3 to the lower bottom plate 22, and to a certain extent, the strength of the unlocking column 3 is improved.
[0058] Further, please refer to Figure 2 , the upper supporting plate 21 is provided with a second limiting structure and a second mark 212. The second limiting structure is used to limit the placement position of the wafer cassette 1, and the second mark 212 is used to indicate the rotation direction of the wafer cassette 1.
[0059] Preferably, the second limiting structure of this embodiment is a first bending portion 211 located at the edge of the upper supporting plate 21, and the side of the first bending portion 211 away from the upper supporting plate 21 is inclined towards the outside of the upper supporting plate 21. Figure 7 For the structural schematic diagram during the placement of an 8-inch wafer cassette on the upper tray, please refer to Figure 7 , the first bending portion 211 of this embodiment is inclined towards the outside of the upper supporting plate 21, which is convenient for guiding the wafer cassette 1 during the placement process of the wafer cassette 1. Moreover, by guiding the wafer cassette 1 through the first bending portion 211 inclined towards the outside of the upper supporting plate 21, the stability of the wafer cassette 1 can be improved when placing the wafer cassette 1. While the wafer cassette 1 is being guided by the first bending portion 211, the wafer cassette 1 is slowly placed on the upper supporting plate 21, which is convenient for the unlocking column 3 to align with the unlocking hole 11, reducing the impact on the wafer cassette 1 caused by the unlocking column 3 during the repeated movement of the wafer cassette 1 due to the inconvenience of aligning with the unlocking hole 11, and improving the stability of the wafer cassette 1.
[0060] The size of the supporting surface of the upper supporting plate 21 in this embodiment matches the bottom size of the 8-inch wafer cassette 1. After the 8-inch wafer cassette 1 is placed on the upper supporting plate 21, the wafer cassette 1 fits against the side of the first bending portion 211 close to the upper supporting plate 21. The outer contour of the upper supporting plate 21 is square, and the corners of the upper supporting plate 21 are rounded. The rounded corner design of the upper supporting plate 21 in this embodiment can improve safety. The rounded corners of the upper supporting plate 21 are not sharp, which is safer compared to the right-angle design, avoiding the harm caused by collisions. Moreover, the rounded corners improve the aesthetics of the wafer cassette unlocking structure.
[0061] On the upper support plate 21 of this embodiment, a second identifier 212 is provided, and the second identifier 212 is used to indicate the placement position of the wafer cassette 1 and the rotation direction of the wafer cassette 1. Optionally, the second identifier is a graphic identifier, or the second identifier is a groove or a protrusion that mates with the bottom of the wafer cassette 1.
[0062] The body of the wafer cassette 1 generally has a wide opening and a narrow opening, and the door body covering the body is generally a transparent structure. Because in actual on-site operations, the operator generally determines the rotation unlocking direction of the wafer cassette 1 according to the wide opening orientation and the narrow opening orientation of the wafer cassette 1. The second identifier 212 of this embodiment is a position identifier that can distinguish the wide opening orientation and the narrow opening orientation of the body. This position identifier can be represented by a graphic, or the second identifier 212 is a groove or a protrusion that mates with the bottom of the wafer cassette 1. By providing a position identifier on the bottom plate 1 that can distinguish the wide opening orientation and the narrow opening orientation of the body, it is convenient for the operator to distinguish the rotation direction during the unlocking process of the wafer cassette. After the wide opening orientation and the narrow opening orientation of the wafer cassette 1 are determined, it is convenient for the operator to quickly clarify the rotation unlocking direction and improve the box opening efficiency.
[0063] Furthermore, the edge of the lower bottom plate 22 has a second bent portion 221 extending toward the side away from the upper support plate 21, and a rubber pad is provided at the bottom of the second bent portion 221. Exemplarily, the edge of the lower bottom plate 22 of this embodiment is bent, and a rubber pad is added at the bent portion to increase the friction between the lower bottom plate 22 and the carrying platform. Moreover, by bending the edge of the lower bottom plate 22 toward the bottom direction, it is convenient to install the unlocking column 3 at the bottom of the lower bottom plate 22.
[0064] The wafer cassette unlocking structure of this embodiment is used for unlocking the wafer cassette. The wafer cassette 1 includes a body, a door body covering the body, and a bottom lock mechanism provided on the door body. The unlocking hole 11 is located on the bottom lock mechanism. The unlocking steps of the wafer cassette unlocking structure of this embodiment are as follows: Place the bottom lock mechanism of the wafer cassette 1 downward on the upper support plate 21, insert two unlocking columns 3 into two unlocking holes 11, rotate the wafer cassette 1, the wafer cassette 1 and the upper support plate 21 rotate together, the lower bottom plate 22 and the unlocking columns 3 do not move, and the unlocking columns 3 unlock the bottom lock mechanism of the wafer cassette 1. Then, move the door body of the wafer cassette 1 away to take out the body. This wafer cassette unlocking structure can open the bottom lock mechanism of the wafer cassette 1 by rotating the wafer cassette 1. After the wafer cassette 1 is unlocked, there is no need to flip the wafer cassette 1, and the door body can be directly moved away to take out the body. This improves the unlocking efficiency of the wafer cassette 1 and reduces or avoids the risk of wafer fragmentation.
[0065] The unlocking structure of the wafer cassette provided by the present utility model includes an upper support plate, a lower bottom plate, and two unlocking columns. The upper support plate and the lower bottom plate are stacked, and the upper support plate and the lower bottom plate are rotatably connected. The unlocking column is fixedly connected to the lower bottom plate, and the unlocking column extends out of the plane where the upper support plate is located. The upper support plate is used to support the wafer cassette, and the unlocking column is used to cooperate with the unlocking hole to unlock the wafer cassette when the wafer cassette is rotated. When the unlocking structure of the wafer cassette is in use, the wafer cassette is placed on the upper support plate, the unlocking column is matched with the unlocking hole, and when the wafer cassette is rotated, the lower bottom plate and the unlocking column do not move, and the wafer cassette and the upper support plate rotate simultaneously to realize the unlocking of the wafer cassette. The unlocking structure of the wafer cassette has a simple structure, low cost, and can reduce the risk of wafer fragmentation during the unlocking process.
[0066] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model.
Claims
1. A wafer cassette unlocking structure for unlocking a wafer cassette, the wafer cassette including two unlocking holes, characterized in that, The unlocking structure of the wafer cassette includes: a bottom plate and two unlocking posts, the unlocking posts are fixed on the bottom plate, the bottom plate is used to support the wafer cassette, and the unlocking posts are used to cooperate with the unlocking holes; wherein, after the unlocking holes cooperate with the unlocking posts, the bottom plate and the unlocking posts are fixed, and by rotating the wafer cassette, the wafer cassette can be unlocked.
2. The unlocking structure of the wafer cassette according to claim 1, wherein, The unlocking posts are screws or cylindrical pins with internal threads.
3. The unlocking structure of the wafer cassette according to claim 1, characterized in that, The bottom plate is made of aluminum alloy or stainless steel; The bottom plate is provided with a first limiting structure and a first mark, the first limiting structure is used to limit the placement position of the wafer cassette, and the first mark is used to indicate the rotation direction of the wafer cassette.
4. A wafer cassette unlocking structure for unlocking a wafer cassette, the wafer cassette including two unlocking holes, characterized in that, The unlocking structure of the wafer cassette includes an upper support plate, a lower bottom plate and two unlocking posts; The upper support plate and the lower bottom plate are stacked, the upper support plate and the lower bottom plate are rotatably connected, the unlocking posts are fixedly connected to the lower bottom plate, the unlocking posts extend out of the plane where the upper support plate is located, the upper support plate is used to support the wafer cassette, and the unlocking posts are used to cooperate with the unlocking holes, and when the wafer cassette is rotated, the wafer cassette can be unlocked.
5. The wafer cassette unlocking structure according to claim 4, wherein, It further includes a rotating structure, the rotating structure includes an outer ring and an inner ring, the outer ring can rotate relative to the inner ring, the inner ring is fixedly connected to the lower bottom plate, the outer ring is fixedly connected to the upper support plate, and the unlocking posts extend out from the inside of the inner ring.
6. The wafer cassette unlocking structure according to claim 5, wherein, The top of the inner ring is provided with a mounting plate, the unlocking posts are arranged on the mounting plate, and the upper top surface of the mounting plate is coplanar with the upper top surface of the upper support plate.
7. The unlocking structure of the wafer cassette according to claim 4, wherein The upper support plate is provided with a second limiting structure and a second mark, the second limiting structure is used to limit the placement position of the wafer cassette, and the second mark is used to indicate the rotation direction of the wafer cassette.
8. The unlocking structure of the wafer cassette according to claim 7, wherein the second limiting structure is a first bent portion located at the edge of the upper support plate, and the side of the first bent portion away from the upper support plate is inclined towards the outside of the upper support plate; The size of the upper support plate matches the size of the bottom of the wafer cassette, the outer contour of the upper support plate is square, and the corners of the upper support plate are rounded.
9. The unlocking structure of the wafer cassette according to claim 7, wherein, The second mark is a graphic mark or a text mark, or the second mark is a groove or a protrusion that cooperates with the bottom of the wafer cassette.
10. The wafer cassette unlocking structure according to claim 4, characterized in that, The edge of the lower bottom plate has a second bent portion extending towards the side away from the upper support plate, and a rubber pad is arranged at the bottom of the second bent portion.