Chip detecting and removing device

Abstract

The utility model provides a chip detecting and removing device which is used for detecting a lamp panel, and the lamp panel comprises a panel body and a chip arranged on the panel body. The chip detecting and removing device comprises a supporting platform and a removing mechanism. The top surface of the supporting platform is used for bearing a lamp panel to be detected, and the supporting platform can ascend and descend in the vertical direction. The clearing mechanism comprises a rack and a clearing piece arranged on the rack, and the clearing piece is located above the supporting platform. A sticky cleaning surface is formed on the surface, facing the supporting platform, of the cleaning piece, and the cleaning surface can be bonded with the chip. Wherein the supporting platform can be relatively close to the removing part, so that a chip of a lamp panel arranged on the supporting platform can be attached to and bonded with the removing surface; and then, the supporting platform can be far away from the removing part, and in the process, the poorly welded chip can be bonded and fixed on the removing part, so that the poorly welded chip is removed from the plate body, and the operation is convenient, simple, rapid and effective.

Description

Technical Field

[0001] The utility model relates to the technical field of display screen manufacturing, and particularly relates to a chip detection and removal device. Background Art

[0002] LED (Light Emitting Diode) light boards have advantages such as a larger viewing angle, higher brightness, and lower energy consumption, and are currently widely used in fields such as advertising, transportation, commercial displays, stages, conferences, and command centers. With the continuous change of market demands and in response to the characteristics of different usage scenarios, LED display screens with different pitch and packaging methods have emerged.

[0003] Among them, COB (Chip on board) packaging belongs to a new packaging process in LED light boards. This packaging process is a process of directly fixing chips onto a PCB board, which can achieve smaller-pitch pixel points, has higher color reduction and display clarity, and the overall packaging has higher protection ability and better reliability.

[0004] In the production process of COB light boards, LED chips are bonded to the PCB board by means of stencil printing solder paste + reflow soldering, and this process is called die bonding. One of the common pain points in the die bonding process is poor soldering, also known as welding defects. This refers to the situation that after the chips are die-bonded and soldered, due to inconsistent stencil printing solder volume, less solder, or chip offset during die bonding, resulting in poor solder fusion, blackening, or the contact area between the chip pads and the PCB pads after die bonding is too small, and the welding is not firm. The above situations often do not show dead lights or dim lights during production or in the initial stage of the finished product, and it is difficult to be immediately detected. However, during the process of completing the overall packaging of the light board or during the use of the finished product, as the continuous action of stress in the package, the solder joints of the poorly soldered chips gradually break, presenting as dead lights or dim lights, reducing the reliability of the product. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a chip detection and removal device, which can simply, quickly, and effectively detect the welding strength of chips on the light board, and at the same time remove the chips with relatively weak welding strength from the light board.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] According to one aspect of the present application, the present application provides a chip detection and removal device. The light board includes a board body and chips arranged on the board body. The chip detection and removal device includes:

[0008] A support platform, the top surface of which is used to carry the light board to be detected, and the support platform can move up and down in the vertical direction;

[0009] A cleaning mechanism, which includes a frame and a cleaning member disposed on the frame, and the cleaning member is located above the support platform; a cleaning surface with adhesiveness is formed on the surface of the cleaning member facing the support platform, and the cleaning surface can bond with the chip;

[0010] Wherein, the support platform can move relatively closer to or away from the cleaning member, so that the chip of the light board disposed on the support platform can be attached to the cleaning surface, enabling the poorly welded chip to be adhesively fixed, and thus the poorly welded chip can be removed from the board body.

[0011] In some embodiments, the cleaning member includes a main body and an adhesive layer disposed on the surface of the main body, and the adhesive layer is used to bond with the chip;

[0012] One side of the adhesive layer facing the support platform constitutes the cleaning surface;

[0013] The cleaning surface extends horizontally.

[0014] In some embodiments, the cleaning mechanism includes two reels, the two reels are spaced apart horizontally on the frame, both the two reels are located above the support platform, and the opposite ends of the cleaning member are respectively connected to the two reels in one-to-one correspondence; the part of the cleaning member between the two reels facing the support platform constitutes the cleaning surface;

[0015] The cleaning member is movably disposed on the frame; the two reels are respectively rotatably connected to the frame;

[0016] The two reels are respectively a first reel and a second reel, one end of the cleaning member is wound on the first reel, and the other end of the cleaning member is wound on the second reel;

[0017] Wherein, the first reel and the second reel can rotate in the same direction relative to the frame, so that the first reel releases the cleaning member, and the second reel winds up and recovers the cleaning member with the poorly welded chip attached and fixed.

[0018] In some embodiments, the cleaning mechanism includes a first driving member, the first driving member is disposed on the frame, and the first driving member is drivingly connected to the second reel for driving the second reel to rotate;

[0019] The cleaning mechanism further includes a second driving member, the second driving member is disposed on the frame, and the second driving member is drivingly connected to the first reel for driving the first reel to rotate.

[0020] In some embodiments, at least one of the reels is movably connected to the frame and can move up and down relative to the frame;

[0021] The cleaning mechanism comprises at least one adjusting member, the adjusting member is arranged in one-to-one correspondence with the reel, and the adjusting member is used to realize the movable connection between the reel and the frame;

[0022] The adjusting member is a cylinder or a motor.

[0023] In some embodiments, the support platform is provided with a suction hole with a top opening;

[0024] The chip detection and cleaning device comprises an adsorption mechanism having an air inlet connected to the suction hole, and the adsorption mechanism is used to suck the air above the support platform to adsorb and fix the lamp board to be detected located on the support platform.

[0025] In some embodiments, the support platform is provided with a receiving groove opening upward, for receiving the electrical component located on the side of the chip away from the light board to be detected.

[0026] In some embodiments, a lifting mechanism is provided at the bottom of the support platform, and the lifting mechanism is used to drive the support platform to rise and fall;

[0027] The lifting mechanism is a cylinder or a motor.

[0028] In some embodiments, the chip detection and cleaning device also includes a crimping piece, which is movably connected to the frame, abuts against the side of the cleaning piece facing away from the cleaning surface, and can move along the cleaning piece relative to the frame to press the cleaning surface and the chip on the lamp board.

[0029] In some embodiments, the chip detection and removal device further comprises a loading mechanism, and the loading mechanism is used to transfer the lamp board to be detected to the supporting platform;

[0030] The feeding mechanism comprises a base, a first arm, a second arm and a gripper, wherein the first arm is fixedly connected or rotatably connected to the base, an end of the first arm away from the base is rotatably and / or movably connected to the second arm, the gripper is rotatably connected to an end of the second arm away from the first arm, and the gripper is used to grab the light board to be inspected;

[0031] The chip detection and removal device also includes a material unloading mechanism, which is used to grab and transfer the lamp board after detection on the support platform; the structure of the material unloading mechanism is the same as that of the material loading mechanism.

[0032] It can be seen from the above technical solution that the utility model has at least the following advantages and positive effects:

[0033] In the chip detection and cleaning device of the present application, through the cooperation of the support platform and the cleaning member, that is, the support platform carries the lamp board upward to approach the cleaning surface of the cleaning member, and uses the adhesiveness of the cleaning surface to make the chips on the lamp board adhere to and bond with the cleaning surface of the cleaning member. Then, the support platform carries the lamp board downward, and a downward pulling force will be given to the lamp board during the downward movement of the support platform to pull the lamp board so that the chips with good soldering can be separated from the cleaning surface, while the chips with poor soldering will remain adhered to the cleaning member. In this way, the chips with poor soldering on the entire lamp board can be simply, quickly, and effectively screened out and completely removed, so as to ensure the soldering yield of the chips on the lamp board, and improve the display effect and overall reliability of the lamp board.

[0034] In addition, since the cleaning surface of the cleaning member has adhesiveness, the cleaning member can directly bond and remove the chips with poor soldering from the board body. In this way, there is no need to additionally add a cleaning process to peel off the chips with poor soldering from the board body, so as to avoid the remaining chips becoming foreign objects affecting the subsequent lamp board packaging process, ensure the yield of the finally obtained lamp board product, and improve production efficiency. Description of the Drawings

[0035] Figure 1 It is a schematic structural diagram of the chip detection and cleaning device in this embodiment.

[0036] Figure 2 It is a partial schematic diagram when the chip detection and cleaning device in this embodiment performs chip detection on the lamp board.

[0037] The description of the reference numerals is as follows:

[0038] 100, lamp board; 110, board body; 120, chip; 1, support platform; 2, cleaning mechanism; 21, cleaning member; 22, first reel; 23, second reel; 3, lifting mechanism; 4, pressing member; 5, feeding mechanism; 6, discharging mechanism. Detailed Embodiments

[0039] Typical embodiments reflecting the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments, all of which do not depart from the scope of the present invention, and the descriptions and illustrations therein are essentially for illustrative purposes and not for limiting the present invention.

[0040] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indication of the direction or positional relationship (such as up, down, left, right, front and back, etc.) is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. When these elements are in the positions shown in the drawings, these descriptions are appropriate. If the description of the positions of these elements changes, then the indication of these directions also changes accordingly.

[0041] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically defined.

[0042] The present application provides a chip detection and cleaning device for detecting chips on a lamp board after the die bonding process to detect the welding yield of the chips, ensure the display effect of the lamp board, and improve the reliability of the lamp board.

[0043] Among them, the lamp board includes a board body and chips disposed on the board body. The number of chips is multiple, and the multiple chips are spaced apart and distributed on the surface of the board body. The chips herein refer to LED chips (light emitting diode chips) for emitting light.

[0044] The lamp board further includes electrical components disposed on the surface of the board body facing away from the chips, and the electrical components are electrically connected to the chips. That is, the electrical components and the chips are arranged on opposite sides of the board body. The electrical components herein refer to driving ICs (driving chips), which are used to control the current of the lamp board to provide a stable current for the LED chips to drive the LED chips to emit light.

[0045] The following will specifically describe the specific embodiments of the chip detection and cleaning device of the present application with reference to the accompanying drawings.

[0046] Figure 1 It is a schematic structural diagram of the chip detection and cleaning device in this embodiment.

[0047] Reference Figure 1, the chip detection and removal device includes a support platform 1 and a removal mechanism 2. The top surface of the support platform 1 is used to carry the lamp board 100 to be detected, and the support platform 1 can move up and down in the vertical direction. The removal mechanism 2 includes a frame and a removal member 21 provided on the frame. The removal member 21 is located above the support platform 1. The surface of the removal member 21 facing the support platform 1 forms a sticky removal surface 211, and the removal surface 211 can bond with the chip 120. Wherein, the support platform 1 can move relatively closer to or farther away from the removal member 21, so that the chip 120 of the lamp board 100 provided on the support platform 1 can be attached to the removal surface 211, so that the poorly soldered chip 120 can be adhesively fixed on the removal member 21, thereby removing the poorly soldered chip 120 from the board body 110.

[0048] In the above chip detection and removal device, through the cooperation of the support platform 1 and the removal member 21, that is, by the support platform 1 carrying the lamp board 100 upward to approach the removal surface 211 of the removal member 21, and using the stickiness of the removal surface 211 to make the chip 120 of the lamp board 100 adhere to and bond with the removal surface 211 of the removal member 21, and then by the support platform 1 carrying the lamp board 100 downward, a downward pulling force will be given to the lamp board 100 during the downward movement of the support platform 1 to pull the lamp board 100 so that the well-soldered chip 120 can be away from the removal surface 211, while the poorly soldered chip 120 will remain adhesively on the removal member 21. In this way, the poorly soldered chips 120 on the entire lamp board 100 can be simply, quickly and effectively screened out and completely removed, so as to ensure the soldering yield of the chips 120 on the lamp board 100, and improve the display effect and overall reliability of the lamp board 100.

[0049] In addition, since the removal surface 211 of the removal member 21 has stickiness, the removal member 21 can directly bond and remove the poorly soldered chip 120 from the board body 110. In this way, there is no need to add an additional cleaning process to peel off the poorly soldered chip 120 from the board body 110, so as to avoid the remaining chip 120 becoming a foreign object affecting the subsequent packaging process of the lamp board 100, and ensure the yield of the final lamp board 100 product, and improve production efficiency.

[0050] Reference Figure 1 , the top surface of the support platform 1 is used to carry the lamp board 100 to be detected. Specifically, the lamp board 100 to be detected is placed on the top surface of the support platform 1 with its chip 120 facing upward.

[0051] In this embodiment, the support platform 1 is provided with a receiving groove opening upward for receiving electrical components on the side of the chip 120 facing away from the to-be-detected lamp board 100. The top surface of the support platform 1 extends horizontally at the outer peripheral part of the receiving groove. When the to-be-detected lamp board 100 is carried by the support platform 1 as described above, the electrical components on the board body 110 of the to-be-detected lamp board 100 will be received and limited in the receiving groove, which facilitates the board body 110 of the to-be-detected lamp board 100 to fit on the top surface of the support platform 1 and be in a horizontal state, thereby ensuring that the surface of the chip 120 of the to-be-detected lamp board 100 facing away from the board body 110 is in a horizontally extending state.

[0052] Among them, the number of receiving grooves can be multiple, and the multiple receiving grooves are spaced apart. The specific positions and shapes of the receiving grooves are determined according to the shapes and positions of the electrical components on the surface of the board body 110 to ensure that each electrical component can be correspondingly received and limited in a receiving groove.

[0053] The support platform 1 is provided with suction holes with open tops, and the suction holes are spaced apart from the receiving grooves. That is, the suction holes avoid the electrical components and are provided corresponding to the exposed part of the board body 110 of the to-be-detected lamp board 100.

[0054] In this embodiment, the chip detection and cleaning device includes an adsorption mechanism. The adsorption mechanism has an air inlet, and the air inlet communicates with the suction hole. The adsorption mechanism functions to allow the air above the support platform 1 to enter the adsorption mechanism through the suction hole and the air inlet, so as to achieve the purpose of sucking the air between the support platform 1 and the board body 110 of the to-be-detected lamp board 100. In this way, a negative pressure state can be formed between the support platform 1 and the board body 110 of the to-be-detected lamp board 100, thereby adsorbing and fixing the to-be-detected lamp board 100 on the support platform 1. In addition, since the suction holes are provided corresponding to the exposed part of the board body 110 of the to-be-detected lamp board 100, the adsorption and fixing effect of the adsorption mechanism on the to-be-detected lamp board 100 can be improved, and the adsorption mechanism can be prevented from acting on the electrical components on the surface of the board body 110, reducing the connection strength between the electrical components and the board body 110, or even directly disconnecting the connection between the electrical components and the board body 110, thereby ensuring the connection stability between the electrical components and the board body 110.

[0055] Specifically, the adsorption mechanism includes a vacuum pump and a suction pipe. The vacuum pump has an air inlet, and the suction pipe is used to connect the air inlet and the suction hole. The vacuum pump and the suction pipe cooperate to suck the air above the support platform 1.

[0056] In this embodiment, the support platform 1 can move up and down in the vertical direction and can carry the lamp board 100 to be detected up and down. Among them, the support platform 1 has a low position state and a high position state. Here, the low position state refers to the lowest position of the support platform 1 in the lifting stroke, and the high position state refers to the highest position of the support platform 1 in the lifting stroke. When the support platform 1 is in the low position state, the lamp board 100 to be detected can be placed on the support platform 1, or the lamp board 100 that has completed the detection can be removed from the support platform 1. When detecting the lamp board 100, the support platform 1 will carry the lamp board 100 to be detected and sequentially switch among the low position state, the high position state, and the low position state.

[0057] Specifically, a lifting mechanism 3 is provided at the bottom of the support platform 1, and the lifting mechanism 3 is used to drive the support platform 1 to move up and down. Exemplarily, the lifting mechanism 3 can be a cylinder or a motor.

[0058] Reference Figure 1 , the cleaning mechanism 2 includes a frame and a cleaning member 21. The frame is arranged outside the support platform 1, and the frame extends upward beyond the top of the support platform 1 in the high position state. Specifically, the frame can be provided on one side of the support platform 1. In other embodiments, the frame can also be erected above the support platform 1. Specifically, the two opposite ends of the frame are open and the interior is hollow to form a receiving space, and the support platform 1 is arranged in the receiving space.

[0059] The cleaning member 21 is arranged on the frame and is located above the support platform 1. At this time, since the frame extends upward beyond the top of the support platform 1 in the high position state, it is convenient to arrange the cleaning member 21 above the support platform 1. Specifically, the side of the cleaning member 21 facing the support platform 1 can be attached to the chip 120 of the lamp board 100 carried on the support platform 1 in the high position state.

[0060] In this embodiment, the cleaning mechanism 2 further includes two reels. The two reels are spaced apart horizontally on the frame and are located on the side of the frame close to the support platform 1. Both reels are located above the support platform 1. The opposite ends of the cleaning member 21 are respectively connected to the two reels. That is, the two reels cooperate together to realize the installation of the cleaning member 21.

[0061] In this embodiment, the cleaning member 21 is movably disposed on the frame. Specifically, the reel is rotatably connected to the frame respectively. The two reels are a first reel 22 and a second reel 23 respectively. One end of the cleaning member 21 is wound on the first reel 22, and the other end of the cleaning member 21 is wound on the second reel 23. Wherein, the first reel 22 and the second reel 23 can rotate in the same direction relative to the frame, so that the first reel 22 releases the cleaning member 21, and the second reel 23 winds up and recycles the used part of the cleaning member 21. This embodiment utilizes the same-direction rotation of the first reel 22 and the second reel 23 to realize the translation of the part of the cleaning member 21 between the first reel 22 and the second reel 23, can continuously unfold the unused part of the cleaning member 21, and continuously recycle the used part of the cleaning member 21. Moreover, the above design can also reduce the frequency of replacing the cleaning member 21 and improve the efficiency of detecting the lamp board 100.

[0062] In this embodiment, the cleaning mechanism 2 includes a first driving member. The first driving member is disposed on the frame and is drivingly connected to the second reel 23 for driving the second reel 23 to rotate.

[0063] In this embodiment, the first driving member includes a first driving body and a first output shaft. The first driving body is disposed on the side of the frame facing the support platform 1. The first output shaft is connected to the side of the first driving body facing the support platform 1, and the first output shaft extends in the horizontal direction. The first output shaft is drivingly connected to the first driving body, and the first driving body can drive the first output shaft to rotate. The first output shaft passes through the second reel 23 and is connected to the second reel 23, so as to drive the second reel 23 to rotate.

[0064] The first output shaft is detachably connected to the second reel 23, so as to facilitate the detachment of the second reel 23 wound with the used cleaning member 21 from the first output shaft, and at the same time facilitate the installation of a brand-new second reel 23 on the first output shaft, which is convenient for replacing the second reel 23 and replacing the cleaning member 21 on the second reel 23.

[0065] Exemplarily, the cleaning mechanism 2 further includes a first limiting member. The first limiting member is sleeved on the first output shaft and is located at the end of the first output shaft away from the first driving body. It is used to abut against the end of the second reel 23 passing through the first output shaft and away from the first driving body, so as to limit and connect the second reel 23 to the first output shaft. Wherein, the first limiting member can be connected to the first output shaft by screwing or clamping.

[0066] The cleaning mechanism 2 may also include a second driving member, which is arranged on the frame at intervals with the first driving member in the horizontal direction, and the second driving member is drivingly connected to the first reel 22, and is used to drive the first reel 22 to rotate. Wherein, the second driving member acts simultaneously with the first driving member, and drives the first reel 22 and the second reel 23 to rotate in the same direction, so as to ensure that the unused cleaning member 21 part is rolled up while the used cleaning member 21 part is rolled up and recovered. In addition, the above design makes the first reel 22 and the second reel 23 rotate actively, so that the release of the cleaning member 21 and the smoothness and stability of the recovery process can be improved by the joint action of the first reel 22 and the second reel 23.

[0067] In this embodiment, the structure of the second driving member is the same as that of the first driving member, and the specific description is referred to above. The connection mode between the second driving member and the first reel 22 is the same as that between the first driving member and the second reel 23, and the specific description is referred to above.

[0068] In other embodiments, the cleaning mechanism 2 may also include only the first driving member, and the second driving member is omitted. At this time, the first driving member drives the first reel 22 to rotate, and the used cleaning member 21 is wound up. During this process, the first reel 22 will pull the cleaning member 21 portion located between the first reel 22 and the second reel 23 to translate, and then drive the second reel 23 to rotate, so as to release the unused cleaning member 21 portion. The above design can simplify the structure of the cleaning mechanism 2 and save costs while realizing the process of releasing and winding the cleaning member 21.

[0069] In this embodiment, the surface of the cleaning member 21 facing the support platform 1 forms a sticky cleaning surface 211, which can adhere to the chip 120. Specifically, the cleaning member 21 located between the two reels and facing the support platform 1 constitutes the cleaning surface 211.

[0070] In this embodiment, the cleaning member 21 includes a body and an adhesive layer disposed on the surface of the body. The surface of the body facing away from the adhesive layer has anti-stick properties. The side of the adhesive layer facing the support platform 1 constitutes a cleaning surface 211. The adhesive layer has stickiness and is used to bond with the chip 120.

[0071] Among them, the cleaning piece 21 is rolled up on the reel with the adhesive layer facing the reel. At this time, in the two adjacent layers of the cleaning piece 21, the adhesive layer of the cleaning piece 21 located on the outer layer will be attached to the surface of the main body of the cleaning piece 21 located on the inner layer that is away from the adhesive layer. Since the surface of the main body away from the adhesive layer has anti-stickiness, when the cleaning piece 21 is rolled up, the two adjacent layers of the cleaning piece 21 will not stick to each other, thereby ensuring that the cleaning piece 21 can be used normally and ensuring the bonding effect of the cleaning piece 21.

[0072] In this embodiment, the cleaning member 21 is a high-viscosity adhesive film, which is made by mixing a variety of polymer resin materials. Among them, the variety of polymer resin materials include, but are not limited to, modified polyurethane, silicone pressure-sensitive adhesive, polyacrylate pressure-sensitive adhesive, etc., so that the cleaning member 21 has a relatively high bonding strength and no residual adhesive after peeling, so that no adhesive layer will remain on the chip 120 with good welding strength, so as to ensure the display effect of the chip 120 on the lamp board 100. In addition, the viscosity of the cleaning member 21 can be controlled by adjusting the formula and process parameters during the mixing process of various polymer resin materials. The specific operation depends on the needs and will not be elaborated here.

[0073] In this embodiment, the cleaning surface 211 of the cleaning member 21 extends horizontally, which can improve the fitting effect with the chip 120 extending horizontally at the top.

[0074] Specifically, at least one reel is movably connected to the frame and can be lifted and lowered relative to the frame to adjust the height of at least one end of the portion of the cleaning member 21 located between the two reels, so as to facilitate keeping the portion of the cleaning member 21 located between the two reels in a horizontally extended state.

[0075] The cleaning mechanism 2 includes at least one adjusting member, and the adjusting members are arranged in one-to-one correspondence with the reels. The adjusting member is used to realize the movable connection between the reel and the frame.

[0076] In this embodiment, the adjusting member can be a cylinder or a motor.

[0077] Exemplarily, the cleaning mechanism 2 includes a first adjusting member, and the first adjusting member is connected to the first reel 22 and is used to drive the first reel 22 to lift and lower in the vertical direction. Among them, the first adjusting member includes a first adjusting main body and a first adjusting shaft. Specifically, the first adjusting main body is fixed to the frame. The first adjusting shaft extends vertically. One end of the first adjusting shaft is connected to the first adjusting main body, and the other end is connected and fixed to the second driving main body or the first reel 22. The first adjusting main body can drive the first adjusting shaft to expand and contract to drive the first reel 22 to lift and lower.

[0078] The cleaning mechanism 2 may further include a second adjusting member, and the second adjusting member and the first adjusting member are arranged at intervals in the horizontal direction on the side of the frame facing the support platform 1. Among them, the second adjusting member is connected to the second reel 23 and is used to drive the second reel 23 to lift and lower in the vertical direction. Specifically, the structure of the second adjusting member is the same as that of the first adjusting member, and the connection manner between the second adjusting member and the second reel 23 is the same as the connection manner between the first adjusting member and the first reel 22. For specific description, refer to the above text.

[0079] In this embodiment, the number of the cleaning members 21 is multiple, and the adhesive layers of the multiple cleaning members 21 have different viscosities. During actual application, a cleaning member 21 with an appropriate viscosity can be selected according to the welding strength standard of the lamp board 100 to perform at least one detection process on the lamp board 100, or multiple cleaning members 21 with different viscosities can be selected to perform multiple detection processes on the lamp board 100 until it is determined that all the chips 120 with welding strength lower than the standard on the lamp board 100 to be detected are removed by being adhered by the cleaning member 21.

[0080] In this embodiment, the chip detection and cleaning device further includes a pressing member 4. The pressing member 4 is movably connected to the frame. The pressing member 4 abuts against the side of the cleaning member 21 away from the cleaning surface 211. The pressing member 4 can move relative to the frame along the cleaning member 21 to press the cleaning surface 211 against the chips 120 on the lamp board 100, ensuring that all the chips 120 on the lamp board 100 are adhesively fixed to the cleaning surface 211 of the cleaning member 21. Specifically, one end in the length direction of the pressing member 4 is movably connected to the frame.

[0081] The pressing member 4 includes a rotating shaft and a pressing cylinder. The rotating shaft is movably connected to the frame. The pressing cylinder is sleeved on the outer periphery of the rotating shaft and is rotatably connected to the rotating shaft. The outer periphery of the pressing cylinder abuts against the side of the cleaning member 21 away from the cleaning surface 211. Among them, during the process of the rotating shaft driving the pressing cylinder to move along the frame, the pressing cylinder rolls along the cleaning member 21 relative to the rotating shaft to press the cleaning surface 211 against the chips 120 on the lamp board 100. That is to say, in this embodiment, a rolling movement method is adopted to move on the side of the cleaning member 21 away from the cleaning surface 211, which can improve the smoothness of the movement of the pressing cylinder and enable the cleaning surface 211 of the cleaning member 21 to better fit and adhesively fix all the chips 120 on the lamp board 100.

[0082] The chip detection and cleaning device further includes a power member. The power member is arranged on the frame and is drivingly connected to the pressing member 4 to drive the pressing member 4 to move along the cleaning member 21. Specifically, the power member is connected to the end of the rotating shaft of the pressing member 4 close to the frame.

[0083] In this embodiment, the power member can be a telescopic motor or a cylinder, etc.

[0084] In this embodiment, the chip detection and cleaning device further includes a feeding mechanism 5. The feeding mechanism 5 is used to transfer the lamp board 100 to be detected to the support platform 1.

[0085] Exemplarily, the feeding mechanism 5 includes a base, a first arm, a second arm and a gripper. The first arm is fixedly connected or rotatably connected to the base. One end of the first arm away from the base is rotatably connected and / or movably connected to the second arm. The gripper is rotatably connected to one end of the second arm away from the first arm. The gripper is used to grasp the lamp board 100 to be detected.

[0086] In this embodiment, the loading mechanism 5 is a manipulator with a fixed-position base, that is, the position of the base relative to the support platform 1 remains stationary in the horizontal plane, and the lamp board 100 within the moving range of the loading mechanism 5 is grasped through the movement of the first arm, the second arm, and the gripper. In other embodiments, the loading mechanism 5 can also be a manipulator with a movable base, that is, the position transformation of the entire loading mechanism 5 can be realized to expand the moving range of the loading mechanism 5 and improve the flexibility of loading of the loading mechanism 5.

[0087] The chip detection and cleaning device further includes a unloading mechanism 6, and the unloading mechanism 6 is used to grasp and transfer the lamp board 100 after detection located on the support platform 1. The structure of the unloading mechanism 6 is the same as that of the loading mechanism 5, and for specific description, refer to the above text.

[0088] In some embodiments, the chip detection and cleaning device can only include the loading mechanism 5 and omit the setting of the unloading mechanism 6, that is, directly transfer the lamp board 100 to be detected to the support platform 1 through the loading mechanism 5, and transfer the lamp board 100 after detection on the support platform 1 after the lamp board 100 is detected. In addition, the above design can simplify the structure of the chip detection and cleaning device and save costs.

[0089] In this embodiment, the chip detection and cleaning device further includes a controller, and the controller is communicatively connected to the adsorption mechanism, the lifting mechanism 3, the cleaning mechanism 2, the power component, the loading mechanism 5 and the unloading mechanism 6 to control the opening and closing of the communication connections of the adsorption mechanism, the lifting mechanism 3, the cleaning mechanism 2, the power component, the loading mechanism 5 and the unloading mechanism 6. Specifically, the controller is communicatively connected to the vacuum pump, the lifting mechanism 3, the first driving component, the second driving component, the first adjusting component, the second adjusting component, the power component, the loading mechanism 5 and the unloading mechanism 6.

[0090] Figure 2 This is a partial schematic diagram when the chip detection and cleaning device in this embodiment detects the chip 120 on the lamp board 100.

[0091] Refer to Figure 1 and Figure 2 , and an operation method of the above chip detection and cleaning device is exemplarily listed as follows:

[0092] First, select a cleaning part 21 with an adapted viscosity according to the welding strength standard of the lamp board 100 to be detected after the die bonding process, and install it on the rack through the first reel 22 and the second reel 23.

[0093] The first adjusting member is controlled to drive the first reel 22 to rise and fall to adjust the vertical position of the first reel 22, and / or the second adjusting member is controlled to drive the second reel 23 to rise and fall to adjust the vertical position of the second reel 23, so as to ensure that the part of the cleaning member 21 located between the first reel 22 and the second reel 23 is in a horizontally extended state, and then the first adjusting member and / or the second adjusting member are controlled to be closed.

[0094] The loading mechanism 5 is controlled to grab the lamp board 100 to be inspected and transfer it to the supporting platform 1. During this process, the electrical components of the lamp board 100 to be inspected are correspondingly accommodated in the accommodating grooves on the supporting platform 1 to ensure that the surfaces of all chips 120 of the lamp board 100 to be inspected are in a horizontal state.

[0095] Then the adsorption mechanism is controlled to start, so that the vacuum pump continues to work to suck the air between the support platform 1 and the lamp board 100 to be detected, so that the support platform 1 and the lamp board 100 to be detected are in a negative pressure state, thereby adsorbing and fixing the lamp board 100 to be detected.

[0096] Then, the lifting mechanism 3 is controlled to drive the support platform 1 to rise vertically so that the lamp board 100 to be inspected is close to the cleaning surface 211 of the cleaning member 21, until the support platform 1 is in a high position and the chip 120 of the lamp board 100 to be inspected is in contact with the cleaning surface 211, and the lifting mechanism 3 is controlled to close.

[0097] The power component is controlled to drive the crimping component 4 to move along the side of the cleaning component 21 away from the cleaning surface 211 until the cleaning surface 211 and all the chips 120 on the lamp board 100 to be inspected are completely attached and bonded and fixed, and then the power component is turned off.

[0098] The lifting mechanism 3 is controlled to drive the support platform 1 to descend. Since the cleaning member 21 has a strong viscosity, at the moment when the support platform 1 drives the lamp board 100 to be inspected to descend, the lamp board 100 to be inspected will be subjected to a downward pulling force given by the adsorption mechanism and an upward bonding force given by the cleaning member 21. During the continuous descent of the support platform 1, the chip 120 whose welding strength is less than the viscosity of the cleaning member 21 will be peeled off from the board body 110 and remain bonded to the cleaning surface 211 of the cleaning member 21, and the board body 110 and part of the chip 120 can descend with the support platform 1.

[0099] The first driving member is controlled to drive the second reel 23 to rotate, and the second driving member is controlled to drive the first reel 22 to rotate, so as to reel in the used cleaning member 21 portion with the chip 120 bonded thereto, and release the unused cleaning member 21 portion, until the used cleaning member 21 portion with the chip 120 bonded thereto is completely reeled in the second reel 23, and the first driving member and the second driving member are turned off. Thus, the purpose of screening the lamp panels 100 once and removing the poorly welded chips 120 at the same time is achieved.

[0100] According to actual needs, perform a detection process on the lamp board 100 using the above method, or repeat the above method to perform multiple detection processes on the lamp board 100 to remove the chips 120 with poor soldering, until it is determined that all chips 120 with soldering strength lower than the standard have been removed by adhesive film bonding. Then, control the adsorption mechanism to close, and control the blanking mechanism 6 to grab and transfer the lamp board 100 that has completed the detection on the support platform 1.

[0101] Alternatively, multiple cleaning parts 21 with different viscosities can be selected, and one of the cleaning parts 21 is installed on the frame through the first reel 22 and the second reel 23. After performing one or multiple detection processes on the lamp board 100 to be detected by the above method, replace the cleaning part 21, install the cleaning parts 21 with different viscosities on the frame, and then repeat the above method to perform one or multiple detection processes on the lamp board 100 to be detected until it is determined that all chips 120 with soldering strength lower than the standard have been removed by adhesive film bonding.

[0102] When detecting the next lamp board 100 to be detected, repeat the above method as needed.

[0103] It should be particularly noted that the sequence of steps of the operation method of the above chip detection and cleaning device is not limited and can be changed according to actual situations.

[0104] It should be particularly noted that in the operation method of the above chip detection and cleaning device, the opening and closing of the vacuum pump, the lifting mechanism 3, the first driving part, the second driving part, the first adjusting part, the second adjusting part, the power part, the feeding mechanism 5, and the blanking mechanism 6 can be controlled by a controller or manually by an operator.

[0105] From the above technical solutions, it can be seen that the present utility model has at least the following advantages and positive effects:

[0106] In the chip detection and cleaning device of the present application, through the cooperation of the support platform and the cleaning part, that is, the support platform carries the lamp board up to approach the cleaning surface of the cleaning part, and uses the viscosity of the cleaning surface to make the chips of the lamp board adhere to and bond with the cleaning surface of the cleaning part. Then, the support platform carries the lamp board down, and a downward pulling force will be given to the lamp board during the downward movement of the support platform to pull the lamp board so that the chips with good soldering can be separated from the cleaning surface, while the chips with poor soldering will remain adhered to the cleaning part. In this way, the chips with poor soldering on the entire lamp board can be simply, quickly, and effectively screened out and completely removed, so as to ensure the soldering yield of the chips of the lamp board, and improve the display effect and overall reliability of the lamp board.

[0107] In addition, since the cleaning surface of the cleaning member has adhesiveness, the cleaning member can directly bond the chips with poor soldering and remove them from the board body. In this way, there is no need to add an extra cleaning process to peel off the chips with poor soldering from the board body, so as to avoid the remaining chips from becoming foreign objects affecting the subsequent lamp board packaging process, ensure the yield of the finally obtained lamp board product, and improve production efficiency.

[0108] Although the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be construed broadly within the spirit and scope defined by the appended claims. Therefore, all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A chip detection and cleaning device for detecting a lamp board, the lamp board including a board body and chips arranged on the board body, characterized in that, The chip detection and removal device includes: A support platform, the top surface of which is used to carry the lamp board to be detected, and the support platform can move up and down in the vertical direction; A cleaning mechanism, which includes a frame and a cleaning member arranged on the frame, and the cleaning member is located above the support platform; the surface of the cleaning member facing the support platform forms a sticky cleaning surface, and the cleaning surface can bond with the chip; Wherein, the support platform can move relatively closer to or away from the cleaning member, so that the chip on the lamp board arranged on the support platform can be attached to the cleaning surface, so that the poorly welded chip can be bonded and fixed, and thus the poorly welded chip can be removed from the board body.

2. The chip detection and cleaning device according to claim 1, characterized in that, The cleaning member includes a body and an adhesive layer arranged on the surface of the body, and the adhesive layer is used to bond with the chip; One side of the adhesive layer facing the support platform constitutes the cleaning surface; The cleaning surface extends horizontally.

3. The chip detection and cleaning device according to claim 1, wherein The cleaning mechanism includes two reels, and the two reels are spaced apart horizontally on the frame, and both the two reels are located above the support platform, and the opposite ends of the cleaning member are respectively connected to the two reels in one-to-one correspondence; the part of the cleaning member located between the two reels facing the support platform constitutes the cleaning surface; The cleaning member is movably arranged on the frame; the two reels are respectively rotatably connected to the frame; The two reels are respectively a first reel and a second reel, one end of the cleaning member is wound on the first reel, and the other end of the cleaning member is wound on the second reel; Wherein, the first reel and the second reel can rotate in the same direction relative to the frame, so that the first reel releases the cleaning member, and the second reel winds and recovers the cleaning member with the poorly welded chip attached and fixed.

4. The chip detection and cleaning device according to claim 3, wherein, The cleaning mechanism includes a first driving member, the first driving member is arranged on the frame, and the first driving member is drivingly connected to the second reel for driving the second reel to rotate; The cleaning mechanism further includes a second driving member, the second driving member is arranged on the frame, and the second driving member is drivingly connected to the first reel for driving the first reel to rotate.

5. The chip detection and cleaning device according to claim 3, characterized in that, At least one of the reels is movably connected to the frame and can move up and down relative to the frame; The cleaning mechanism includes at least one adjusting member, and the adjusting member is arranged in one-to-one correspondence with the reel, and the adjusting member is used to realize the movable connection between the reel and the frame; The adjusting member is a cylinder or a motor.

6. The chip detection and cleaning device according to claim 1, characterized in that The support platform is provided with a suction hole with an open top; The chip detection and removal device includes an adsorption mechanism, the adsorption mechanism has an air inlet, the air inlet is communicated with the suction hole, and the adsorption mechanism is used to suck the air above the support platform to adsorb and fix the lamp board to be detected located on the support platform.

7. The chip detection and cleaning device according to claim 1, wherein The support platform is provided with a receiving groove with an upward opening for receiving electrical components on the side of the chip facing away from the lamp board to be detected.

8. The chip detection and cleaning device according to claim 1, characterized in that A lifting mechanism is arranged at the bottom of the support platform, and the lifting mechanism is used to drive the support platform to lift; The lifting mechanism is a cylinder or a motor.

9. The chip detection and cleaning device according to claim 1, characterized in that, The chip detection and removal device further includes a crimping member, which is movably connected to the frame. The crimping member abuts against one side of the removal member away from the removal surface, and the crimping member can move relative to the frame along the removal member to press the removal surface against the chips on the lamp board.

10. The chip detection and cleaning device according to claim 1, wherein The chip detection and removal device further includes a feeding mechanism for transferring the lamp board to be detected onto the support platform. The feeding mechanism includes a base, a first arm, a second arm and a gripper. The first arm is fixedly connected or rotatably connected to the base. One end of the first arm away from the base is rotatably connected and / or movably connected to the second arm. The gripper is rotatably connected to one end of the second arm away from the first arm, and the gripper is used to grab the lamp board to be detected. The chip detection and removal device further includes a discharging mechanism for grabbing and transferring the lamp board after the detection on the support platform. The structure of the discharging mechanism is the same as that of the feeding mechanism.

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