LED backlight lamp bead capable of improving brightness and irradiation area of backlight source

By expanding the heat dissipation components and secondary dispensing process, the brightness and heat dissipation problems of LED backlight beads are solved, and the brightness and cost reduction are improved while the chip volume remains unchanged, and the light source irradiation area is expanded.

CN223139991UActive Publication Date: 2025-07-22ANHUI YUGUAN OPTOELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202422489329.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-15
Publication Date
2025-07-22
Estimated Expiration
2034-10-15

AI Technical Summary

Technical Problem

In the prior art, the chip size of the LED backlight bead cannot be increased, resulting in the inability to increase the luminous brightness. At the same time, the heat dissipation defects caused by high brightness are difficult to solve and the cost is high.

Method used

The expanded heat dissipation components and secondary dispensing process are adopted to increase the heat dissipation effect by using the inner and outer heat dissipation plates and scattering plates of fish bones, and the brightness is improved by adjusting the excitation sequence of phosphors, reducing the blue light conversion efficiency.

Benefits of technology

When the chip volume remains unchanged, the luminous brightness is improved, the heat dissipation problem is solved, the cost is reduced and the light source is irradiated, and the brightness is increased by about 30%.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of LED backlight, and solves the technical problems that in the prior art, the chip size cannot be increased, so that the luminance cannot be improved, the increased support size and chip size are high in cost and are congruent with the requirement of customers for small size and high luminance, and meanwhile, the high luminance of LED lamp beads brings heat dissipation defects. In particular to an LED (light-emitting diode) backlight lamp bead capable of improving brightness and irradiation area of a backlight source, which comprises a base, and expanded heat dissipation components used for dissipating heat and increasing scattering angles of the light source are arranged on the left side and the right side of the base. By means of the scattering plate and the scattering cambered surface in the expansion heat dissipation assembly, the light irradiation area can be enlarged, the using number of lamp beads can be reduced under the same area, and the side face light emitting intensity of an LED with the same brightness is improved by means of the secondary dispensing technology.
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Description

Technical Field

[0001] The utility model relates to the technical field of LED backlights, in particular to an LED backlight bead for improving the brightness and illumination area of a backlight source. Background Art

[0002] LED backlight means using LEDs, that is, light-emitting diodes, as the backlight source of a liquid crystal display screen. Compared with the traditional CCFL, that is, cold cathode tube as the backlight source, LEDs have the characteristics of low power consumption, low heat generation, high brightness, long life, etc., and are expected to completely replace the traditional backlight system in recent years. The backlights of notebook backlit keyboards and mobile phones are mainly reflected in the lighting of keyboard keys or panels. In the actual use process, LED beads of some specific sizes are required, and certain illumination brightness and angles are satisfied at the same time.

[0003] However, in specific scenarios, affected by the product specification size, the chip size cannot be increased, so the luminous brightness cannot be improved. Increasing the bracket size and chip size not only has a high cost but also contradicts the customer's requirement of a small size and high luminous brightness. At the same time, the heat dissipation defect brought by the high brightness of the LED bead is also a major problem that is difficult to solve. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides an LED backlight bead for improving the brightness and illumination area of a backlight source, solves the technical problems that the luminous brightness cannot meet the requirements on the premise that the chip volume remains unchanged, and at the same time, the high-brightness LED also has a heat dissipation defect, and achieves the purpose of increasing the luminous brightness on the premise that the chip volume remains unchanged and solving the heat dissipation problem.

[0005] To solve the above technical problems, the utility model provides the following technical solutions: An LED backlight bead for improving the brightness and illumination area of a backlight source, including a base, and extended heat dissipation components for heat dissipation and increasing the light source scattering angle are arranged on both left and right sides of the base. The extended heat dissipation components include a plurality of fishbone inner heat dissipation plates for fixing and heat dissipation. A side wall plate for fixing and carrying fluorescent silica gel is fixedly connected to the side ends of the plurality of fishbone inner heat dissipation plates. A scattering plate for heat dissipation and increasing the light source scattering angle is fixedly connected to the top end of the side wall plate. A plurality of fishbone outer heat dissipation plates for heat dissipation are arranged outside the scattering plate. A scattering arc surface for increasing the light source scattering angle and aggregating the silica gel is arranged inside the scattering plate.

[0006] Preferably, a carrying component for carrying fluorescent silica gel is arranged inside the base. A light source chip for emitting light is fixedly connected to the central position of the carrying component. Two conductive fixing grooves for power-on and fixing are respectively arranged on the front and rear sections outside the base.

[0007] Preferably, the bearing component includes a bearing groove for bearing the fluorescent silica gel. A bearing side wall for fixing and shaping the fluorescent silica gel is arranged at the side end of the bearing groove, and a bearing arc surface for enabling the fluorescent silica gel to gather by gravity is arranged at the top end of the bearing side wall.

[0008] Preferably, the side wall plates are fixedly connected to the left and right side walls of the base.

[0009] Preferably, the bottom surface of the bearing groove is fixedly connected to the bottom surface of the inner heat dissipation plate of the fishbone.

[0010] Preferably, the circular arc surface between the bearing arc surface and the scattering arc surface is fixedly connected together and the surface is kept smooth.

[0011] By means of the above technical solution, the present utility model provides an LED backlight lamp bead for improving the brightness and illumination area of a backlight source, and at least has the following beneficial effects:

[0012] 1. The present utility model uses the cooperation of the inner heat dissipation plate and the outer heat dissipation plate of the fishbone of the extended heat dissipation component to efficiently dissipate heat from the lamp bead. At the same time, the fishbone structure can increase the contact area between the side wall and the fluorescent silica gel, thereby increasing the fixing effect of the silica gel and preventing the silica gel from falling off after being used for a period of time. By using the scattering plate and the scattering arc surface in the extended heat dissipation component, the light angle of the light source can be expanded by using the principle of refracting light by a convex lens, so that the light can irradiate a larger area of objects, and the number of lamp beads used can be reduced under the same area, reducing the cost.

[0013] 2. The present utility model uses the secondary dispensing process to enable the blue light to first excite the red phosphor and then excite the yellow-green phosphor, which can effectively improve the side light emission intensity of the LED with the same brightness. At the same time, the improvement of the brightness can reduce the usage amount of the LDE lamp beads, thereby saving costs, and can also reduce the conversion efficiency of blue light to red light, further improving the brightness of the light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The illustrative embodiments and descriptions thereof of the present application are used to explain the present application, and do not constitute an improper limitation of the present application. In the drawings:

[0015] Figure 1 is a side three-dimensional structure diagram of the present utility model;

[0016] Figure 2 is a three-dimensional structure diagram of the bearing component of the present utility model;

[0017] Figure 3 is Figure 2 a partial enlarged view of part A in

[0018] Figure 4This is the top-down three-dimensional structure diagram of the present utility model;

[0019] Figure 5 This is the comparison diagram of the present utility model before and after the improvement of the light irradiation angle.

[0020] In the figure: 1, base; 2, extended heat dissipation component; 201, fishbone inner heat dissipation plate; 202, side wall plate; 203, scattering plate; 204, scattering arc surface; 205, fishbone outer heat dissipation plate; 3, bearing component; 301, bearing groove; 302, bearing side wall; 303, bearing arc surface; 4, light source chip; 5, conductive fixing groove. Specific embodiments

[0021] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. Thereby, a full understanding of how the present application uses technical means to solve technical problems and achieve the realization process of technical effects can be obtained and implemented accordingly.

[0022] Since the luminous brightness cannot meet the requirements on the premise that the chip volume remains unchanged, and at the same time, high-brightness LEDs also have heat dissipation defects, please refer to Figures 1-5 , this embodiment provides an LED backlight bead that can improve the brightness and illumination area of the backlight source, which can increase the luminous brightness on the premise that the chip volume remains unchanged and solve the heat dissipation problem. The bead includes a base 1, and extended heat dissipation components 2 for heat dissipation and increasing the light source scattering angle are arranged on the left and right sides of the base 1. The extended heat dissipation component 2 includes a plurality of fishbone inner heat dissipation plates 201 for fixing and heat dissipation. A side wall plate 202 for fixing and carrying fluorescent silica gel is fixedly connected to the side ends of the plurality of fishbone inner heat dissipation plates 201. A scattering plate 203 for heat dissipation and increasing the light source scattering angle is fixedly connected to the top end of the side wall plate 202. A plurality of fishbone outer heat dissipation plates 205 for heat dissipation are arranged on the outer side of the scattering plate 203. A scattering arc surface 204 for increasing the light source scattering angle and aggregating the silica gel is arranged on the inner side of the scattering plate 203. The side wall plate 202 is fixedly connected to the left and right side walls of the base 1.

[0023] It should be noted that the fishbone inner heat dissipation plate 201 and the side wall plate 202 can increase the contact area with the fluorescent silica gel, so that the fluorescent silica gel can be more firmly attached, avoiding phenomena such as the shedding of the fluorescent silica gel after a certain period of use. At the same time, the fishbone inner heat dissipation plate 201 and the fishbone outer heat dissipation plate 205 release the heat of high brightness to the outside through more contact area, achieving a good heat dissipation effect. Using the scattering effect of the scattering plate 203 and the scattering arc surface 204, the scattering angle of the light can be expanded, thereby increasing the illumination area of the bead. Under the same area of illumination requirements, the number of beads used can be reduced, thereby reducing the demand.

[0024] In an alternative embodiment, asFigure 1 As shown, a loading component 3 for loading fluorescent silica gel is provided inside the base 1. A light source chip 4 for emitting light is fixedly connected to the central position of the loading component 3. Two conductive fixing grooves 5 for power supply and fixation are respectively provided at the front and rear sections on the outside of the base 1.

[0025] It should be noted that the light-emitting principle of the LED light source is that the blue light emitted by the LED chip respectively excites red, yellow-green fluorescent powders to generate red light and green light, and then the remaining blue light is mixed into white light. In the prior art, the red powder and the yellow-green powder are generally mixed and formulated. Because the blue light emitted by the LED chip respectively excites the red, yellow-green fluorescent powders, in this process, the red fluorescent powder will be excited by the green light, reducing the conversion efficiency of the blue light of the chip and the light-emitting efficiency of the LED light source. In the present invention, the light source chip 4 is first fixedly connected to the central position of the loading component 3. The first dispensing is carried out on the light source chip 4 using a red powder mixed encapsulation glue, and the amount of glue just covers the surface of the chip. After the dispensing is completed, centrifugation is carried out to sink the fluorescent powder to the bottom of the light source chip 4. Then, the yellow-green powder dots and the encapsulation glue are reconfigured for the second dispensing on the red powder to improve the light source brightness. The blue light fully excites the red light and then uses the red light to excite the yellow-green fluorescent powder, avoiding the situation where the green light excites the red light, and increasing the brightness by about 30%.

[0026] In an alternative embodiment, as Figure 2 shown, the loading component 3 includes a loading groove 301 for loading fluorescent silica gel. A loading side wall 302 for fixing and shaping the fluorescent silica gel is provided at the side end of the loading groove 301. A loading arc surface 303 for making the fluorescent silica gel gather by gravity is provided at the top of the loading side wall 302. The bottom surface of the loading groove 301 is fixedly connected to the bottom surface of the fishbone inner heat dissipation plate 201. The arc surface between the loading arc surface 303 and the scattering arc surface 204 is fixedly connected together and the surface is kept smooth.

[0027] It should be noted that the inside of the loading groove 301 needs to be used for fixedly installing the light source chip 4 and also for filling the fluorescent silica gel. The loading side wall 302 provides a certain space to enable the fluorescent silica gel to have sufficient space for filling. The loading arc surface 303 can form a semi-circular arc surface together with the scattering arc surface 204, enabling the fluorescent silica gel to flow into the inside of the loading groove 301 along the arc surface by gravity, preventing the fluorescent silica gel at the top edge of the base 1 from overflowing and affecting the overall light-emitting effect. The contact area between the fluorescent silica gel inside the loading groove 301 and the fishbone inner heat dissipation plate 201 is increased, which can strengthen the fixing effect and make the service life of the fluorescent silica gel longer.

[0028] Each embodiment in this specification is described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. For the above embodiments, since they are basically similar to the method embodiments, the description is relatively simple. For the relevant parts, reference can be made to the partial description of the method embodiments.

[0029] The above embodiments have introduced the present utility model in detail. Specific examples are used in this article to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model. At the same time, for those of ordinary skill in the art, based on the idea of the present utility model, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present utility model.

Claims

1. An LED backlight bead for improving the brightness and illumination area of a backlight source, comprising a base (1), characterized in that, On the left and right sides of the base (1), there are respectively arranged extended heat dissipation components (2) for heat dissipation and increasing the light source scattering angle. The extended heat dissipation components (2) include a number of fishbone inner heat dissipation plates (201). At the side ends of the number of fishbone inner heat dissipation plates (201), there are fixedly connected side wall plates (202) for fixing and carrying fluorescent silica gel. At the top of the side wall plates (202), there is fixedly connected a scattering plate (203) for increasing the light source scattering angle. Outside the scattering plate (203), there are a number of fishbone outer heat dissipation plates (205) for heat dissipation. Inside the scattering plate (203), there is a scattering arc surface (204) for increasing the light source scattering angle and making the silica gel gather.

2. The LED backlight bead for improving the brightness and illumination area of a backlight source according to claim 1, wherein Inside the base (1), there is provided a carrying component (3) for carrying fluorescent silica gel. At the central position of the carrying component (3), there is fixedly connected a light source chip (4) for emitting light. On the outer side of the base (1), there are respectively provided two conductive fixing grooves (5) at the front and rear sections.

3. The LED backlight bead for improving the brightness and illumination area of a backlight source according to claim 2, wherein The carrying component (3) includes a carrying groove (301) for carrying fluorescent silica gel. At the side end of the carrying groove (301), there is provided a carrying side wall (302) for fixing and shaping the fluorescent silica gel. At the top of the carrying side wall (302), there is provided a carrying arc surface (303) for making the fluorescent silica gel gather by gravity.

4. The LED backlight lamp bead for improving the brightness and illumination area of a backlight source according to claim 1, characterized in that, The side wall plates (202) are fixedly connected to the left and right side walls of the base (1).

5. The LED backlight bead for improving the brightness and illumination area of a backlight source according to claim 3, wherein The bottom surface of the carrying groove (301) is fixedly connected to the bottom surface of the fishbone inner heat dissipation plates (201).

6. The LED backlight bead for improving the brightness and illumination area of a backlight source according to claim 3, wherein, The arc surfaces between the carrying arc surface (303) and the scattering arc surface (204) are fixedly connected together and the surfaces are kept smooth.