Semiconductor chopper assembly

Abstract

The utility model provides a semiconductor chopper assembly, which relates to the field of semiconductor packaging and comprises a chopper body, a fixing sleeve fixedly connected to the top end of the outside of the chopper body, a first connecting piece fixedly connected to the bottom of the fixing sleeve, a second connecting piece sleeved outside the first connecting piece, and the second connecting piece can move outside the first connecting piece and can be clamped with the first connecting piece. The first connecting piece is sleeved with a second connecting piece, the second connecting piece is sleeved with a third connecting piece, the third connecting piece can move outside the second connecting piece and can be clamped with the second connecting piece, the second connecting piece is sleeved with a fourth connecting piece, the fourth connecting piece can move outside the third connecting piece and can be clamped with the third connecting piece, and the first connecting piece, the second connecting piece, the third connecting piece and the fourth connecting piece are combined. The chopper can be flexibly switched between a working state and a storage state, the chopper is compact in structure and small in occupied space, the chopper body is designed to be exposed and shielded, use is facilitated, operation safety is improved, and damage to personnel or equipment in a non-working state is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to a semiconductor bonding tool assembly. Background Art

[0002] A semiconductor bonding tool is a tool used in the process of semiconductor manufacturing and packaging, mainly for cutting wafers, connecting chips to substrates or pins, etc. According to different applications and requirements, semiconductor bonding tools can be divided into various types, such as ceramic bonding tools, aluminum wire bonding tools, etc. In the packaging process, semiconductor bonding tools are mainly used to connect chips to substrates or pins.

[0003] In the prior art, the bonding tool is generally installed on a wire bonding machine. Even when it is not in use, the bonding tool is always exposed outside. The exposed bonding tool is easily contaminated by dust, particles or other pollutants in the environment. These pollutants may adhere to the surface of the bonding tool, affecting the wire bonding quality and the service life of the bonding tool, or a transparent adhesive sleeve is stealthily sleeved outside the bonding tool, but this operation method is rather troublesome. It is difficult to align the adhesive sleeve with the welded bonding tool, and the operator may accidentally touch the sharp edge of the bonding tool, resulting in scratches or more serious injuries.

[0004] Therefore, it is necessary to provide a new semiconductor bonding tool assembly to solve the above technical problems. Summary of the Utility Model

[0005] To solve the above technical problems, the utility model provides a semiconductor bonding tool assembly.

[0006] The semiconductor bonding tool assembly provided by the utility model includes: a bonding tool body, a fixing sleeve is fixedly connected to the top end outside the bonding tool body, a first connecting member is fixedly connected to the bottom of the fixing sleeve, a second connecting member is sleeved outside the first connecting member, the second connecting member can move outside the first connecting member and can be mutually engaged, a third connecting member is sleeved outside the second connecting member, the third connecting member can move outside the second connecting member and can be mutually engaged, a fourth connecting member is sleeved outside the second connecting member, the fourth connecting member can move outside the third connecting member and can be mutually engaged.

[0007] A male thread ring is fixedly connected to the bottom of the first connecting member, and a female thread ring adapted to the male thread ring is fixedly connected to the bottom of the fourth connecting member.

[0008] Preferably, the first connecting member includes a first connecting ring with the same inner and outer diameters as the fixing sleeve. The top surface of the first connecting ring is fixedly connected to the fixing sleeve, a first sliding groove is formed in the outer side wall of the first connecting ring, and the bottom surface of the first connecting ring is fixedly connected to the male thread ring.

[0009] Preferably, the second connecting member includes a second connecting ring which can be sleeved outside the first connecting ring. A second connecting block is fixedly connected to the top of the inner wall of the second connecting ring. The second connecting block is arranged in the first sliding groove, and a second sliding groove is formed in the outer side wall of the second connecting ring.

[0010] Preferably, the third connecting member includes a third connecting ring which can be sleeved outside the first connecting ring. A third connecting block is fixedly connected to the top of the inner wall of the third connecting ring. The third connecting block is arranged in the second sliding groove. A first limiting ring is fixedly connected to the top of the outer wall of the third connecting ring, and a second limiting ring is fixedly connected to the bottom of the outer wall of the third connecting ring.

[0011] Preferably, the fourth connecting member includes a fourth connecting ring. A third limiting ring is fixedly connected to the top of the inner wall of the fourth connecting ring. The third limiting ring can move between the first limiting ring and the second limiting ring on the third connecting ring. The inner threaded ring is fixedly connected to the bottom of the inner wall of the fourth connecting ring.

[0012] Preferably, the top surface of the splitting blade body is higher than the top surface of the fixed sleeve.

[0013] Compared with the related art, the semiconductor splitting blade assembly provided by the present invention has the following beneficial effects:

[0014] The present invention provides a semiconductor splitting blade assembly. When the splitting blade is in use, the inner threaded ring at the bottom of the fourth connecting member is threadedly connected to the outer threaded ring at the bottom of the first connecting member. The second connecting member and the third connecting member are sequentially sleeved between the first connecting member and the fourth connecting member. The first connecting member, the second connecting member, the third connecting member and the fourth connecting member are horizontally placed to expose the splitting blade body for use. When the splitting blade work is completed, rotate the fourth connecting member until the outer threaded ring and the inner threaded ring are completely released, and stretch the fourth connecting member downward until the first connecting member, the second connecting member, the third connecting member and the fourth connecting member are vertically placed in a head-to-tail connection state to shield the splitting blade body. The splitting blade realizes the fixation and release with the first connecting member through the threaded connection of the inner threaded ring and the outer threaded ring. This connection method is easy to operate and only needs to rotate the fourth connecting member to complete, without special tools or complex operations. Through the combination of the first connecting member, the second connecting member, the third connecting member and the fourth connecting member, the flexible conversion of the splitting blade between the working state and the storage state is realized. The structure is compact and occupies a small space. The exposed and shielded design of the splitting blade body not only facilitates the use, but also increases the operation safety and avoids damage to personnel or equipment in the non-working state. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of the semiconductor splitting blade assembly provided by the present invention;

[0016] Figure 2 Schematic diagram of the overall structure of the splitting knife during operation provided by the present utility model;

[0017] Figure 3 Schematic diagram of the structure of the first connecting member area provided by the present utility model;

[0018] Figure 4 Schematic diagram of the structure of the second connecting member provided by the present utility model;

[0019] Figure 5 Schematic diagram of the structure of the third connecting member provided by the present utility model;

[0020] Figure 6 Schematic diagram of the structure of the fourth connecting member area provided by the present utility model.

[0021] Reference numerals in the figure: 1, splitting knife body; 2, fixing sleeve; 3, first connecting member; 301, first connecting ring; 302, first sliding groove; 4, second connecting member; 401, second connecting ring; 402, second connecting block; 403, second sliding groove; 5, third connecting member; 501, third connecting ring; 502, third connecting block; 503, first limiting ring; 504, second limiting ring; 6, fourth connecting member; 601, fourth connecting ring; 602, third limiting ring; 7, external thread ring; 8, internal thread ring. Specific implementation manner

[0022] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0023] Please refer to Figures 1-6 , wherein, Figure 1 Schematic diagram of the overall structure of the semiconductor splitting knife assembly provided by the present utility model; Figure 2 Schematic diagram of the overall structure of the splitting knife during operation provided by the present utility model; Figure 3 Schematic diagram of the structure of the first connecting member area provided by the present utility model; Figure 4 Schematic diagram of the structure of the second connecting member provided by the present utility model; Figure 5 Schematic diagram of the structure of the third connecting member provided by the present utility model; Figure 6 Schematic diagram of the structure of the fourth connecting member area provided by the present utility model.

[0024] In the specific implementation process, such as Figures 1-6As shown in the figure, a semiconductor split blade assembly includes a split blade body 1. A fixing sleeve 2 is fixedly connected to the outer top end of the split blade body 1. A first connecting member 3 is fixedly connected to the bottom of the fixing sleeve 2. A second connecting member 4 is sleeved outside the first connecting member 3. The second connecting member 4 can move outside the first connecting member 3 and can be engaged with each other. A third connecting member 5 is sleeved outside the second connecting member 4. The third connecting member 5 can move outside the second connecting member 4 and can be engaged with each other. A fourth connecting member 6 is sleeved outside the second connecting member 4. The fourth connecting member 6 can move outside the third connecting member 5 and can be engaged with each other. The fixing sleeve 2 is fixed to the outer top end of the split blade body 1, playing a role in connecting the split blade body 1 and the first connecting member 3, ensuring that the split blade body 1 is stable and does not shake during use. A male thread ring 7 is fixedly connected to the bottom of the first connecting member 3. A female thread ring 8 adapted to the male thread ring 7 is fixedly connected to the bottom of the fourth connecting member 6. The cooperation between the female thread ring 8 and the male thread ring 7 realizes the locking and unlocking of the split blade. The first connecting member 3 includes a first connecting ring 301 with the same inner and outer diameters as the fixing sleeve 2. The top surface of the first connecting ring 301 is fixedly connected to the fixing sleeve 2. A first sliding groove 302 is formed on the outer side wall of the first connecting ring 301. The bottom surface of the first connecting ring 301 is fixedly connected to the male thread ring 7. The second connecting member 4 includes a second connecting ring 401. The second connecting ring 401 can be sleeved outside the first connecting ring 301. A second connecting block 402 is fixedly connected to the top of the inner wall of the second connecting ring 401. The second connecting block 402 is arranged in the first sliding groove 302. The first sliding groove 302 provides an engaging point for the second connecting block 402, ensuring that the second connecting member 4 can slide stably on the first connecting member 3 without falling off and can be engaged when there is a relative displacement in the horizontal direction. A second sliding groove 403 is formed on the outer side wall of the second connecting ring 401. The third connecting member 5 includes a third connecting ring 501. The third connecting ring 501 can be sleeved outside the first connecting ring 301. A third connecting block 502 is fixedly connected to the top of the inner wall of the third connecting ring 501. The third connecting block 502 is arranged in the second sliding groove 403. The second sliding groove 403 provides an engaging point for the third connecting block 502, ensuring that the second connecting member 4 can slide stably on the first connecting member 3 and does not fall off. A first limiting ring 503 is fixedly connected to the top of the outer wall of the third connecting ring 501. A second limiting ring 504 is fixedly connected to the bottom of the outer wall of the third connecting ring 501. The fourth connecting member 6 includes a fourth connecting ring 601. A third limiting ring 602 is fixedly connected to the top of the inner wall of the fourth connecting ring 601. The third limiting ring 602 can move between the first limiting ring 503 and the second limiting ring 504 on the third connecting ring 501. A female thread ring 8 is fixedly connected to the bottom of the inner wall of the fourth connecting ring 601. The top surface of the split blade body 1 is higher than the top surface of the fixing sleeve, which is convenient for installing the split blade on the wire bonding machine, does not affect the original structure, and avoids incompatibility with the existing wire bonding machine.

[0025] The working principle provided by the present utility model is as follows: When the splitting tool is in use, the internal thread ring 8 is threadedly connected to the external thread ring 7. The second connecting block 402 is located at the top of the first sliding groove 302, the third connecting block 502 is located at the top of the second sliding groove 403, the top surface of the third limiting ring 602 is in contact with the bottom surface of the first limiting ring 503, and the bottom surface of the second limiting ring 504 is in contact with the top surface of the internal thread ring 8, exposing the splitting tool body 1 for use. When the splitting tool finishes working, rotate the fourth connecting ring 601 until the external thread ring 7 and the internal thread ring 8 are completely released. The second connecting block 402 slides in the first sliding groove 302, the third connecting block 502 slides in the second sliding groove 403, and the third limiting ring 602 slides on the outer surface of the third connecting ring 501. Under the action of gravity, the first connecting member 3, the second connecting member 4, the third connecting member 5, and the fourth connecting member 6 maintain a vertically placed state with their heads and tails connected, covering the splitting tool body 1.

[0026] The circuits and controls involved in the present utility model are all prior arts and will not be elaborated here.

[0027] The above are only the embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present utility model.

Claims

1. A semiconductor bonding tool assembly, characterized in that, Comprising: A bonding tool body (1), a fixing sleeve (2) is fixedly connected to the outer top end of the bonding tool body (1), a first connecting member (3) is fixedly connected to the bottom of the fixing sleeve (2), a second connecting member (4) is sleeved outside the first connecting member (3), the second connecting member (4) can move outside the first connecting member (3) and can be engaged with each other, a third connecting member (5) is sleeved outside the second connecting member (4), the third connecting member (5) can move outside the second connecting member (4) and can be engaged with each other, a fourth connecting member (6) is sleeved outside the second connecting member (4), the fourth connecting member (6) can move outside the third connecting member (5) and can be engaged with each other, The bottom of the first connecting member (3) is fixedly connected with an external thread ring (7), and the bottom of the fourth connecting member (6) is fixedly connected with an internal thread ring (8) adapted to the external thread ring (7).

2. The semiconductor splitting knife assembly according to claim 1, wherein The first connecting member (3) includes a first connecting ring (301) with both inner and outer diameters the same as those of the fixing sleeve (2), the top surface of the first connecting ring (301) is fixedly connected to the fixing sleeve (2), a first sliding groove (302) is formed in the outer side wall of the first connecting ring (301), and the bottom surface of the first connecting ring (301) is fixedly connected to the external thread ring (7).

3. The semiconductor splitting knife assembly according to claim 2, wherein The second connecting member (4) includes a second connecting ring (401), the second connecting ring (401) can be sleeved outside the first connecting ring (301), a second connecting block (402) is fixedly connected to the top of the inner wall of the second connecting ring (401), the second connecting block (402) is arranged in the first sliding groove (302), and a second sliding groove (403) is formed in the outer side wall of the second connecting ring (401).

4. The semiconductor splitting knife assembly according to claim 3, characterized in that, The third connecting member (5) includes a third connecting ring (501), the third connecting ring (501) can be sleeved outside the first connecting ring (301), a third connecting block (502) is fixedly connected to the top of the inner wall of the third connecting ring (501), the third connecting block (502) is arranged in the second sliding groove (403), a first limiting ring (503) is fixedly connected to the top of the outer wall of the third connecting ring (501), and a second limiting ring (504) is fixedly connected to the bottom of the outer wall of the third connecting ring (501).

5. The semiconductor dicing blade assembly according to claim 4, characterized in that, The fourth connecting member (6) includes a fourth connecting ring (601), a third limiting ring (602) is fixedly connected to the top of the inner wall of the fourth connecting ring (601), the third limiting ring (602) can move between the first limiting ring (503) and the second limiting ring (504) on the third connecting ring (501), and the internal thread ring (8) is fixedly connected to the bottom of the inner wall of the fourth connecting ring (601).

6. The semiconductor splitting knife assembly according to claim 5, characterized in that, The top surface of the bonding tool body (1) is higher than the top surface of the fixing sleeve.

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