A fan-out board-level packaging bonding machine

Abstract

This invention relates to the field of semiconductor packaging technology, and more particularly to a fan-out board-level packaging bonding machine, comprising a support and a cavity. The cavity is fixed inside the support, and a vacuum transfer gate is provided at the front end of the cavity. A pressure applying mechanism is mounted on the top of the support and extends into the cavity. An upper bonding platform is mounted on the bottom of the pressure applying mechanism. A lower bonding platform is provided at the bottom of the cavity. An alignment mechanism and a receiving mechanism are mounted inside the cavity. This invention, through the structural design of the receiving mechanism, alignment mechanism, pressure applying mechanism, and top PIN mechanism, achieves product loading and unloading, high-precision alignment, and bonding. Furthermore, it features high flatness of each bonding layer, high parallelism between bonding surfaces, high uniformity of force acting on the product, and high uniformity of platform temperature. It also allows for controlled temperature rise and fall, enabling the board-level packaging to accommodate more chips, improving production efficiency and reducing costs.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more particularly to a fan-out board-level packaging bonding machine. Background Technology

[0002] Fan-out board-level packaging is a technology that packages multiple wafers or chips onto a large panel. It offers advantages such as low cost and high space utilization, making it the most advanced packaging process currently available. A bonding machine is required when bonding two products. In existing technologies, the heating and cooling functions of the bonding machine's heating and cooling platform are integrated, using oil circuits for heating and cooling. Due to the large board surface, the pipes need to be of a certain length, but achieving uniform temperature distribution is difficult. For example, the longer the pipe, the greater the temperature difference between the inlet and outlet. Furthermore, existing technologies are not conducive to achieving uniform high-temperature and high-pressure action on the product surface. To solve these technical problems, we propose a fan-out board-level packaging bonding machine. Summary of the Invention

[0003] The purpose of this invention is to provide a fan-out board-level packaging bonding machine to solve the problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A fan-out board-level packaging bonding machine includes a support and a cavity, wherein the cavity is fixed inside the support and a vacuum transfer door is provided at the front end of the cavity;

[0006] The top of the bracket is equipped with a pressure-applying mechanism, and the pressure-applying mechanism extends into the cavity;

[0007] The bottom of the pressure application mechanism is equipped with an upper pressure platform;

[0008] The bottom of the cavity is provided with a pressing platform;

[0009] The cavity is equipped with an alignment mechanism and a receiving mechanism.

[0010] Preferably, the alignment mechanism includes a mounting base, an upper guide rail, a U-shaped plate, a vertical plate, an alignment electric cylinder, a floating joint, a tension / compression sensor, a linear bearing, an alignment bellows, and an alignment block. Mounting bases are fixed to all four sides of the cavity. The upper guide rail is mounted on the mounting base. A U-shaped plate is mounted on the upper guide rail. A vertical plate is mounted on the top of the U-shaped plate. The alignment electric cylinder is mounted on the top of the cavity via a bracket. A tension / compression sensor and a floating joint are sequentially fixed to the telescopic shaft of the alignment electric cylinder. The floating joint is fixedly connected to the vertical plate. Two linear bearings are provided on the side of the cavity. A pull rod is movably mounted inside the linear bearing. One end of the pull rod is connected to the U-shaped plate, and the other end is fitted with an alignment block. An alignment bellows is sleeved on the outside of the pull rod.

[0011] Preferably, the receiving mechanism includes a lower guide rail, a receiving bracket, a receiving linear bearing, a receiving bellows, a smoothing cylinder, and a receiving block. The lower guide rail is installed below the mounting base, the receiving bracket is installed on the lower guide rail, two receiving linear bearings are provided on the side of the cavity, a receiving push rod is movably installed inside the receiving linear bearing, one end of the receiving push rod is connected to the receiving bracket, and the other end is installed with a receiving block. A receiving bellows is sleeved on the outside of the receiving push rod, and the telescopic bearing of the smoothing cylinder is fixedly connected to the bracket.

[0012] Preferably, the bottom of the bracket is provided with a top PIN mechanism, which includes a lifting PIN screw, a drive motor, a top PIN support rod, and a support platform. The drive motor is fixed to the bottom of the inner side of the bracket, and the output end of the drive motor is fixed with the lifting PIN screw. The support platform is threaded to the outer side of the lifting PIN screw. The support platform is slidably connected to the inner side of the cavity. A set of top PIN support rods is provided on the support platform. The lower pressing platform is provided with a clearance hole, and the top PIN support rod is located in the clearance hole.

[0013] Preferably, the upper pressing platform includes, from top to bottom, a pressure-applying plate, a pressure-equalizing layer, an upper platform heat insulation layer, an upper platform cooling layer, an upper platform heating layer, an upper platform temperature equalizing layer, and an upper worktable, all fixedly connected in sequence. The pressure-applying plate is fixedly connected to the pressure-applying mechanism.

[0014] Preferably, the lower pressing platform includes a lower platform substrate, a lower platform heat insulation layer, a lower platform cooling layer, a lower platform heating layer, a lower platform temperature uniform layer, and a lower worktable, which are fixedly connected from bottom to top, and the lower platform substrate is fixed to the bottom of the cavity.

[0015] Preferably, the pressure applying mechanism includes a pressure applying electric cylinder, a pressure applying shaft, and a bellows. Five pressure applying electric cylinders are evenly distributed and fixed on the top of the bracket. The output end of the pressure applying electric cylinder is connected to the pressure applying shaft. The pressure applying shaft extends into the cavity. The bottom of the pressure applying shaft is fixedly connected to the pressure applying plate. A bellows is fitted on the pressure applying shaft.

[0016] Preferably, one end of the pressure-applying plate is fixed with an air port and a liquid port, and the top of the pressure-applying plate is evenly distributed with multiple guide shafts that are slidably connected.

[0017] Preferably, a water pipe assembly is provided on the inner side of the bracket, near the cavity. Furthermore, through the above technical solution, the present invention possesses at least the following beneficial effects:

[0018] This invention achieves product loading and unloading, high-precision alignment, and pressing through the structural design of the receiving mechanism, alignment mechanism, pressing mechanism, and top PIN mechanism; and the flatness of each pressing layer, the parallelism between pressing surfaces, the uniformity of force acting on the product, and the uniformity of platform temperature are all high. It can also control the temperature rise and fall, so that the board-level package can accommodate more chips, improve production efficiency, and reduce costs. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the connection structure between the support and the cavity of the present invention;

[0022] Figure 3 This is a schematic diagram of the connection structure between the bracket and the water pipe assembly of the present invention;

[0023] Figure 4 This is a schematic diagram of the connection structure between the pressure application mechanism and the upper pressing mechanism of the present invention;

[0024] Figure 5 This is a side view of the pressure application mechanism and the upper pressing mechanism of the present invention;

[0025] Figure 6 This is a schematic diagram of the upper and lower pressing platforms of the present invention;

[0026] Figure 7 This is a schematic diagram of the top PIN mechanism of the present invention;

[0027] Figure 8 This is a schematic diagram of the cavity structure of the present invention. Figure 1 ;

[0028] Figure 9 This is a schematic diagram of the cavity structure of the present invention. Figure 2 ;

[0029] Figure 10 This is a schematic diagram of the alignment mechanism of the present invention;

[0030] Figure 11 This is a schematic diagram of the alignment mechanism and pressure application mechanism of the present invention;

[0031] Figure 12This is an exploded view of the alignment mechanism and the receiving mechanism of the present invention;

[0032] Figure 13 This is a structural side view of the alignment mechanism and receiving mechanism of the present invention;

[0033] Figure 14 This is a top view of the alignment mechanism and receiving mechanism of the present invention.

[0034] In the diagram: 1. Support frame; 2. Cavity; 201. Vacuum transfer door; 202. Water pipe assembly; 3. Top pin mechanism; 301. Lifting pin screw; 302. Drive motor; 303. Top pin support rod; 304. Bearing platform; 4. Pressing mechanism; 401. Pressing electric cylinder; 402. Pressing shaft; 403. Bellows; 5. Upper pressing platform; 51. Pressing plate; 511. Air port; 512. Liquid port; 513. Guide shaft; 52. Uniform pressure layer; 53. Upper platform heat insulation layer; 54. Upper platform cooling layer; 55. Upper platform heating layer; 56. Upper platform temperature uniform layer; 57. Upper worktable; 6. Lower pressing platform. 61 Lower platform substrate, 62 Lower platform heat insulation layer, 63 Lower platform cooling layer, 64 Lower platform heating layer, 65 Lower platform temperature uniform layer, 66 Lower worktable, 7 Alignment mechanism, 701 Mounting base, 702 Upper guide rail, 703 U-shaped plate, 704 Vertical plate, 705 Alignment electric cylinder, 706 Floating joint, 707 Tension and compression sensor, 708 Linear bearing, 709 Alignment bellows, 710 Alignment block, 8 Receiving mechanism, 801 Lower guide rail, 802 Receiving bracket, 803 Receiving linear bearing, 804 Receiving bellows, 805 Smoothing cylinder, 806 Receiving block. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0036] Example 1

[0037] Reference Figure 1-14 A fan-out board-level packaging bonding machine includes a support 1 and a cavity 2. The cavity 2 is fixed inside the support 1. A vacuum transfer door 201 is provided at the front end of the cavity 2. The vacuum transfer door 201 can be opened and closed to facilitate the entry and exit of the chip to be bonded. When closed, the vacuum transfer door 201 can ensure that the cavity 2 is in a sealed state.

[0038] A pressure-applying mechanism 4 is mounted on the top of the support 1, and the pressure-applying mechanism extends into the cavity 2; an upper pressing platform 5 is mounted on the bottom of the pressure-applying mechanism 4; a lower pressing platform 6 is provided at the bottom of the cavity 2, and the upper pressing platform 5 and the lower pressing platform 6 are used to press chip product one and product two together; an alignment mechanism 7 and a receiving mechanism 8 are mounted on the inner side of the cavity 2.

[0039] Specifically, the alignment mechanism 7 includes a mounting base 701, an upper guide rail 702, a U-shaped plate 703, a vertical plate 704, an alignment electric cylinder 705, a floating joint 706, a tension / compression sensor 707, a linear bearing 708, an alignment bellows 709, and an alignment block 710. Mounting bases 701 are fixed to all four sides of the cavity 2. The upper guide rail 702 is mounted on the mounting base 701. A U-shaped plate 703 is mounted on the upper guide rail 702. A vertical plate 704 is mounted on the top of the U-shaped plate 703. The alignment electric cylinder 705 is mounted on the top of the cavity 2 via a bracket. The extension shaft of the alignment electric cylinder 705 is sequentially fixed with the tension / compression sensor 707 and the floating joint 706. The floating joint 706 is fixedly connected to the vertical plate 704. Two linear bearings are provided on the side of the cavity 2. A linear bearing 708 has a pull rod movably installed inside it. One end of the pull rod is connected to a U-shaped plate 703, and the other end is fitted with an alignment block 710. An alignment bellows 709 is sleeved on the outside of the pull rod. The function of the alignment mechanism is to align product one and product two on all four sides within the cavity 2. In use, the telescopic shaft of the alignment electric cylinder 705 moves, driving the floating joint 706, the vertical plate 704, and the U-shaped plate 703 to move. The U-shaped plate 703 slides on the upper guide rail 702, which in turn drives the pull rod to slide within the linear bearing 708, ultimately causing the alignment block 710 to move and align product one and product two on all four sides. The two ends of the alignment bellows 709 are connected to the cavity 2 and the U-shaped plate 703 respectively, and the alignment bellows 709 and the linear bearing 708 cooperate to seal.

[0040] The receiving mechanism 8 includes a lower guide rail 801, a receiving bracket 802, a receiving linear bearing 803, a receiving bellows 804, a smoothing cylinder 805, and a receiving block 806. The lower guide rail 801 is installed below the mounting base 701, and the receiving bracket 802 is installed on the lower guide rail 801. Two receiving linear bearings 803 are provided on the side of the cavity 2. A receiving push rod is movably installed inside the receiving linear bearing 803. One end of the receiving push rod is connected to the receiving bracket 802, and the other end is equipped with the receiving block 806. The receiving bellows 804 is sleeved on the outside of the receiving push rod. The telescopic bearing of the smoothing cylinder 805 is fixedly connected to the bracket 802. The function of the receiving mechanism 8 is to lift and support the product. The movement of the telescopic shaft of the smoothing cylinder 805 causes the receiving bracket 802 to slide on the lower guide rail 801, and drives the receiving push rod and the receiving block 806 to move, thus achieving the function of lifting the product.

[0041] A top pin mechanism 3 is provided at the bottom of the bracket 1. The top pin mechanism 3 includes a lifting pin screw 301, a drive motor 302, a top pin support rod 303, and a support platform 304. The drive motor 302 is fixed to the bottom of the inner side of the bracket 1. The output end of the drive motor 302 is fixed to the lifting pin screw 301. The support platform 304 is threaded to the outer side of the lifting pin screw 301. The support platform 304 is slidably connected to the inner side of the cavity 2. A set of top pin support rods 3 is provided on the support platform. 03. The lower pressing platform 6 is provided with a clearance hole, and the top PIN support rod 303 is located in the clearance hole. When the drive motor 302 is started, the output end of the drive motor 302 drives the lifting PIN screw 301 to rotate, so that the support platform 304 can drive the top PIN support rod 303 to move up and down, so that the top PIN support rod 303 moves vertically along the clearance hole and moves to the bottom of the lower pressing platform. There are multiple top PIN support rods 303, and the top PIN support rod 303 plays the role of supporting product two.

[0042] The upper pressing platform 5 includes, from top to bottom, a pressure-applying plate 51, a pressure-equalizing layer 52, an upper platform heat insulation layer 53, an upper platform cooling layer 54, an upper platform heating layer 55, an upper platform temperature-equalizing layer 56, and an upper worktable 57, all fixedly connected in sequence. The pressure-applying plate 51 is fixedly connected to the pressure-applying mechanism 4. The pressure-applying plate 51 is made of a high-thickness plate that cannot deform under high pressure. The pressure-equalizing layer 52 is composed of an air bladder layer. Thermal expansion affects the pressure. Since the action of forces is mutual, the pressure is fed back to the air bladder. By regulating the pressure in the air bladder, pressure equalization is achieved. At the same time, the pressure-equalizing layer adds temperature control to avoid high-temperature damage. The upper platform heat insulation layer 53 utilizes its material properties to ensure heating of the upper layer and avoid heat loss, which would affect the heating speed. The upper platform cooling layer 54 is used to cool the worktable. The upper platform heating layer 55 is used to heat the worktable. The upper platform temperature-equalizing layer 56 utilizes its material properties to evenly transfer temperature to the worktable. The upper worktable 57 utilizes its material properties to control thermal expansion, processing flatness, and deformation.

[0043] The lower pressing platform 6 includes a lower platform base plate 61, a lower platform heat insulation layer 62, a lower platform cooling layer 63, a lower platform heating layer 64, a lower platform temperature equalization layer 65, and a lower worktable 66, which are fixedly connected from bottom to top. The lower platform base plate 61 is fixed to the bottom of the inner side of the cavity 2. The lower worktable 66 utilizes the material properties to control thermal expansion, processing flatness, and deformation. The lower platform temperature equalization layer 65 utilizes the material properties to evenly transfer temperature to the worktable. The lower platform heating layer 64 is used to heat the worktable. The lower platform cooling layer 63 is used to cool the worktable. The lower platform heat insulation layer 62 utilizes the material properties to ensure heating of the upper layer and avoid heat loss, which would affect the heating speed. The lower platform base plate 61 is a high-pressure load-bearing plate and cannot be deformed under high pressure.

[0044] The above-mentioned temperature uniformity principle utilizes the material properties and the anisotropy of temperature, where the temperature transfer speed in the planar direction is much higher than in the direction perpendicular to the plane, resulting in uniform temperature across the plane. The above-mentioned heating principle, due to the thermal expansion of the board material, causes the interior to expand upwards while the edges diffuse outwards. This leads to overall thermal expansion of the board, resulting in poor uniformity in the Z-direction.

[0045] The pressure applying mechanism 4 includes a pressure applying electric cylinder 401, a pressure applying shaft 402, and a bellows 403. Five pressure applying electric cylinders 401 are evenly distributed and fixed on the top of the bracket 1. The output end of the pressure applying electric cylinder 401 is connected to the pressure applying shaft 402. The pressure applying shaft 402 extends into the cavity, and the bottom of the pressure applying shaft 402 is fixedly connected to the pressure applying plate 51. The bellows 403 is fitted on the pressure applying shaft 402. When the pressure applying electric cylinder 401 is activated, the pressure applying shaft 402 applies downward pressure to the pressure applying plate 51. The bellows 403 acts as a seal. The use of five pressure applying electric cylinders 401 and pressure applying shaft 402 makes the applied pressure more uniform. At the same time, in the later implementation process, since the pressure applying shaft 402 acts on the pressure applying plate 51, if the applied pressure is too large, it will cause stress concentration at the edge of the pressure applying shaft, and stress relief grooves need to be opened.

[0046] One end of the pressure plate 51 is fixed with an air port 511 and a liquid port 512. Multiple guide shafts 513 are evenly distributed and slidably connected to the top of the pressure plate 51. The guide shafts 513 can provide guidance for the movement of the pressure plate 51, making the pressure plate 51 move more stably.

[0047] A water pipe assembly 202 is installed on the inner side of the bracket 1 and near the cavity 2.

[0048] Usage process: (a) First, the vacuum transfer door 201 and the top PIN mechanism 3 are started, and the top PIN support rod 303 rises to the material picking position. Product 1 is handed over to the top PIN support rod 303 of the top PIN mechanism by the robotic arm toothed fork;

[0049] (b) When product 1 rises from the top PIN mechanism to the handover position, the receiving mechanism 8 moves, and the receiving block 806 moves laterally (i.e. retracts), product 1 is handed over from the top PIN mechanism 3 to the receiving mechanism 8.

[0050] (c) Then the top pin support rod 303 descends to the material handling position, and product two is handed over to the top pin mechanism by the robotic arm's toothed fork;

[0051] (d) Product 2 is raised to the alignment area by the top PIN mechanism; then the alignment electric cylinder 705 is activated, so that the alignment block 710 is pushed out. The alignment block 710 aligns the four sides of Product 1 and Product 2, which ensures the accuracy of the product bonding. After the alignment is completed, the alignment mechanism 7 retracts. The alignment mechanism is equipped with a tension and pressure sensor 707 to avoid damaging the product.

[0052] (e) Close the vacuum transmission door 201 and evacuate the cavity 2;

[0053] (f) The receiving block 806 of the receiving mechanism 8 disengages (i.e. expands outward), causing product one to fall onto product two. The receiving mechanism 8 is driven by a smooth cylinder 805 to avoid damage to the products due to excessive speed. Afterward, the top pin mechanism 3 descends, and product one and product two fall onto the lower worktable 66.

[0054] (g) Finally, the pressure mechanism 4 is activated, so that the upper pressing platform 5 applies pressure to product one and product two on the lower pressing platform, pressing the two products together.

[0055] After bonding is complete, release the vacuum, use the top pin mechanism to lift the bonded products 1 and 2 to the material handling position, and use the robotic arm toothed fork to remove the products.

[0056] This invention achieves product loading and unloading, high-precision alignment, and pressing through the structural design of the receiving mechanism, alignment mechanism, pressing mechanism, and top PIN mechanism; and the flatness of each pressing layer, the parallelism between pressing surfaces, the uniformity of force acting on the product, and the uniformity of platform temperature are all high. It can also control the temperature rise and fall, so that the board-level package can accommodate more chips, improve production efficiency, and reduce costs.

[0057] Obviously, the embodiments described above are merely some embodiments of the present invention, not all embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms; rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this invention.

Claims

1. A fan-out board-level packaging bonding machine, characterized in that, It includes a support (1) and a cavity (2), the cavity (2) is fixed inside the support (1), and a vacuum transmission door (201) is provided at the front end of the cavity (2). The top of the bracket (1) is equipped with a pressure applying mechanism (4), and the pressure applying mechanism extends into the cavity (2); The bottom of the pressure applying mechanism (4) is equipped with an upper pressing platform (5). The cavity (2) is provided with a pressing platform (6) at the bottom. The cavity (2) is equipped with an alignment mechanism (7) and a receiving mechanism (8) on its inner side. The upper pressing platform (5) includes a pressure plate (51), a pressure equalization layer (52), an upper platform heat insulation layer (53), an upper platform cooling layer (54), an upper platform heating layer (55), an upper platform temperature equalization layer (56), and an upper worktable (57) that are fixedly connected from top to bottom. The pressure plate (51) is fixedly connected to the pressure mechanism (4). The lower pressing platform (6) includes a lower platform base plate (61), a lower platform heat insulation layer (62), a lower platform cooling layer (63), a lower platform heating layer (64), a lower platform temperature uniform layer (65), and a lower worktable (66) that are fixedly connected from bottom to top. The lower platform base plate (61) is fixed to the bottom of the inner side of the cavity (2).

2. The fan-out board-level packaging bonding machine according to claim 1, characterized in that, The alignment mechanism (7) includes a mounting base (701), an upper guide rail (702), a U-shaped plate (703), a vertical plate (704), an alignment electric cylinder (705), a floating joint (706), a tension / compression sensor (707), a linear bearing (708), an alignment bellows (709), and an alignment block (710). Mounting bases (701) are fixed to all four sides of the cavity (2). The upper guide rail (702) is mounted on the mounting base (701). A U-shaped plate (703) is mounted on the upper guide rail (702), and a vertical plate is mounted on the top of the U-shaped plate (703). The alignment electric cylinder (705) is mounted on the top of the cavity (2) via a bracket. The telescopic shaft of the alignment electric cylinder (705) is fixed with a tension / compression sensor (707) and a floating joint (706) in sequence. The floating joint (706) is fixedly connected to the vertical plate (704). Two linear bearings (708) are provided on the side of the cavity (2). A pull rod is movably installed inside the linear bearing (708). One end of the pull rod is connected to the U-shaped plate (703), and the other end is equipped with an alignment block (710). An alignment bellows (709) is sleeved on the outside of the pull rod.

3. The fan-out board-level packaging bonding machine according to claim 2, characterized in that, The receiving mechanism (8) includes a lower guide rail (801), a receiving bracket (802), a receiving linear bearing (803), a receiving bellows (804), a smoothing cylinder (805), and a receiving block (806). The lower guide rail (801) is installed below the mounting base (701), and the receiving bracket (802) is installed on the lower guide rail (801). Two receiving linear bearings (803) are provided on the side of the cavity (2). A receiving push rod is movably installed inside the receiving linear bearing (803). One end of the receiving push rod is connected to the receiving bracket (802), and the other end is equipped with a receiving block (806). A receiving bellows (804) is sleeved on the outside of the receiving push rod. The telescopic bearing of the smoothing cylinder (805) is fixedly connected to the bracket (802).

4. The fan-out board-level packaging bonding machine according to claim 1, characterized in that, The bottom of the bracket (1) is provided with a top PIN mechanism (3). The top PIN mechanism (3) includes a lifting PIN screw (301), a drive motor (302), a top PIN support rod (303), and a support platform (304). The drive motor (302) is fixed to the bottom of the inner side of the bracket (1). The output end of the drive motor (302) is fixed with the lifting PIN screw (301). The outer side of the lifting PIN screw (301) is threadedly connected to the support platform (304). The support platform (304) is slidably connected to the inner side of the cavity (2). A set of top PIN support rods (303) is provided on the support platform. The lower pressing platform (6) is provided with a clearance hole. The top PIN support rod (303) is located in the clearance hole.

5. A fan-out board-level packaging bonding machine according to claim 4, characterized in that, The pressure applying mechanism (4) includes a pressure applying electric cylinder (401), a pressure applying shaft (402), and a bellows (403). Five pressure applying electric cylinders (401) are evenly distributed and fixed on the top of the bracket (1). The output end of the pressure applying electric cylinder (401) is connected to the pressure applying shaft (402). The pressure applying shaft (402) extends into the cavity. The bottom of the pressure applying shaft (402) is fixedly connected to the pressure applying plate (51). A bellows (403) is fitted on the pressure applying shaft (402).

6. A fan-out board-level packaging bonding machine according to claim 1, characterized in that, One end of the pressure plate (51) is fixed with an air port (511) and a liquid port (512), and multiple guide shafts (513) are evenly distributed and slidably connected to the top of the pressure plate (51).

7. A fan-out board-level packaging bonding machine according to claim 1, characterized in that, A water pipe assembly (202) is provided on the inner side of the bracket (1) and near the cavity (2).

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