Eutectic device

Abstract

The utility model relates to a eutectic device which at least comprises a bearing part, a heating assembly and a seat body, the bearing part is used for bearing an eutectic assembly, the heating assembly comprises a heating part and a temperature detection part which are arranged in the bearing part, the heating part is electrically connected with the temperature detection part, and the heating temperature of the heating part can be more effectively controlled. Correspondingly, the seat body is arranged on the bottom side of the bearing part, and the first cooling channel is arranged in the seat body, so that the heated eutectic assembly can be cooled more quickly. Therefore, the eutectic device provided by the utility model not only can effectively control the heating temperature, but also can quickly cool the eutectic assembly after heating is completed, and is beneficial to improving the yield of products.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging equipment, and in particular to a eutectic device. Background Art

[0002] Eutectic connection refers to the process in which two or more components of an alloy of a certain composition cool, solidify, and crystallize from liquid to form two or more solid phases at the eutectic reaction temperature. Eutectic connection is usually used to connect substrates and chips, and has the advantages of high connection strength and high reliability. However, the current use of eutectic devices to eutectically connect substrates and chips will cause poor connection between the substrate and the chip, which in turn makes the product yield of the substrate and chip low. Utility Model Content

[0003] Based on this, it is necessary to provide a eutectic device to improve the yield of the product.

[0004] The embodiment of the present application provides a eutectic device, comprising:

[0005] A carrier, used for carrying the component to be eutectic along a first direction;

[0006] A heating assembly, comprising a heating element and a temperature detecting element both disposed in the carrier, the heating element being electrically connected to the temperature detecting element; and

[0007] The seat body is arranged on the bottom side of the bearing component along the first direction; a first cooling channel is arranged in the seat body.

[0008] In one of the embodiments, the eutectic device further comprises a heat insulating member disposed between the carrier and the base along the first direction;

[0009] The first cooling channel has at least one first cooling outlet. The heat insulating member is provided with at least one first connecting channel penetrating the heat insulating member along the first direction. The first cooling outlet is connected with the inlet of the first connecting channel in one-to-one correspondence. The outlet of the first connecting channel is arranged toward the supporting member.

[0010] In one embodiment, there is a gap between the heat insulating member and the supporting member in the first direction.

[0011] In one embodiment, a second cooling channel is defined on a side of the seat body and the heat insulating member that is opposite to each other; a third cooling channel is provided in the seat body, and the third cooling channel is provided close to a side of the seat body that is away from the heat insulating member;

[0012] The second cooling channel and the third cooling channel are in communication with each other.

[0013] In one embodiment, the second cooling channel has a plurality of first cooling segments, and the plurality of first cooling segments are sequentially connected and enclosed to define an unclosed second cooling channel;

[0014] Along the connection direction of the plurality of first cooling segments, an inlet of the second cooling channel is provided at the leading end of the first first cooling segment, and an outlet of the second cooling channel is provided at the trailing end of the last first cooling segment.

[0015] In one embodiment, there are four first cooling segments; along the connection direction of the four first cooling segments, the extending directions of two adjacent first cooling segments are perpendicular to each other.

[0016] In one embodiment, the third cooling channel has a plurality of second cooling segments and a plurality of conducting segments;

[0017] All the second cooling segments are arranged at intervals in sequence along the second direction, and one end of two adjacent second cooling segments close to each other is connected by a conducting segment; the second direction is perpendicular to the first direction.

[0018] In one embodiment, the extending directions of all the second cooling segments are parallel to each other, and the extending direction of the second cooling segment, the first direction and the second direction are perpendicular to each other; and / or

[0019] The extending path of the conducting segment is configured as an arc.

[0020] In one embodiment, a plurality of adsorption channels are further provided on the base body, and a plurality of adsorption ports for adsorbing the eutectic components to be processed are provided on the carrier;

[0021] Each adsorption channel is communicated with at least one adsorption port, and the adsorption ports communicated by all the adsorption channels are different from each other.

[0022] In one embodiment, the carrier has a first surface for carrying the eutectic components to be processed, and a first adsorption area and a second adsorption area surrounding the first adsorption area are provided on the first surface;

[0023] A part of the adsorption ports are arranged in the first adsorption area, and another part of the adsorption ports are arranged in the second adsorption area;

[0024] The adsorption channels communicated with the adsorption ports arranged in the first adsorption area are different from the adsorption channels communicated with the adsorption ports arranged in the second adsorption area.

[0025] In one embodiment, the eutectic device further includes a cover; the cover is covered on the base body along the first direction, and defines a receiving cavity with the base body, the carrier is located in the receiving cavity, and an opening communicated with the receiving cavity is provided on the side of the cover away from the base body;

[0026] Wherein, a blowing channel for providing protective gas is provided in the base body, the blowing channel has at least one blowing outlet, and the blowing outlet is communicated with the receiving cavity; and / or

[0027] The eutectic device further comprises an air blowing mechanism, which is arranged on one side of the cover body and configured to provide protective gas on a side of the cover body away from the seat body.

[0028] In the above-mentioned eutectic device, the eutectic device at least includes a carrier, a heating component and a seat. The carrier is used to carry the component to be eutectic, and the heating component includes a heating element and a temperature detection element both arranged in the carrier. The heating element is electrically connected to the temperature detection element, which can more effectively control the heating temperature of the heating element. Correspondingly, the seat is arranged on the bottom side of the carrier, and a first cooling channel is arranged in the seat, which can quickly cool the eutectic component after heating. Therefore, the eutectic device provided in the embodiment of the present application can not only control the heating temperature more accurately, but also quickly cool the eutectic component after heating, which is beneficial to improve the yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a partial three-dimensional structural schematic diagram of a eutectic device according to some embodiments of the present application.

[0030] Figure 2 for Figure 1 The cross-sectional structure schematic diagram of the eutectic device is shown in the cross-sectional direction AA.

[0031] Figure 3 It is a partial top view structural schematic diagram of a eutectic device according to some embodiments of the present application.

[0032] Figure 4 It is a partial bottom view structural diagram of a eutectic device according to some embodiments of the present application.

[0033] Figure 5 for Figure 1 The cross-sectional structure schematic diagram of the eutectic device is shown in the cross-sectional direction BB.

[0034] Figure 6 for Figure 1 A schematic top view of the structure of a eutectic device is shown.

[0035] Figure 7 Schematic diagram of the three-dimensional structure of the eutectic device according to some embodiments of the present application.

[0036] Figure 8 for Figure 7 A schematic diagram of the three-dimensional structure of the eutectic device in another direction is shown.

[0037] Figure 9 for Figure 7 The cross-sectional structure schematic diagram of the eutectic device is shown in the cross-sectional direction CC.

[0038] Figure 10 for Figure 1 The cross-sectional structure schematic diagram of the eutectic device is shown in the cross-sectional direction DD.

[0039] Figure 11 For Figure 7 The top - view structural schematic diagram of the eutectic device shown.

[0040] The reference numerals in the specific embodiments are as follows:

[0041] Eutectic device 100;

[0042] Carrier 110, adsorption port k, terminal E;

[0043] Heating component 120;

[0044] Base 130, adsorption channel T, blowing channel D, blowing outlet H;

[0045] Heat - insulating part 140, first communication channel t1;

[0046] First cooling channel p1, first cooling outlet c1;

[0047] Second cooling channel p2, first cooling section a1;

[0048] Third cooling channel p3, second cooling section a2, conduction section b;

[0049] First surface B1, first adsorption area R1, second adsorption area R2;

[0050] First connector J1, second connector J2, third connector J3, fourth connector J4, fifth connector J5;

[0051] Groove G;

[0052] Seal M;

[0053] Cover 150, accommodation cavity Q;

[0054] Blowing mechanism 160, fixing part 170;

[0055] First direction F1, second direction F2, third direction F3. Specific embodiments

[0056] To make the above - mentioned objects, features, and advantages of the present application more obvious and understandable, the following detailed description of the specific embodiments of the present application will be given in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0057] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0058] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0059] In the present application, unless otherwise clearly defined and limited, if there are terms such as "installed", "connected", "coupled", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0060] In the present application, unless otherwise clearly defined and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0061] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.

[0062] Figure 1 The three-dimensional structural schematic diagram of the eutectic device provided by some embodiments of this application is shown; Figure 2 shown Figure 1 The cross-sectional structural schematic diagram of the shown eutectic device in the cross-sectional direction of A-A; for ease of explanation, only the content related to the embodiments of this application is shown.

[0063] Please refer to Figures 1 to 2 , an eutectic device 100 is provided in the embodiments of this application, including a carrier 110, a heating component 120 and a base 130. In the embodiments of this application, the height direction of the base 130 is the first direction F1, the width direction of the base 130 is the second direction F2, and the length direction of the base 130 is the third direction F3. The first direction F1, the second direction F2 and the third direction F3 are used as references for illustrative purposes.

[0064] The carrier 110 is a component for carrying the eutectic component to be carried, and is used to carry the eutectic component to be carried along the first direction F1. The carrier 110 can be made of materials such as aluminum nitride or silicon nitride, as long as it has good heat conduction performance, and can be set according to actual needs, and no specific limitation is made here.

[0065] The heating component 120 includes a heating element and a temperature detection element both disposed in the carrier 110. Specifically, a wiring terminal E is provided on one side of the carrier 110, and the outside is connected to the circuits of the heating element and the temperature detection element inside the carrier 110 through the wiring terminal E. The heating element is electrically connected to the temperature detection element, and the heating temperature of the heating element is adjusted according to the detection signal of the temperature detection element. "Electrically connected" means that a connection relationship is established between the heating element and the temperature detection element through a conductive circuit, and this connection enables current to flow between the heating element and the temperature detection element to transmit relevant electrical signals, so as to achieve information exchange or collaborative work. The temperature detection element can convert the detected temperature information into electrical signals, and these electrical signals can be transmitted to the control circuit related to the heating element through electrical connection. The control circuit adjusts the heating temperature of the heating element according to the detection signal of the temperature detection element. For example, when the temperature detection element detects that the temperature is too high, a signal is transmitted through electrical connection to stop the heating of the heating element or reduce the heating power; on the contrary, when the temperature is too low, the heating power is increased.

[0066] The heating element and the temperature detection element can form a closed-loop temperature control system through electrical connection. The heating element is responsible for generating heat to change the temperature, and the temperature detection element monitors the temperature change in real time. The electrical connection between them ensures that the temperature information can be timely fed back to the control part related to the heating element for dynamic adjustment, so that the temperature of the heated environment is maintained within a relatively stable range.

[0067] The base 130 refers to the component that provides the installation base and stable support for the carrier 110. The base 130 is arranged on the bottom side of the carrier 110 along the first direction F1. A first cooling channel p1 is provided in the base 130, and the first cooling channel p1 is configured to cool the eutectic component after heating. After heating is completed, cooling gas can be quickly introduced into the first cooling channel p1 to cool the eutectic component after heating, which can improve the connection quality of the eutectic component. The cooling gas can be nitrogen or inert gas. Of course, the first cooling channel p1 can be set to multiple channels, which can be set according to actual needs and will not be elaborated here.

[0068] Among them, in the eutectic process, there can be the following situation: the component to be eutectic can be a substrate and a chip. The operator places the component to be eutectic on the carrier plate 110. The heating component 120 in the carrier plate 110 preheats the substrate to the operating temperature and quickly heats the substrate through contact heat conduction. Subsequently, the operator then mounts the chip to the corresponding mounting position on the substrate according to the process sequence. After the substrate and the chip are mounted, the heating component 120 in the carrier plate 110 heats the substrate and the chip to the eutectic temperature. Then, cooling gas is introduced into the first cooling channel p1 in the base 130. The cooling gas flows through the first cooling channel p1 to reach the bottom of the carrier 110, so that the cooling gas cools the substrate and the chip after heating is completed. The substrate and the chip quickly cool down and solidify, and the eutectic is completed.

[0069] In this way, through the carrier 110 and the heating element and temperature detection element in the carrier 110, the heating temperature can be more effectively controlled. The component to be eutectic placed on the carrier 110 can be quickly heated, improving the heat conduction efficiency. At the same time, a first cooling channel p1 is provided in the base 130 on the bottom side of the carrier 110, and cooling gas can be introduced more quickly to cool the eutectic component after heating is completed, thereby improving the yield of the product.

[0070] Figure 3 FIG. shows a partial top view structural schematic diagram of the eutectic device provided by some embodiments of the present application; for ease of description, only the content related to the embodiments of the present application is shown.

[0071] In some embodiments, please continue to refer to Figures 1 to 2 and, in combination with reference to Figure 3, the eutectic device 100 further includes a heat insulating member 140 disposed between the carrier 110 and the base 130 along the first direction F1.

[0072] The heat insulating member 140 refers to a component that reduces the heat transfer of the heating component 120 in the carrier 110. The material of the heat insulating member 140 can be ceramic or other materials with heat insulating effects, which can be set according to actual needs and are not limited herein. Specifically, the first cooling channel p1 has at least one first cooling outlet c1, and the heat insulating member 140 is provided with at least one first communication channel t1 penetrating the heat insulating member 140 along the first direction F1. Among them, the first cooling outlet c1 is in one-to-one correspondence with the inlet of the first communication channel t1, and the outlet of the first communication channel t1 is arranged facing the carrier 110. The first cooling channel p1 penetrates through the inside of the base 130, and both ends of the first cooling channel p1 can be connected to the first joint J1, and the first joint J1 is located on both sides of the base 130 along the second direction F2. After heating is completed, the cooling gas can enter the first cooling channel p1 through the first joint J1, so as to cool the eutectic assembly on the inside of the base 130, the inside of the heat insulating member 140, and the carrier 110 more quickly, improve the cooling effect, and thus make the eutectic connection more stable and reliable. Here, the cooling gas can be nitrogen or inert gas, which can be set according to actual needs and are not limited herein. Exemplarily, taking Figures 1 to 3 as an example, it shows a situation where two first cooling channels p1 are provided in the base 130, both ends of each first cooling channel p1 are provided with a first joint J1, the first joint J1 is located on both sides of the base 130 along the second direction F2, each first cooling channel p1 has two first cooling outlets c1, and the heat insulating member 140 is provided with four first communication channels t1 penetrating the heat insulating member 140 along the first direction F1.

[0073] In this way, the first cooling outlet c1 of the first cooling channel p1 is in one-to-one correspondence with the inlet of the first communication channel t1, which can cool the eutectic assembly on the carrier plate 110 after heating is completed more quickly, and at the same time cool the base 130 and the heat insulating member 140, improve the cooling effect, and thus improve the stability and reliability of the eutectic connection.

[0074] In some embodiments, please continue to refer to Figure 1 and Figure 2 , there is a gap between the heat insulating member 140 and the carrier 110 in the first direction F1.

[0075] When the cooling gas is introduced into the first cooling channel p1 in the base body 130, the cooling gas can flow through the first cooling channel p1 and the first communication channel t1 and then reach the bottom of the carrier plate 110, and finally flow out from the gap between the heat insulation member 140 and the carrier member 110. In this way, the cooling area of the carrier member 110 is increased, and the eutectic assembly after heating on the carrier member 110 can be effectively cooled. Of course, as described above, one of the first connectors J1 at both ends of the first cooling channel p1 can introduce the cooling gas, and the other first connector J1 can discharge the cooling gas. The operator can control the gas flow rate of the first connector J1 that discharges the cooling gas, so that the cooling gas can also flow through the first cooling channel p1 and the first communication channel t1 and then reach the bottom of the carrier plate 110, and the cooling gas can flow out from the gap between the heat insulation member 140 and the carrier member 110. It can be set according to actual needs and is not specifically limited here. Here, the cooling gas can be nitrogen or inert gas, which can be set according to actual needs and is not limited here.

[0076] In this way, there is a gap between the heat insulation member 140 and the carrier member 110 in the first direction F1, and the cooling gas flows out through the gap, increasing the cooling area of the carrier member 110, so that the carrier member 110 can be cooled simultaneously, improving the cooling uniformity, and thus improving the cooling efficiency of the eutectic assembly after heating on the carrier member 110.

[0077] Figure 4 The partial bottom view structural schematic diagram of the eutectic device provided by some embodiments of the present application is shown; for the convenience of description, only the content related to the embodiments of the present application is shown.

[0078] In some embodiments, please continue to refer to Figures 1 to 3 and, in combination with reference to Figure 4 One side of the base body 130 and the heat insulation member 140 facing each other defines a second cooling channel p2, and the second cooling channel p2 can introduce the cooling gas to cool the top of the base body 130 and the bottom of the heat insulation member 140.

[0079] A third cooling channel p3 is provided in the base body 130. The third cooling channel p3 is arranged close to the side of the base body 130 facing away from the heat insulation member 140, and the third cooling channel p3 can introduce the cooling gas to cool the bottom of the base body 130.

[0080] Specifically, the second cooling channel p2 communicates with the third cooling channel p3. On both sides of the base 130 along the second direction F2, second connectors J2 can be provided. One of the second connectors J2 admits the cooling gas, and the other second connector J2 discharges the cooling gas. After heating is completed, the cooling gas enters the second cooling channel p2 from one of the second connectors J2. After flowing through the second cooling channel p2, the cooling gas flows from the outlet of the second cooling channel p2 into the inlet of the third cooling channel p3. After flowing through the third cooling channel p3, the cooling gas is discharged from the outlet of the third cooling channel p3 through the other second connector J2. Here, the cooling gas can be any gas as long as it can achieve the cooling effect, and no specific limitation is made here.

[0081] In addition, a seal M can be provided at the bottom of the base 130. The seal M is used to make the third cooling channel p3 in a relatively sealed environment. When the cooling gas flows into the third cooling channel p3, the cooling gas can flow smoothly in the third cooling channel p3 to improve the cooling efficiency.

[0082] In this way, the second cooling channel p2 defined by the side where the base 130 and the heat insulation member 140 face each other and the third cooling channel p3 provided close to the side of the base 130 facing away from the heat insulation member 140 can increase the heat exchange area, thereby improving the heat transfer efficiency, being able to take away heat more quickly, and improving the cooling effect. In addition, the second cooling channel p2 and the third cooling channel p3 communicate with each other, which can enable the cooling gas to flow in a larger space and be more evenly distributed, and take away heat more effectively, thereby improving the cooling effect of the base 130.

[0083] In some embodiments, please continue to refer to Figure 2 and Figure 3 , the second cooling channel p2 has a plurality of first cooling segments a1. The plurality of first cooling segments a1 are connected in sequence and enclose and define an unclosed second cooling channel p2. "Unclosed" means that the second cooling channel p2 is not a completely closed ring, and two adjacent first cooling segments a1 are not connected. In addition, the connection between two adjacent first cooling segments a1 can be connected by an arc segment, which can make the cooling gas flow more smoothly. Specifically, along the connection direction of the plurality of first cooling segments a1, the inlet of the second cooling channel p2 is provided at the head end of the first first cooling segment a1, and the outlet of the second cooling channel p2 is provided at the tail end of the last first cooling segment a1, which can enable the cooling gas to smoothly flow into the second cooling channel p2 from the second connector J2 on one side of the base 130 along the second direction F2 and then flow from the outlet of the second cooling channel p2 into the inlet of the third cooling channel p3.

[0084] In this way, a plurality of first cooling sections a1 are connected in sequence and enclose to define an unclosed second cooling channel p2, enabling the cooling gas to smoothly flow into the third cooling channel p3 after flowing through the second cooling channel p2. At the same time, when the cooling gas flows through the plurality of first cooling sections a1, it can exchange heat more fully with the area between the seat body 130 and the heat insulation member 140, effectively taking away the heat, thereby improving the cooling efficiency.

[0085] In some embodiments, please continue to refer to Figure 2 and Figure 3 , four first cooling sections a1 are provided.

[0086] Specifically, along the connection direction of the four first cooling sections a1, the extending directions of two adjacent first cooling sections a1 are perpendicular to each other. In the embodiments of the present application, the extending direction of one of the two adjacent first cooling sections a1 may be parallel to the second direction F2, and the extending direction of the other first cooling section a1 may be parallel to the third direction F3. In this way, the four first cooling sections a1 are connected in sequence and enclose to define an unclosed second cooling channel p2, which can be generally square. It can be set according to actual needs and is not limited here.

[0087] In this way, the four first cooling sections a1 and two adjacent first cooling sections a1 are perpendicular to each other, enabling the first cooling channel p2 to be distributed in different directions, thereby more comprehensively covering the cooling area and improving the cooling effect on the seat body 130 and the heat insulation member 140.

[0088] In some embodiments, please continue to refer to Figure 2 and Figure 4 , the third cooling channel p3 has a plurality of second cooling sections a2 and a plurality of conduction sections b.

[0089] Specifically, all the second cooling sections a2 are arranged at intervals in sequence along the second direction F2, and one end of two adjacent second cooling sections a2 close to each other is connected by a conduction section b. In this way, the plurality of second cooling sections a2 and the plurality of conduction sections b are connected to form the third cooling channel p3. Among them, the corresponding interval arrangement can be made according to actual needs and is not specifically limited here. The first end of the first second cooling section a2 may be provided with an inlet of the third cooling channel p3, and this inlet communicates with the outlet of the second cooling channel p2. The last end of the last second cooling section a2 may be provided with an outlet of the third cooling channel p3. Here, the second direction F2 is perpendicular to the first direction F1.

[0090] In this way, multiple second cooling sections a2 arranged at intervals and the conduction sections b connecting the second cooling sections a2 can enable the cooling gas to have more path changes when flowing through the third cooling channel p3, so as to more efficiently remove heat and achieve the purpose of cooling. At the same time, all the second cooling sections a2 being arranged at intervals in sequence along the second direction F2 can enable the heat to be more evenly removed from the bottom of the seat body 130, reducing the situation of local overheating.

[0091] In some embodiments, please continue to refer to Figure 2 and Figure 4 , the extending directions of all the second cooling sections a2 are parallel to each other, and the extending direction of the second cooling section a2, the first direction F1 and the second direction F2 are perpendicular to each other. Among them, the extending direction of the second cooling section a2 is parallel to the third direction.

[0092] In this way, the extending directions of all the second cooling sections a2 being parallel to each other can enable the heat to be more evenly removed when the cooling gas flows through the third cooling channel p3, achieving the purpose of cooling.

[0093] In some embodiments, please continue to refer to Figure 2 and Figure 4 , the extending path of the conduction section b is configured as an arc.

[0094] Specifically, the extending path of the conduction section b being configured as an arc can enable the cooling gas to more smoothly change the flow direction when flowing through the third cooling channel p3. Compared with configuring the extending path of the conduction section b as a right angle or a broken line shape, the extending path of the conduction section b being configured as an arc can enable the cooling gas to flow more smoothly in the third cooling channel p3, reducing the flow resistance of the gas. Thus, by providing multiple second cooling sections a2 and multiple conduction sections b, the adjacent ends of two adjacent second cooling sections a2 are connected by a conduction section b, and the formed third cooling channel p3 can be generally in an S shape, which can be set according to actual situations and is not limited herein.

[0095] In this way, by configuring the extending path of the conduction section b as an arc, the cooling gas can flow more smoothly in the third cooling channel p3, thereby improving the cooling efficiency of the bottom of the seat body 130.

[0096] Figure 5 shows Figure 1 The schematic cross-sectional structure diagram of the eutectic device shown in the cross-section in the B-B direction; for the convenience of description, only the content related to the embodiments of the present application is shown.

[0097] In some embodiments, please continue to refer to Figure 1 and Figure 3 , and in combination with reference to Figure 5, there are also multiple adsorption channels T provided on the base body 130, and multiple adsorption ports k for adsorbing the eutectic components to be processed are provided on the carrier 110.

[0098] Specifically, the adsorption port k penetrates through the carrier 110. Each adsorption channel T is connected to at least one adsorption port k, and the adsorption ports k connected by all the adsorption channels T are different from each other. Each adsorption channel T is connected to at least one adsorption port k through a channel provided in the heat insulation member 140. Third connectors J3 communicating with the adsorption channels T may be provided on both sides of the base body 130 along the second direction F2. The vacuum gas is introduced into the inlet of the adsorption channel T from the third connector J3, and different adsorption channels T are controlled through the third connector J3, so as to further control the adsorption ports k, and the adsorption of eutectic components to be processed with different sizes can be further realized. Of course, the number of the adsorption channels T may also be set to three or other numbers, and the corresponding number of adsorption ports k may also be multiple, which can be set according to actual needs and is not limited herein. Exemplarily, taking Figure 1 and Figure 5 as an example, it shows that there are two adsorption channels T provided in the base body 130 along the second direction F2. One of the adsorption channels T is connected to a third connector J3 and has three outlets at the top of the base body 130 along the first direction F1. The three channels in the heat insulation member 140 along the first direction F1 are respectively connected to the three outlets, and the three channel outlets in the heat insulation member 140 are connected to the three adsorption ports k on the carrier 110; the other adsorption channel T is connected to another third connector J3 and has one outlet at the top of the base body 130 along the first direction F1. This outlet is connected to the channel provided at the top of the base body 130 along the second direction F2. There are two channels in the heat insulation member 140 along the first direction F1. One of the channels is directly connected to the outlet at the top of the base body 130, and the other channel is connected through one end of the channel at the top of the base body 130. The two channel outlets in the heat insulation member 140 are connected to the two adsorption ports k on the carrier.

[0099] In this way, through the multiple adsorption channels T and the connection with different adsorption ports k, the eutectic components to be processed with different sizes can be adsorbed flexibly, and the adsorption ports k can be selected for adsorption according to needs. At the same time, each adsorption channel T is connected to different adsorption ports k, so that different adsorption areas can be adjusted independently. For eutectic components to be processed with different sizes, weights and shapes, the adsorption force can be adjusted through the corresponding adsorption channel T to achieve a better adsorption effect and reduce the movement of the eutectic components during the eutectic process.

[0100] Figure 6 shows Figure 1 a schematic top view structure diagram of the eutectic device shown; for the convenience of description, only the content related to the embodiments of the present application is shown.

[0101] In some embodiments, please continue to refer toFigure 1 and in combination with reference Figure 6 , the carrier 110 has a first surface B1 for carrying the eutectic component to be processed, and a first adsorption area R1 and a second adsorption area R2 surrounding the first adsorption area R1 are provided on the first surface B1.

[0102] Specifically, a part of the adsorption ports k are provided in the first adsorption area R1, and another part of the adsorption ports k are provided in the second adsorption area R2. The adsorption channels T connected to the adsorption ports k provided in the first adsorption area R1 are different from the adsorption channels T connected to the adsorption ports k provided in the second adsorption area R2. An annular groove G is provided on the carrier 110, and the adsorption ports k in the second adsorption area R2 are provided on the bottom wall of the groove G, and the adsorption ports k in the second adsorption area R2 can communicate with each other through the groove G. Exemplarily, taking Figure 1 and Figure 6 as an example, it shows the situation where the adsorption ports k provided in the first adsorption area R1 are arranged in a line, the adsorption ports k provided in the second adsorption area R2 are arranged in a line with the adsorption ports k provided in the first adsorption area R1, and the adsorption ports k in the second adsorption area R2 are connected through the annular groove G. Of course, the adsorption ports k provided in the first adsorption area R1 and the adsorption ports k provided in the second adsorption area R2 may not be arranged in a line, and can be set according to actual needs, and no specific limitation is made here.

[0103] The adsorption ports k in the two areas are respectively connected to different adsorption channels T, and the adsorption force can be independently adjusted according to the different needs of the first adsorption area R1 and the second adsorption area R2. For example, for a larger and heavier eutectic component to be processed, a larger adsorption force can be provided in the first adsorption area R1 for main bearing, and fine-tuning can be performed in the second adsorption area R2 according to the actual situation to achieve more precise control of the adsorption force. At the same time, for a smaller eutectic component to be processed, adsorption can be mainly relied on the first adsorption area R1; for a larger eutectic component to be processed, the second adsorption area R2 can provide additional adsorption force. It can be set according to actual needs, and no limitation is made here.

[0104] In this way, by providing the first adsorption area R1 and the second adsorption area R2 surrounding the first adsorption area R1, the eutectic component to be processed is adsorbed from different areas, and the adsorption force can be provided from different areas, making the eutectic component to be processed placed on the carrier 110 more stable and reducing the movement during the eutectic process.

[0105] Figure 7 shows a schematic three-dimensional structure diagram of the eutectic device according to some embodiments of the present application, Figure 8 shows Figure 7 a schematic three-dimensional structure diagram of the eutectic device shown in another direction, Figure 9 shows Figure 7The cross-sectional structure diagram of the eutectic device shown is in the cross-sectional direction CC, Figure 10 for Figure 1 The cross-sectional structure diagram of the eutectic device is shown in the cross-sectional direction DD; for ease of explanation, only the contents related to the embodiments of the present application are shown.

[0106] In some embodiments, please refer to Figure 1 , and combined with reference Figures 7 to 10 The eutectic device 100 further includes a cover 150 .

[0107] The cover 150 is a component that provides a relatively closed space environment for the eutectic process, and is composed of a component located on the base 130 along the first direction F1 and a component below the terminal E on the carrier 110. Specifically, the cover 150 is located on the base 130 along the first direction F1, and defines a receiving cavity Q with the base 130, the carrier 110 is located in the receiving cavity Q, the terminal E on the carrier 110 extends out of the receiving cavity Q, and the side of the cover 150 that is away from the base 130 is provided with an opening that is connected to the receiving cavity Q. Here, the cover 150 is provided with an opening that is connected to the receiving cavity Q, which can be used to place the eutectic component to be eutectic and take out the eutectic component after the eutectic is completed.

[0108] Among them, a blowing channel D for providing protective gas is provided in the base body 130, and the blowing channel D has at least one blowing outlet H, and the blowing outlet H is connected to the accommodating chamber Q. A fourth joint J4 can be provided on both sides of the base body 130 along the second direction F2, and the fourth joint J4 is connected to both ends of the blowing channel D. After the protective gas flows into the blowing channel D through the fourth joint J4, it flows out from the blowing outlet H, so that the protective gas enters the accommodating chamber Q, and then flows out from the opening of the cover body 150. This allows the protective gas to fill the entire accommodating chamber Q, which can reduce other impurity gases and reduce the risk of chemical reactions such as oxidation between the eutectic component and the impurity gas during the heating process, making the eutectic component more stable during the heating process. Here, the protective gas can be nitrogen or an inert gas, which can be set according to actual conditions and is not limited here. Of course, the blowing channel D can be set to multiple, which can be set according to actual needs and is not limited here. For example, with Figure 1 , Figures 7 to 10 For example, it is illustrated that two blowing channels D are provided in the seat body 130 along the second direction F2, both ends of each blowing channel D are provided with fourth joints J4, and each blowing channel D has a plurality of blowing outlets H.

[0109] In this way, a blowing channel D is provided in the seat body 130 and a blowing outlet H is provided to communicate with the accommodating chamber Q, so that the protective gas can directly enter the accommodating chamber Q. The protective gas can be evenly distributed in the accommodating chamber Q, effectively covering the entire eutectic region, and reducing the adverse effects such as oxidation caused by lack of protective gas in local areas. At the same time, the protective gas blown out from the seat body 130 can form a specific airflow direction in the accommodating chamber Q, and remove impurities, reaction by-products, etc. that may exist in the eutectic device 100 from the opening, which is conducive to the smooth progress of the eutectic process, thereby improving the yield of the product.

[0110] Figure 11 for Figure 7 A schematic diagram of the top structure of a eutectic device is shown; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0111] In some embodiments, please refer to Figures 1 to 10 , and combined with reference Figure 11 The eutectic device 100 further includes a blowing mechanism 160 .

[0112] The blowing mechanism 160 is a component for providing protective gas for the eutectic process. Specifically, the blowing mechanism 160 is disposed on one side of the cover body 150 and is connected to one side of the cover body 150 through a fixing member 170. The blowing mechanism 160 is configured to provide protective gas on the side of the cover body 150 away from the base body 130. At the same time, the fifth joints J5 can be provided at both ends of the blowing mechanism 160 along the second direction F2, and the protective gas can be passed into the blowing mechanism 160 through the fifth joints J5. The blowing mechanism 160 is provided with a plurality of gas outlets on the side close to the cover body 150, and the gas outlet direction of the gas outlet is above the cover body 150 and directly facing the opening on the cover body 150. The protective gas blown out from the blowing mechanism 160 can further isolate the air above the cover body 150, so that the eutectic component to be eutectic is eutectic in an oxygen-free environment, and at the same time, the gas and hot air flowing out of the opening on the cover body 150 can be blown away, so that the temperature distribution in the cover body 150 is more uniform, thereby improving the stability and reliability of the eutectic connection.

[0113] In this way, the blowing mechanism 160 provides protective gas on the side of the cover body 150 away from the base body 130, which is not only conducive to the rapid dissipation of heat, but also can further improve the stability and reliability of the eutectic connection.

[0114] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0115] The above-described embodiments merely represent several implementation manners of the present application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A eutectic device, characterized in that, Comprising: A carrier for carrying the eutectic component to be processed along a first direction; A heating component including a heating element and a temperature detection element both disposed within the carrier, the heating element being electrically connected to the temperature detection element; and A base body disposed along the first direction at the bottom side of the carrier; a first cooling channel is provided within the base body.

2. The eutectic device according to claim 1, wherein The eutectic device further includes a heat insulation member disposed along the first direction between the carrier and the base body; The first cooling channel has at least one first cooling outlet, and the heat insulation member is provided with at least one first communication channel penetrating the heat insulation member along the first direction. The first cooling outlet is in one-to-one correspondence and communication with the inlet of the first communication channel, and the outlet of the first communication channel faces the carrier.

3. The eutectic device according to claim 2, wherein There is a gap between the heat insulation member and the carrier in the first direction.

4. The eutectic device according to claim 2, characterized in that, A second cooling channel is defined on the side of the base body and the heat insulation member facing each other; a third cooling channel is provided within the base body, and the third cooling channel is disposed close to the side of the base body facing away from the heat insulation member; The second cooling channel and the third cooling channel are in communication with each other.

5. The eutectic device according to claim 4, characterized in that, The second cooling channel has a plurality of first cooling segments, and the plurality of first cooling segments are sequentially connected and enclose to define the unclosed second cooling channel; Along the connection direction of the plurality of first cooling segments, the inlet of the second cooling channel is provided at the head end of the first one of the first cooling segments, and the outlet of the second cooling channel is provided at the end of the last one of the first cooling segments.

6. The eutectic device according to claim 5, characterized in that, There are four first cooling segments; along the connection direction of the four first cooling segments, the extending directions of two adjacent first cooling segments are perpendicular to each other.

7. The eutectic device according to claim 4, characterized in that, The third cooling channel has a plurality of second cooling segments and a plurality of conduction segments; All the second cooling segments are arranged at intervals in sequence along a second direction, and one end of two adjacent second cooling segments close to each other is connected by one of the conduction segments; the second direction is perpendicular to the first direction.

8. The eutectic device according to claim 7, characterized in that, The extending directions of all the second cooling segments are parallel to each other, and the extending direction of the second cooling segment, the first direction and the second direction are perpendicular to each other; and / or The extending path of the conduction segment is configured as an arc.

9. The eutectic device according to any one of claims 1-8, characterized in that, A plurality of adsorption channels are further provided on the base body, and a plurality of adsorption ports for adsorbing the eutectic component to be processed are provided on the carrier; Each of the adsorption channels is connected to at least one of the adsorption ports, and the adsorption ports connected by all the adsorption channels are different from each other.

10. The eutectic device according to claim 9, characterized in that, The carrier has a first surface for carrying the eutectic component to be processed, and a first adsorption area and a second adsorption area surrounding the first adsorption area are provided on the first surface; A part of the adsorption ports are provided in the first adsorption area, and another part of the adsorption ports are provided in the second adsorption area; The adsorption channels connected to the adsorption ports provided in the first adsorption area are different from the adsorption channels connected to the adsorption ports provided in the second adsorption area.

11. The eutectic device according to any one of claims 1-8, characterized in that, The eutectic device further includes a cover body; the cover body is disposed on the base body along the first direction and defines a receiving cavity with the base body, the carrier is located in the receiving cavity, and an opening communicating with the receiving cavity is provided on a side of the cover body facing away from the base body; Wherein, a blowing channel for providing a protective gas is provided in the base body, the blowing channel has at least one blowing outlet, and the blowing outlet communicates with the receiving cavity; and / or The eutectic device further includes a blowing mechanism, the blowing mechanism is disposed on one side of the cover body, and the blowing mechanism is configured to provide a protective gas on a side of the cover body facing away from the base body.

Images