Baking equipment for semiconductor processing

Abstract

The utility model discloses baking equipment for semiconductor processing, and relates to the technical field of semiconductors. The device comprises a box body, a rotating rod is rotatably mounted in the box body, and a plurality of circular plates are distributed on the rotating rod at intervals. By adopting the design of the separation mechanism, when the separation mechanism acts, the box body can be separated into the heating cavity and the buffering cavity, at the moment, the chip is baked through the heating cavity, when baking is completed, the separation mechanism can be driven to act reversely so that the heating cavity can communicate with the buffering cavity, and then the rotating rod is driven to rotate through the driving part; the positions of the unbaked chips and the baked chips on the circular plate are exchanged, finally, the heating cavity and the buffer cavity are separated again through the separation mechanism, the oven door can be opened to take out the baked chips, and due to the design, when the oven door is opened, workers are not prone to being scalded by high-temperature air, hot air in the heating cavity does not need to be exhausted, and the working efficiency is improved. The baking time of the chip can be effectively reduced, and the energy consumption is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and particularly to a baking device for semiconductor processing. Background Art

[0002] Baking and die bonding is a key step in the semiconductor manufacturing process. The principle is to cure the glue (thermal conductive glue, conductive glue, insulating glue, epoxy resin glue, UV glue, etc.) by heating, so as to firmly bond the chip to the frame. In this process, it is necessary to accurately control the temperature, time and environment of the oven, and also make adjustments according to the types and characteristics of different glues.

[0003] After the baking and die bonding process is completed, in order to ensure the stable cooling of the material, the natural cooling method is mostly adopted. After baking is completed, the material is taken out and left to stand for cooling. In order to avoid scalding the staff by the hot gas, it is necessary to exhaust the hot air in the oven before taking the material, which is likely to prolong the baking time of the oven and result in large energy consumption. In order to reasonably improve this problem, the present application proposes a baking device for semiconductor processing. Utility Model Content

[0004] The purpose of the present application is to solve the technical problem that after the baking and die bonding process is completed, in order to ensure the stable cooling of the material, the natural cooling method is mostly adopted. After baking is completed, the material is taken out and left to stand for cooling. In order to avoid scalding the staff by the hot gas, it is necessary to exhaust the hot air in the oven before taking the material, which is likely to prolong the baking time of the oven and result in large energy consumption. The present application provides a baking device for semiconductor processing.

[0005] The present application specifically adopts the following technical solutions to achieve the above purpose:

[0006] A baking device for semiconductor processing, comprising:

[0007] A box body, in which a rotating rod is rotatably installed. A plurality of circular plates are spaced apart on the rotating rod, and positioning holes are annularly distributed on the circular plates;

[0008] Two arc-shaped grooves are symmetrically arranged in the box body and are movably abutted against the outer sides of a plurality of circular plates. Separation mechanisms are provided on both arc-shaped grooves. The box body can be separated into a heating chamber and a buffer chamber through the two separation mechanisms. A heating element is provided in the heating chamber. A pick-up and placement opening is formed on the box body. The pick-up and placement opening is communicated with the buffer chamber, and a box door for closing the pick-up and placement opening is provided;

[0009] A driving member is installed on the top of the box body, and the rotating rod can be driven to rotate through the driving member;

[0010] A circulation assembly is arranged on the box body, and the hot air in the heating chamber can be circulated through the circulation assembly.

[0011] Further, the separation mechanism includes an installation cavity constructed inside the box body. A plurality of chute groups are linearly distributed on the installation cavity. Each chute group includes two parallel sliding chutes. Heat insulation plates are slidably fitted in the sliding chutes. The two heat insulation plates are respectively movably lapped with the opposite sides of the adjacent circular plates. A driving mechanism is arranged in the installation cavity, and multiple groups of heat insulation plates can be unfolded through the driving mechanism.

[0012] Further, strip-shaped grooves for accommodating the heat insulation plates are annularly distributed on the opposite sides of the circular plates. Sealing gaskets are arranged at the opposite ends of the two heat insulation plates, and the sealing gaskets are in contact and lap with the strip-shaped grooves. Transverse plates are constructed at the opposite ends of the two heat insulation plates, and the transverse plates extend relatively. Flexible blocks are connected to the opposite sides of the transverse plates.

[0013] Further, baffles are connected to the two heat insulation plates. The baffles cover the sliding chutes and are slidably fitted with the inner wall of the installation cavity.

[0014] Further, a sealing rubber sleeve is arranged between adjacent two circular plates. The sealing rubber sleeve is rotatably fitted with the rotating rod, and the end of the heat insulation plate is movably lapped with the outer side of the sealing rubber sleeve.

[0015] Further, the driving mechanism includes a rod body rotatably installed in the installation cavity. A motor is connected to the end of the rod body. A plurality of double-threaded sections are constructed on the rod body. Fixed blocks are connected to the opposite ends of the two heat insulation plates, and the two fixed blocks are respectively in threaded cooperation with the two ends of the double-threaded section.

[0016] Further, the circulation assembly includes a flow channel constructed on the inner wall of the box body. The flow channel includes a first inner wall and a second inner wall that are perpendicular to each other, and the first inner wall and the second inner wall are respectively tangent to the inner walls of the two arc-shaped grooves. An air pump is connected to the top of the flow channel, and the output end of the air pump is connected to the bottom of the flow channel.

[0017] Further, a filter is arranged at the input end of the air pump.

[0018] The beneficial effects of the present application are as follows:

[0019] By adopting the design of the separation mechanism in the present application, when the separation mechanism acts, the box body can be separated into a heating cavity and a buffer cavity. At this time, the chip is baked in the heating cavity. When the baking is completed, the separation mechanism can be driven to act in the reverse direction to communicate the heating cavity and the buffer cavity. Then, the rotating rod is driven to rotate by the driving member to exchange the positions of the un-baked chips and the baked chips on the circular plate. Finally, the heating cavity and the buffer cavity are separated again by the separation mechanism, and the box door can be opened to take out the baked chips. With such a design, when the box door is opened, the staff is not easily scalded by the high-temperature air, there is no need to discharge the hot air in the heating cavity, the baking time of the chips can be effectively reduced, and the energy consumption can be reduced. Brief Description of the Drawings

[0020] Figure 1 is the three-dimensional structure diagram of the present application;

[0021] Figure 2 is the partial three-dimensional structure cross-sectional view of the present application;

[0022] Figure 3 is the partial three-dimensional structure cross-sectional view of the present application from another angle;

[0023] Figure 4 is the structure diagram of the heat insulation board of the present application;

[0024] Reference numerals: 1, box body; 2, rotating rod; 3, circular plate; 4, positioning hole; 5, arc-shaped groove; 6, partitioning mechanism; 601, installation cavity; 602, chute group; 6021, sliding chute; 603, heat insulation board; 604, driving mechanism; 6041, rod body; 6042, motor; 6043, double-threaded section; 6044, fixing block; 7, heating cavity; 8, buffer cavity; 9, heating element; 10, access opening; 11, box door; 12, driving part; 13, circulation component; 1301, flow channel; 13011, first inner wall; 13012, second inner wall; 1302, air pump; 14, strip-shaped groove; 15, sealing gasket; 16, cross plate; 17, flexible block; 18, baffle; 19, sealing rubber sleeve; 20, filter; 21, curved surface. Detailed Description of the Embodiments

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.

[0026] As Figures 1-4 shown, a baking device for semiconductor processing proposed in an embodiment of the present application includes:

[0027] A box body 1, in which a rotating rod 2 is rotatably installed. The rotating rod 2 is vertical, and a plurality of circular plates 3 are spaced apart on the rotating rod 2. The plurality of circular plates 3 are parallel to each other. Positioning holes 4 are annularly distributed on the circular plates 3. A plate body filled with chips can be fixed on the circular plates 3 through the positioning holes 4 to facilitate the taking and placing of the chips.

[0028] Two arc-shaped grooves 5 are symmetrically arranged inside the box body 1, with their openings facing each other. The arc surfaces of the two arc-shaped grooves 5 are in the same circular plane and are in movable contact with the outer sides of multiple circular plates 3. The arc surfaces of the arc-shaped grooves 5 are in movable contact with the outer sides of the circular plates 3. Through the multiple circular plates 3, the arc-shaped grooves 5 can be equally divided into multiple parts. Separation mechanisms 6 are provided on both of the two arc-shaped grooves 5. Through the two separation mechanisms 6, the box body 1 can be separated into a heating chamber 7 and a buffer chamber 8. A heating element 9 is provided in the heating chamber 7. The heating element 9 is specifically an electric heating tube heater. A pick-up and placement opening 10 is formed on the box body 1. The pick-up and placement opening 10 is communicated with the buffer chamber 8, and a box door 11 for closing the pick-up and placement opening 10 is provided. A curved surface 21 is constructed at a corner of the box body 1. The pick-up and placement opening 10 is formed on the curved surface 21, and its opening angle is 90 degrees. When the two separation mechanisms 6 act, the two arc-shaped grooves 5 can be equally divided. The distance between adjacent circular plates 3 can be equally divided into two semi-cylinders by the separation mechanisms 6 and the arc-shaped grooves 5. At this time, under the action of the separation mechanisms 6, the heating chamber 7 and the buffer chamber 8 are not communicated with each other. When heating the heating chamber 7 through the heating element 9, the high-temperature gas in the heating chamber 7 can bake the chips inside it. Subsequently, the separation mechanisms 6 can be driven to act in the reverse direction to briefly communicate the heating chamber 7 and the buffer chamber 8. By rotating the rotating rod 2, the un-baked chips on the circular plates 3 and the baked chips are swapped positions. Finally, the separation mechanisms 6 are driven to act and the heating chamber 7 and the buffer chamber 8 are separated again. At this time, the temperature in the buffer chamber 8 is slightly higher than the outdoor temperature and lower than the temperature in the heating chamber 7. After the chips are preliminarily cooled in the buffer chamber 8, the box door 11 can be opened, and they can be taken out from the pick-up and placement opening 10 and left to stand and cool. And when the pick-up and placement opening is opened, the buffer chamber 8 can be cooled to make the temperatures of the heating chamber 7, the buffer chamber 8 and the outdoor temperature show a decreasing trend;

[0029] A driving member 12 is installed on the top of the box body 1. Through the driving member 12, the rotating rod 2 can be driven to rotate. The driving member 12 is specifically a motor 6042, and its output end is connected to the rotating rod 2;

[0030] A circulation assembly 13 is provided on the box body 1. Through the circulation assembly 13, the hot air in the heating chamber 7 can be circulated. It cooperates with the heating element 9 to improve the baking efficiency of the chips;

[0031] By adopting the design of the partition mechanism 6, when the partition mechanism 6 operates, the box body 1 can be partitioned into a heating chamber 7 and a buffer chamber 8. At this time, the chip is baked in the heating chamber 7. When the baking is completed, the partition mechanism 6 can be driven to act reversely so that the heating chamber 7 communicates with the buffer chamber 8. Subsequently, the rotating rod 2 is driven to rotate by the driving member 12 to exchange the positions of the unbaked chips and the baked chips on the circular plate 3. Finally, the heating chamber 7 and the buffer chamber 8 are partitioned again by the partition mechanism 6, and the box door 11 can be opened to take out the baked chips. With such a design, when the box door 11 is opened, the staff is not easily scalded by the high-temperature air, and there is no need to discharge the hot air in the heating chamber 7, which can effectively reduce the baking time of the chips and reduce the energy consumption.

[0032] As Figures 2-4 shown, in some embodiments, the partition mechanism 6 includes an installation cavity 601 constructed in the box body 1. A plurality of chute groups 602 are linearly distributed on the installation cavity 601. The plurality of chute groups 602 are arranged vertically. The number of chute groups 602 is one less than the number of circular plates 3. The chute group 602 includes two parallel sliding grooves 6021. Both of the two sliding grooves 6021 are vertical. The installation cavity 601 communicates with the arc-shaped groove 5 through the sliding grooves 6021. Heat insulation plates 603 are slidably fitted in the sliding grooves 6021. The heat insulation plates 603 are made of rigid polyurethane material and have the advantage of low thermal conductivity. The two heat insulation plates 603 are respectively movably lapped on the opposite sides of the adjacent circular plates 3. A driving mechanism 604 is provided in the installation cavity 601. Multiple groups of heat insulation plates 603 can be unfolded by the driving mechanism 604. When the driving mechanism 604 drives multiple groups of heat insulation plates 603 to unfold, the two heat insulation plates 603 in a single group are staggered up and down. At this time, the opposite ends of the two heat insulation plates 603 can respectively contact the two circular plates 3, and the opposite ends of the two heat insulation plates 603 are not separated from each other. In this way, the distance between the adjacent circular plates 3 can be equally divided into two semi-cylinders, so that the box body 1 can be partitioned into a heating chamber 7 and a buffer chamber 8. When the driving mechanism 604 drives multiple groups of heat insulation plates 603 to be received, the two heat insulation plates 603 approach and coincide with each other, and the heating chamber 7 and the buffer chamber 8 communicate with each other.

[0033] As Figures 2-4As shown, in some embodiments, strip-shaped grooves 14 for accommodating heat insulation plates 603 are annularly distributed on the opposite sides of the circular plate 3. The number of strip-shaped grooves 14 on one side of the circular plate 3 is four. Sealing gaskets 15 are provided at the opposite ends of the two heat insulation plates 603 in a matching manner. The sealing gaskets 15 are silica gel gaskets, and the sealing gaskets 15 are in contact and overlap with the strip-shaped grooves 14. When the two heat insulation plates 603 are unfolded, the heat insulation plates 603 contact the circular plate 3, and the sealing gaskets 15 can be in contact with the strip-shaped grooves 14. Transverse plates 16 are constructed at the opposite ends of the two heat insulation plates 603. The two transverse plates 16 extend relatively. Flexible blocks 17 are connected to the opposite sides of the transverse plates 16. The flexible blocks 17 are rubber blocks. When the heat insulation plates 603 contact the circular plate 3, the opposite sides of the two transverse plates 16 are in contact, and the two flexible blocks 17 are in contact with each other, so as to improve the sealing performance between the heating cavity 7 and the buffer cavity 8 when the two heat insulation plates 603 are unfolded.

[0034] As Figures 2-4 shown, in some embodiments, two heat insulation plates 603 are both connected with baffle plates 18. The baffle plates 18 are rubber plates. The baffle plates 18 cover the sliding grooves 6021 and are in sliding fit with the inner wall of the installation cavity 601. Whether the heat insulation plates 603 are in the unfolded or stored state, the baffle plates 18 cover the sliding grooves 6021, so that the air in the heating cavity 7 is not easily introduced into the buffer cavity 8 through the installation cavity 601, thereby further improving the sealing performance between the heating cavity 7 and the buffer cavity 8.

[0035] As Figures 2-4 shown, in some embodiments, a sealing rubber sleeve 19 is provided between adjacent two circular plates 3. The sealing rubber sleeve 19 is made of rubber. The sealing rubber sleeve 19 is in rotational fit with the rotating rod 2. The sealing rubber sleeve 19 is in a cylindrical shape, and its two ends are respectively in contact with the opposite sides of the two circular plates 3. The end of the heat insulation plate 603 is in movable overlap with the outer side of the sealing rubber sleeve 19. By adopting the design of the sealing rubber sleeve 19, the air in the heating cavity 7 is not easily introduced into the buffer cavity 8 through the gap between the heat insulation plate 603 and the rotating rod 2.

[0036] As Figures 2-4 shown, in some embodiments, the driving mechanism 604 includes a rod body 6041 rotatably installed in the installation cavity 601. The rod body 6041 is in a vertical shape. The end of the rod body 6041 is connected with a motor 6042. The motor 6042 is installed in the installation cavity 601. When it works, it can drive the rod body 6041 to rotate. A plurality of double-threaded sections 6043 are constructed on the rod body 6041. The number of the double-threaded sections 6043 is the same as that of the chute groups 602, and the distances between them are the same. Fixed blocks 6044 are connected to the opposite ends of the two heat insulation plates 603. The two fixed blocks 6044 extend relatively, and the two fixed blocks 6044 are respectively in threaded fit with the two ends of the double-threaded section 6043. When the rod body 6041 rotates, it can drive the two fixed blocks 6044 to move relatively or away from each other, so as to unfold or store the two heat insulation plates 603.

[0037] As Figures 2-4 shown, in some embodiments, the circulation component 13 includes a flow channel 1301 constructed on the inner wall of the box body 1. The flow channel 1301 includes a first inner wall 13011 and a second inner wall 13012 that are perpendicular to each other, and the first inner wall 13011 and the second inner wall 13012 are respectively tangent to the inner walls of two arc-shaped grooves 5. There is a spacing between the flow channel 1301 and the circumferential side of the circular plate 3. The top of the flow channel 1301 is connected to an air pump 1302, and the output end of the air pump 1302 is connected to the bottom of the flow channel 1301. When the air pump 1302 works, the gas in the heating chamber 7 can circulate from bottom to top, so as to bake the chip.

[0038] As Figure 4 shown, in some embodiments, a filter 20 is provided at the input end of the air pump 1302. The filter 20 is a high-temperature resistant air filter 20, so as to filter the waste gas generated by baking the glue, so that the air in the heating chamber 7 is relatively clean.

[0039] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A baking device for semiconductor processing, characterized in that, Comprising: A box body (1), a rotating rod (2) is rotatably installed inside the box body (1), a plurality of circular plates (3) are distributed at intervals on the rotating rod (2), and positioning holes (4) are annularly distributed on the circular plates (3); Two arc-shaped grooves (5), symmetrically arranged inside the box body (1) and movably abutted against the outer sides of a plurality of circular plates (3). A separating mechanism (6) is provided on each of the two arc-shaped grooves (5). The box body (1) can be separated into a heating cavity (7) and a buffer cavity (8) by the two separating mechanisms (6). A heating element (9) is provided in the heating cavity (7). A pick-up and placement opening (10) is formed in the box body (1), the pick-up and placement opening (10) communicates with the buffer cavity (8), and a box door (11) for closing the pick-up and placement opening (10) is provided; A driving member (12), installed on the top of the box body (1), and the rotating rod (2) can be driven to rotate by the driving member (12); A circulation assembly (13), provided on the box body (1), and the hot air in the heating cavity (7) can be circulated by the circulation assembly (13).

2. The baking equipment for semiconductor processing according to claim 1, characterized in that, The separating mechanism (6) includes an installation cavity (601) constructed inside the box body (1). A plurality of chute groups (602) are linearly distributed on the installation cavity (601). The chute group (602) includes two parallel sliding grooves (6021). Heat insulation plates (603) are slidably fitted in the sliding grooves (6021). The two heat insulation plates (603) are respectively movably lapped with the opposite sides of adjacent circular plates (3). A driving mechanism (604) is provided in the installation cavity (601), and multiple groups of heat insulation plates (603) can be unfolded by the driving mechanism (604).

3. The baking equipment for semiconductor processing according to claim 2, wherein, Bar-shaped grooves (14) for accommodating the heat insulation plates (603) are annularly distributed on the opposite sides of the circular plates (3). Sealing gaskets (15) are provided at the opposite ends of the two heat insulation plates (603), and the sealing gaskets (15) are in contact and lapped with the bar-shaped grooves (14). Transverse plates (16) are constructed at the opposite ends of the two heat insulation plates (603). The transverse plates (16) extend relatively. Flexible blocks (17) are connected to the opposite sides of the transverse plates (16).

4. The baking equipment for semiconductor processing according to claim 3, characterized in that, The two heat insulation plates (603) are both connected with baffles (18). The baffles (18) cover the sliding grooves (6021) and are slidably fitted with the inner wall of the installation cavity (601).

5. The baking equipment for semiconductor processing according to claim 4, wherein A sealing rubber sleeve (19) is provided between adjacent two circular plates (3). The sealing rubber sleeve (19) is rotatably fitted with the rotating rod (2), and the end of the heat insulation plate (603) is movably lapped with the outer side of the sealing rubber sleeve (19).

6. The baking equipment for semiconductor processing according to claim 2, characterized in that, The driving mechanism (604) includes a rod body (6041) rotatably installed in the installation cavity (601). A motor (6042) is connected to the end of the rod body (6041). A plurality of double-threaded sections (6043) are constructed on the rod body (6041). Fixed blocks (6044) are connected to the opposite ends of the two heat insulation plates (603), and the two fixed blocks (6044) are respectively in threaded cooperation with the two ends of the double-threaded section (6043).

7. The baking equipment for semiconductor processing according to claim 1, wherein The circulating component (13) includes a flow channel (1301) constructed on the inner wall of the box body (1). The flow channel (1301) includes a first inner wall (13011) and a second inner wall (13012) that are perpendicular to each other, and the first inner wall (13011) and the second inner wall (13012) are respectively tangent to the inner walls of two arc-shaped grooves (5). The top of the flow channel (1301) is communicated with an air pump (1302), and the output end of the air pump (1302) is communicated with the bottom of the flow channel (1301).

8. The baking equipment for semiconductor processing according to claim 7, characterized in that, A filter (20) is provided at the input end of the air pump (1302).

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