Packaging structure, power module and electronic equipment

Abstract

The utility model discloses a packaging structure, a power module and electronic equipment, the packaging structure comprises a protection part and a first heat transfer part, and the protection part is provided with an accommodating cavity for accommodating a power device; the first heat transfer piece is detachably connected with the protection piece and is used for bearing a power device; wherein the heat conductivity coefficient of the first heat transfer piece is larger than that of the protection piece, so that the power device conducts heat to the heat dissipation piece through the first heat transfer piece. According to the embodiment of the invention, the packaging structure is additionally provided with the first heat transfer part between the protection part and the heat dissipation part, the connection stability of the packaging structure can be improved, the heat conduction path of the packaging structure is improved, and the heat dissipation performance of the power module is improved.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor devices, and particularly relates to a packaging structure, a power module, and an electronic device. Background Art

[0002] A power module refers to a modular structure integrating multiple power semiconductor devices, which is widely used in various electronic devices. During the preparation and application of the power module, its packaging process has a direct impact on the performance and reliability of the power module.

[0003] In related products, the packaging structure of the power module needs to be further improved in terms of heat dissipation ability and packaging stability. Summary of the Utility Model

[0004] Embodiments of this application provide a packaging structure, a power module, and an electronic device, and the packaging structure can...

[0005] In a first aspect, embodiments of this application provide a packaging structure, including a protective member and a first heat transfer member. The protective member has a receiving cavity for accommodating a power device; the first heat transfer member is detachably connected to the protective member, and the first heat transfer member is used for carrying the power device; wherein, the thermal conductivity of the first heat transfer member is greater than that of the protective member, so that the power device conducts heat to the heat sink through the first heat transfer member.

[0006] In some embodiments, the protective member includes a first mounting portion, a connecting portion, and a second mounting portion that are sequentially connected in a first direction. The second mounting portion is detachably connected to the first heat transfer member, and the second mounting portion is provided with a positioning structure.

[0007] In some embodiments, the positioning structure includes two first stop portions and two second stop portions. The two first stop portions are disposed on both sides of the first heat transfer member in a second direction, and the two second stop portions are disposed on both sides of the first heat transfer member in a third direction.

[0008] In some embodiments, in a plane perpendicular to the first direction, the orthographic projection of the first mounting portion falls within the orthographic projection of the first heat transfer member, and the orthographic projection of the first heat transfer member falls within the orthographic projection of the second mounting portion.

[0009] In some embodiments, the first mounting portion is provided with a plurality of third connection holes. The third connection holes are of a blind hole structure, and the first mounting portion is connected to the PCB board through the third connection holes. The plurality of third connection holes are symmetrically distributed about the first mounting portion.

[0010] In some embodiments, the first mounting portion is provided with a plurality of first stepped surfaces, and the plurality of first stepped surfaces are provided in one-to-one correspondence with the plurality of third connection holes. When the first mounting portion is connected to the PCB board, the first stepped surfaces are in abutting contact with the PCB board.

[0011] In some embodiments, the first heat transfer member is provided with a first connection hole, and the protective member is provided with a second connection hole. The second connection hole is coaxially arranged with the first connection hole and the aperture of the second connection hole is larger than that of the first connection hole.

[0012] In some embodiments, the encapsulation structure further includes a second heat transfer member. The second heat transfer member is disposed above the first heat transfer member along a first direction, and the second heat transfer member is fixedly welded to the first heat transfer member; wherein, the thermal conductivity of the second heat transfer member is less than that of the first heat transfer member, and / or, the heat dissipation area of the second heat transfer member is less than that of the first heat transfer member.

[0013] In a second aspect, an embodiment of the present application provides a power module. The power module includes a power device, a heat dissipation member, and the encapsulation structure provided in any one of the foregoing embodiments. Wherein, the power device is disposed on the first heat transfer member along the first direction and is installed in the accommodation cavity, and the encapsulation structure is connected to the heat dissipation member through the first heat transfer member.

[0014] In a third aspect, an embodiment of the present application provides an electronic device. The electronic device includes the power module provided in any one of the foregoing embodiments.

[0015] The encapsulation structure of the embodiment of the present application adds a first heat transfer member. The protective member can be connected to the heat dissipation member through the first heat transfer member to optimize the heat conduction performance between the protective member and the heat dissipation member, reduce the accumulation of heat in the encapsulation structure, thereby improving the heat dissipation performance of the power module, and at the same time enhancing the connection stability between the encapsulation structure and the heat dissipation member, and improving the reliability of the power module. The first heat transfer member can close the accommodation cavity while carrying the power device in the accommodation cavity, so as to facilitate the installation or disassembly of the encapsulation structure equipped with the power device as a whole to the heat dissipation member. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the following detailed description of the preferred embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. Moreover, in all the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0017] Figure 1 is a schematic structural diagram of an encapsulation structure according to some embodiments of the present application;

[0018] Figure 2 is a top view of an encapsulation structure according to some embodiments of the present application;

[0019] Figure 3 is Figure 2 a schematic cross-sectional view taken along line A-A of the shown encapsulation structure;

[0020] Figure 4 is Figure 1Schematic diagram of the connection between the protective component and the first heat transfer component in the shown encapsulation structure;

[0021] Figure 5 Schematic diagram of the structure of a power module according to some embodiments of the present application.

[0022] The reference numerals in the specific embodiments are as follows:

[0023] 100, protective component; 101, first mounting portion; 1011, third connection hole; 1012, first step surface; 1013, second step surface; 1014, lead-out hole; 1015, third step surface; 102, connecting portion; 103, second mounting portion; 1031, second connection hole; 1032, protection structure 111, first stop portion; 112, second stop portion;

[0024] 200, first heat transfer component; 201, first connection hole;

[0025] 300, second heat transfer component; 400, power device; 500, PCB board;

[0026] First direction Z; second direction X; third direction Y. Specific embodiments

[0027] The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to illustrate the technical solutions of the present application more clearly, so they are only examples and cannot be used to limit the protection scope of the present application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.

[0029] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0030] References to "embodiments" in this specification mean that the particular features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] In the description of the embodiments of the present application, the term "and / or" is merely a relationship describing the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this text generally represents an "or" relationship between the associated objects before and after.

[0032] In the description of the embodiments of the present application, the term "plural" refers to two or more (including two). Similarly, "multiple groups" refers to two or more groups (including two groups), and "multiple pieces" refers to two or more pieces (including two pieces).

[0033] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the embodiments of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the embodiments of the present application.

[0034] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated as a whole; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0035] A power module is a packaging unit that integrates multiple power electronic devices, their drive circuits, and protection circuits into one. This modular design helps to simplify the system layout and improve the system reliability, and is widely used in various electronic devices.

[0036] As a main component of the power module, the packaging structure directly affects the electrical performance, heat dissipation performance, and reliability of the power module. In related products, the packaging structure and the power device are respectively fixed on the heat sink to achieve the assembly of the power module. However, the stability of this assembly form needs to be improved. There is a probability that the relative displacement between the packaging structure and the power device may damage the power device, and the heat conduction performance between the packaging structure and the heat sink is poor.

[0037] To solve the problems of the prior art, the embodiments of the present application provide a packaging structure, a power module, and an electronic device. The packaging structure provided by the embodiments of the present application will be introduced first below.

[0038] In a first aspect, please refer to Figures 1 to 4 , the embodiments of the present application provide a packaging structure, which includes a protection member 100 and a first heat transfer member 200. The protection member 100 has a receiving cavity for accommodating a power device 400. The first heat transfer member 200 is detachably connected to the protection member 100, and the first heat transfer member 200 is used to carry the power device 400. Among them, the protection member 100 is connected to the heat sink through the first heat transfer member 200.

[0039] The first heat transfer member 200 and the protection member 100 can form an integral structure while protecting the power device 400, and can be more conveniently installed or disassembled to the heat sink for the assembly or disassembly of the power module, reducing the probability that the protection member 100 causes relative displacement relative to the power device 400 and damages the power device 400.

[0040] In the packaging structure, the thermal conductivity of the first heat transfer member 200 is greater than that of the protection member 100, so that the power device conducts heat to the heat sink through the first heat transfer member, accelerating the heat conduction between the packaging structure and the heat sink to improve the heat dissipation performance of the power module, reducing the heat accumulation in the receiving cavity, reducing the probability of thermal damage to the power device 400, and improving the reliability of the power module.

[0041] According to some embodiments of the present application, the protection member 100 includes a first mounting portion 101, a connecting portion 102, and a second mounting portion 103 that are sequentially connected in a first direction. The second mounting portion 103 is detachably connected to the first heat transfer member 200, and the second mounting portion 103 is provided with a positioning structure.

[0042] Optionally, please refer to Figure 1 , the connecting portion 102 is distributed along the circumferential side of the first mounting portion 101, and the first mounting portion 101 and the connecting portion 102 together form a receiving cavity with one end open.

[0043] Optionally, the protective member 100 further includes a reinforcing structure, and the reinforcing structure is connected to both the connecting portion 102 and the second mounting portion 103 at the same time to enhance the connection strength between the connecting portion 102 and the second mounting portion 103.

[0044] Optionally, the positioning structure is symmetrically distributed about the first heat transfer member 200 to balance the load applied by the second mounting portion 103 to the first heat transfer member 200. Exemplarily, the positioning structure includes a plurality of convex portions symmetrically distributed about the first heat transfer member, and the first heat transfer member is provided with a plurality of grooves for receiving the convex portions to achieve quick positioning and installation of the protective member to the first heat transfer member.

[0045] Thus, the protective member 100 covers and protects the power device 400 through the first mounting portion 101 and the connecting portion 102, and realizes detachable connection with the first heat transfer member 200 through the second mounting portion 103. The second mounting portion 103 is provided with a positioning structure to facilitate quick docking and installation of the protective member 100 with the first heat transfer member 200, and at the same time reduce the relative displacement that may occur between the protective member 100 and the first heat transfer member 200.

[0046] According to some embodiments of the present application, the positioning structure includes two first stop portions 111 spaced along the second direction. In the state where the protective member 100 is connected to the first heat transfer member 200, the two first stop portions 111 are respectively disposed on both sides of the first heat transfer member 200.

[0047] Optionally, the positioning structure further includes two second stop portions 112 spaced along the third direction. In the state where the protective member 100 is connected to the first heat transfer member 200, the two second stop portions 112 are respectively disposed on both sides of the first heat transfer member 200, and the second stop portions 112 can cooperate with the first stop portions 111 to achieve circumferential relative fixation between the first heat transfer member 200 and the protective member 100.

[0048] Thus, the docking difficulty between the protective member 100 and the first heat transfer member 200 is reduced, which helps the rapid assembly of the packaging structure.

[0049] According to some embodiments of the present application, in a plane perpendicular to the first direction, the orthographic projection of the first mounting portion 101 falls within the orthographic projection range of the first heat transfer member 200.

[0050] Optionally, in a plane perpendicular to the first direction, the orthographic projection of the first heat transfer member 200 falls within the orthographic projection of the second mounting portion 103. It should be noted that the orthographic projection of the first heat transfer member 200 falling within the orthographic projection of the second mounting portion 103 means that in a plane perpendicular to the first direction, the outermost boundary lines of the second mounting portion 103 are all located outside the outermost boundary lines of the first heat transfer member 200, so as to reduce the probability of interference between the first heat transfer member 200 and other components in the electronic device in the packaging structure.

[0051] Thus, the first heat transfer member 200 can enclose the accommodation cavity while carrying the power device 400, improving the connection stability between the protective member 100 and the heat dissipation member and increasing the heat conduction area between the protective member 100 and the first heat transfer member 200, thereby enhancing the heat dissipation performance.

[0052] According to some embodiments of the present application, the first heat transfer member 200 is provided with a first connection hole 201, and the protective member 100 is provided with a second connection hole 1031. The connecting member passes through the first connection hole 201 and the second connection hole 1031 at the same time to realize the relative fixation between the first heat transfer member 200 and the protective member 100.

[0053] Optionally, the second connection hole 1031 is opened in the second mounting portion 103.

[0054] Optionally, the connecting member is a pin.

[0055] Optionally, the connecting member includes a screw and a connecting cap. The first connection hole 201 and the second connection hole 1031 are coaxially arranged, and the aperture of the first connection hole 201 is smaller than the aperture of the second connection hole 1031. When the first heat transfer member 200 and the protective member 100 are relatively fixed, the screw is located in the first connection hole 201 and the connecting cap is located in the second connection hole 1031, and the end face of the connecting cap is flush with or lower than the surface of the second mounting portion 103.

[0056] Thus, it is convenient for the disassembly, assembly and fixation between the first heat transfer member 200 and the protective member 100 and quick positioning.

[0057] Please refer to Figure 5 , according to some embodiments of the present application, the protective member 100 is provided with a plurality of third connection holes 1011, and the encapsulation structure is connected to the PCB board 500 through the third connection holes 1011.

[0058] Optionally, the third connection hole 1011 is opened in the first mounting portion 101, and the third connection hole 1011 is a blind hole structure, so that the encapsulation structure can be respectively connected to the PCB board 500 and the heat dissipation member, reducing the assembly difficulty of the power module.

[0059] Optionally, the plurality of third connection holes 1011 are symmetrically distributed about the first mounting portion 101 to improve the connection stability between the first mounting portion 101 and the PCB board 500.

[0060] Thus, the encapsulation structure realizes the connection between the power device 400 and the PCB board 500 through the relative fixation between the protective member 100 and the PCB board 500, thereby realizing the electrical connection of the power module.

[0061] According to some embodiments of the present application, the first mounting portion 101 is provided with a plurality of first stepped surfaces 1012, and the plurality of first stepped surfaces 1012 are correspondingly arranged with the plurality of third connection holes 1011.

[0062] Optionally, the number of the first stepped surfaces 1012 is equal to that of the third connection holes 1011 and they are correspondingly arranged one by one.

[0063] Further optionally, the first stepped surfaces 1012 and the third connection holes 1011 are coaxially arranged.

[0064] Further optionally, the first mounting portion 101 is further provided with a second stepped surface 1013, and the second stepped surface 1013 is correspondingly arranged one by one with the first stepped surface 1012. Exemplarily, the second stepped surface 1013 is coaxially arranged above the first stepped surface 1012 in the first direction, and the radius of the second stepped surface 1013 is smaller than that of the first stepped surface 1012.

[0065] Thus, by providing the first stepped surface 1012, the PCB board 500 is spaced apart from the packaging structure, leaving an exposed space for the power device 400 to reduce the situation of poor contact with the PCB board 500 due to insufficient exposure of the power device 400.

[0066] According to some embodiments of the present application, the first mounting portion 101 is provided with a lead-out hole 1014, and the power device 400 in the accommodation cavity passes through the lead-out hole 1014 and is exposed outside the protective member 100 to achieve electrical connection of the power module.

[0067] Optionally, a plurality of lead-out holes 1014 are provided, and the plurality of lead-out holes 1014 are arranged in an array so that the power device 400 can present various exposed postures to adapt to different electrical connection forms. Exemplarily, the plurality of lead-out holes 1014 are arranged in a rectangular dot matrix or a circular dot matrix.

[0068] Optionally, the first mounting portion 101 is further provided with a plurality of third stepped surfaces 1015, the number of the third stepped surfaces 1015 is equal to that of the lead-out holes 1014 and they are correspondingly arranged one by one, and the third stepped surfaces 1015 and the lead-out holes 1014 are coaxially arranged to improve the circumferential fixing and protecting effect of the first mounting portion 101 on the power device 400.

[0069] Thus, the packaging structure exposes the power device 400 through the lead-out hole 1014 to achieve electrical connection of the power module.

[0070] According to some embodiments of the present application, the protective member 100 further includes a protection structure 1032, the protection structure 1032 is arranged on the side of the second mounting portion 103 facing away from the first heat transfer member 200, and the protection structure 1032 is arranged along the circumference of the second connection hole 1031.

[0071] Optionally, the protection structure 1032 is made of an insulating material to increase the creepage distance between the connecting member at the second connection hole 1031 and the connection terminal at the lead-out hole 1014, thereby improving the reliability of the power module.

[0072] Optionally, the protection structure 1032 semi-openly surrounds the second connection hole 1031, that is, the angle corresponding to the protection structure 1032 and the second connection hole 1031 is less than 360°, facilitating the loading and removal of the connecting member at the second connection hole 1031.

[0073] According to some embodiments of the present application, the encapsulation structure further includes a second heat transfer member 300. The second heat transfer member 300 is disposed above the first heat transfer member 200 along the first direction, and the first heat transfer member 200 bears the power device 400 through the second heat transfer member 300.

[0074] Optionally, the thermal conductivity of the second heat transfer member 300 is less than that of the first heat transfer member 200.

[0075] Optionally, the heat dissipation area of the second heat transfer member 300 is less than that of the first heat transfer member 200.

[0076] Optionally, the power device 400 is mounted on the first heat transfer member 200 through a double-sided copper-clad ceramic structure, and the second heat transfer member 300 is the copper layer on the side of the double-sided copper-clad ceramic structure away from the power device 400.

[0077] Further optionally, the second heat transfer member 300 is fixedly welded to the first heat transfer member 200.

[0078] Thus, hierarchical heat conduction of the power module is achieved through the first heat transfer member 200 and the second heat transfer member 300, which helps to quickly release the heat generated during the operation of the power device 400, reduce the probability of thermal failure of the power device 400, and improve the reliability of the power module.

[0079] In a second aspect, please refer to Figure 5 , an embodiment of the present application provides a power module. The power module includes a power device 400, a heat dissipation member, and the encapsulation structure provided in any one of the foregoing embodiments. Among them, the power device 400 is disposed on the first heat transfer member 200 along the first direction and is mounted in the accommodation cavity, and the encapsulation structure is connected to the heat dissipation member through the first heat transfer member 200. It can be understood that since the power module has the encapsulation structure provided in any one of the foregoing embodiments, the power module correspondingly has all the beneficial effects of the foregoing encapsulation structure.

[0080] Thirdly, an embodiment of the present application provides an electronic device, which includes the power module provided by any one of the embodiments of the second aspect. Therefore, the electronic device has all the beneficial effects of the foregoing power module. Specifically, the electronic device may be at least one of a wearable device, a camera, a mobile phone, a tablet computer, a television, a remote control, and an automotive terminal.

[0081] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered by the scope of the claims and the description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A packaging structure, characterized in that, Comprising: A protective member having a receiving cavity for accommodating a power device; A first heat transfer member detachably connected to the protective member, the first heat transfer member being used for carrying a power device; Wherein, the thermal conductivity of the first heat transfer member is greater than that of the protective member, and the packaging structure is connected to a heat sink through the first heat transfer member, so that the power device conducts heat to the heat sink through the first heat transfer member.

2. The encapsulation structure according to claim 1, wherein, The protective member includes a first mounting portion, a connecting portion, and a second mounting portion sequentially connected in a first direction. The second mounting portion is detachably connected to the first heat transfer member, and the second mounting portion is provided with a positioning structure.

3. The encapsulation structure according to claim 2, characterized in that The positioning structure includes two first stop portions and two second stop portions. The two first stop portions are disposed on both sides of the first heat transfer member along a second direction, and the two second stop portions are disposed on both sides of the first heat transfer member along a third direction.

4. The encapsulation structure according to claim 3, wherein On a plane perpendicular to the first direction, the orthographic projection of the first mounting portion falls within the orthographic projection of the first heat transfer member, and the orthographic projection of the first heat transfer member falls within the orthographic projection of the second mounting portion.

5. The encapsulation structure according to claim 2, wherein, The first mounting portion is provided with a plurality of third connection holes, the third connection holes are blind hole structures, and the first mounting portion is connected to a PCB board through the third connection holes. The plurality of third connection holes are symmetrically distributed about the first mounting portion.

6. The encapsulation structure according to claim 5, wherein The first mounting portion is provided with a plurality of first stepped surfaces, and the plurality of first stepped surfaces are arranged in one-to-one correspondence with the plurality of third connection holes. When the first mounting portion is connected to the PCB board, the first stepped surfaces are in abutting contact with the PCB board.

7. The encapsulation structure according to claim 1, wherein The first heat transfer member is provided with a first connection hole, and the protective member is provided with a second connection hole. The second connection hole and the first connection hole are coaxially arranged and the aperture of the second connection hole is larger than that of the first connection hole.

8. The encapsulation structure according to any one of claims 1 to 7, characterized in that, The packaging structure further includes a second heat transfer member. The second heat transfer member is disposed above the first heat transfer member along the first direction, and the second heat transfer member is fixedly welded to the first heat transfer member; wherein, the thermal conductivity of the second heat transfer member is less than that of the first heat transfer member, and / or, the heat dissipation area of the second heat transfer member is less than that of the first heat transfer member.

9. A power module, characterized in that, Comprising: The packaging structure according to any one of claims 1 to 8; A power device, the power device is disposed on the first heat transfer member along a first direction, and the power device is installed in the receiving cavity; A heat sink, the packaging structure is connected to the heat sink through the first heat transfer member.

10. An electronic device, characterized in that, Including the power module according to claim 9.

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