Packaging structure, display module and display device

Abstract

The utility model discloses a packaging structure, a display module and a display device. The packaging structure comprises a substrate, at least one light-emitting unit and at least one functional unit, the substrate is provided with a first surface; the light-emitting unit is used for responding to the first control signal to be turned on or turned off; the functional unit is used for responding to a second control signal to work; each functional unit is arranged on the first surface of the substrate through the corresponding first bonding conductive layer; each light-emitting unit is arranged on the first surface of the substrate through the corresponding second bonding conductive layer and the functional unit; or the light-emitting unit and the functional unit are stacked on the first surface of the substrate. The functional unit and the light-emitting unit are directly integrated in one packaging structure, and the non-light-emitting area on the substrate is fully utilized, so that the single packaging structure can realize functions except for light emitting.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and particularly relates to a packaging structure, a display module, and a display device. Background Art

[0002] Currently, with the improvement of the efficiency of light-emitting diode (LED) chips and the continuous reduction of their size, the area of the non-light-emitting region in a single pixel unit is getting larger and larger, and the area ratio of the LED chip in a pixel unit is even less than 1 / 10. In a display screen with a resolution of 2K or higher, there will be a larger area of non-light-emitting region. Summary of the Utility Model

[0003] The purpose of this application is to provide a packaging structure, a display module, and a display device, aiming to solve the problem that traditional pixel units have more useless non-light-emitting regions.

[0004] In the first aspect of the embodiment of this application, a packaging structure is provided, including: a substrate having a first surface; a light-emitting unit for lighting or extinguishing in response to a first control signal; a functional unit for operating in response to a second control signal; the functional unit is disposed on the first surface of the substrate through a corresponding first bonding conductive layer, and the light-emitting unit is disposed on the first surface of the substrate with the functional unit through a corresponding second bonding conductive layer; or the light-emitting unit and the functional unit are stacked on the first surface of the substrate.

[0005] In one embodiment, the light-emitting unit includes at least one LED chip, and the LED chip includes at least one of a red LED chip, a green LED chip, a blue LED chip, and other color LED chips; the functional unit includes at least one functional device; the LED chip is used to light or extinguish in response to a first control signal, and the functional device is used to operate in response to a second control signal.

[0006] In one embodiment, at least one of the functional devices includes a speaker for emitting a corresponding sound according to the second control signal.

[0007] In one embodiment, at least one of the functional devices includes a driving integrated circuit electrically connected to the light-emitting unit, and the driving integrated circuit is used to provide the first control signal to the light-emitting unit based on the operating voltage according to the second control signal.

[0008] In one embodiment, at least one of the functional devices includes one or more of an infrared sensor, a camera unit, a sound sensor, a temperature sensor, a humidity sensor, a light intensity sensor, and a gas sensor.

[0009] In one embodiment, the materials of the first bonding conductive layer and the second bonding conductive layer include conductive adhesive or conductive metal.

[0010] In one embodiment, it further includes a packaging layer for packaging the light-emitting unit and / or the functional unit.

[0011] The second aspect of the embodiments of the present application provides a display module, including at least one packaging structure as described above.

[0012] In one embodiment, between two adjacent packaging structures, the light-emitting unit of one packaging structure is arranged adjacent to the functional unit of the other packaging structure.

[0013] The third aspect of the embodiments of the present application provides a display device, including at least one display module as described above.

[0014] The beneficial effects of the embodiments of the present application compared with the prior art are as follows: By directly integrating the functional unit and the light-emitting unit in one packaging structure and making full use of the non-light-emitting area on the substrate, a single packaging structure can achieve functions other than light emission.

[0015] When the functional unit includes a speaker, corresponding sounds can be emitted according to the displayed image while the packaging structure emits light. When the packaging structure with a speaker is applied to a display screen, there is no need to open holes on the display screen for setting additional speakers / horns, thereby improving the user's sensory experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a top view of the packaging structure provided by an embodiment of the present application;

[0017] Figure 2 It is a front view of the packaging structure provided by an embodiment of the present application;

[0018] Figure 3 It is another top view of the packaging structure provided by an embodiment of the present application;

[0019] Figure 4 It is yet another top view of the packaging structure provided by an embodiment of the present application;

[0020] Figure 5 It is a schematic structural diagram of the light-emitting unit and the functional unit provided by an embodiment of the present application;

[0021] Figure 6 It is another schematic structural diagram of the light-emitting unit and the functional unit provided by an embodiment of the present application;

[0022] Figure 7Schematic structural diagram of a display module provided by an embodiment of the present application;

[0023] Figure 8 Another schematic structural diagram of a display module provided by an embodiment of the present application;

[0024] Figure 9 Yet another schematic structural diagram of a display module provided by an embodiment of the present application;

[0025] Figure 10 Yet another schematic structural diagram of a display module provided by an embodiment of the present application;

[0026] Figure 11 Schematic structural diagram of a display device provided by an embodiment of the present application. Detailed implementation manners

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0029] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0030] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0031] In recent years, with the continuous development of Mini / Micro LED (MLED) chip technology and the gradual reduction of the size of light-emitting chips, the integrated packaging technology (Chip on Board; COB) and discrete device technology (MLED in Package; MIP) are gradually becoming the mainstream packaging solutions for MLED applications in the field of large-size display devices. Since the above technologies eliminate the bracket and mask processes of traditional LED lamp beads, smaller pixel pitch and higher display brightness can be achieved.

[0032] In an LED integrated unit using COB or MIP, the size of the LED chips therein can be 250μm×250μm, and in a display using this LED integrated unit, the spacing between each LED chip can be 1250μm, and the area ratio of the LED chips is less than 1 / 10 of the entire pixel unit.

[0033] The non-light-emitting area mainly presents the superposition of the bottom substrate and the reflected light on the surface of the display screen visually. In a large number of cases, due to the uneven reflectivity of the bottom substrate, in a large-area display screen, the phenomenon of inconsistent reflection will occur. In a large number of literatures and patents, this phenomenon is described as the "ink color inconsistency" problem.

[0034] At the same time, as LED display screens are moving towards application scenarios where displays are everywhere, LED displays need to have more diverse interaction and sensing functions. For example, the commonly used touch function and the on-screen camera function. In the field of displays such as mobile phones, a front cut-out design is adopted, and the infrared sensing module and the camera are placed in the "notch" position of the mobile phone. However, this design separates the display area and the sensing area, affecting the perception effect of consumers. In order to make the sensor invisible, technologies such as under-screen cameras and under-screen fingerprint recognition have been developed. However, in order to achieve under-screen visible light sensing, a large number of design adjustments need to be made to the display unit, which is technically difficult and results in a considerable loss of image quality.

[0035] Figure 1 The top view of the packaging structure provided by an embodiment of the present application is shown. For the sake of convenience of description, only the parts related to this embodiment are shown and are described in detail as follows:

[0036] As Figures 1 to 3 shown, the packaging structure 10 includes: a substrate 100, a light-emitting unit 200, and a functional unit 300.

[0037] Among them, the light-emitting unit 200 is used to light up or go out in response to the first control signal. The functional unit 300 is used to work in response to the second control signal.

[0038] The substrate 100 has a first surface and a second surface opposite to the first surface.

[0039] The functional unit 300 is disposed on the first surface of the substrate 100 through the corresponding first bonding conductive layer 410.

[0040] The light-emitting unit 200 and the functional unit 300 are disposed on the first surface of the substrate 100 through the corresponding second bonding conductive layer 420. The functional unit 300 and the light-emitting unit 200 can be respectively disposed on the first surface of the substrate 100, and the specific arrangement manners of the functional unit 300 and the light-emitting unit 200 are not limited. For example, the two can be arranged side by side or staggered, can be adjacent and bonded, or can be spaced apart by a certain distance.

[0041] Alternatively, the light-emitting unit 200 and the functional unit 300 are stacked on the first surface of the substrate 100.

[0042] It can be understood that when the light-emitting unit 200 is lit in response to the first control signal, it can emit light of a corresponding color according to the requirements of the first control signal and its own light-emitting conditions.

[0043] Among them, both the first control signal and the second control signal can be electrical signals input from devices and circuits outside the encapsulation structure 10. The functional unit 300 can work in response to the second control signal to implement functions including sound generation, infrared sensing, touch feedback, etc.

[0044] In some embodiments, the second surface of the substrate 100 can be used to dispose a transmission circuit or to connect and fix to other substrates, conductive glass, and circuit boards. The transmission circuit can be connected to an external circuit to transmit electrical signals including the first control signal and the second control signal.

[0045] In the embodiment of the present application, by directly integrating the functional unit 300 and the light-emitting unit 200 in an encapsulation structure 10, a single encapsulation structure 10 can implement functions other than light emission, thereby making full use of the surface of the substrate 100 except for the surface of the light-emitting unit 200.

[0046] Since the present application utilizes the non-light-emitting area on the substrate 100, while ensuring the display effect, the surface space of the substrate 100 is fully utilized, and richer content and more effective real-time interaction can be provided for users.

[0047] It should be noted that the encapsulation structure 10 can adopt two encapsulation methods. One is the co-encapsulation method, in which the light-emitting unit 200 and the functional unit 300 are integrally connected to the substrate 100 through a single bonding process. The other is the individual bonding method, in which each light-emitting unit 200 and each functional unit 300 are individually bonded to the substrate 100 and then integrally encapsulated to form an encapsulation structure 10.

[0048] In some embodiments, the encapsulation structure 10 uses the MIP process to bond the light-emitting unit 200 and the functional unit 300 to the substrate 100.

[0049] In some embodiments, the encapsulation structure 10 is a thin-film encapsulation structure or an encapsulation glue structure. It can be understood that the thin-film encapsulation structure has a smaller volume, which is convenient for subsequent installation and use.

[0050] In one embodiment, as Figure 3 shown, the first surface of the functional unit 300 is disposed on the first surface of the substrate 100 through the corresponding first bonding conductive layer 410; the light-emitting unit 200 is disposed on the second surface of the functional unit 300 away from the substrate 100.

[0051] It can be understood that the light-emitting unit 200 and the functional unit 300 can be stacked to further reduce the space occupied on the first surface of the substrate 100.

[0052] In one embodiment, as Figure 4 shown, the functional unit 300 can also be disposed on the light-emitting unit 200. Specifically, it can be set according to the actual situation. For example, when the functional unit 300 is light-transmissive, the functional unit 300 can be disposed on the light-emitting unit 200, or when the functional unit 300 is disposed on the light-emitting unit 200, the functional unit 300 can leave a certain gap or be misaligned with the light-emitting unit 200 for light transmission.

[0053] In one embodiment, as Figure 5 shown, the light-emitting unit 200 includes at least one LED chip 210, and the functional unit 300 includes at least one functional device 310. The LED chip 210 is used to be lit or extinguished in response to the first control signal, and the functional device 310 is used to operate in response to the second control signal.

[0054] It can be understood that after the light-emitting unit 200 receives the first control signal, each LED chip 210 therein can be individually controlled. For example, only some of the LEDs are controlled to be lit, or the brightness of some of the LED chips 210 is controlled, so that the light-emitting unit 200 finally emits light of a color corresponding to the first control signal. The functional unit 300 can also individually control each functional device 310 therein according to the second control signal to achieve a certain function.

[0055] In one embodiment, a light-emitting unit 200 includes at least one of a red LED chip 211, a green LED chip 212, a blue LED chip 213, and other color LED chips. The red LED chip 211 is configured to emit red light, the green LED chip 212 is configured to emit green light, the blue LED chip 213 is configured to emit blue light, and the other color LED chips may be white LED chips, yellow LED chips, and so on.

[0056] It can be understood that a light-emitting unit 200 may include only one color of LED chips 210, or may include multiple colors of LED chips 210.

[0057] Exemplarily, as Figure 6 shown, a light-emitting unit 200 may include a red LED chip 211, a green LED chip 212, and a blue LED chip 213.

[0058] A red LED chip 211, a green LED chip 212, and a blue LED chip 213 are arranged on the substrate 100 along a first direction parallel to the first surface of the substrate 100. In theory, the light-emitting unit 200 can emit light of any color through the combination of the red LED chip 211, the green LED chip 212, and the blue LED chip 213.

[0059] In one embodiment, at least one functional device 310 includes a speaker, and the speaker is configured to emit corresponding sounds according to a second control signal.

[0060] When the functional unit 300 includes a speaker, corresponding sounds can be emitted according to the displayed image while the package structure 10 emits light. In the prior art, the speaker / horn is disposed on the back of the display screen. In order to clearly hear the sound on the front of the display screen, holes are often made in the display screen. However, when the package structure 10 provided with a speaker is applied to the display screen, there is no need to make holes in the display screen for setting the speaker / horn, thereby improving the user's sensory experience.

[0061] In one embodiment, at least one functional device 310 includes a driving integrated circuit (IC). The driving integrated circuit is electrically connected to the light-emitting unit 200, and the driving integrated circuit is configured to provide a first control signal to the light-emitting unit 200 based on a working voltage / working current according to a second control signal.

[0062] It can be understood that in this embodiment, the first control signal can be a driving voltage / current, the second control signal can be a data signal, and the driving integrated circuit can control the light-emitting unit 200 according to the second control signal. Since the driving integrated circuit is an essential functional device 310 of the light-emitting unit 200, by integrating the driving integrated circuit on the first surface of the substrate 100, it is possible to eliminate the need for an additional circuit board and space to arrange the driving integrated circuit, thereby realizing the miniaturization of the overall circuit.

[0063] In some embodiments, the light-emitting unit 200 and the driving integrated circuit are stacked to further reduce the space occupied on the first surface of the substrate 100.

[0064] In one embodiment, at least one functional device 310 includes one or more of an infrared sensor, a camera unit, a sound sensor, a temperature sensor, a humidity sensor, a light intensity sensor, and a gas sensor.

[0065] It can be understood that a functional unit 300 can include multiple different types of functional devices 310.

[0066] Infrared touch detection can be performed through the infrared sensor. When the packaging structure 10 using the infrared sensor is applied to a display screen, the display screen can collect touches through the infrared sensor, thereby realizing the touch operation of the display screen. Among them, the infrared sensor can be a Time of Flight (ToF) infrared sensor. In some embodiments, the second control signal is the voltage signal for driving the infrared sensor to work.

[0067] The camera unit can collect images in the corresponding direction and then generate and output corresponding video signals. When the packaging structure 10 using the camera unit is applied to a display screen, it can replace the front-mounted independent camera for shooting, thereby ensuring the integrity of the display screen and enhancing the user's sensory experience. Among them, the camera unit can specifically be a Charge-coupled Device (CCD) or a Complementary Metal-Oxide-Semiconductor (CMOS) sensor. In some embodiments, the second control signal is the voltage signal for driving the camera unit to work.

[0068] The sound sensor can collect sounds. When the packaging structure 10 using the sound sensor is applied to a display screen, it can replace the microphone to collect sounds around the display screen. In some embodiments, the second control signal is the voltage signal for driving the camera unit to work.

[0069] The temperature sensor can detect temperature. When the packaging structure 10 with a temperature sensor is applied to a display screen, the brightness, color, etc. of the light-emitting unit 200 can be controlled according to the ambient temperature and the temperature of the display screen. For example, the brightness of the light-emitting unit 200 can be reduced when the temperature of the packaging structure is too high, or the hue, brightness, etc. of the light-emitting unit 200 can be changed when the ambient temperature is low.

[0070] The humidity sensor can detect the humidity of the air. When the packaging structure 10 with a humidity sensor is applied to a display screen, the humidity of the air around the display screen can be monitored. In some embodiments, the second control signal is the voltage signal for driving the humidity sensor to work.

[0071] The light intensity sensor can sense the light intensity. When the packaging structure 10 with a light intensity sensor is applied to a display screen, the brightness of the display screen can be adjusted according to the light intensity (ambient brightness) in front of the display screen. For example, when the light intensity in front of the display screen is low, the brightness of the display screen can be reduced to protect eyesight in a dim environment.

[0072] The gas sensor can identify specified substances in the air. When the packaging structure 10 with a gas sensor is applied to a display screen, the air around the display screen can be monitored. When the air quality deteriorates and the concentration of a certain substance in the air increases, this situation can be detected in time by the gas sensor, so that timely responses can be made. In some embodiments, the second control signal is the voltage signal for driving the gas sensor to work.

[0073] In one embodiment, the materials of the first bonding conductive layer 410 and the second bonding conductive layer 420 include conductive glue or conductive metal.

[0074] It can be understood that the bonding processes that can be adopted include die bonding process, metal bonding process, and conductive glue process. The appropriate process can be selected according to actual needs to bond the light-emitting unit 200 and the functional unit 300. For example, the appropriate process can be selected according to the specific structure of the specific devices in the light-emitting unit 200 or the functional unit 300 and the requirements of the specific devices for bonding.

[0075] In one embodiment, the packaging structure 10 further includes a packaging layer for packaging the light-emitting unit 200 and / or the functional unit 300.

[0076] Specifically, the packaging layer can be packaging glue or packaging film. For example, after the packaging glue is coated and cured, the light-emitting unit 200 and / or the functional unit 300 can be wrapped, or the packaging film can be attached to the substrate 100 to wrap the light-emitting unit 200 and / or the functional unit 300. Among them, the main components of the packaging glue and the packaging film can be epoxy resin.

[0077] Encapsulation using an encapsulation film can reduce the volume of the overall encapsulation, facilitating the installation and use of the encapsulation structure 10 and improving practicability.

[0078] In some embodiments, the size of a single encapsulation structure 10 is 1 mm × 1 mm.

[0079] Figure 7 The schematic structural diagram of a display module provided by an embodiment of the present application is shown. For ease of illustration, only the parts related to this embodiment are shown and are described in detail as follows:

[0080] The display module 20 includes at least one encapsulation structure 10 as described in any of the above embodiments.

[0081] The display module 20 may include a plurality of encapsulation structures 10, and the encapsulation structures 10 are arranged in a certain array.

[0082] For example, the respective encapsulation structures 10 can be arranged in a rectangular array.

[0083] It can be understood that by separately controlling the light emitted by each encapsulation structure 10, the display module 20 can display corresponding images. The functional units 300 of the respective encapsulation structures 10 in a display module 20 can be different from each other, and the corresponding encapsulation structure 10 can be selected according to the functional requirements of the display module 20.

[0084] In one embodiment, the size of a single encapsulation structure 10 is 1 mm × 1 mm. The edge spacing between the encapsulation structure 10 and an adjacent encapsulation structure 10 or other devices is 0.8 mm, and the center spacing between two adjacent encapsulation structures 10 is 1.8 mm. It can be understood that a single encapsulation structure 10 can also be of other sizes, such as 0.25 mm × 0.25 mm, and the center spacing between two adjacent encapsulation structures 10 can also be of other sizes, such as 1.25 mm, and specific values are not limited.

[0085] In one embodiment, as Figure 8 shown, the display module 20 can also use the encapsulation structure 10 and traditional pixel units 30 in combination, such that there is at least one traditional pixel unit 30 between the encapsulation structures 10. By using the encapsulation structure 10 and traditional pixel units 30 in combination, the corresponding functions can be achieved by the encapsulation structure 10 while reducing the manufacturing cost.

[0086] In one embodiment, as Figure 9 shown, the light-emitting units 200 of the encapsulation structure 10 adopted by the display module 20 are all stacked with the corresponding functional units 300.

[0087] In one embodiment, asFigure 10 As shown, between two adjacent encapsulation structures 10, the light-emitting unit 200 of one encapsulation structure 10 is disposed adjacent to the functional unit 300 of the other encapsulation structure 10.

[0088] By disposing the light-emitting unit 200 and the functional unit 300 adjacent to each other, it is possible to ensure that the display module 20 emits light evenly, guarantee the display effect of the display module 20, and avoid the light-emitting unit 200 being too concentrated or sparse, which may affect the display effect.

[0089] Figure 11 The figure shows a schematic structural diagram of a display device provided by an embodiment of the present application. For the sake of convenience of description, only the parts related to this embodiment are shown and are described in detail as follows:

[0090] The display device 40 includes a frame 41 and at least one display module 20 as described in any of the above embodiments. The display module 20 is mounted on the frame 31, and the frame 41 is used to support each display module 20.

[0091] Exemplarily, as Figure 11 shown, the display device 40 includes four display modules 20, and the four display modules 20 are arranged in a cross shape.

[0092] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the above-mentioned functional units and modules are divided for illustration. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated units can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of mutual distinction and do not limit the protection scope of the present application. The specific working processes of the units and modules in the above system can refer to the corresponding processes in the foregoing method embodiments and will not be described herein again.

[0093] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0094] The foregoing embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An encapsulation structure, characterized in that, Comprising: A substrate having a first surface; A light-emitting unit configured to be lit or extinguished in response to a first control signal; A functional unit configured to operate in response to a second control signal; The functional unit is disposed on the first surface of the substrate through a corresponding first bonding conductive layer, and the light-emitting unit is disposed on the first surface of the substrate together with the functional unit through a corresponding second bonding conductive layer; Or the light-emitting unit and the functional unit are stacked on the first surface of the substrate.

2. The encapsulation structure according to claim 1, wherein The light-emitting unit includes at least one LED chip, and the LED chip includes at least one of a red LED chip, a green LED chip, a blue LED chip, a white light LED chip, and a yellow light LED chip; the functional unit includes at least one functional device; the LED chip is configured to be lit or extinguished in response to a first control signal, and the functional device is configured to operate in response to a second control signal.

3. The encapsulation structure according to claim 2, wherein At least one of the functional devices includes a speaker configured to emit a corresponding sound according to the second control signal.

4. The encapsulation structure according to claim 2 or 3, characterized in that, At least one of the functional devices includes a driving integrated circuit electrically connected to the light-emitting unit, and the driving integrated circuit is configured to provide the first control signal to the light-emitting unit based on a working voltage according to the second control signal.

5. The encapsulation structure according to claim 2 or 3, characterized in that, At least one of the functional devices includes one or more of an infrared sensor, a camera unit, a sound sensor, a temperature sensor, a humidity sensor, a light intensity sensor, and a gas sensor.

6. The encapsulation structure according to claim 2 or 3, characterized in that, The materials of the first bonding conductive layer and the second bonding conductive layer include conductive adhesive or conductive metal.

7. The encapsulation structure according to claim 1, wherein It further includes a packaging layer configured to package the light-emitting unit and / or the functional unit.

8. A display module, characterized in that, Comprising at least one packaging structure according to any one of claims 1 to 7.

9. The display module according to claim 8, wherein Between two adjacent packaging structures, the light-emitting unit of one packaging structure is disposed adjacent to the functional unit of the other packaging structure.

10. A display device, characterized in that, Comprising at least one display module according to claim 8 or 9.

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