BMS control system

Abstract

The utility model provides a BMS control system comprising a power supply processing module, an AFE module, an external ADC, an operational amplifier, an NTC temperature measurement module, an equalization module, and a DCDC power supply module. The power supply processing module comprises an MCU and an isolation communication module. The power supply processing module is connected with the power supply processing module; the AFE module is used for collecting battery voltage and current signals and communicating with the MCU, and the AFE module controls the multiplex switch through an I2C bus, is used for collecting voltage at the two ends of a multi-branch NTC, is used for measuring the temperature of stacked batteries and sends data to the MCU through the isolation transmitter; the equalization module is connected with the operational amplifier through a sampling resistor, and the operational amplifier is connected with the MCU through an external ADC. The wireless communication system is small in error, capable of achieving long-distance communication, high in RF anti-interference performance, high in sampling rate, high in stability, high in real-time performance and low in power consumption.

Description

Technical Field

[0001] The utility model belongs to the technical field of battery management, and particularly relates to a BMS control system. Background Art

[0002] In recent years, the strategic status of renewable energy represented by photovoltaic and wind power has become prominent. Energy storage, as a key technology to support the development of renewable energy, and electric vehicles have also developed rapidly. With the rapid development of electrochemical energy storage, the safety management of electric vehicles and power stations has become the focus of attention of all parties. The safety of electrochemical energy storage power stations has also been put on the agenda. From the national to the local level, a number of policies and standards have been introduced to strengthen the safety management of energy storage power stations. Among them, BMS, as the "brain" of the batteries in the energy storage power station, undertakes functions such as real-time monitoring of battery parameters, thermal management, balancing management, alarm reminder, etc. The existing BMS generally has disadvantages such as low accuracy in real-time acquisition of voltage, current, and temperature, and unstable operation under high-temperature conditions. Summary of the Invention

[0003] In view of this, the utility model aims to overcome the above deficiencies in the prior art. In view of the need in the prior art for a high degree of integration, the ability to detect battery signals in real time, high-precision measurement, safe and stable and efficient processing of battery data, a BMS control system is proposed.

[0004] To achieve the above object, the technical solution of the utility model is realized as follows:

[0005] A BMS control system includes a power processing module, an AFE module, an external ADC, an operational amplifier, an NTC temperature measurement module, a balancing module, and a DCDC power module;

[0006] The power processing module includes an MCU; the power processing module is connected to the DCDC power module;

[0007] The AFE module is used to collect battery voltage and current signals and communicate with the MUC. The AFE module controls a multiplexing switch through an I2C bus, is used to collect the voltages at both ends of multiple branches of NTCs, converts the voltage of the NTC into a digital signal through the ADC of the AFE module, is used to measure the temperature of stacked batteries, and sends the data to the MCU through an isolation transmitter. The AFE module is connected to a PWM drive module through a digital I2C bus, and controls the speed of a cooling fan through a PWM chip;

[0008] The balancing module is connected to the operational amplifier through a sampling resistor, and the operational amplifier is connected to the MCU through an external ADC.

[0009] Furthermore, the MCU further includes a crystal oscillator, a memory, and a reset circuit.

[0010] Further, the isolation transmitter is connected to the MCU through an analysis chip.

[0011] Further, the external ADC includes: resistor R28, reference power supply TL431, resistor R35, resistor R37, resistor R29, resistor R30, resistor R36, resistor R42, operational amplifier U16, capacitor C32, resistor R58, resistor R59, capacitor C34, capacitor C35, capacitor C36, capacitor C37, chip U20, resistor R102, resistor R106, resistor R111, chip U23, capacitor C39, resistor R126, resistor R131;

[0012] Pin 5 of operational amplifier U16 is connected to C32 and +5V, the other end of capacitor C32 is connected to the reference ground, pin 2 of operational amplifier U16 is connected to the reference ground, pin 3 of operational amplifier U16 is connected to one ends of resistors R37 and R35, the other end of resistor R37 is connected to the high end of the sampling resistor, the other end of the sampling resistor is connected to the reference ground of the whole system, the other end of resistor R37 is connected to pins 1 and 2 of reference power supply TL431, pins 1 and 2 of reference power supply TL431 are connected to one end of resistor R28, the other end of resistor R28 is connected to DC5V, pin 3 of operational amplifier U16 is connected to one ends of resistors R35 and R37, resistor R35 is connected to sampling resistor R29, the other end of resistor R36 is connected to the other end of sampling resistor R29, pin 4 of operational amplifier U16 is connected to resistors R36 and R42, pin 1 of operational amplifier U16 is connected to the other ends of resistors R59 and R42, the other end of resistor R59 is connected to capacitor C36, capacitor C35, and pin 4 of chip U20, the other end of capacitor C36 is connected to the reference ground, pin 9 of chip U20 is connected to pin 5 of chip U23 and one end of resistor R102, the other end of resistor R102 is connected to DC5V, pin 10 of U20 is connected to pin 6 of chip U23 and one end of resistor R106, the other end of resistor R106 is connected to DC5V, pin 1 of chip U20 is connected to the reference ground, pins 7 and 8 of chip U23 are connected to one end of resistor R111, the other end of resistor R111 is connected to DC5V, pin 3 of chip U23 is connected to pin 47 of chip U7 in the power processing module and one end of resistor R126, the other end of resistor R126 is connected to DC3.3V, pin 4 of chip U23 is connected to pin 48 of chip U7 in the power processing module and one end of resistor R131, the other end of resistor R131 is connected to DC3.3V.

[0013] Further, the power supply processing module includes: STM32F103 chip U7, RS485 isolation module U5, CAN isolation module U10, capacitor C8, transient suppression diode D1, transient suppression diode D2, transient suppression diode D3, capacitor C18, resistor R24, common mode inductor FL1, terminal J21, capacitor C25, common mode inductor FL3, resistor R47, resistor R48, transient suppression diode D4, transient suppression diode D5, transient suppression diode D6, terminal J22, STM32F103 chip U7;

[0014] The USART1_TX transmission 68 pin of STM32F103 chip U7 is connected to the TX transmission 3 pin of RS485 isolation module U5, the USART1_RX reception 69 pin of STM32F103 chip U7 is connected to the RX reception 4 pin of RS485 isolation module U5, the PA8 pin 67 of STM32F103 chip U7 is connected to the CON control pin 5 of RS485 isolation module U5, the 1 pin of RS485 isolation module U5 is connected to capacitor C8 and then to +3.3V, the other end of capacitor C8 is connected to the reference ground, the 2 pin of RS485 isolation module U5 is connected to the reference ground, the 8 pin of RS485 isolation module U5 is connected to one end of transient suppression diode D3 and the 1 pin of common mode inductor FL1, the 2 pin of common mode inductor FL1 is connected to the 2 of terminal J21, the 9 pin of RS485 isolation module U5 is connected to the other end of transient suppression diode D3, one end of transient suppression diode D2 and the 3 pin of common mode inductor FL1, the 3 pin of common mode inductor FL1 is connected to the 1 pin of terminal J21, the 10 pin of RS485 isolation module U5 is connected to capacitor C18 and resistor R24, and the other ends of capacitor C18 and resistor R24 are connected to the housing. The USART3_TX transmission 55 pin of STM32F103 chip U7 is connected to the 4 transmission pin of CAN isolation module U10, the USART3_RX reception 56 pin of STM32F103 chip U7 is connected to the 3 reception pin of U10, the 6 pin of CAN isolation module U10 is connected to the 1 pin of common mode inductor FL3, the 2 pin of common mode inductor FL3 is connected to resistor R47, the other end of resistor R47 is connected to transient suppression diode D4, transient suppression diode D5, and the 1 pin of port J22. The 7 pin of CAN isolation module U10 is connected to the 3 pin of common mode inductor FL3, the 4 pin of common mode inductor FL3 is connected to resistor R48, the other end of resistor R48 is connected to transient suppression diode D5, transient suppression diode D6, and the 2 pin of port J22. The 8 pin of CAN isolation module U10 is connected to transient suppression diode D4 and transient suppression diode D6 and then to the housing.

[0015] Further, the AFE module includes an LTC6813 acquisition chip U29, a resistor R220, a capacitor C78, a capacitor C80, a resistor R229, a resistor R203, a capacitor C82, a diode D12, a resistor R200, a capacitor C65, a capacitor C66, a resistor R189, a resistor R201, a resistor R191, and a triode Q35;

[0016] The 38th pin of the LTC6813 acquisition chip U29 is connected to the reference ground. The 36th pin C1 of the LTC6813 acquisition chip U29 is connected to the capacitor C57 and the resistor R172. The 34th pin C2 of the LTC6813 acquisition chip U29 is connected to the capacitor C58 and the resistor R173. The 32nd pin C3 of the LTC6813 acquisition chip U29 is connected to the capacitor C59 and the resistor R173. The 30th pin C4 of the LTC6813 acquisition chip U29 is connected to the capacitor C60 and the resistor R178. The 28th pin C5 of the LTC6813 acquisition chip U29 is connected to the capacitor C61 and the resistor R180. The 26th pin C6 of the LTC6813 acquisition chip U29 is connected to the capacitor C62 and the resistor R182. The 24th pin C7 of the LTC6813 acquisition chip U29 is connected to the capacitor C63 and the resistor R184. The 22nd pin C8 of the LTC6813 acquisition chip U29 is connected to the capacitor C64 and the resistor R186. The 20th pin C9 of the LTC6813 acquisition chip U29 is connected to the capacitor C69 and the resistor R206. The 18th pin C10 of the LTC6813 acquisition chip U29 is connected to the capacitor C70 and the resistor R208. The 16th pin C11 of the LTC6813 acquisition chip U29 is connected to the capacitor C71 and the resistor R210. The 14th pin C12 of the LTC6813 acquisition chip U29 is connected to the capacitor C72 and the resistor R212. The 12th pin C13 of the LTC6813 acquisition chip U29 is connected to the capacitor C73 and the resistor R214. The 10th pin C14 of the LTC6813 acquisition chip U29 is connected to the capacitor C74 and the resistor R216. The 8th pin C15 of the LTC6813 acquisition chip U29 is connected to the capacitor C75 and the resistor R218. The 6th pin C16 of the LTC6813 acquisition chip U29 is connected to the capacitor C76 and the resistor R204.

[0017] Further, the equalization module includes: transistor Q19, transistor Q20, transistor Q21, transistor Q22, transistor Q23, transistor Q24, transistor Q25, transistor Q26, transistor Q27, transistor Q28, transistor Q29, transistor Q30, transistor Q31, transistor Q32, transistor Q33, transistor Q34, resistor R172, resistor R176, resistor R192, resistor R188, resistor R173, resistor R174, resistor R190, resistor R175, resistor R177, resistor R193, resistor R178, resistor R179, resistor R194, resistor R180, resistor R181, resistor R195, resistor R182, resistor R183, resistor R196, resistor R184, resistor R185, resistor R197, resistor R206, resistor R207, resistor R222, resistor R208, resistor R209, resistor R223, resistor R210, resistor R211, resistor R224, resistor R212, resistor R213, resistor R225, resistor R214, resistor R215, resistor R226, resistor R216, resistor R217, resistor R227, resistor R218, resistor R219, resistor R228, resistor R204, resistor R205, resistor R221, capacitor C57, capacitor C67, capacitor C58, capacitor C59, capacitor C60, capacitor C61, capacitor C62, capacitor C63, capacitor C64, capacitor C69, capacitor C70, capacitor C71, capacitor C72, capacitor C73, capacitor C74, capacitor C75, capacitor C76;

[0018] The 37th pin S1 of the LTC6813 acquisition chip U29 is connected to the resistor R176, the 35th pin S2 of the LTC6813 acquisition chip U29 is connected to the resistor R174, the 33rd pin S3 of the LTC6813 acquisition chip U29 is connected to the resistor R177, the 31st pin S4 of the LTC6813 acquisition chip U29 is connected to the resistor R179, the 29th pin S5 of the LTC6813 acquisition chip U29 is connected to the resistor R181, the 27th pin S6 of the LTC6813 acquisition chip U29 is connected to the resistor R183, the 25th pin S7 of the LTC6813 acquisition chip U29 is connected to the resistor R184, the 23rd pin S8 of the LTC6813 acquisition chip U29 is connected to the resistor R187, the 21st pin S9 of the LTC6813 acquisition chip U29 is connected to the resistor R207, the 19th pin S10 of the LTC6813 acquisition chip U29 is connected to the resistor R209, the 17th pin S11 of the LTC6813 acquisition chip U29 is connected to the resistor R211, the 15th pin S12 of the LTC6813 acquisition chip U29 is connected to the resistor R213, the 13th pin S13 of the LTC6813 acquisition chip U29 is connected to the resistor R215, the 11th pin S14 of the LTC6813 acquisition chip U29 is connected to the resistor R217, the 9th pin S15 of the LTC6813 acquisition chip U29 is connected to the resistor R219, and the 7th pin S16 of the LTC6813 acquisition chip U29 is connected to the resistor R205.

[0019] Further, the NTC temperature measurement module includes: NTC1, NTC2, NTC3, NTC4, NTC5, NTC6, NTC7, NTC8, NTC9, NTC10, NTC11, NTC12, NTC13, NTC14, NTC_R15, NTC16, resistor R150, resistor R151, resistor R153, resistor R156, resistor R157, resistor R158, resistor R159, resistor R161, resistor R162, resistor R163, resistor R164, resistor R166, resistor R167, resistor R168, resistor R169, resistor R7, resistor R11, capacitor C15, capacitor C16, capacitor C17, capacitor C20, resistor R25, ADG728 analog switch U3, ADG728 analog switch U4, TLV333 operational amplifier U6;

[0020] Resistors R150, R151, R152, R153, R156, R157, R158, R159, R161, R162, R163, R164, R166, R167, R168, R169 are connected to pin 50 of the LTC6813 acquisition chip U29. The other end of resistor R150 is connected to NTC1 and pin 4 of analog switch ADG728 U3. The other end of resistor R151 is connected to NTC2 and pin 5 of analog switch ADG728 U3. The other end of resistor R152 is connected to NTC3 and pin 6 of analog switch ADG728 U3. The other end of resistor R153 is connected to NTC4 and pin 7 of analog switch ADG728 U3. The other end of resistor R156 is connected to NTC5 and pin 12 of analog switch ADG728 U3. The other end of resistor R157 is connected to NTC6 and pin 11 of analog switch ADG728 U3. The other end of resistor R158 is connected to NTC7 and pin 10 of analog switch ADG728 U3. The other end of resistor R159 is connected to NTC8 and pin 9 of analog switch ADG728 U3. The other end of resistor R161 is connected to NTC9 and pin 4 of analog switch ADG728 U4. The other end of resistor R162 is connected to NTC10 and pin 5 of analog switch ADG728 U4. The other end of resistor R163 is connected to NTC11 and pin 6 of analog switch ADG728 U4. The other end of resistor R164 is connected to NTC12 and pin 7 of analog switch ADG728 U4. The other end of resistor R166 is connected to NTC13 and pin 12 of analog switch ADG728 U4. The other end of resistor R167 is connected to NTC14 and pin 11 of analog switch ADG728 U4. The other end of resistor R168 is connected to NTC15 and pin 10 of analog switch ADG728 U4. The other end of resistor R169 is connected to NTC16 and pin 9 of analog switch ADG728 U4.

[0021] Pin 13 of the ADG728 analog switch U3 and capacitor C15 are connected to +5V, the other end of capacitor C15 is connected to the reference ground, pins 14 and 16 of the ADG728 analog switch U3 are connected to the reference ground, pins 2 and 15 of the ADG728 analog switch U3 are connected to +5V, pin 13 of the ADG728 analog switch U4 and capacitor C16 are connected to +5V, the other end of capacitor C16 is connected to the reference ground, pins 14 and 16 of the ADG728 analog switch U4 are connected to the reference ground, pins 2 and 15 of the ADG728 analog switch U4 are connected to +5V, pin 1 of the ADG728 analog switch U3 is connected to pin 1 of the ADG728 analog switch U4, resistor R11, and pin 43 of the LTC6813 acquisition chip U29, the other end of resistor R11 is connected to +3.3V, pin 3 of the ADG728 analog switch U3 is connected to pin 3 of the ADG728 analog switch U4, resistor R7, and pin 42 of the LTC6813 acquisition chip U29, the other end of resistor R7 is connected to +3.3V, pin 8 of the ADG728 analog switch U3 is connected to pin 8 of the ADG728 analog switch U4 and pin 3 of the TLV333 operational amplifier U6, pin 4 of the TLV333 operational amplifier U6 is connected to pin 1 and resistor R25, the other end of R25 is connected to capacitor C20 and pin 39 of the LTC6813 acquisition chip U29, the other end of capacitor C20 is connected to the reference ground, pin 5 of the TLV333 operational amplifier U6 and capacitor C17 are connected to +5V, the other end of capacitor C17 is connected to the reference ground, and pin 2 of the TLV333 operational amplifier U6 is connected to the reference ground.

[0022] Further, the isolation transmitter module includes: HM2100NLT transmitter TR1, resistor R12, resistor R13, resistor R22, resistor R23, capacitor C43, capacitor C44, capacitor C84, capacitor C22, capacitor C83, capacitor C42, port J18;

[0023] Pin 1 of the HM2100NLT transmitter TR1 is connected to pin 64 of the acquisition chip U29 of the LTC6813 through resistor R12, capacitor C43. The other end of resistor R12 is connected to resistor R13, capacitor C84, and capacitor C44. The other end of capacitor C44 is connected to the reference ground. Pin 2 of the HM2100NLT transmitter TR1 is connected to pin 63 of the acquisition chip U29 of the LTC6813 through resistor R13, capacitor 44. Pin 4 of the HM2100NLT transmitter TR1 is connected to pin 62 of the acquisition chip U29 of the LTC6813 through resistor R22, capacitor C22. The other end of resistor R22 is connected to resistor R23, capacitor C83, and capacitor C42. The other end of capacitor C83 is connected to the reference ground. Pin 5 of the HM2100NLT transmitter TR1 is connected to pin 61 of the acquisition chip U29 of the LTC6813 through resistor R23, capacitor 42. Pin 6 of the HM2100NLT transmitter TR1 is connected to pin 1 of port J18. Pin 7 of the HM2100NLT transmitter TR1 is connected to pin 3 of port J18. Pin 9 of the HM2100NLT transmitter TR1 is connected to pin 4 of port J18. Pin 10 of the HM2100NLT transmitter TR1 is connected to pin 2 of port J18.

[0024] Further, the PWM drive module includes: resistor R26, resistor R27, capacitor C87, diode D11, resistor R160, resistor R165, field effect transistor Q18, GP7101 chip U31, fan FAN, and terminal J20;

[0025] Pin 8 of the GP7101 chip U31 is connected to C87 and +3.3V. Pin 6 of the GP7101 chip U31 is connected to resistor R160. The other end of resistor R160 is connected to the connection of field effect transistor Q18 and resistor R165. The other end of resistor R165 is connected to the reference ground. Pin 3 of field effect transistor Q18 is connected to the anode of diode D11, pin 2 of fan FAN, and pin 2 of port J20. Pin 1 of fan FAN, pins 3 and 4 of port J20 are connected to +24V. Pin 1 of port J20 is connected to the reference ground.

[0026] Pin 1 of the GP7101 chip U31 is connected to resistor R27 and pin 18 of chip U7. Pin 2 of the GP7101 chip U31 is connected to resistor R26 and pin 33 of chip U7.

[0027] Compared with the prior art, the BMS control system of the present invention has the following advantages:

[0028] The BMS control system of the present invention has small error, can achieve long-distance communication, has strong RF anti-interference performance, high sampling rate, high stability, strong real-time performance, and low self-power consumption. Description of the Drawings

[0029] The accompanying drawings, which form a part of the present utility model, are used to provide a further understanding of the present utility model. The schematic embodiments and descriptions thereof of the present utility model are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0030] Figure 1 is a schematic control structure diagram of the BMS control system of the present utility model;

[0031] Figure 2 is a schematic circuit diagram of the AFE module of the BMS control system of the present utility model;

[0032] Figure 3 is a schematic circuit diagram of the equalization module of the BMS control system of the present utility model;

[0033] Figure 4 is a schematic circuit diagram of the PWM drive module of the BMS control system of the present utility model;

[0034] Figure 5 is a schematic circuit diagram of the isolation transmitter module circuit of the BMS control system of the present utility model;

[0035] Figure 6 is a schematic circuit diagram of the parsing chip module of the BMS control system of the present utility model;

[0036] Figure 7 is a schematic circuit diagram of the power processing module of the BMS control system of the present utility model;

[0037] Figure 8 is a schematic circuit diagram of the external ADC of the BMS control system of the present utility model;

[0038] Figure 9 is a schematic circuit diagram of the NTC temperature measurement circuit of the BMS control system proposed by the present utility model. Specific embodiments

[0039] It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0040] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more.

[0041] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication between two elements inside. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.

[0042] The present utility model will be described in detail below with reference to the drawings and in conjunction with embodiments.

[0043] As Figure 1 shown, the present utility model provides a BMS control system, including a power processing module, an AFE module, an external ADC, an operational amplifier, an NTC temperature measurement module, an equalization module, and a DCDC power module;

[0044] The power processing module includes an MCU; the power processing module is connected to the DCDC power module;

[0045] The AFE module is used to collect battery voltage and current signals, communicate with the MUC. The AFE module controls a multiplexing switch through an I2C bus, is used to collect the voltages at both ends of multiple branches of NTCs, converts the voltage of the NTC into a digital signal through the ADC of the AFE module, is used to measure the temperature of stacked batteries, and sends the data to the MCU through an isolation transmitter. The AFE module is connected to a PWM drive module through a digital I2C bus, and drives and controls the speed of a cooling fan through a PWM chip;

[0046] The equalization module is connected to the operational amplifier through a sampling resistor, and the operational amplifier is connected to the MCU through an external ADC.

[0047] As Figure 8 shown, the external ADC includes: resistor R28, reference power supply TL431, resistor R35, resistor R37, resistor R29, resistor R36, resistor R42, OPA333 operational amplifier U16, capacitor C32, resistor R58, resistor R59, capacitor C34, capacitor C35, capacitor C36, ADS1115 chip U20, capacitor C37, resistor R102, resistor R106, resistor R111, resistor R26, resistor R131, PCA9306 chip U23, and capacitor C39. Pin 5 of the OPA333 operational amplifier U16 is connected to C32 and +5V, the other end of C32 is connected to the reference ground, pin 2 of the OPA333 operational amplifier U16 is connected to the reference ground, pin 3 of the OPA333 operational amplifier U16 is connected to one end of resistors R35 and R37, the other end of R35 is connected to the high end of the R29 sampling resistor, the other end of the R29 sampling resistor is connected to resistor R36, the other end of R37 is connected to pins 1 and 2 of the TL431 reference power supply U9 and R58, pins 1 and 2 of the TL431 reference power supply U9 are connected to one end of resistor R28, and the other end of R28 is connected to DC5V. Pin 3 of the OPA333 operational amplifier U16 is connected to one end of R35 and R37. Pin 1 of the PA333 operational amplifier U16 is connected to resistors R42 and R59, the other end of R59 is connected to pin 4 of the ADS1115 chip U20 and one end of C35 and C36, and the other end of C36 is connected to the reference ground. Pin 9 of the ADS1115 chip U20 is connected to pin 5 of the PCA9306 chip U23 and one end of R102, the other end of R102 is connected to DC5V, pin 10 of the ADS1115 chip U20 is connected to pin 6 of the PCA9306 chip U23 and one end of R106, the other end of R106 is connected to DC5V, pin 1 of the ADS1115 chip U20 is connected to the reference ground, pins 7 and 8 of the PCA9306 chip U23 are connected to one end of R111, the other end of R111 is connected to DC5V, pin 3 of the PCA9306 chip U23 is connected to pin 47 of the STM32F103 chip U7 and one end of R126, and the other end of R126 is connected to DC3.3V. Pin 4 of the PCA9306 chip U23 is connected to pin 48 of the STM32F103 chip U7 and one end of R131, and the other end of R131 is connected to DC3.3V

[0048] As Figure 7As shown in the figure, the communication processing module includes: STM32F103 chip U7, RS485 isolation module U5, CAN isolation module U10, capacitor C8, transient suppression diode D1, transient suppression diode D2, transient suppression diode D3, capacitor C18, resistor R24, common mode inductor FL1, terminal J21, capacitor C23, common mode inductor FL3, resistor R47, resistor R48, transient suppression diode D4, transient suppression diode D5, transient suppression diode D6, terminal J22. The USART1_TX transmission pin 68 of STM32F103 chip U7 is connected to the TX transmission pin 3 of RS485 isolation module U5, the USART1_RX reception pin 69 of STM32F103 chip U7 is connected to the RX reception pin 4 of RS485 isolation module U5, the PA11 pin 70 of STM32F103 chip U7 is connected to the CON control pin 5 of RS485 isolation module U5, the pin 1 of RS485 isolation module U5 is connected to capacitor C8 and then to +3.3V, the other end of capacitor C8 is connected to the reference ground, the pin 2 of RS485 isolation module U5 is connected to the reference ground, the pin 8 of RS485 isolation module U5 is connected to transient suppression diode D1, transient suppression diode D3, and the pin 1 of common mode inductor FL1, the pin 2 of common mode inductor FL1 is connected to the pin 2 of terminal J21, the pin 9 of RS485 isolation module U5 is connected to transient suppression diode D2, transient suppression diode D3, and the pin 3 of common mode inductor FL1, the pin 3 of common mode inductor FL1 is connected to the pin 1 of terminal J21, the pin 10 of RS485 isolation module U5 is connected to capacitor C18 and resistor R24, and the other ends of capacitor C18 and resistor R24 are connected to the housing. The USART1_TX transmission pin 55 of STM32F103 chip U7 is connected to the transmission pin 4 of CAN isolation module U10, the USART3_RX reception pin 56 of STM32F103 chip U7 is connected to the reception pin 3 of CAN isolation module U10, the pin 6 of CAN isolation module U10 is connected to the pin 1 of common mode inductor FL3, the pin 2 of common mode inductor FL3 is connected to resistor R47, the other end of resistor R47 is connected to transient suppression diode D4, transient suppression diode D5, and the pin 1 of port J22, the pin 7 of CAN isolation module U10 is connected to the pin 3 of common mode inductor FL3, the pin 4 of common mode inductor FL3 is connected to resistor R48, the other end of resistor R48 is connected to transient suppression diode D5, transient suppression diode D6, and the pin 1 of port J22, and the pin 8 of CAN isolation module U10 is connected to transient suppression diode D4 and transient suppression diode D6 and then to the housing.

[0049] As Figure 2The shown AFE module includes the LTC6813 acquisition chip U29, resistor R220, capacitor C78, capacitor C80, resistor R229, resistor R203, capacitor C82, diode D12, resistor R200, capacitor C65, capacitor C66, resistor R189, resistor R201, resistor R191, and triode Q35.

[0050] Pin 38 of the LTC6813 acquisition chip U29 is connected to the reference ground. Pin C1 of the LTC6813 acquisition chip U29 is connected to capacitor C57 and resistor R172. Pin C2 of the LTC6813 acquisition chip U29 is connected to capacitor C58 and resistor R173. Pin C3 of the LTC6813 acquisition chip U29 is connected to capacitor C59 and resistor R173. Pin C4 of the LTC6813 acquisition chip U29 is connected to capacitor C60 and resistor R178. Pin C5 of the LTC6813 acquisition chip U29 is connected to capacitor C61 and resistor R180. Pin C6 of the LTC6813 acquisition chip U29 is connected to capacitor C62 and resistor R182. Pin C7 of the LTC6813 acquisition chip U29 is connected to capacitor C63 and resistor R184. Pin C8 of the LTC6813 acquisition chip U29 is connected to capacitor C64 and resistor R186. Pin C9 of the LTC6813 acquisition chip U29 is connected to capacitor C69 and resistor R206. Pin C10 of the LTC6813 acquisition chip U29 is connected to capacitor C70 and resistor R208. Pin C11 of the LTC6813 acquisition chip U29 is connected to capacitor C71 and resistor R210. Pin C12 of the LTC6813 acquisition chip U29 is connected to capacitor C72 and resistor R212. Pin C13 of the LTC6813 acquisition chip U29 is connected to capacitor C73 and resistor R214. Pin C14 of the LTC6813 acquisition chip U29 is connected to capacitor C74 and resistor R216. Pin C15 of the LTC6813 acquisition chip U29 is connected to capacitor C75 and resistor R218. Pin C16 of the LTC6813 acquisition chip U29 is connected to capacitor C76 and resistor R204.

[0051] Figure 3The equalization module shown includes: transistor Q19, transistor Q20, transistor Q21, transistor Q22, transistor Q23, transistor Q24, transistor Q25, transistor Q26, transistor Q27, transistor Q28, transistor Q29, transistor Q30, transistor Q31, transistor Q32, transistor Q33, transistor Q34, resistor R172, resistor R176, resistor R188, resistor R192, resistor R173, resistor R174, resistor R190, resistor R175, resistor R177, resistor R193, resistor R178, resistor R179, resistor R194, resistor R180, resistor R181, resistor R195, resistor R182, resistor R183, resistor R196, resistor R184, resistor R185, resistor R197, resistor R206, resistor R207, resistor R222, resistor R208, resistor R209, resistor R223, resistor R210, resistor R211, resistor R224, resistor R212, resistor R213, resistor R225, resistor R214, resistor R215, resistor R226, resistor R216, resistor R217, resistor R227, resistor R218, resistor R219, resistor R228, resistor R204, resistor R205, resistor R221, capacitor C57, capacitor C67, capacitor C58, capacitor C59, capacitor C60, capacitor C61, capacitor C62, capacitor C63, capacitor C64, capacitor C69, capacitor C70, capacitor C71, capacitor C72, capacitor C73, capacitor C74, capacitor C75, capacitor C76.

[0052] The 37th pin S1 of the LTC6813 acquisition chip U29 is connected to the resistor R176, the 35th pin S2 of the LTC6813 acquisition chip U29 is connected to the resistor R174, the 33rd pin S3 of the LTC6813 acquisition chip U29 is connected to the resistor R177, the 31st pin S4 of the LTC6813 acquisition chip U29 is connected to the resistor R179, the 29th pin S5 of the LTC6813 acquisition chip U29 is connected to the resistor R181, the 27th pin S6 of the LTC6813 acquisition chip U29 is connected to the resistor R183, the 25th pin S7 of the LTC6813 acquisition chip U29 is connected to the resistor R184, the 23rd pin S8 of the LTC6813 acquisition chip U29 is connected to the resistor R187, the 21st pin S9 of the LTC6813 acquisition chip U29 is connected to the resistor R207, the 19th pin S10 of the LTC6813 acquisition chip U29 is connected to the resistor R209, the 17th pin S11 of the LTC6813 acquisition chip U29 is connected to the resistor R211, the 15th pin S12 of the LTC6813 acquisition chip U29 is connected to the resistor R213, the 13th pin S13 of the LTC6813 acquisition chip U29 is connected to the resistor R215, the 11th pin S14 of the LTC6813 acquisition chip U29 is connected to the resistor R217, the 9th pin S15 of the LTC6813 acquisition chip U29 is connected to the resistor R219, and the 7th pin S16 of the LTC6813 acquisition chip U29 is connected to the resistor R205.

[0053] As Figure 4 shown, the PWM drive module includes: resistor R26, resistor R27, capacitor C87, diode D11, resistor R160, resistor R165, field effect transistor Q18, GP7101 chip U31, fan FAN, and terminal J20.

[0054] The 8th pin of the GP7101 chip U31 and C87 are connected to +3.3V. The 6th pin of the GP7101 chip U31 is connected to the resistor R160. The other end of the resistor R160 is connected to the field effect transistor Q18 and the resistor R165. The other end of the resistor R165 is connected to the reference ground. The 3rd pin of the field effect transistor Q18 is connected to the anode of the diode D11, the 2nd pin of the fan FAN, and the 2nd pin of the port J20. The 1st pin of the fan FAN, the 3rd and 4th pins of the port J20 are connected to +24V. The 1st pin of the port J20 is connected to the reference ground. The 1st pin of the GP7101 chip U31 and the resistor R27 are connected to the 18th pin of the STM32F103 chip U7. The 2nd pin of the GP7101 chip U31 and the resistor R26 are connected to the 33rd pin of the STM32F103 chip U7.

[0055] As Figure 5The shown transmitter module includes: HM2100NLT transmitter TR1, resistor R12, resistor R13, resistor R22, resistor R23, capacitor C43, capacitor C44, capacitor C84, capacitor C22, capacitor C83, capacitor C42, and port J18.

[0056] Pin 1 of HM2100NLT transmitter TR1 is connected to resistor R12, capacitor C43, and pin 64 of LTC6813 acquisition chip U29. The other end of resistor R12 is connected to resistor R13, capacitor C84, and capacitor C44. The other end of capacitor C44 is connected to the reference ground. Pin 2 of HM2100NLT transmitter TR1 is connected to resistor R13, capacitor 44, and pin 63 of LTC6813 acquisition chip U29. Pin 4 of HM2100NLT transmitter TR1 is connected to resistor R22, capacitor C22, and pin 62 of LTC6813 acquisition chip U29. The other end of resistor R22 is connected to resistor R23, capacitor C83, and capacitor C42. The other end of capacitor C83 is connected to the reference ground. Pin 5 of HM2100NLT transmitter TR1 is connected to resistor R23, capacitor 42, and pin 61 of LTC6813 acquisition chip U29. Pin 6 of HM2100NLT transmitter TR1 is connected to pin 1 of port J18. Pin 7 of HM2100NLT transmitter TR1 is connected to pin 3 of port J18. Pin 9 of HM2100NLT transmitter TR1 is connected to pin 4 of port J18. Pin 10 of HM2100NLT transmitter TR1 is connected to pin 2 of port J18.

[0057] As Figure 9 The shown temperature measurement module includes: NTC1, NTC2, NTC3, NTC4, NTC5, NTC6, NTC7, NTC8, NTC9, NTC10, NTC11, NTC12, NTC13, NTC14, NTC15, NTC16, resistor R150, resistor R151, resistor R152, resistor R153, resistor R156, resistor R157, resistor R158, resistor R159, resistor R161, resistor R162, resistor R163, resistor R164, resistor R166, resistor R167, resistor R168, resistor R169, resistor R7, resistor R11, capacitor C15, capacitor C16, capacitor C17, capacitor C20, resistor R25, ADG728 analog switch U3, ADG728 analog switch U4, and TLV333 operational amplifier U6.

[0058] Resistor R150, resistor R151, resistor R152, resistor R153, resistor R156, resistor R157, resistor R158, resistor R159, resistor R161, resistor R162, resistor R163, resistor R164, resistor R166, resistor R167, resistor R168, resistor R169 are connected to pin 50 of the LTC6813 acquisition chip U29. The other end of resistor R150 is connected to NTC1 and pin 4 of the ADG728 analog switch U3. The other end of resistor R151 is connected to NTC2 and pin 5 of the ADG728 analog switch U3. The other end of resistor R152 is connected to NTC3 and pin 6 of the ADG728 analog switch U3. The other end of resistor R153 is connected to NTC4 and pin 7 of the ADG728 analog switch U3. The other end of resistor R156 is connected to NTC5 and pin 12 of the ADG728 analog switch U3. The other end of resistor R157 is connected to NTC6 and pin 11 of the ADG728 analog switch U3. The other end of resistor R158 is connected to NTC7 and pin 10 of the ADG728 analog switch U3. The other end of resistor R159 is connected to NTC8 and pin 9 of the ADG728 analog switch U3. The other end of resistor R161 is connected to NTC9 and pin 4 of the ADG728 analog switch U4. The other end of resistor R162 is connected to NTC10 and pin 5 of the ADG728 analog switch U4. The other end of resistor R163 is connected to NTC11 and pin 6 of the ADG728 analog switch U4. The other end of resistor R164 is connected to NTC12 and pin 7 of the ADG728 analog switch U4. The other end of resistor R166 is connected to NTC13 and pin 12 of the ADG728 analog switch U4. The other end of resistor R167 is connected to NTC14 and pin 11 of the ADG728 analog switch U4. The other end of resistor R168 is connected to NTC15 and pin 10 of the ADG728 analog switch U4. The other end of resistor R169 is connected to NTC16 and pin 9 of the ADG728 analog switch U4.

[0059] Pin 13 of the ADG728 analog switch U3 and the capacitor C15 are connected to +5V, the other end of the capacitor C15 is connected to the reference ground, pins 14 and 16 of the ADG728 analog switch U3 are connected to the reference ground, pins 2 and 15 of the ADG728 analog switch U3 are connected to +5V, pin 13 of the ADG728 analog switch U4 and the capacitor C16 are connected to +5V, the other end of the capacitor C16 is connected to the reference ground, pins 14 and 16 of the ADG728 analog switch U4 are connected to the reference ground, pins 2 and 15 of the ADG728 analog switch U4 are connected to +5V, pin 1 of the ADG728 analog switch U3 is connected to pin 1 of the ADG728 analog switch U4, the resistor R11, and pin 43 of the LTC6813 acquisition chip U29, the other end of the resistor R11 is connected to +3.3V, pin 3 of the ADG728 analog switch U3 is connected to pin 3 of the ADG728 analog switch U4, the resistor R7, and pin 42 of the LTC6813 acquisition chip U29, the other end of the resistor R7 is connected to +3.3V, pin 8 of the ADG728 analog switch U3 is connected to pin 8 of the ADG728 analog switch U4 and pin 3 of the TLV333 operational amplifier U6, pin 4 of the TLV333 operational amplifier U6 is connected to pin 1 and the resistor R25, the other end of R25 is connected to the capacitor C20 and pin 39 of the LTC6813 acquisition chip U29, the other end of the capacitor C20 is connected to the reference ground, pin 5 of the TLV333 operational amplifier U6 and the capacitor C17 are connected to +5V, the other end of the capacitor C17 is connected to the reference ground, and pin 2 of the TLV333 operational amplifier U6 is connected to the reference ground

[0060] The working process of the present utility model is as follows:

[0061] The AFE module measures the voltage of each battery cell and the total voltage of the battery pack. The AFE module converts the analog signal of the battery voltage into a digital signal, communicates with the MUC through the iso-SPI port, and transmits the data of the voltage of each battery cell and the total voltage of the battery pack to the MUC.

[0062] During temperature measurement, the AFE module communicates with the multiplexed analog switch through the I2C bus, transmits the command to switch the NTC channel, polls and switches the NTC channel. The AFE converts each analog signal of the NTC voltage into a digital signal and transmits it to the MCU through the iso-SPI port. The MUC converts the NTC voltage into temperature.

[0063] During current measurement, the current is converted into a voltage signal. The voltage across the sampling resistor is amplified by a differential operational amplifier, and the amplified voltage is given to the ADC. The MCU reads the ADC conversion data through the isolated I2C and calculates the current through the MCU.

[0064] The MCU reads the voltage of each battery through the iso-SPI port, compares whether the voltage difference between each battery reaches the threshold, and decides whether to turn on the battery equalization. When the equalization opening condition is met, the MOS transistor of the equalization module is turned on. Each battery forms a loop with the MOS transistor and the resistor, and each battery discharges by itself until the voltage of each battery is discharged to the same level and then the equalization is turned off, so as to make the voltage of each battery the same.

[0065] All matters not covered above are prior art.

[0066] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A BMS control system, characterized in that: It includes a power processing module, an AFE module, an external ADC, an operational amplifier, an NTC temperature measurement module, an equalization module, and a DCDC power module; The power processing module includes an MCU; the power processing module is connected to the DCDC power module; The AFE module is used to collect battery voltage and current signals and communicate with the MUC. The AFE module controls a multiplexing switch through an I2C bus to collect the voltages across multiple branches of NTCs, converts the NTC voltages into digital signals through the ADC of the AFE module to measure the temperature of the stacked batteries, and sends the data to the MCU through an isolation transmitter. The AFE module is connected to a PWM drive module through a digital I2C bus and drives and controls the speed of a cooling fan through a PWM chip; The equalization module is connected to the operational amplifier through a sampling resistor, and the operational amplifier is connected to the MCU through an external ADC.

2. The BMS control system according to claim 1, characterized in that: The MCU also includes a crystal oscillator, a memory, and a reset circuit.

3. A BMS control system according to claim 1, characterized in that: The isolation transmitter is connected to the MCU through an analysis chip.

4. A BMS control system according to claim 1, characterized in that: The external ADC includes: resistor R28, reference power supply TL431, resistor R35, resistor R37, resistor R29, resistor R30, resistor R36, resistor R42, operational amplifier U16, capacitor C32, resistor R58, resistor R59, capacitor C34, capacitor C35, capacitor C36, capacitor C37, chip U20, resistor R102, resistor R106, resistor R111, chip U23, capacitor C39, resistor R126, resistor R131; Pin 5 of the operational amplifier U16 is connected to C32 and +5V. The other end of the capacitor C32 is connected to the reference ground. Pin 2 of the operational amplifier U16 is connected to the reference ground. Pin 3 of the operational amplifier U16 is connected to one end of the resistors R37 and R35. The other end of the resistor R37 is connected to the high end of the sampling resistor. The other end of the sampling resistor is connected to the reference ground of the entire system. The other end of the resistor R37 is connected to pins 1 and 2 of the reference power supply TL431. Pins 1 and 2 of the reference power supply TL431 are connected to one end of the resistor R28. The other end of the resistor R28 is connected to DC5V. Pin 3 of the operational amplifier U16 is connected to one end of the resistors R35 and R37. The resistor R35 is connected to the sampling resistor R29. The other end of the resistor R36 is connected to the other end of the sampling resistor R29. Pin 4 of the operational amplifier U16 is connected to the resistors R36 and R42. Pin 1 of the operational amplifier U16 is connected to the other ends of the resistors R59 and R42. The other end of the resistor R59 is connected to the capacitor C36, C35, and pin 4 of the chip U20. The other end of the capacitor C36 is connected to the reference ground. Pin 9 of the chip U20 is connected to pin 5 of the chip U23 and one end of the resistor R102. The other end of the resistor R102 is connected to DC5V. Pin 10 of U20 is connected to pin 6 of the chip U23 and one end of the resistor R106. The other end of the resistor R106 is connected to DC5V. Pin 1 of the chip U20 is connected to the reference ground. Pins 7 and 8 of the chip U23 are connected to one end of the resistor R111. The other end of the resistor R111 is connected to DC5V. Pin 3 of the chip U23 is connected to pin 47 of the chip U7 in the power supply processing module and one end of the resistor R126. The other end of the resistor R126 is connected to DC3.3V. Pin 4 of the chip U23 is connected to pin 48 of the chip U7 in the power supply processing module and one end of the resistor R131. The other end of the resistor R131 is connected to DC3.3V.

5. The BMS control system according to claim 1, wherein: The power supply processing module includes: STM32F103 chip U7, RS485 isolation module U5, CAN isolation module U10, capacitor C8, transient suppression diode D1, transient suppression diode D2, transient suppression diode D3, capacitor C18, resistor R24, common mode inductor FL1, terminal J21, capacitor C25, common mode inductor FL3, resistor R47, resistor R48, transient suppression diode D4, transient suppression diode D5, transient suppression diode D6, terminal J22, STM32F103 chip U7; The USART1_TX transmission pin 68 of chip U7 of STM32F103 is connected to the TX transmission pin 3 of RS485 isolation module U5. The USART1_RX reception pin 69 of chip U7 of STM32F103 is connected to the RX reception pin 4 of RS485 isolation module U5. The PA8 pin 67 of chip U7 of STM32F103 is connected to the CON control pin 5 of RS485 isolation module U5. Pin 1 of RS485 isolation module U5 is connected to capacitor C8 and then connected to +3.3V. The other end of capacitor C8 is connected to the reference ground. Pin 2 of RS485 isolation module U5 is connected to the reference ground. Pin 8 of RS485 isolation module U5 is connected to one pin of transient suppression diode D3 and common mode inductor FL1. Pin 2 of common mode inductor FL1 is connected to pin 2 of terminal J21. Pin 9 of RS485 isolation module U5 is connected to the other end of transient suppression diode D3, one end of transient suppression diode D2 and pin 3 of common mode inductor FL1. Pin 3 of common mode inductor FL1 is connected to pin 1 of terminal J21. Pin 10 of RS485 isolation module U5 is connected to capacitor C18 and resistor R24. The other ends of capacitor C18 and resistor R24 are connected to the housing. The USART3_TX transmission pin 55 of chip U7 of STM32F103 is connected to the transmission pin 4 of CAN isolation module U10. The USART3_RX reception pin 56 of chip U7 of STM32F103 is connected to the reception pin 3 of U10. Pin 6 of CAN isolation module U10 is connected to pin 1 of common mode inductor FL3. Pin 2 of common mode inductor FL3 is connected to resistor R47. The other end of resistor R47 is connected to transient suppression diode D4, transient suppression diode D5 and pin 1 of port J22. Pin 7 of CAN isolation module U10 is connected to pin 3 of common mode inductor FL3. Pin 4 of common mode inductor FL3 is connected to resistor R48. The other end of resistor R48 is connected to transient suppression diode D5, transient suppression diode D6 and pin 2 of port J22. Pin 8 of CAN isolation module U10 is connected to transient suppression diode D4 and transient suppression diode D6 and then connected to the housing.

6. A BMS control system according to claim 1, characterized in that: The AFE module includes acquisition chip U29 of LTC6813, resistor R220, capacitor C78, capacitor C80, resistor R229, resistor R203, capacitor C82, diode D12, resistor R200, capacitor C65, capacitor C66, resistor R189, resistor R201, resistor R191, triode Q35; The 38th pin of the LTC6813 acquisition chip U29 is connected to the reference ground. The 36th pin C1 of the LTC6813 acquisition chip U29 is connected to the capacitor C57 and the resistor R172. The 34th pin C2 of the LTC6813 acquisition chip U29 is connected to the capacitor C58 and the resistor R173. The 32nd pin C3 of the LTC6813 acquisition chip U29 is connected to the capacitor C59 and the resistor R173. The 30th pin C4 of the LTC6813 acquisition chip U29 is connected to the capacitor C60 and the resistor R178. The 28th pin C5 of the LTC6813 acquisition chip U29 is connected to the capacitor C61 and the resistor R180. The 26th pin C6 of the LTC6813 acquisition chip U29 is connected to the capacitor C62 and the resistor R182. The 24th pin C7 of the LTC6813 acquisition chip U29 is connected to the capacitor C63 and the resistor R184. The 22nd pin C8 of the LTC6813 acquisition chip U29 is connected to the capacitor C64 and the resistor R186. The 20th pin C9 of the LTC6813 acquisition chip U29 is connected to the capacitor C69 and the resistor R206. The 18th pin C10 of the LTC6813 acquisition chip U29 is connected to the capacitor C70 and the resistor R208. The 16th pin C11 of the LTC6813 acquisition chip U29 is connected to the capacitor C71 and the resistor R210. The 14th pin C12 of the LTC6813 acquisition chip U29 is connected to the capacitor C72 and the resistor R212. The 12th pin C13 of the LTC6813 acquisition chip U29 is connected to the capacitor C73 and the resistor R214. The 10th pin C14 of the LTC6813 acquisition chip U29 is connected to the capacitor C74 and the resistor R216. The 8th pin C15 of the LTC6813 acquisition chip U29 is connected to the capacitor C75 and the resistor R218. The 6th pin C16 of the LTC6813 acquisition chip U29 is connected to the capacitor C76 and the resistor R204.

7. The BMS control system according to claim 6, characterized in that: The equalization module includes: transistor Q19, transistor Q20, transistor Q21, transistor Q22, transistor Q23, transistor Q24, transistor Q25, transistor Q26, transistor Q27, transistor Q28, transistor Q29, transistor Q30, transistor Q31, transistor Q32, transistor Q33, transistor Q34, resistor R172, resistor R176, resistor R192, resistor R188, resistor R173, resistor R174, resistor R190, resistor R175, resistor R177, resistor R193, resistor R178, resistor R179, resistor R194, resistor R180, resistor R181, resistor R195, resistor R182, resistor R183, resistor R196, resistor R184, resistor R185, resistor R197, resistor R206, resistor R207, resistor R222, resistor R208, resistor R209, resistor R223, resistor R210, resistor R211, resistor R224, resistor R212, resistor R213, resistor R225, resistor R214, resistor R215, resistor R226, resistor R216, resistor R217, resistor R227, resistor R218, resistor R219, resistor R228, resistor R204, resistor R205, resistor R221, capacitor C57, capacitor C67, capacitor C58, capacitor C59, capacitor C60, capacitor C61, capacitor C62, capacitor C63, capacitor C64, capacitor C69, capacitor C70, capacitor C71, capacitor C72, capacitor C73, capacitor C74, capacitor C75, capacitor C76; The 37th pin S1 of the LTC6813 acquisition chip U29 is connected to the resistor R176, the 35th pin S2 of the LTC6813 acquisition chip U29 is connected to the resistor R174, the 33rd pin S3 of the LTC6813 acquisition chip U29 is connected to the resistor R177, the 31st pin S4 of the LTC6813 acquisition chip U29 is connected to the resistor R179, the 29th pin S5 of the LTC6813 acquisition chip U29 is connected to the resistor R181, the 27th pin S6 of the LTC6813 acquisition chip U29 is connected to the resistor R183, the 25th pin S7 of the LTC6813 acquisition chip U29 is connected to the resistor R184, the 23rd pin S8 of the LTC6813 acquisition chip U29 is connected to the resistor R187, the 21st pin S9 of the LTC6813 acquisition chip U29 is connected to the resistor R207, the 19th pin S10 of the LTC6813 acquisition chip U29 is connected to the resistor R209, the 17th pin S11 of the LTC6813 acquisition chip U29 is connected to the resistor R211, the 15th pin S12 of the LTC6813 acquisition chip U29 is connected to the resistor R213, the 13th pin S13 of the LTC6813 acquisition chip U29 is connected to the resistor R215, the 11th pin S14 of the LTC6813 acquisition chip U29 is connected to the resistor R217, the 9th pin S15 of the LTC6813 acquisition chip U29 is connected to the resistor R219, and the 7th pin S16 of the LTC6813 acquisition chip U29 is connected to the resistor R205.

8. A BMS control system according to claim 1, wherein: The NTC temperature measurement module includes: NTC1, NTC2, NTC3, NTC4, NTC5, NTC6, NTC7, NTC8, NTC9, NTC10, NTC11, NTC12, NTC13, NTC14, NTC_R15, NTC16, resistor R150, resistor R151, resistor R153, resistor R156, resistor R157, resistor R158, resistor R159, resistor R161, resistor R162, resistor R163, resistor R164, resistor R166, resistor R167, resistor R168, resistor R169, resistor R7, resistor R11, capacitor C15, capacitor C16, capacitor C17, capacitor C20, resistor R25, ADG728 analog switch U3, ADG728 analog switch U4, TLV333 operational amplifier U6; Resistors R150, R151, R152, R153, R156, R157, R158, R159, R161, R162, R163, R164, R166, R167, R168, R169 are connected to pin 50 of the LTC6813 acquisition chip U29. The other end of resistor R150 is connected to NTC1 and pin 4 of the ADG728 analog switch U3. The other end of resistor R151 is connected to NTC2 and pin 5 of the ADG728 analog switch U3. The other end of resistor R152 is connected to NTC3 and pin 6 of the ADG728 analog switch U3. The other end of resistor R153 is connected to NTC4 and pin 7 of the ADG728 analog switch U3. The other end of resistor R156 is connected to NTC5 and pin 12 of the ADG728 analog switch U3. The other end of resistor R157 is connected to NTC6 and pin 11 of the ADG728 analog switch U3. The other end of resistor R158 is connected to NTC7 and pin 10 of the ADG728 analog switch U3. The other end of resistor R159 is connected to NTC8 and pin 9 of the ADG728 analog switch U3. The other end of resistor R161 is connected to NTC9 and pin 4 of the ADG728 analog switch U4. The other end of resistor R162 is connected to NTC10 and pin 5 of the ADG728 analog switch U4. The other end of resistor R163 is connected to NTC11 and pin 6 of the ADG728 analog switch U4. The other end of resistor R164 is connected to NTC12 and pin 7 of the ADG728 analog switch U4. The other end of resistor R166 is connected to NTC13 and pin 12 of the ADG728 analog switch U4. The other end of resistor R167 is connected to NTC14 and pin 11 of the ADG728 analog switch U4. The other end of resistor R168 is connected to NTC15 and pin 10 of the ADG728 analog switch U4. The other end of resistor R169 is connected to NTC16 and pin 9 of the ADG728 analog switch U4. Pin 13 of the ADG728 analog switch U3 and the capacitor C15 are connected to +5V, and the other end of the capacitor C15 is connected to the reference ground. Pins 14 and 16 of the ADG728 analog switch U3 are connected to the reference ground. Pins 2 and 15 of the ADG728 analog switch U3 are connected to +5V. Pin 13 of the ADG728 analog switch U4 and the capacitor C16 are connected to +5V, and the other end of the capacitor C16 is connected to the reference ground. Pins 14 and 16 of the ADG728 analog switch U4 are connected to the reference ground. Pins 2 and 15 of the ADG728 analog switch U4 are connected to +5V. Pin 1 of the ADG728 analog switch U3 is connected to pin 1 of the ADG728 analog switch U4, the resistor R11, and pin 43 of the LTC6813 acquisition chip U29. The other end of the resistor R11 is connected to +3.3V. Pin 3 of the ADG728 analog switch U3 is connected to pin 3 of the ADG728 analog switch U4, the resistor R7, and pin 42 of the LTC6813 acquisition chip U29. The other end of the resistor R7 is connected to +3.3V. Pin 8 of the ADG728 analog switch U3 is connected to pin 8 of the ADG728 analog switch U4 and pin 3 of the TLV333 operational amplifier U6. Pin 4 of the TLV333 operational amplifier U6 is connected to pin 1 and the resistor R25. The other end of R25 is connected to the capacitor C20 and pin 39 of the LTC6813 acquisition chip U29. The other end of the capacitor C20 is connected to the reference ground. Pin 5 of the TLV333 operational amplifier U6 and the capacitor C17 are connected to +5V, and the other end of the capacitor C17 is connected to the reference ground. Pin 2 of the TLV333 operational amplifier U6 is connected to the reference ground.

9. The BMS control system according to claim 6, characterized in that: The isolation transmitter module includes: the HM2100NLT transmitter TR1, the resistors R12, R13, R22, R23, the capacitors C43, C44, C84, C22, C83, C42, and the port J18; Pin 1 of the HM2100NLT transmitter TR1 is connected to pin 64 of the acquisition chip U29 of the resistor R12, capacitor C43, and LTC6813. The other end of the resistor R12 is connected to the resistor R13, capacitor C84, and capacitor C44. The other end of the capacitor C44 is connected to the reference ground. Pin 2 of the HM2100NLT transmitter TR1 is connected to pin 63 of the resistor R13, capacitor 44, and LTC6813 acquisition chip U29. Pin 4 of the HM2100NLT transmitter TR1 is connected to pin 62 of the resistor R22, capacitor C22, and LTC6813 acquisition chip U29. The other end of the resistor R22 is connected to the resistor R23, capacitor C83, and capacitor C42. The other end of the capacitor C83 is connected to the reference ground. Pin 5 of the HM2100NLT transmitter TR1 is connected to pin 61 of the resistor R23, capacitor 42, and LTC6813 acquisition chip U29. Pin 6 of the HM2100NLT transmitter TR1 is connected to pin 1 of the port J18. Pin 7 of the HM2100NLT transmitter TR1 is connected to pin 3 of the port J18. Pin 9 of the HM2100NLT transmitter TR1 is connected to pin 4 of the port J18. Pin 10 of the HM2100NLT transmitter TR1 is connected to pin 2 of the port J18.

10. A BMS control system according to claim 5, characterized in that: The PWM drive module includes: resistor R26, resistor R27, capacitor C87, diode D11, resistor R160, resistor R165, field effect transistor Q18, GP7101 chip U31, fan FAN, and terminal J20; Pin 8 of the GP7101 chip U31 and C87 are connected to +3.3V. Pin 6 of the GP7101 chip U31 is connected to the resistor R160. The other end of the resistor R160 is connected to the connection of the field effect transistor Q18 and the resistor R165. The other end of the resistor R165 is connected to the reference ground. Pin 3 of the field effect transistor Q18 is connected to the anode of the diode D11, pin 2 of the fan FAN, and pin 2 of the port J20. Pin 1 of the fan FAN, pins 3 and 4 of the port J20 are connected to +24V. Pin 1 of the port J20 is connected to the reference ground. Pin 1 of the GP7101 chip U31 is connected to the resistor R27 and pin 18 of the STM32F103 chip U7. Pin 2 of the GP7101 chip U31 is connected to the resistor R26 and pin 33 of the STM32F103 chip U7.

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