Communication module circuit board

Abstract

The utility model discloses a communication module circuit board, which comprises a support and a plurality of communication units arranged on the support in order horizontally and vertically. The support at least comprises an upper track edge, a lower track edge, a left track edge, a right track edge and a unit body integrally supported on the communication unit. The communication unit is formed by splicing the unit bodies, the support is formed on the periphery of the communication unit through the upper track, the lower track edge, the left track edge and the right track edge, and when the circuit board is machined, other assemblies are arranged on the support, so that machining of the circuit board is facilitated.

Description

Technical Field

[0001] The utility model relates to the technology of circuit boards, especially a communication module circuit board. Background Art

[0002] Communication circuit boards are key components indispensable in the communication industry and are widely used in various communication devices and systems. The specific models of communication circuit boards also vary due to changes in application fields.

[0003] During the production and transportation process of existing communication circuit boards, sometimes due to the traction of the conveyor belt or the deviation of the placement position, it will affect the position of the communication circuit board when it reaches the next processing point, resulting in poor processing of the communication circuit board and thus affecting the processing effect of the circuit board. Content of the Utility Model

[0004] In view of this, aiming at the deficiencies existing in the prior art, the main purpose of the utility model is to provide a communication module circuit board, which solves the processing problems caused by position deviation when the communication circuit board is transported on the production line.

[0005] To achieve the above purpose, the utility model adopts the following technical solution: A communication module circuit board includes a bracket and a plurality of communication units arranged neatly in horizontal and vertical directions on the bracket;

[0006] The bracket at least includes an upper track edge, a lower track edge, a left track edge, a right track edge, and a unit main body that integrally supports the communication units.

[0007] Further, the unit main body has 6 layers of dielectric, and each layer of dielectric is connected and conducted through exposed copper.

[0008] Further, the top layer and the bottom layer of the unit main body are coated with solder mask ink.

[0009] Further, the exposed copper contains multiple layers, the dielectrics are arranged from top to bottom, and the exposed copper on each layer of dielectric is not on the same vertical line. The width of the exposed copper is W, where W is 5MM. The exposed copper includes a first-layer exposed copper, a second-layer exposed copper, and a third-layer exposed copper. The distance between the first-layer exposed copper and the boundary point of the unit main body is 10MM. The horizontal distance between the second-layer exposed copper and the first-layer exposed copper is W, and the horizontal distance between the third-layer exposed copper and the second-layer exposed copper is W.

[0010] Further, a first optical point and a second optical point are provided on the upper track edge, and the distance between the first optical point and the second optical point is L1;

[0011] A third optical point and a fourth optical point are provided on the lower track edge, the distance between the third optical point and the fourth optical point is L2, L2 is greater than L1, a connecting line S1 is provided between the first optical point and the second optical point, a connecting line S2 is provided between the third optical point and the fourth optical point, S1 is parallel to S2, the first optical point and the third optical point are not at the same distance from the edge of the left track edge, and the second optical point and the fourth optical point are not at the same distance from the edge of the right track edge.

[0012] Furthermore, a bad board point is arranged on the bracket next to the corresponding communication unit, there are multiple bad board points, and one bad board point corresponds to one communication unit.

[0013] Furthermore, anti-fool points are provided at the four corners of the bracket.

[0014] Furthermore, a first solder paste point and a second solder paste point are respectively opened on the left track side and the right track side, the second solder paste point is a positive pole, and the first solder paste point is a negative pole.

[0015] Furthermore, the communication units include , and are arranged in three rows and four columns on the circuit board, and the spacing between adjacent communication units is 2 mm.

[0016] Furthermore, blanking holes are provided between adjacent communication units.

[0017] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical scheme that a communication unit is formed by splicing a plurality of unit bodies, and the periphery of the communication unit forms a bracket through an upper track, a lower track edge, a left track edge and a right track edge. When processing the circuit board, other components are arranged on the bracket to facilitate the processing of the circuit board.

[0018] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a display diagram of the circuit board of Example 1 of the utility model.

[0020] Figure 2 It is a cross-sectional view of the unit body of Example 1 of the present utility model.

[0021] Description of the accompanying drawings:

[0022] 1 support, 11 upper track side, 12 lower track side, 13 left track side, 14 right track side;

[0023] 2 communication unit, 3 unit body, 4 medium, 5 solder resist ink;

[0024] 41 exposed copper, 411 first layer exposed copper, 412 second layer exposed copper, 413 third layer exposed copper;

[0025] 61 First optical point, 62 Second optical point, 63 Third optical point, 64 Fourth optical point.

[0026] 7 Bad board point, 8 Anti-fooling point, 91 First solder paste point, 92 Second solder paste point, 10 Blanking hole. Detailed implementation mode

[0027] Please refer to Figure 1-2 As shown, it shows the specific structure of the first preferred embodiment of the present invention, which is a communication module circuit board, including a bracket 1 and a plurality of communication units 2 arranged neatly horizontally and vertically on the bracket 1; the bracket 1 at least includes an upper track edge 11, a lower track edge 12, a left track edge 13 and a right track edge 14, and a unit main body 3 that integrally supports the communication unit 2. An outer frame is formed by the upper track edge 11, the lower track edge 12, the left track edge 13 and the right track edge 14, and a plurality of communication units 2 are installed in the outer frame. Users can install other identification parts on the outer frame to better position the communication circuit board during transportation on the conveyor belt and improve the processing accuracy.

[0028] Specifically, the bracket 1 is rectangular, circular or arc-shaped, and the bracket 1 is spliced by the upper track edge 11, the lower track edge 12, the left track edge 13 and the right track edge 14. The spliced circuit board can be fixed on the track by an SMT mounter for transmission.

[0029] As Figure 1 As shown, exemplarily, the unit main body 3 has 6 dielectric layers 4, and each dielectric layer 4 is connected and conducted through exposed copper 41. The 6 dielectric layers 4 have multiple functions such as impedance control, insulation, characteristic impedance, improving electromagnetic compatibility, increasing integration and improving signal transmission performance, significantly improving the overall performance and reliability of the circuit board. Among them, impedance control means that the top and bottom layers of the unit main body 3 are usually located on thin dielectrics, and the dielectric layer 4 can be used for impedance control of signals. The insulating layer means that the dielectric layer 4 is used as insulation between conductors to prevent electrical short circuits in the unit main body 3.

[0030] As Figure 2 As shown, exemplarily, the top and bottom layers of the unit main body 3 are coated with solder mask ink 5. The solder mask ink 5 on the top and bottom layers of the unit main body 3 can protect the metal wires and components on the unit main body 3 to prevent these parts from being covered by tin during the welding process, thus avoiding short circuits and other problems.

[0031] As Figure 2As shown, exemplary, the exposed copper 41 has multiple layers, and the dielectrics 4 are arranged from top to bottom. The exposed copper 41 on each layer of the dielectric 4 is not on the same vertical line. The width of the exposed copper 41 is W, and W is 5 mm. The exposed copper 41 includes a first-layer exposed copper 411, a second-layer exposed copper 412, and a third-layer exposed copper 413. The distance from the first-layer exposed copper 411 to the boundary point of the unit body 3 is 10 mm. The horizontal distance between the second-layer exposed copper 412 and the first-layer exposed copper 411 is W, and the horizontal distance between the third-layer exposed copper 413 and the second-layer exposed copper 412 is W. The exposed copper 41 on the dielectric 4 is used for users to solder electronic components to the unit body 3 to enable the normal function of the unit body 3 to be realized. In addition, the exposed copper can also reduce the ground wire impedance to reduce interference and improve the stability of the circuit board. In addition, by applying the above distances between the first-layer exposed copper 411, the second-layer exposed copper 412, the third-layer exposed copper 413, and even the subsequent exposed copper, the circuit can be protected to prevent parts that should not be exposed, such as conductors, from contacting other conductors to avoid short circuits. In addition, through the setting of the spacing, the current distribution on different exposed copper can be made more uniform to improve the performance of the circuit board.

[0032] As Figure 1 shown, exemplary, a first optical point 61 and a second optical point 62 are provided on the upper track edge 11, and the distance between the first optical point 61 and the second optical point 62 is L1;

[0033] A third optical point 63 and a fourth optical point 64 are provided on the lower track edge 12. The distance between the third optical point 63 and the fourth optical point 64 is L2, and L2 is greater than L1. A connection line S1 is provided between the first optical point 61 and the second optical point 62, and a connection line S2 is provided between the third optical point 63 and the fourth optical point 64. S1 is parallel to S2. The distances from the first optical point 61 and the third optical point 63 to the edge of the left track edge 13 are not equal, and the distances from the second optical point 62 and the fourth optical point 64 to the edge of the right track edge 14 are not equal. The optical point 64 is used for the processing and positioning of the communication circuit board. During the conveying process of the communication circuit board, the first optical point 61, the second optical point 62, the third optical point 63, and the fourth optical point 64 are found through a CCD camera to achieve alignment during processing. And because the positions of each optical point are different, it is convenient for the CCD detection system to analyze the direction of the circuit board to ensure the accuracy of the conveying direction of the circuit board.

[0034] As Figure 1 shown, exemplary, a bad board point 7 is provided on the bracket 1 corresponding to the communication unit 2. There are multiple bad board points 7, and one bad board point 7 corresponds to one communication unit 2. When different communication units 2 are detected to have performance problems, marks can be made on the corresponding bad board points 7 to facilitate the staff to process a single communication unit 2 based on the marks on the bad board points 7.

[0035] As Figure 1As shown, exemplarily, anti-false-position points 8 are provided at the four corners of the bracket 1. The horizontal and vertical lengths of the bracket 1 are not equal. Therefore, anti-false-position points 8 are set at different positions. During automated processing and detection, the direction is judged through the anti-false-position points 8 to be installed in the corresponding fixtures, preventing incorrect assembly.

[0036] As Figure 1 shown, exemplarily, a first solder paste point 91 and a second solder paste point 92 are respectively provided on the left track side 13 and the right track side 14. The second solder paste point 92 is the positive electrode, and the first solder paste point 91 is the negative electrode. When producing and testing the whole board, the first solder paste point 91 and the second solder paste point 92 are soldered and connected to the detection instrument, and the second solder paste point 92 is used as the positive electrode to pass through, and the first solder paste point 91 is used as the negative electrode to flow out of the detection circuit.

[0037] There are 12 communication units 2, which are arranged in three rows and four columns on the circuit board, and the distance between adjacent communication units 2 is 2 mm. The horizontal distance between every two adjacent communication units 2 is 2 mm, and the vertical distance is also 2 mm.

[0038] A blanking hole 10 is provided between adjacent communication units 2. When the communication circuit board is punched and cut, the communication units can be cut into quadrilaterals through the blanking hole 10.

[0039] In summary, the design focus of the present utility model is to enable better processing of the circuit board by providing four optical points on the circuit board, including a first optical point 61, a second optical point 62, a third optical point 63, and a fourth optical point 64, as well as a bad board point 7, an anti-false-position point 8, and a first solder paste point 91 and a second solder paste point 92.

[0040] The above is only a preferred embodiment of the present utility model, and does not impose any limitation on the technical scope of the present utility model. Therefore, any minor modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present utility model still belong to the scope of the technical solution of the present utility model.

Claims

1. A communication module circuit board, comprising a bracket (1) and a plurality of communication units (2) arranged neatly vertically and horizontally on the bracket (1); The bracket (1) at least includes an upper track edge (11), a lower track edge (12), a left track edge (13) and a right track edge (14), and a unit main body (3) integrally supporting the communication unit (2).

2. The communication module circuit board according to claim 1, wherein: The unit main body (3) has 6 layers of media (4), and each layer of the media (4) is connected and conducted through exposed copper (41).

3. The communication module circuit board according to claim 2, characterized in that: The top layer and the bottom layer of the unit main body (3) are coated with solder mask ink (5).

4. The communication module circuit board according to claim 3, characterized in that: The exposed copper (41) contains multiple layers, the media (4) are arranged from top to bottom, and the exposed copper (41) on each layer of the media (4) is not on the same vertical line. The width of the exposed copper (41) is W, where W = 5MM. The exposed copper (41) includes a first-layer exposed copper (411), a second-layer exposed copper (412) and a third-layer exposed copper (413). The distance from the first-layer exposed copper (411) to the boundary point of the unit main body (3) is 10MM. The horizontal distance between the second-layer exposed copper (412) and the first-layer exposed copper (411) is W. The horizontal distance between the third-layer exposed copper (413) and the second-layer exposed copper (412) is W.

5. A communication module circuit board according to claim 1, characterized in that: The upper track edge (11) is provided with a first optical point (61) and a second optical point (62), and the distance between the first optical point (61) and the second optical point (62) is L1; The lower track edge (12) is provided with a third optical point (63) and a fourth optical point (64), the distance between the third optical point (63) and the fourth optical point (64) is L2, L2 is greater than L1. A connecting line S1 is provided between the first optical point (61) and the second optical point (62), and a connecting line S2 is provided between the third optical point (63) and the fourth optical point (64). S1 is parallel to S2. The distances from the first optical point (61) and the third optical point (63) to the edge of the left track edge (13) are not equal, and the distances from the second optical point (62) and the fourth optical point (64) to the edge of the right track edge (14) are not equal.

6. The communication module circuit board according to claim 1, wherein: Bad board points (7) are provided on the bracket (1) corresponding to the communication unit (2). There are multiple bad board points (7), and one bad board point (7) corresponds to one communication unit (2).

7. A communication module circuit board according to claim 1, characterized in that: Anti-fooling points (8) are provided at the four corners of the bracket (1).

8. A communication module circuit board according to claim 1, wherein: First solder paste points (91) and second solder paste points (92) are respectively opened on the left track edge (13) and the right track edge (14). The second solder paste point (92) is the positive electrode, and the first solder paste point (91) is the negative electrode.

9. A communication module circuit board according to claim 1, characterized in that: There are 12 communication units (2), which are arranged in three rows and four columns on the circuit board, and the spacing between adjacent communication units (2) is 2mm.

10. A communication module circuit board according to claim 9, characterized in that: A blanking hole (10) is provided between adjacent communication units (2).

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