Sensor chip packaging structure and electronic cigarette using same

Abstract

The utility model relates to sensitive element and sensor manufacturing in the electronic core industry, in particular to a sensor chip packaging structure and an electronic cigarette using the same. The utility model relates to a sensor chip packaging structure, which comprises a head contour part, a first through hole and a second contour part, wherein the head contour part is provided with a first through hole; the chip bearing part is combined to the head contour part, a chip mounting cavity is formed in the side, away from the head contour part, of the chip bearing part, and a second through hole is formed in the bottom of the chip mounting cavity; the sensor chip is mounted at the bottom of the chip mounting cavity, and a sensing film of the sensor chip is communicated to the second through hole; and the sensing film is communicated to the outer side of the head contour piece through the second through hole and the first through hole. According to the utility model, the development cost and period can be reduced, and the project import is quicker.

Description

Technical Field

[0001] The utility model relates to the manufacturing of sensitive components and sensors in the core electronic industry, and particularly to a sensor chip packaging structure and an electronic cigarette applying the same. Background Art

[0002] As an alternative to traditional tobacco products, electronic cigarettes are gradually accepted by all social strata.

[0003] In the prior art, most of the capacitive sensors applied in electronic cigarettes are of Φ6 packaging. However, due to many defects of capacitive sensors, piezoelectric sensors are gradually replacing capacitive sensors. However, the structural components in electronic cigarettes are all designed based on the Φ6 packaging form. If a surface-mounted piezoelectric sensor is directly used to replace the capacitive sensor, the structure will not be compatible, and redesigning the structural components will cause additional cost.

[0004] Therefore, designing an electronic cigarette sensor chip packaging structure to make the new piezoelectric sensor compatible with the existing Φ6-packaged capacitive sensor has become a shortcut to promote the development of the electronic cigarette sensor industry. Summary of the Utility Model

[0005] I. Technical Problems to be Solved

[0006] The utility model is expected to solve at least one of the above technical problems.

[0007] II. Technical Solutions

[0008] The first aspect of the utility model provides a sensor chip packaging structure, including: a head profile member, on which a first through hole is formed; a chip carrier member, combined with the head profile member, and a chip mounting cavity is formed on the side away from the head profile member, and a second through hole is provided at the bottom of the chip mounting cavity; a sensor chip, mounted at the bottom of the chip mounting cavity, and its sensing film is communicated with the second through hole; wherein, the sensing film is communicated with the outside of the head profile member through the second through hole and the first through hole.

[0009] In some embodiments of the utility model, the second through hole is disposed opposite to the first through hole; or, the second through hole and the first through hole are offset from each other, and the two are horizontally communicated through the gap between the head profile member and the chip carrier member.

[0010] In some embodiments of the utility model, the head profile member includes: a base portion, at the bottom of which the first through hole is provided; an extension portion, extending upward from the base portion; a chip carrier member, combined with the extension portion of the head profile member; wherein, the second through hole and the first through hole are offset from each other, and the two are horizontally communicated through the gap between the base portion and the chip carrier member.

[0011] In some embodiments of the present utility model, the base portion has a cylindrical structure, and the extension portion extends upward on one side of the base portion; the outer peripheral surface contour of the combined body formed by the combination of the chip carrier and the extension portion is the same as or smoothly transitions to the outer peripheral surface contour of the base portion; the sensor chip packaging structure further includes: a chamber cover, which is disposed on the opening part of the chip installation chamber and is flush with the top surface of the extension portion away from the base portion.

[0012] In some embodiments of the present utility model, one or more of the head contour member, the chip carrier, and the chamber cover are formed by injection molding of liquid crystal polymer.

[0013] In some embodiments of the present utility model, the combined body formed by the combination of the chip carrier and the extension portion has an outer cylindrical surface that is continuous with the outer cylindrical surface of the base portion.

[0014] In some embodiments of the present utility model, the head contour member, the chip carrier, and the chamber cover are all black.

[0015] In some embodiments of the present utility model, the base portion has a cylindrical structure; the cross-section of the chip carrier is semi-circular.

[0016] In some embodiments of the present utility model, the chamber cover is adhesively bonded to the opening part of the chip installation chamber to seal the chip installation chamber, and the adhesive material is silicone.

[0017] In some embodiments of the present utility model, a mutually matching buckle structure is provided between the chamber cover and the opening part of the chip installation chamber.

[0018] In some embodiments of the present utility model, a radial groove is provided inside the extension portion; N signal pins led out from the chip installation chamber first extend towards the radial groove and are bent 90° in the radial groove and then extend in a direction away from the base portion, where N≥1.

[0019] In some embodiments of the present utility model, the N signal pins include: a third signal pin, and the starting end of the third signal pin in the chip installation chamber is located on the side away from the radial groove; at the position corresponding to the starting end of the third signal pin, an axial limiting hole is provided at the bottom of the chip installation chamber.

[0020] In some embodiments of the present utility model, a step structure or a ramp structure is formed in the gap between the base portion and the chip carrier; wherein, the projection of the first through hole in the gap is located on the lower side of the step structure or the ramp structure, and the projection of the second through hole in the gap is located on the higher side of the step structure or the ramp structure.

[0021] In some embodiments of the utility model, the base portion is provided with an axial groove opening toward the chip carrier, and at least a portion of the first through hole is located at the bottom of the axial groove; an axial protrusion matching the bearing groove is formed on the top of the chip carrier, and the second through hole is arranged at the top of the axial protrusion; wherein, when the chip carrier is combined with the extension portion, the axial protrusion is embedded in the axial groove, and a gap is formed between the opposing surfaces of the axial protrusion and the axial groove for transverse connection of the first through hole and the second through hole.

[0022] In some embodiments of the utility model, the gap between the axial protrusion and the axial groove includes: an oil collecting groove formed on the top of the axial protrusion; a step structure is arranged in the oil collecting groove; wherein the oil collecting groove itself forms a circumferentially closed groove structure; or, the oil collecting groove is open on one side facing the extension portion, and the oil collecting groove and the extension portion on the opposite side together form a circumferentially closed groove structure.

[0023] In some embodiments of the present invention, a glue containing groove is provided on the top of the chip carrier outside the axial protrusion; the chip carrier is glue-connected to the head contour part.

[0024] In some embodiments of the present invention, the sensing film of the sensor chip is disposed opposite to the second through hole.

[0025] In some embodiments of the present invention, the first through hole and the second through hole are both along the vertical direction, and their central axes are parallel to each other.

[0026] In some embodiments of the present invention, compared with the second through hole, the first through hole is disposed at a position closer to the central axis.

[0027] In some embodiments of the present invention, the oil collecting groove is in a strip-shaped structure, which extends in a horizontal direction.

[0028] In some embodiments of the present invention, the shape of the oil collecting groove extending on the horizontal plane is a straight line or an arc.

[0029] The second aspect of the utility model provides an electronic cigarette, comprising: an electronic cigarette smoking device, an atomizer is arranged inside, and an electronic cigarette mouthpiece is arranged at the end; the above sensor chip packaging structure is arranged in the electronic cigarette smoking device, wherein the sensor chip is a piezoelectric sensor chip; and further comprising: a microcontroller chip, installed at the bottom of the chip mounting cavity, and the signal is connected to the piezoelectric sensor chip; wherein the sensing film of the piezoelectric sensor chip is connected to the electronic cigarette mouthpiece through the second through hole and the first through hole, and the microcontroller chip controls the opening and closing of the atomizer according to the user's inhalation signal provided by the piezoelectric sensor chip.

[0030] 3. Beneficial Effects

[0031] As can be seen from the above technical solution, the present utility model has at least one of the following beneficial effects compared with the prior art:

[0032] 1. In the present utility model, the shapes and sizes of the head profile member and the chip carrier determine the overall shape of the sensor chip packaging structure. No matter what type of sensor chip is packaged into this packaging structure, it presents a unified shape externally, thus avoiding the trouble of customizing different packaging structures due to the different shapes of the chips themselves.

[0033] 2. In the present utility model, the e-cigarette sensor chip packaging structure is consistent with the external shape of the existing mainstream Φ6 electret microphone, which can well adapt to the existing e-cigarette structural parts, reduce the development cost and cycle, and make the project introduction more rapid.

[0034] Furthermore, the e-cigarette sensor chip packaging structure of the present utility model can be designed as a structural member with the same shape and size as various existing general sensor structures, so that the newly emerged sensor chips can be applied to the existing technology, which can reduce the development cost and cycle, and make the project introduction more rapid.

[0035] 2. In traditional packaging, such as Φ6 or silicon microphone patch packaging, the air holes are directly opposite to the MEMS chip or ASIC chip, so that light directly irradiates the MEMS chip or ASIC chip, and the resulting photoelectric effect affects the sensing accuracy.

[0036] In the present utility model, the central axes of the first through hole and the second through hole are offset from each other, and they are connected through the gap formed between the opposite surfaces of the axial protrusion and the axial groove, thus forming a Z-shaped air passage. This Z-shaped air passage plays an isolation role for direct light irradiation, avoiding direct light irradiation on the internal chip, thus greatly reducing the generation of the photoelectric effect, making the sensor voltage detection more accurate, and significantly improving the accuracy of the sensor. In addition, each structural member of the present utility model is pure black, which plays a certain role in absorbing light, thus reducing the probability of light interference.

[0037] 3. In the present utility model, through the embedded installation of the axial groove and the axial protrusion, the head profile member and the chip carrier can be conveniently combined, reducing the manufacturing cost.

[0038] 4. In the present utility model, the central axes of the first through hole and the second through hole are offset from each other, and an oil collecting groove is provided on the top surface of the chip carrier facing the base portion. Through the above settings, the e-liquid will not directly enter the second through hole from the first through hole, but must pass through the horizontally extending oil collecting groove before entering the chip installation cavity, thereby reducing the probability of e-liquid condensate entering the chip installation cavity and improving the accuracy and service life of the chip.

[0039] 5. In the present utility model, a stepped structure (or a ramp structure) is formed in the oil collecting groove. The side of the stepped structure close to the second through hole is the higher side, and the side close to the first through hole is the lower side. Thus, the e-liquid condensed in the air flow entering from the external environment remains on the lower side of the step and will not enter the sensor chip through the second through hole, further reducing the probability of the e-liquid condensate entering the chip installation cavity and improving the accuracy and service life of the chip.

[0040] 6. In the present utility model, by using LCP material for injection molding to form each component, the influence of temperature on the sensor chip can be effectively isolated, and the reliability, safety and accuracy of the e-cigarette sensor can be greatly improved.

[0041] 7. In the present utility model, the chip carrier is adhesively connected to the head profile member. At the same time, the chamber cover is adhesively bonded to the opening of the chip installation cavity. Both adhesive materials are silicone materials. Using silicone materials for encapsulation has a good sealing effect under high temperature and high humidity conditions, and moreover, the cured silicone is soft, which is more beneficial for the next-step encapsulation of the device. Description of the Drawings

[0042] Figure 1A 、 Figure 1B 、 Figure 1C are respectively the first-angle perspective view, the second-angle perspective view, and the cross-sectional view of the e-cigarette sensor chip encapsulation structure according to the embodiment of the present utility model.

[0043] Figure 2A and Figure 2B are respectively Figures 1A - 1C the first-angle perspective view and the second-angle perspective view of the head profile member in the e-cigarette sensor chip encapsulation structure shown.

[0044] Figure 3A and Figure 3B are respectively Figures 1A - 1C the first-angle perspective view and the second-angle perspective view of the chip carrier in the e-cigarette sensor chip encapsulation structure shown.

[0045] Figure 3C is the second-angle perspective view of the chip carrier in the e-cigarette sensor chip encapsulation structure according to another embodiment of the present utility model.

[0046] Figure 4A and Figure 4B are respectively Figures 1A - 1C the first-angle perspective view and the second-angle perspective view of the chamber cover in the e-cigarette sensor chip encapsulation structure shown.

[0047] Figure 5 is Figures 1A - 1C the schematic diagram of the electrical connection of the chip in the e-cigarette sensor chip encapsulation structure shown.

[0048] Figure 6 For Figures 1A - 1C The schematic diagram of the e-cigarette sensor chip packaging structure shown to avoid e-liquid from entering the chip installation cavity in the e-cigarette application scenario. Detailed implementation manners

[0049] The concept of the present utility model lies in providing an e-cigarette sensor chip packaging structure that can be compatible with existing capacitive sensors and is easy to assemble, making it easier to promote and apply other types of barometric pressure sensors.

[0050] Before describing the specific embodiments of the present utility model, it is helpful to define some specific terms. In the present utility model, "inner side" refers to the side close to the central axis, and "outer side" refers to the side far from the central axis; "central axis direction" and "vertical direction" refer to the longitudinal direction, and "direction parallel to the central axis" and "lateral direction" refer to the horizontal direction; "upper side" and "top" refer to the direction close to the first through hole, and "lower side" and "bottom" refer to the direction far from the first through hole; "lower side" refers to the side where the e-liquid freely flows under the action of its own gravity; "higher side" refers to the side opposite to the "lower side".

[0051] To make the purpose, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in combination with specific implementation manners and with reference to the accompanying drawings.

[0052] The first aspect of the present utility model provides an e-cigarette sensor chip packaging structure. Figure 1A 、 Figure 1B 、 Figure 1C They are respectively the first-angle perspective view, the second-angle perspective view, and the cross-sectional view of the e-cigarette sensor chip packaging structure according to the embodiment of the present utility model. Figure 2A And Figure 2B They are respectively Figures 1A - 1C The first-angle perspective view and the second-angle perspective view of the head profile part in the e-cigarette sensor chip packaging structure shown. Figure 3A And Figure 3B They are respectively Figures 1A - 1C The first-angle perspective view and the second-angle perspective view of the chip carrier in the e-cigarette sensor chip packaging structure shown. Figure 4A And Figure 4B They are respectively Figures 1A - 1C The first-angle perspective view and the second-angle perspective view of the chamber cover in the e-cigarette sensor chip packaging structure shown. Figure 5 For Figures 1A - 1C The schematic diagram of the electrical connection of the chip in the e-cigarette sensor chip packaging structure shown.

[0053] Please refer to the accompanying drawings. The e-cigarette sensor chip packaging structure of this embodiment includes:

[0054] A head contour member 10, on which a first through hole P1 is formed;

[0055] A chip carrier 20, combined onto the head contour member, on the side away from the head contour member, a chip mounting cavity A is formed, and a second through hole P2 is provided at the bottom of the chip mounting cavity;

[0056] A sensor chip 41, mounted at the bottom of the chip mounting cavity, with its sensing film facing the second through hole;

[0057] A chamber cover 30, which covers the opening part of the chip mounting cavity to enclose the chip mounting cavity A.

[0058] Wherein, the sensing film communicates to the outside of the head contour member through the second through hole and the first through hole.

[0059] In this embodiment, the sensor chip is a new type of piezoelectric sensor chip. The piezoelectric sensor chip is fixed in the chip mounting cavity. The combination of the head contour member and the chip carrier can be designed according to the shape of the capacitive sensor to be compatible. Thus, when applying the new type of piezoelectric sensor chip to the production of e-cigarettes with a mature design, there is no need to change other designs of the e-cigarette, thereby greatly reducing the cost of popularizing and applying the piezoelectric sensor chip in the existing e-cigarette production field.

[0060] The following will separately elaborate on each component of the e-cigarette sensor chip packaging structure of this embodiment in detail.

[0061] In this embodiment, the head contour member, the chip carrier, and the chamber cover are all formed by injection molding of liquid crystal polymer. LCP (liquid crystal polymer) material, due to its unique molecular structure and thermal behavior, has the advantages of high temperature resistance, high flame retardancy, high rigidity, low moisture absorption, high radiation resistance, extremely low thermal conductivity, and extremely low permeability to gases and water vapor, and is particularly suitable for stably operating in the high temperature and high humidity environment where the e-cigarette sensor is located.

[0062] In this embodiment, by using LCP material to injection mold each component, the influence of temperature on the sensor chip can be effectively isolated, and the reliability, safety, and accuracy of the e-cigarette sensor can be greatly improved.

[0063] Those skilled in the art should understand that the above is only the preferred embodiment of the present invention. In other embodiments of the present invention, other injection molding materials can also be used, or only one or two of the three components are prepared from LCP material, and the present invention can be realized, and all are within the protection scope of the present invention.

[0064] Referring to the attached drawings, the head contour member 10 includes: a base portion 11 having a first through hole P1 in the vertical direction at its bottom; and an extension portion 12 extending upward from one side of the base portion. The chip carrier 20 is combined with one side of the extension portion of the head contour member. The outer peripheral surface contour of the combination formed by the chip carrier 20 and the extension portion 12 is the same as or smoothly transitions to the outer peripheral surface contour of the base portion; a chip mounting cavity A is formed inside the chip carrier, and a second through hole P2 is provided at the bottom of the chip mounting cavity.

[0065] In this embodiment, the electronic cigarette sensor chip packaging structure needs to be compatible with a traditional Φ6 capacitive sensor. Based on this, in this embodiment, the base portion 11 has a cylindrical structure, and its outer peripheral contour surface is a cylindrical surface; the combination formed by the chip carrier 20 and the extension portion 12 has an outer cylindrical surface that is continuous with the outer cylindrical surface of the base portion. The chamber cover is flush with the top surface of the extension portion away from the base portion. A radial groove B is provided inside the extension portion; the 3 signal pins led out from the chip mounting cavity first extend toward the radial groove B and are bent 90° in the radial groove B and then extend in a direction away from the base portion.

[0066] In this embodiment, the electronic cigarette sensor chip packaging structure is consistent with the external shape of the existing mainstream Φ6 electret microphone, can well adapt to the existing electronic cigarette structural parts, reduce the development cost and cycle, and the project can be introduced more quickly.

[0067] Of course, those skilled in the art should understand that the above is only a design for compatibility with the Φ6 electret microphone. In order to be compatible with other types of sensors, the shapes and sizes of the corresponding head contour members and chip carriers can be designed, and the present invention can also be realized, and it is also within the protection scope of the present invention.

[0068] In this embodiment, the chip carrier can be conveniently combined with the head contour member, and the extension portion ensures the firmness and reliability of the chip carrier fixed on the head contour member. The chamber cover can also be very conveniently covered, so that the structures of the components of the entire electronic cigarette sensor chip packaging structure are simple, easy to combine, and work reliably.

[0069] In this embodiment, the chip carrier 20 is combined with one side of the extension portion of the head contour member close to the central axis direction of the overall electronic cigarette sensor chip packaging structure, but the present invention is not limited thereto. The purpose of the extension portion is to jointly form the shape of the sensor to be compatible with the chip carrier and ensure the bonding strength between the base portion and the chip carrier. Therefore, when the shape of the sensor to be compatible is determined, the shape of the extension portion and the chip carrier can be complementary. The shape, position of the extension portion, the shape of the chip carrier, etc. can all be adjusted according to actual needs and are all within the protection scope of the present invention.

[0070] In this embodiment, the three signal pins are integrally formed with the injection molding material of the chip carrier. As Figure 5 shown, among the three signal pins - H1, H2, and H3, the starting ends of two signal pins - the first signal pin H1 and the second signal pin H2 are close to the radial groove B, and the starting end S of the third signal pin H3 is far from the radial groove B.

[0071] It should be particularly noted that since the third signal pin H3 extends a relatively long length, the starting end S of the third signal pin H3 is very prone to warping, resulting in poor signal contact. To avoid this situation, at the position corresponding to the starting end of the third signal pin, the chip carrier is provided with an upward axial limiting hole P3. Actual tests show that the axial limiting hole P3 can well avoid the warping of the starting end of the third signal pin.

[0072] Please refer to Figure 2A and Figure 3B , the base portion 11 of the head profile member is provided with an axial groove C opening towards the chip carrier along the axial direction. A partial area of the first through hole P1 falls into the bottom of the axial groove C, and another partial area falls into the position where the extension portion of the outer profile member is located. The top of the chip carrier forms an axial protrusion C' matching the axial groove. The second through hole P2 is provided at the top of the axial protrusion C'. The central axes of the first through hole P1 and the second through hole P2 are parallel and offset from each other. Among them, when the chip carrier is combined with the extension portion, the axial protrusion C' is embedded in the axial groove C, thereby realizing the fixation of the chip carrier on the head profile member. And, a gap for communicating the first through hole and the second through hole is formed between the axial protrusion C' and the axial groove C.

[0073] In this embodiment, through the embedded installation of the axial groove and the axial protrusion, the head profile member and the chip carrier can be conveniently combined. Even without adhesive fixation, the overall strength of the sensor chip packaging structure can be ensured through the embedded installation, reducing the manufacturing cost.

[0074] In the present utility model, the first through hole and the second through hole need to be communicated so that the sensing film can be communicated to the outside of the head profile member through the second through hole and the first through hole. To achieve the above purpose, there are three communication methods for the first through hole and the second through hole:

[0075] ① The second through hole is set opposite to the first through hole;

[0076] ② The second through hole and the first through hole are offset from each other, and the two are horizontally communicated through the gap between the head profile member and the chip carrier;

[0077] ③ The first through hole and the second through hole are communicated through an additional communication pipe.

[0078] In the process of implementing the present utility model, the applicant found that in traditional encapsulation, such as Φ6 or silicon microphone patch encapsulation, the air holes face the MEMS chip or the ASIC chip directly, so that sunlight shines directly on the MEMS chip or the ASIC chip, and the resulting photovoltaic effect affects the sensing accuracy.

[0079] In this embodiment, the second method described above is adopted, that is, the central axes of the first through hole P1 and the second through hole P2 are offset from each other, and they are connected through the gap formed between the opposite surfaces of the axial protrusion and the axial groove, so as to form a Z-shaped air duct. This Z-shaped air duct plays an isolating role in direct light irradiation, avoiding direct light irradiation on the internal chip, greatly reducing the generation of the photovoltaic effect, making the sensor voltage detection more accurate, and greatly improving the accuracy of the sensor. In addition, each structural member in the present utility model is set to black, which plays a certain role in absorbing light, thereby further reducing the probability of light interference.

[0080] In addition, in order to ensure the fixation of the chip carrier and the head profile member, a glue receiving groove F is provided at the top of the chip carrier outside the axial protrusion; during device assembly, sealant can be injected into the glue receiving groove F, and the chip carrier and the head profile member are adhesively connected. Among them, the material used for adhesion is silicone.

[0081] Those skilled in the art should understand that the above is only a preferred embodiment of the present utility model. In other embodiments of the present utility model, other methods can also be used to fix the chip carrier on the head profile member, which can also achieve the present utility model and is also within the protection scope of the present utility model.

[0082] In order to avoid the contamination of the sensor chip by e-liquid as much as possible, this embodiment adopts a special design. Please refer to Figure 1C and Figure 3B , in this embodiment, an oil collecting groove E is provided on the top surface of the chip carrier facing the base portion. The oil collecting groove E extends in the horizontal direction, having a strip structure, and one side of the oil collecting groove E facing the extension portion of the outer contour member is an open structure, and the opening structure is closed by the extension portion on the opposite side.

[0083] Those skilled in the art can understand that since the central axes of the first through hole P1 and the second through hole P2 are offset from each other, the e-liquid will not directly enter the second through hole P2 from the first through hole P1, but must pass through the oil collecting groove E extending in the horizontal direction before entering the chip installation cavity, thereby reducing the probability of the e-liquid condensate entering the chip installation cavity.

[0084] Further, a stepped structure T is formed in the oil collecting groove E. The side of the stepped structure T close to the second through hole is the higher side, and the side close to the first through hole is the lower side. Thus, the tobacco oil condensate in the air flow entering from the external environment will remain on the lower side of the step, that is, the side of the first through hole, and will not enter the sensor chip through the second through hole P2, thereby further reducing the probability of the tobacco oil condensate entering the chip installation cavity.

[0085] Figure 6 For Figures 1A - 1C It is a schematic diagram of the electronic cigarette sensor chip packaging structure to avoid tobacco oil entering the chip installation cavity in the application scenario of the electronic cigarette. Among them, the air mixed with tobacco oil enters the first through hole P1, and it flows horizontally along the oil collecting groove. During the flow, the tobacco oil condenses into liquid. Due to the existence of the stepped structure, the tobacco oil condensate remains on the lower side of the oil collecting groove and will not enter the chip installation cavity A through the second through hole P2.

[0086] It can be seen that by setting the oil collecting groove and the stepped structure, the present invention can prevent the tobacco oil condensate and the like from flowing to the chip installation cavity to corrode the ASIC and MEMS chips, and improves the accuracy and service life of the chips.

[0087] In this embodiment, the chamber cover 30 is covered on the opening part of the chip installation cavity to seal the chip installation cavity. In order to ensure the reliable connection between the chamber cover 30 and the chip installation cavity, a plurality of matching buckle structures 31 are provided between the chamber cover and the opening part of the chip installation cavity. And, the chamber cover 30 is glued to the opening part of the chip installation cavity. The material used for gluing is silica gel.

[0088] It should be particularly noted that the existing technology electronic cigarette sensors use solder paste welding and physical curling of the microphone head. However, the applicant found that the sealing effect of this packaging method is poor under high temperature and high humidity conditions, especially after long-term use. In this embodiment, the chip carrier 20 and the head profile 10 are adhesively connected. At the same time, the chamber cover 30 is adhesively covered on the opening part of the chip installation cavity A. The two adhesive materials are both silica gel materials. Using silica gel materials for packaging has a good sealing effect under high temperature and high humidity conditions, and can still ensure a good sealing effect after long-term use. And, the cured silica gel is soft, which is more beneficial for the next packaging of the device. Of course, if the sealing accuracy requirement is not particularly high, epoxy glue can also be used for gluing.

[0089] The following refers to the drawings to introduce the assembly process of the electronic cigarette sensor chip packaging structure of this embodiment:

[0090] The first step: First, the MEMS piezoelectric sensor chip 41 and the ASIC chip 42 are installed in the chip installation cavity A through die bonding technology, and the sensing film of the MEMS piezoelectric sensor chip 41 is aligned with the second through hole P2;

[0091] Step 2: Bond and wire the MEMS piezoelectric sensor chip 41 and the ASIC chip 42 to achieve electrical signal connection;

[0092] Step 3: Bond the chamber cover 30 and the chip carrier 20 together with silicone. The chamber cover 30 is similar to the bottom cover to seal the chip installation chamber and prevent water vapor from entering;

[0093] Step 4: Combine the object prepared in Step 3 with the head contour part 10. The head contour part 10 is similar to the top cover and is bonded with silicone (method of applying glue: face glue or machine scribing glue) to complete the preparation of the e-cigarette sensor chip packaging structure of this embodiment.

[0094] Regarding the e-cigarette sensor chip packaging structure of the present utility model, the following aspects need to be explained:

[0095] (1) Extension directions of the first through hole and the second through hole

[0096] In this embodiment, both the first through hole P1 and the second through hole P2 are along the vertical direction, and their central axes are parallel but offset from each other.

[0097] Those skilled in the art should understand that the above are only the preferred implementation manners of the present utility model. In other embodiments of the present utility model, the first through hole and the second through hole do not necessarily have to be strictly along the vertical direction, as long as they are not directly opposite to each other and the e-liquid condensate cannot directly enter the second through hole from the first through hole. These manners can also achieve the present utility model and are also within the protection scope of the present utility model.

[0098] (2) Communication between the first through hole and the second through hole

[0099] In this embodiment, the first through hole and the second through hole are communicated through an oil collecting groove along the horizontal direction. In other words, the first-level function of the oil collecting groove in this embodiment is to achieve the horizontal communication between the first through hole and the second through hole; the second-level function is to collect the e-liquid condensate.

[0100] Those skilled in the art should understand that the above are only the preferred implementation manners of the present utility model. In other embodiments of the present utility model, the first through hole and the second through hole can also be communicated through a gap formed between the opposite surfaces of an axial protrusion and an axial groove that are generally along the horizontal direction. Even if this gap cannot achieve the collection of e-liquid, it can also partially achieve the present utility model and is also within the protection scope of the present utility model.

[0101] (3) Opening of the oil collecting groove

[0102] In this embodiment, one side of the oil collecting groove E facing the extension of the outer contour member is of an open structure, and the opening structure is closed by the extension on the opposite side, jointly forming a cigarette oil condensate collection cavity. The purpose of such a setting is as follows: ① To avoid the difficulty in injection molding of the chip carrier caused by the fine-sized oil collecting groove E, thereby reducing the manufacturing cost of the chip carrier; ② To expand the volume of the oil collecting groove as much as possible.

[0103] Those skilled in the art should understand that the above is only the preferred implementation mode of the present utility model. In other embodiments of the present utility model, the oil collecting groove E can also form an enclosing structure by itself, such as Figure 3C shown. Figure 3C The chip carrier shown has a relatively high manufacturing cost and a small volume, but it can also prevent the cigarette oil condensate from entering the chip installation cavity. Moreover, the advantage of this structure is that the cigarette oil condensate will not seep into the space between the chip carrier and the head contour member, and the cleanliness and reliability of the electronic cigarette sensor chip packaging structure are higher.

[0104] (4) Formation of the oil collecting groove

[0105] In this embodiment, the oil collecting groove is realized by a groove on the axial protrusion. Such a setting is beneficial to reducing the manufacturing cost and improving the collection efficiency of the cigarette oil condensate.

[0106] Those skilled in the art should understand that the above is only the preferred implementation mode of the present utility model. In other embodiments of the present utility model, since the axial protrusion and the axial groove are complementary structures, the oil collecting groove can also be realized in the axial groove of the base part, which can also achieve the present utility model and is also within the protection scope of the present utility model.

[0107] (5) Shape and number of the step structures

[0108] In this embodiment, the step structure extends linearly on a horizontal plane and has only one level. Such a setting is beneficial to reducing the manufacturing cost and improving the cigarette oil collection efficiency.

[0109] Those skilled in the art should understand that the above is only the preferred implementation mode of the present utility model. In other embodiments of the present utility model, the step structure can also extend along an arc on a horizontal plane, can also be provided with multiple levels, or can be directly set as a slope structure. These deformation methods can also achieve the present utility model and are also within the protection scope of the present utility model.

[0110] (6) Chamber cover

[0111] In this embodiment, an independent chamber cover 30 is provided, that is, the chamber cover 30 is independently arranged from the chip carrier 20. The advantage of such a setting is convenient assembly and reduced production cost. After installing the sensor chip and the ASIC chip in the chip installation cavity A, the chamber cover 30 can be covered and sealed.

[0112] However, the present invention is not limited to this embodiment. In other embodiments of the present invention, the chamber cover can be designed as an integral part with the chip carrier, or a separate chamber cover is no longer provided. As long as the reliability and safety of the sensor chip and the ASIC chip in the chip installation cavity can be guaranteed, the present invention can be implemented and is within the protection scope of the present invention.

[0113] (7) Sensor type

[0114] The application field of this embodiment is electronic cigarette sensor, so the sensor chip used is a MEMS piezoelectric sensor chip. However, the present invention is not limited to this. Similarly, in the application of electronic cigarette sensors, other types of sensors can also apply the packaging structure technical solution of the present invention to achieve compatibility with existing packaging structures. Furthermore, in other application fields, various types of sensors can apply the packaging structure technical solution of the present invention, which is also within the protection scope of the present invention.

[0115] (8) Sensor chip

[0116] In this embodiment, the sensor chip is directly facing the second through hole, but the present invention is not limited thereto. In other embodiments of the present invention, the sensor chip only needs to be connected to the second through hole, and the two may be directly connected through a curved path, which can also implement the present invention and is also within the protection scope of the present invention.

[0117] (9) Other application areas

[0118] This embodiment is described by taking the electronic cigarette sensor chip packaging structure as an example, but the present invention is not limited to this. In other embodiments of the present invention, sensor chip packaging structures in other fields also adopt the technical solution of the present invention, so that the sensor chip of the new technology can be applied to the existing electronic device design in a low-cost and fast-cycle manner, which can also realize the present invention and is also within the protection scope of the present invention.

[0119] At this point, the electronic cigarette sensor chip packaging structure of the embodiment of the present utility model is introduced.

[0120] Based on the above electronic cigarette sensor chip packaging structure, the second aspect of the present invention provides an electronic cigarette. In one embodiment of the present invention, the electronic cigarette includes:

[0121] An electronic cigarette smoking device, wherein an atomizer is arranged inside and an electronic cigarette mouthpiece is arranged at the end;

[0122] The electronic cigarette sensor chip packaging structure of the above embodiment is arranged in the electronic cigarette smoking device, and further includes:

[0123] A piezoelectric sensor chip is installed at the bottom of the chip installation cavity, and its sensing film faces the second through hole; a microcontroller chip is installed at the bottom of the chip installation cavity and is signal-connected to the piezoelectric sensor chip;

[0124] Wherein, the sensing film of the piezoelectric sensor chip is connected to the electronic cigarette mouthpiece through the second through hole and the first through hole, and the microcontroller chip controls the opening and closing of the atomizer according to the user suction signal provided by the piezoelectric sensor chip.

[0125] In the electronic cigarette of this embodiment, the use of a piezoelectric sensor chip improves the sensitivity and safety of the electronic cigarette, and due to the adoption of a specific packaging structure of the electronic cigarette sensor chip, it can be compatible with existing electronic cigarette design schemes, saving the cost of separate development.

[0126] So far, the introduction of the electronic cigarette of the present utility model embodiment is completed.

[0127] It should be noted that for some implementation manners, if they are not the key content of the present utility model and are well-known to those of ordinary skill in the art, then due to space limitations, they are not described in detail in the specification drawings or the text. At this time, reference can be made to the relevant prior art for understanding.

[0128] So far, the introduction of each embodiment of the present utility model is completed. Based on the above description, those skilled in the art should have a clear understanding of the present utility model.

[0129] The ordinal numbers used in the specification and claims, such as "first", "second", "third", "main", "sub", as well as Arabic numerals, letters, etc., are used to modify the corresponding elements (or steps). Their original intention is only to enable an element (or step) with a certain name to be clearly distinguished from another element (or step) with the same name, and does not mean that the element (or step) has any ordinal number, nor does it represent the order of one element (or step) and another element (or step).

[0130] It should also be noted that the directional terms mentioned in the embodiments, such as "center", "horizontal", "longitudinal", "top", "bottom", "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc., indicate the orientation or positional relationship only based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. And throughout the drawings, the same elements are represented by the same or similar reference numerals. And the shapes and sizes of the components in the drawings do not reflect the true sizes and proportions, but only illustrate the content of the embodiments of the present utility model.

[0131] Those skilled in the art should understand that in the claims and the specification of the present utility model, the word "comprising" does not exclude the existence of elements (or steps) not listed in the claims. The word "a" or "an" preceding an element (or step) does not exclude the existence of a plurality of such elements (or steps).

[0132] It should be understood that the purpose of providing the above embodiments is only to enable the present utility model to meet legal requirements, and the present utility model can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein.

[0133] Furthermore, in order to streamline the present utility model, in the above description of the exemplary embodiments of the present utility model, the various features of the present utility model are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present utility model should not be construed as reflecting an intention that the claimed utility model requires more features than those expressly recited in each claim. Rather, as reflected in the claims, each aspect of the utility model lies in less than all the features of the preceding single embodiment. And, the embodiments may be used in combination with each other or with other embodiments based on design and reliability considerations, that is, the technical features in different embodiments can be freely combined to form more embodiments. Therefore, the claims following the specific implementation manners are hereby expressly incorporated into the specific implementation manners, where each claim itself serves as a separate embodiment of the present utility model.

[0134] In the above specific embodiments, the purpose, technical means and beneficial effects of the present utility model are described in detail. It should be understood that the purpose of the detailed description is for those skilled in the art to understand the present utility model more clearly and is not used to limit the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A sensor chip packaging structure, characterized in that, Comprising: A head profile member, on which a first through hole is formed; A chip carrier, combined onto the head profile member, on the side away from the head profile member, a chip mounting cavity is formed, and a second through hole is provided at the bottom of the chip mounting cavity; A sensor chip, mounted at the bottom of the chip mounting cavity, and its sensing film communicates with the second through hole; Wherein, the sensing film communicates with the outside of the head profile member through the second through hole and the first through hole.

2. The sensor chip packaging structure according to claim 1, characterized in that The second through hole is disposed opposite to the first through hole; Or, the second through hole and the first through hole are offset from each other, and the two are horizontally communicated through the gap between the head profile member and the chip carrier.

3. The sensor chip packaging structure according to claim 2, characterized in that The head profile member includes: A base portion, at the bottom of which the first through hole is provided; An extension portion, extending upward from the base portion; A chip carrier, combined onto the extension portion of the head profile member; Wherein, the second through hole and the first through hole are offset from each other, and the two are horizontally communicated through the gap between the base portion and the chip carrier.

4. The sensor chip packaging structure according to claim 3, characterized in that The base portion has a cylindrical structure, and the extension portion extends upward on one side of the base portion; The outer peripheral surface profile of the combined body formed by the combination of the chip carrier and the extension portion is the same as or smoothly transitions to the outer peripheral surface profile of the base portion; The sensor chip packaging structure further includes: a chamber cover, covering the opening of the chip mounting cavity, and flush with the top surface of the extension portion away from the base portion.

5. The sensor chip packaging structure according to claim 4, characterized in that One or more of the head profile member, the chip carrier, and the chamber cover are formed by injection molding of liquid crystal polymer; And / or, the combined body formed by the combination of the chip carrier and the extension portion has an outer cylindrical surface continuous with the outer cylindrical surface of the base portion; And / or, the head profile member, the chip carrier, and the chamber cover are all black; And / or, the base portion has a cylindrical structure; the cross-section of the chip carrier is semi-circular; And / or, the chamber cover is adhered to the opening of the chip mounting cavity to close the chip mounting cavity, and the adhesive material is silicone; And / or, a mutually matching snap structure is provided between the chamber cover and the opening of the chip mounting cavity.

6. The sensor chip packaging structure according to claim 3, characterized in that A radial groove is provided inside the extension portion; N signal pins led out from the chip mounting cavity first extend towards the radial groove, and after being bent 90° in the radial groove, extend in a direction away from the base portion, N≥1.

7. The sensor chip packaging structure according to claim 6, characterized in that The N signal pins include: a third signal pin, and the starting end of the third signal pin in the chip mounting cavity is located on the side away from the radial groove; At the position corresponding to the starting end of the third signal pin, an axial limiting hole is provided at the bottom of the chip mounting cavity.

8. The sensor chip packaging structure according to claim 3, wherein, A stepped structure or a ramp structure is formed in the gap between the base portion and the chip carrier; Wherein, the projection of the first through hole in the gap is located on the lower side of the stepped structure or the ramp structure, and the projection of the second through hole in the gap is located on the higher side of the stepped structure or the ramp structure.

9. The sensor chip packaging structure according to claim 8, wherein The base portion is provided with an axial groove opening towards the chip carrier, and at least a part of the first through hole is located at the bottom of the axial groove; An axial protrusion matching the axial groove is formed on the top of the chip carrier, and the second through hole is arranged on the top of the axial protrusion; Wherein, when the chip carrier and the extension portion are combined, the axial protrusion is embedded in the axial groove, and a gap for the first through hole and the second through hole to communicate horizontally is formed between the opposite surfaces of the axial protrusion and the axial groove.

10. The sensor chip packaging structure according to claim 9, wherein ； The gap between the axial protrusion and the axial groove includes: an oil collecting groove formed on the top of the axial protrusion; A stepped structure is arranged in the oil collecting groove; Wherein, the oil collecting groove itself forms a circumferentially closed groove structure; or, one side of the oil collecting groove facing the extension portion is in an open shape, and the oil collecting groove and the opposite extension portion jointly enclose a circumferentially closed groove structure.

11. The sensor chip packaging structure according to claim 10, wherein On the top of the chip carrier outside the axial protrusion, a glue receiving groove is arranged; the chip carrier and the head profile member are adhesively connected; and / or, the sensing film of the sensor chip is arranged opposite to the second through hole; and / or, both the first through hole and the second through hole are along the vertical direction, and the central axes of the two are parallel to each other; and / or, compared with the second through hole, the first through hole is arranged at a position closer to the central axis; and / or, the oil collecting groove is in a strip structure and extends in the horizontal direction; and / or, the shape of the oil collecting groove extending on the horizontal plane is a straight line or an arc.

12. An electronic cigarette, characterized in that, Comprising: An electronic cigarette smoking device, which is internally provided with an atomizer and an electronic cigarette mouthpiece at the end; The sensor chip packaging structure according to any one of claims 1 to 11, which is arranged in the electronic cigarette smoking device, wherein The sensor chip is a piezoelectric sensor chip; Further comprising: a microcontroller chip, which is installed at the bottom of the chip installation cavity and is signal-connected to the piezoelectric sensor chip; Wherein, the sensing film of the piezoelectric sensor chip is communicated to the electronic cigarette mouthpiece through the second through hole and the first through hole, and the microcontroller chip controls the opening and closing of the atomizer according to the user suction signal provided by the piezoelectric sensor chip.

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