Automatic sorting device for lettered wafers

Abstract

The utility model discloses an automatic sorting device after wafer lettering, and relates to the technical field of wafer regeneration, the automatic sorting device comprises an outer frame and a wafer main body, the bottom end of the outer frame is fixedly connected with a bottom plate, and the top end of the inner wall of the outer frame and the top end of the bottom plate are symmetrically provided with two image detection mechanisms; the image detection mechanism is used for recording and managing lettering codes on wafers of all customers, meshing columns are symmetrically arranged in the middle of the outer frame and the middle of the bottom plate, two crawler belts are symmetrically meshed with the outer portions of the meshing columns, and the wafer bodies are placed in the middles of the two crawler belts in an attached mode. The automatic overturning device has the main advantages that the wafer body can be automatically overturned through the outer frame, the bottom plate, the image detection mechanism and the telescopic mechanism, so that the requirement of manual intervention can be reduced, the speed of the whole sorting process is increased, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer regeneration, in particular to an automatic sorting device for wafers after scribing. Background Art

[0002] Wafers can be divided into positive wafers, control wafers and dummy wafers according to different application scenarios in the chip factory. Among them, the main function of the dummy wafer is to maintain the stability of the machine tool, and the sources of the dummy wafers are mainly new wafers and regenerated wafers. Through chemical immersion, physical grinding and other treatment methods, various films, surface particle residues, etc. generated on the surfaces of the dummy wafers and control wafers during testing are removed, so that the wafers can regain the functions of testing and stabilizing the machine tool.

[0003] When the existing automatic sorting device performs sorting, it is necessary for the user to manually turn each wafer to ensure that there is no situation where the wafers have different directions during sorting, but manual operation increases the complexity and time cost of the operation.

[0004] Regarding the problem of complex operation caused by manually turning the wafer in the above solution, the scribed code on the wafer surface is read by the wafer scribed code reading mechanism. When it is read that the scribed characters on the wafer surface are not in the opposite direction, the telescopic device is controlled by the wafer data processing device to move up and down to turn the wafer over, so as to solve the problem of complex operation.

[0005] However, during the process of the wafer entering the conveying device, since the wafer is mostly placed manually, the surface of the wafer may be contaminated with fingerprints and other contaminants, which may cause problems affecting the quality and performance of the wafer. Summary of the Utility Model

[0006] The purpose of the utility model is to solve the shortcomings existing in the prior art, and to propose an automatic sorting device for wafers after scribing, and the technical problem it solves is the problem of complex operation caused by manually turning the wafer.

[0007] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0008] An automatic sorting device for wafers after scribing, including an outer frame and a wafer body. A bottom plate is fixedly connected to the bottom end of the outer frame. Two image detection mechanisms are symmetrically arranged at the top end of the inner wall of the outer frame and the top end of the bottom plate. The image detection mechanism is used for collecting and managing the scribed codes on the wafers of each customer. Meshing columns are symmetrically arranged in the middle of the outer frame and the bottom plate. Two track belts are symmetrically meshed outside the meshing columns. The wafer body is placed in the middle of the two track belts in a fitting manner. Thus, automatic reading and collection of the scribed codes on the wafer body can be achieved, thereby greatly improving the efficiency and accuracy of data acquisition.

[0009] As a further improvement of the present utility model, one connecting rod one is symmetrically and fixedly connected to both sides of the outer frame. One end of the connecting rod one away from the outer frame is fixedly connected to a horn-shaped frame. A flat frame is arranged at the narrow end of the horn-shaped frame. Sliding strips are symmetrically and fixedly connected to the upper and lower sides of the flat frame close to the horn-shaped frame. The sliding strips are slidably connected to the side of the horn-shaped frame close to the flat frame. Thus, the wafer body can be aligned and fall between the track strips through the horn-shaped frame and the flat frame.

[0010] As a further improvement of the present utility model, two support rods are symmetrically and fixedly connected to the bottom end of the horn-shaped frame. The bottom ends of the support rods are fixedly connected to the top end of the bottom plate. Connecting rods two are symmetrically rotatably connected to both sides of the meshing column. The bottom ends of the connecting rods two are fixedly connected to the top end of the bottom plate. The sides of the connecting rods two close to the outer frame are fixedly connected to the outer frame. Thus, a supporting effect can be achieved on the horn-shaped frame and the meshing column.

[0011] As a further improvement of the present utility model, a support body is fixedly connected to the top end of the outer frame. A sliding groove is fixedly connected to the top end of the support body. A collection frame is movably connected to the side of the support body away from the meshing column. Two telescopic mechanisms are arranged at the top end of the inner wall of the outer frame and the top end of the bottom plate in a staggered manner. Thus, the wafer body can be flipped after it is detected to reach a suitable position.

[0012] As a further improvement of the present utility model, a motor is fixedly connected to the side of the meshing column close to the horn-shaped frame. Thus, the rotation of the meshing column can be driven by the start of the motor.

[0013] As a further improvement of the present utility model, the distances between the two telescopic mechanisms and the center of the wafer body are one closer and one farther. The distance between the two track strips is the same as the diameter of the wafer body. Thus, a flipping effect can be achieved on the wafer body attached to the middle of the track strips.

[0014] As a further improvement of the present utility model, a wiping cloth is arranged inside the flat frame. A soft pad is arranged at the top end of the sliding groove. Thus, fingerprints that may adhere to the surface of the wafer body can be wiped, and the wafer body can be prevented from being damaged during the transmission process.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] 1. Through the outer frame, bottom plate, image detection mechanism and telescopic mechanism, when the wafer body passes through the middle of the two image detection mechanisms, the image detection mechanism uploads the image. When it is detected that the directions of the wafer bodies are opposite, a signal is transmitted to the telescopic mechanism. When the wafer body moves to the set position, the upper and lower telescopic mechanisms are started simultaneously to erect the wafer body. When the telescopic mechanism returns to its original position, the wafer body is flipped. Automatic flipping can reduce the need for manual intervention, speed up the entire sorting process, and improve production efficiency. Moreover, through automatic flipping, the risk of damaging the wafer body during the manual operation process can be reduced, and the stability of the production line can be improved. Automatic flipping can also ensure that each wafer goes through the same processing procedure, thus ensuring the consistency of product quality. Reducing manual operation can also reduce labor costs and improve the economic benefits of the production line.

[0017] 2. Through the horn frame, flat frame and wafer body, the user puts the wafer body through the large opening of the horn frame, and then the wiping cloth on the inner wall of the flat frame wipes the fingerprint stains on the surface of the wafer body. After the wiping is completed, due to the alignment of the gap between the flat frame and the track strip, the wafer body is completely attached between the track strips, so as to achieve the effect of wiping the fingerprint stains on the surface of the wafer body before sorting. Fingerprints and stains on the surface of the wafer body may interfere with the accuracy of the detection equipment. Wiping can reduce these interferences and ensure the accuracy during the sorting process. Regularly cleaning the wafer surface can also extend the service life of the detection equipment and reduce equipment damage caused by stain accumulation. Moreover, a clean wafer surface helps to ensure product quality and reduce production defects caused by surface stains. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of the present utility model.

[0019] Figure 2 It is a schematic cross-sectional structural diagram of the outer frame and the bottom plate of the present utility model.

[0020] Figure 3 It is a schematic structural diagram of the misaligned state of the horn frame and the flat frame of the present utility model.

[0021] Figure 4 It is a schematic structural diagram of the meshing column, track strip and motor of the present utility model.

[0022] In the figure: 101, outer frame; 102, bottom plate; 103, support body; 104, collection box; 105, sliding groove; 106, image detection mechanism; 107, telescopic mechanism; 201, horn frame; 202, flat frame; 203, sliding strip; 204, connecting rod one; 205, support rod; 206, connecting rod two; 207, meshing column; 208, track strip; 209, motor; 300, wafer body. Detailed implementation mode

[0023] In order to make the above-mentioned objects, features and advantages of the present utility model more obvious and understandable, the following will describe the detailed implementation mode of the present utility model in conjunction with the attached drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific implementations disclosed below.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation mode.

[0025] As shown in the figure, an automatic sorting device for wafers after scribing includes an outer frame 101, a bottom plate 102, an image detection mechanism 106, a telescopic mechanism 107, a meshing column 207, a track bar 208, a motor 209 and a wafer body 300.

[0026] Since a meshing post 207 is fixedly connected to the output shaft of the motor 209, when the motor 209 starts, it will drive the meshing post 207 to rotate. Since the crawler strips 208 are symmetrically meshed outside the two meshing posts 207, the rotation of the meshing post 207 will drive the crawler strips 208 to move along the movement trajectory of the rotation of the two meshing posts 207. Since the connecting rods two 206 are rotatably connected to the sides of the crawler strips 208, and the bottom ends of the connecting rods two 206 are fixedly connected to the top end of the bottom plate 102, and the sides of the connecting rods two 206 are fixedly connected to the sides of the outer frame 101, the meshing post 207 and the crawler strips 208 are limited by the support of the outer frame 101 and the bottom plate 102. When the wafer body 300 moves to the bottom of the image detection mechanism 106 driven by the crawler strips 208, the image detected by the image detection mechanism 106 is uploaded at this time. When it is detected that the direction of the wafer body 300 is opposite, a start signal is transmitted to the telescopic mechanism 107. When the wafer body 300 moves to the set position, at this time, the distances between the two telescopic mechanisms 107 and the center of the wafer body 300 are one closer and one farther. The upper and lower telescopic mechanisms 107 are started simultaneously to erect the wafer body 300. When the telescopic mechanism 107 returns to its original position, the wafer body 300 is flipped. Automatic flipping can reduce the need for manual intervention, speed up the entire sorting process, and improve production efficiency. Moreover, through automatic flipping, the risk of damage to the wafer body 300 during the manual operation process can be reduced, and the stability of the production line can be improved.

[0027] Moreover, through the detection of the image detection mechanism 106, the automatic reading and collection of the wafer engraving code are realized, which greatly improves the efficiency and accuracy of data acquisition. The customer information is bound through the wafer engraving code at the incoming material receiving stage and a corresponding engraving code database for the customer is formed. The database plays a role in data control during the various flows of the entire recycled wafer. Through data integration, the number of times of customer wafer regeneration can be automatically analyzed, and the process distinction actions of the wafers with and without copper can be controlled. At the same time, this functional system is optimized to add a sorting function, which can determine and classify the data of the incoming wafer engraving code, and is more accurate and efficient than manual determination.

[0028] Furthermore, the image detection mechanism 106 internally includes a data collection module and a data determination module; the data collection module includes the collection of content such as customer product name, production batch information, input date, input quantity, and corresponding product engraving code, and forms a systematic management module; the data determination module determines the data generated by the data collection module and generates a sorting file. It is required that the generated sorting file classifies the wafers. At the same time, when the customer requests that special processing be performed on certain engraving codes, corresponding sorting files can also be generated according to the customer's requirements to meet the customer's needs.

[0029] Further, during the process of feeding the wafer body 300, the wafer body 300 enters the flat frame 202 through the horn frame 201. Due to the wiping cloth provided inside the flat frame 202, when the wafer body 300 passes through the wiping cloth on the inner wall of the flat frame 202, the wiping cloth will wipe the fingerprint stains on the surface of the wafer body 300. After the wiping is completed, due to the alignment of the gap between the flat frame 202 and the track bar 208, the wafer body 300 is completely attached between the track bars 208, so as to achieve the effect of wiping the fingerprint stains on the surface of the wafer body 300 before sorting the wafer body 300. The fingerprints and stains on the surface of the wafer body 300 may interfere with the accuracy of the detection equipment, and wiping can reduce these interferences to ensure the accuracy during the sorting process.

[0030] The advantages of the present utility model are as follows: 1) Automatically flipping the wafer can reduce the need for manual intervention, speed up the entire sorting process, and improve production efficiency. 2) Through the detection of the reading mechanism, automatic reading and collection of the wafer engraving code are achieved, greatly improving the efficiency and accuracy of data acquisition. 3) The wafer can be sorted digitally, so as to generate corresponding sorting files according to customer requirements to meet customer needs. 4) The fingerprints and stains on the surface of the wafer can be wiped. The stains on the surface of the wafer may interfere with the accuracy of the detection equipment, and wiping can reduce these interferences to ensure the accuracy during the sorting process.

[0031] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, making equivalent replacements or changes should be covered within the protection scope of the present utility model.

Claims

1. An automatic sorting device after wafer scribing, comprising an outer frame (101) and a wafer body (300), characterized in that, The bottom end of the outer frame (101) is fixedly connected with a bottom plate (102). At the top ends of the inner wall of the outer frame (101) and the bottom plate (102), two image detection mechanisms (106) are symmetrically arranged. The image detection mechanisms (106) are used for collecting and managing the engraved codes on the wafers of each customer. At the middle parts of the outer frame (101) and the bottom plate (102), meshing columns (207) are symmetrically arranged. Two track bars (208) are symmetrically meshed outside the meshing columns (207). The wafer body (300) is placed in the middle of the two track bars (208) in a fitting manner.

2. The automatic sorting device for wafers after scribing according to claim 1, wherein On both sides of the outer frame (101), connecting rods one (204) are symmetrically and fixedly connected. At the end of the connecting rod one (204) far from the outer frame (101), a horn frame (201) is fixedly connected. At the narrow end of the horn frame (201), a flat frame (202) is arranged. On the side of the flat frame (202) close to the horn frame (201), sliding bars (203) are symmetrically and fixedly connected up and down. The sliding bars (203) are slidably connected with the side of the horn frame (201) close to the flat frame (202).

3. The automatic sorting device for wafers after scribing according to claim 2, wherein At the bottom end of the horn frame (201), two support rods (205) are symmetrically and fixedly connected. The bottom ends of the support rods (205) are fixedly connected to the top end of the bottom plate (102). On both sides of the meshing column (207), connecting rods two (206) are symmetrically and rotatably connected. The bottom ends of the connecting rods two (206) are fixedly connected to the top end of the bottom plate (102). On the side of the connecting rods two (206) close to the outer frame (101), they are all fixedly connected with the outer frame (101).

4. The automatic sorting device for wafers after scribing according to claim 2, characterized in that, At the top end of the outer frame (101), a support body (103) is fixedly connected. At the top end of the support body (103), a sliding groove (105) is fixedly connected. On the side of the support body (103) far from the meshing column (207), a collection box (104) is movably connected. At the top ends of the inner wall of the outer frame (101) and the bottom plate (102), two telescopic mechanisms (107) are arranged in a staggered manner.

5. The automatic sorting device for wafers after scribing according to claim 2, wherein, On the side of the meshing column (207) close to the horn frame (201), a motor (209) is fixedly connected.

6. The automatic sorting device for wafers after scribing according to claim 4, wherein, The distances between the two telescopic mechanisms (107) and the center of the wafer body (300) are one closer and one farther. The distance between the two track bars (208) is the same as the diameter of the wafer body (300).

7. An automatic sorting device for wafers after scribing according to claim 4, characterized in that, A wiping cloth is arranged inside the flat frame (202), and a soft pad is arranged at the top end of the sliding groove (105).

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