Rapid cooling device of SMT reflow soldering machine
By introducing a solenoid valve-controlled nitrogen pipeline system in the SMT reflow solder, the use of low-temperature nitrogen to quickly cool down, the long-term cooling problem during model conversion is solved, production efficiency is improved, and the environment and workers' health is protected.
Patent Information
- Application Number
- CN202422232725.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-09-11
AI Technical Summary
Existing SMT reflow machines require long periods of natural cooling during model conversion, resulting in inefficiency and volatile fluxes have an impact on the environment and worker health.
The nitrogen pipeline system controlled by solenoid valves is used to transport the low-temperature nitrogen to the reflow welding chamber through stainless steel pipes to achieve rapid cooling, and the electronic control system controls the on and off of nitrogen.
It realizes rapid cooling of SMT reflow soldering machines, shortens waiting time, reduces heat radiation and flux volatilization, and protects the production environment and workers' health.
Smart Images

Figure CN223146202U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of surface mounting in the electronic manufacturing industry, and particularly relates to a rapid cooling device for an SMT reflow soldering machine. Background Art
[0002] At present, when an SMT reflow soldering machine is in use, it often involves the surface mounting technology processing of different production products. For example, when converting from model A to model B, if the reflow soldering temperatures required for model A and model B are quite different, it is often necessary to cool down the SMT reflow soldering machine. The existing cooling method is generally to open the lid of the reflow soldering machine for natural cooling. This method requires 20 - 30 minutes for cooling, which takes a long time to wait, and the heat dissipated outward also affects the production environment where the workers are located. At the same time, during the long cooling process, a large amount of soldering flux will volatilize, which not only causes waste but also causes certain harm to the workers' bodies due to the smell of the volatilized soldering flux.
[0003] Therefore, it is necessary to design a device that can rapidly cool down the SMT reflow soldering machine. Summary of the Utility Model
[0004] In order to solve the above problems existing in the prior art, this solution provides a rapid cooling device for an SMT reflow soldering machine.
[0005] The technical solution adopted by the utility model is as follows:
[0006] A rapid cooling device for an SMT reflow soldering machine includes an electric control system, a solenoid valve, a nitrogen source, and a stainless steel pipe; one end of the stainless steel pipe is arranged outside the SMT reflow soldering machine and is connected to the outlet of the solenoid valve; the inlet of the solenoid valve is communicated with the nitrogen source; the other end of the stainless steel pipe extends into the reflow soldering chamber of the SMT reflow soldering machine, and a plurality of exhaust holes are arranged on the pipe wall where the stainless steel pipe extends, so as to convey nitrogen into the reflow soldering chamber and cool the temperature in the SMT reflow soldering machine; the electric control system is electrically connected to the solenoid valve to control the on - off of the solenoid valve.
[0007] As an alternative or supplement to the above rapid cooling device for an SMT reflow soldering machine: The part of the stainless steel pipe extending into the reflow soldering chamber is in a straight - tube shape, S - shape, spiral shape, U - shape or Y - shape.
[0008] As an alternative or supplement to the above rapid cooling device for an SMT reflow soldering machine: The electric control system includes a PLC controller, a power supply, and a relay; the power supply is connected to the solenoid valve through the relay; the PLC controller is powered by the power supply and is connected to the control end of the relay.
[0009] As an alternative or supplement to the rapid cooling device of the above SMT reflow soldering machine: The electric control system further includes an industrial computer, which is communicatively connected to the PLC controller; the industrial computer is also connected to a display.
[0010] As an alternative or supplement to the rapid cooling device of the above SMT reflow soldering machine: The nitrogen source includes a liquid nitrogen tank and an evaporator. The outlet of the liquid nitrogen tank is connected to the evaporator through a pipeline. The outlet of the evaporator is connected to the inlet of the solenoid valve. The evaporator is used to evaporate liquid nitrogen into nitrogen gas below normal temperature.
[0011] As an alternative or supplement to the rapid cooling device of the above SMT reflow soldering machine: The evaporator includes an evaporation container. An electric heater is arranged at the bottom of the evaporation container, and a temperature sensor is arranged at the outlet of the evaporation container.
[0012] As an alternative or supplement to the rapid cooling device of the above SMT reflow soldering machine: A machine cover is arranged on the top of the SMT reflow soldering machine, and the machine cover is used to open the reflow soldering chamber.
[0013] As an alternative or supplement to the rapid cooling device of the above SMT reflow soldering machine: When multiple SMT reflow soldering machines are arranged in parallel, stainless steel pipes are arranged in each SMT reflow soldering machine; one end of each stainless steel pipe extending out of the SMT reflow soldering machine is connected to a solenoid valve, and the inlets of the solenoid valves are connected to the same nitrogen source; the electric control system is electrically connected to each solenoid valve.
[0014] The beneficial effects of the present utility model are as follows: In this solution, the on-off of the nitrogen pipeline is controlled by a solenoid valve. When cooling the SMT reflow soldering machine, the solenoid valve is opened to fill nitrogen gas into the reflow soldering chamber, realizing rapid cooling of the reflow soldering chamber and effectively reducing the waiting time for the reflow soldering chamber to cool down and the heat radiated outward. Description of the Drawings
[0015] In order to more clearly illustrate the technical solutions in the embodiments of this solution or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art.
[0016] Figure 1 It is a schematic structural diagram of the rapid cooling device of the SMT reflow soldering machine in this solution.
[0017] In the figure: 1 - industrial computer; 2 - PLC controller; 3 - power supply; 4 - relay; 5 - solenoid valve; 6 - liquid nitrogen tank; 7 - evaporator; 8 - SMT reflow soldering machine; 9 - stainless steel pipe. Detailed Embodiments
[0018] The technical solution in this embodiment will be clearly and completely described below in conjunction with the accompanying drawings. The described embodiments are only a part of the embodiments, rather than all of them. Based on the embodiments in this solution, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of this solution.
[0019] Embodiment 1
[0020] As Figure 1 shown, this embodiment designs a rapid cooling device for an SMT reflow soldering machine, which includes components such as an electric control system, a solenoid valve 5, a nitrogen source, and a stainless steel pipe 9.
[0021] One end of the stainless steel pipe 9 is arranged outside the SMT reflow soldering machine 8 and is connected to the outlet of the solenoid valve 5; when the solenoid valve 5 is opened, the nitrogen of the nitrogen source can enter the stainless steel pipe 9, and when the solenoid valve 5 is closed, the nitrogen of the nitrogen source stops entering the stainless steel pipe 9.
[0022] The inlet of the solenoid valve 5 is communicated with the nitrogen source; the nitrogen source can be a conventional low-temperature nitrogen tank, and the nitrogen source can also use a combined structure of a liquid nitrogen tank 6 and an evaporator 7. When the nitrogen source includes a liquid nitrogen tank 6 and an evaporator 7, the outlet of the liquid nitrogen tank 6 is connected to the evaporator 7 through a pipeline. The liquid nitrogen tank 6 is placed upside down so that the liquid nitrogen can enter the evaporator 7 from the outlet of the liquid nitrogen tank 6 under the action of its own gravity and the internal pressure of the liquid nitrogen tank 6. The outlet of the evaporator 7 is connected to the inlet of the solenoid valve 5. The evaporator 7 is used to evaporate the liquid nitrogen into nitrogen below normal temperature. The evaporator 7 includes an evaporation container, and an electric heater is arranged at the bottom of the evaporation container. The electric heater only needs to heat the liquid nitrogen above the boiling point. A temperature sensor is arranged at the outlet of the evaporation container, so as to measure the temperature of the output nitrogen by using this temperature sensor. It should be ensured that after the nitrogen enters the reflow soldering chamber, it will not affect the cooling efficiency of the reflow soldering chamber due to high temperature, nor will it cause the nitrogen to re-condense and form liquid nitrogen mist beads due to low temperature. At the same time, it should also be avoided that the large temperature difference generated during the nitrogen injection process damages the SMT reflow soldering machine 8.
[0023] The other end of the stainless steel pipe 9 extends into the reflow soldering chamber of the SMT reflow soldering machine 8. The part of the stainless steel pipe 9 extending into the reflow soldering chamber is in a straight pipe shape, S shape, spiral shape, U shape or Y shape. The shape of the stainless steel pipe 9 can be determined according to the shape of the reflow soldering chamber, as long as the reflow soldering chamber can be evenly cooled.
[0024] A number of exhaust holes are arranged on the pipe wall where the stainless steel pipe 9 extends. The nitrogen in the stainless steel pipe 9 transports nitrogen into the reflow soldering chamber through the exhaust holes, thereby cooling the processed PCB board in the SMT reflow soldering machine 8.
[0025] The electronic control system is electrically connected to the solenoid valve 5 to control the opening and closing of the solenoid valve 5. A timing program or a trigger program can be input into the electronic control system, so that when the SMT reflow soldering machine 8 finishes processing the PCB board and other products need to be replaced, the opening and closing of the solenoid valve 5 can be controlled manually or automatically.
[0026] The electronic control system includes components such as a PLC controller 2, a power supply 3, a relay 4, and an industrial computer 1; the power supply 3 is connected to the solenoid valve 5 through the relay 4; the PLC controller 2 is powered by the power supply 3 and is connected to the control end of the relay 4. The industrial computer 1 is communicatively connected to the PLC controller 2; the industrial computer 1 is also connected to a display.
[0027] The top of the SMT reflow soldering machine 8 is provided with a machine cover, which is used to open the reflow soldering chamber. Opening the machine cover can facilitate the replacement of the PCB board in the SMT reflow soldering machine 8.
[0028] When multiple SMT reflow soldering machines 8 are arranged in parallel, a stainless steel pipe 9 is provided in each SMT reflow soldering machine 8; one end of each stainless steel pipe 9 extending out of the SMT reflow soldering machine 8 is connected to a solenoid valve 5, and the inlet of the solenoid valve 5 is connected to the same nitrogen source; the electronic control system is electrically connected to each solenoid valve 5.
[0029] The above embodiments are only examples for clear illustration and are not limitations on the implementation manners; it is not necessary and impossible to enumerate all the implementation manners here. The obvious changes or variations derived therefrom are still within the protection scope of the present technology.
Claims
1. A rapid cooling device for an SMT reflow soldering machine, characterized in that: It includes an electric control system, a solenoid valve (5), a nitrogen source, and a stainless steel pipe (9); one end of the stainless steel pipe (9) is arranged outside the SMT reflow soldering machine (8) and is connected to the outlet of the solenoid valve (5); the inlet of the solenoid valve (5) is communicated with the nitrogen source; the other end of the stainless steel pipe (9) extends into the reflow soldering chamber of the SMT reflow soldering machine (8), and a plurality of exhaust holes are arranged on the pipe wall where the stainless steel pipe (9) extends to convey nitrogen into the reflow soldering chamber and cool the PCB board in the SMT reflow soldering machine (8); the electric control system is electrically connected to the solenoid valve (5) to control the on-off of the solenoid valve (5).
2. The rapid cooling device of the SMT reflow soldering machine according to claim 1, wherein: The part of the stainless steel pipe (9) extending into the reflow soldering chamber is in a straight pipe shape, S shape, spiral shape, U shape or Y shape.
3. The rapid cooling device of the SMT reflow soldering machine according to claim 1, characterized in that: The electric control system includes a PLC controller (2), a power supply (3) and a relay (4); the power supply (3) is connected to the solenoid valve (5) through the relay (4); the PLC controller (2) is powered by the power supply (3) and is connected to the control end of the relay (4).
4. The rapid cooling device of the SMT reflow soldering machine according to claim 3, wherein: The electric control system further includes an industrial computer (1), and the industrial computer (1) is communicatively connected to the PLC controller (2); the industrial computer (1) is also connected to a display.
5. The rapid cooling device of the SMT reflow soldering machine according to claim 1, characterized in that: The nitrogen source includes a liquid nitrogen tank (6) and an evaporator (7), the outlet of the liquid nitrogen tank (6) is connected to the evaporator (7) through a pipeline, the outlet of the evaporator (7) is connected to the inlet of the solenoid valve (5), and the evaporator (7) is used for evaporating liquid nitrogen into nitrogen below normal temperature.
6. The rapid cooling device of the SMT reflow soldering machine according to claim 5, wherein: The evaporator (7) includes an evaporation container, an electric heater is arranged at the bottom of the evaporation container, and a temperature sensor is arranged at the outlet of the evaporation container.
7. The rapid cooling device of the SMT reflow soldering machine according to claim 1, wherein: A machine cover is arranged on the top of the SMT reflow soldering machine (8), and the machine cover is used to open the reflow soldering chamber.
8. The rapid cooling device of the SMT reflow soldering machine according to claim 1, wherein: When multiple SMT reflow soldering machines (8) are arranged in parallel, a stainless steel pipe (9) is arranged in each SMT reflow soldering machine (8); one end of each stainless steel pipe (9) extending outside the SMT reflow soldering machine (8) is connected to a solenoid valve (5), and the inlets of the solenoid valves (5) are communicated with the same nitrogen source; the electric control system is electrically connected to each solenoid valve (5).