Grinding head structure

Abstract

The utility model relates to the technical field of grinding machining, and discloses a grinding head structure which comprises a base disc and a grinding head, the base disc comprises a base shaft and a base, the grinding head comprises an elastic base material body, and the base disc and the elastic base material body are sequentially and coaxially arranged; a first groove is formed in the middle of the second end face of the elastic base material body, a plurality of second grooves are formed in the upper surface and / or the side surface of an outer edge boss of the first groove, and the second grooves extend on the surface of the outer edge boss along the outer edge of the outer edge boss. A plurality of second grooves which are regularly arranged are filled with diamond mucilage to form the grinding head for polishing the electronic glass, planes or side faces or grooves or chamfers of hard and brittle materials such as 3D glass, ceramics and magnetic materials can be ground and polished, the grinding amount can reach 5 [mu] m / min, and Ra is smaller than 0.02 [mu] m.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding processing, and particularly relates to a grinding head structure. Background Art

[0002] With the development of modern social technology, various electronic products are being rapidly iterated. As an essential component of most electronic products, electronic glass is widely used. Especially for terminal electronic products, the quality, performance, and user experience of electronic glass have become the focus of the electronic product industry's technical field.

[0003] The electronic glass industry has developed steadily for more than a hundred years. Electronic glass is one of the basic supporting industries of electronic information products, directly affecting the development of electronic information products. Following the rapid update and replacement of electronic products, the requirements for product performance in the electronic glass industry are constantly increasing, and the technological changes in the downstream products of electronic glass products have also greatly promoted the technological progress of the electronic glass industry.

[0004] The development of electronic glass products in current technology and applications is mainly reflected in the display glass, protective cover glass, or panel glass substrate of terminal display products such as mobile phones, smart watches, cameras, tablet computers, liquid crystal TVs, conference all-in-ones, and industrial control screens.

[0005] The outermost layer of electronic terminal products is provided with a protective cover glass, which plays a role in protecting the touch screen. In addition, patterns or marks need to be screen-printed on the surface of the protective cover glass. Therefore, the protective cover glass is required to have characteristics such as high hardness, drop resistance, scratch resistance, waterproof, smoothness, light transmission, and brightness. The application scenarios of the protective cover glass are mainly reflected in the field of intelligent electronic technology. The protective cover glass can be divided into a front cover and a rear cover. The front covers of terminal intelligent display products such as the display screens of mobile phones, tablet computers, smart watches, cameras, and action cameras are all made of glass, and the rear covers of some electronic products are also made of glass.

[0006] For display glass, protective cover glass, or panel glass substrate, the parts with depressions or grooves also need to consider characteristics such as smooth transition, consistent thickness, light transmission, and brightness. Usually, Ra is used to reflect the height characteristics of surface micro-irregularities. Ra is a measurement unit of surface roughness. Specific values will be marked after Ra. The larger the value, the rougher the surface of the object.

[0007] Therefore, for electronic glass products with depressed parts, how to perform high-efficiency and high-quality polishing has always been a technical problem in the field of electronic glass processing. Summary of the Utility Model

[0008] The purpose of the present utility model is to provide a grinding head structure, as well as a manufacturing and processing method, so as to solve the processing problems of low efficiency and low quality in polishing electronic glass in the grinding and processing technology field described above.

[0009] The present utility model provides a grinding head structure, including a base plate and a grinding head. The grinding head includes an elastic base body, and the base plate and the elastic base body are arranged coaxially in sequence.

[0010] The first end face of the elastic base body is arranged on one end face of the base plate.

[0011] The second end face of the elastic base body is opposite to the first end face of the elastic base body, and a first groove is provided in the middle of the second end face of the elastic base body.

[0012] A plurality of second grooves are regularly arranged on the surface of the outer edge boss of the first groove.

[0013] The second groove extends along the outer edge of the outer edge boss on the surface of the outer edge boss.

[0014] The inside of the second groove is filled with abrasive.

[0015] Preferably, the base plate includes a base shaft and a base, and the base shaft, the base, and the elastic base body are arranged coaxially in sequence.

[0016] One end face of the base shaft is arranged on the first end face of the base, and the second end face of the base is arranged on the first end face of the elastic base body.

[0017] Preferably, the base plate is a base plate made of colloid or magic tape and is directly bonded to the processing machine table.

[0018] Preferably, the material of the elastic base body is an elastomer with a Shore hardness between 25C or 95A or 25C - 95A.

[0019] The shape of the second groove is a rectangular groove.

[0020] The ratio of the width of the second groove to the distance between adjacent two second grooves is 1:1 or 1:2, or any ratio between 1:1 and 1:2. The ratio of the width of the second groove to the thickness of the second groove is 1:1 or 2:1, or any ratio between 1:1 and 2:1.

[0021] Preferably, the material of the elastic base body is polyurethane or silica gel or rubber or non-woven polishing leather.

[0022] When the second end face of the elastic base body is the working face, a plurality of the second grooves are regularly arranged on the upper surface of the outer edge boss of the first groove.

[0023] Preferably, the elastic substrate body is a cylinder;

[0024] The first groove is an annular groove, and the annular groove includes a first inner groove located in the middle of the elastic substrate body. The annular groove further includes a second outer groove surrounding the first inner groove;

[0025] The upper edge of the first inner groove extends towards the outer periphery of the cylinder to form the bottom of the second outer groove, and the upper edge of the second outer groove extends towards the outer periphery of the cylinder to form the outer edge boss of the first groove;

[0026] All the second grooves are fan-shapedly distributed and are regularly arranged in a circle on the upper surface of the outer edge boss of the first groove.

[0027] Preferably, the material of the elastic substrate body is polyurethane or silica gel or rubber or non-woven polishing leather;

[0028] When the side surface of the elastic substrate body is the working surface, a plurality of the second grooves are regularly arranged on the side surface of the outer edge boss of the first groove.

[0029] Preferably, the second grooves provided on the side surface of the outer edge boss of the first groove extend along the side surface of the elastic substrate body towards the base plate.

[0030] Preferably, the elastic substrate body is a cylinder;

[0031] The upper edge of the first groove extends towards the outer periphery of the cylinder to form the outer edge boss of the first groove;

[0032] The long sides of all the second grooves are longitudinally distributed parallel to the axis of the elastic substrate body, and all the second grooves are regularly arranged in a circle and are arranged on the side surface of the outer edge boss of the first groove.

[0033] Preferably, the abrasive is an abrasive formed by diamond paste;

[0034] The diamond paste includes two-component polyurethane glue or epoxy resin, and diamond powder formed by one or more particle size combinations of 0.5um and / or 50um, and / or between 0.5um and 50um;

[0035] The proportion of the diamond powder in the diamond paste is 10% or 80%, or any value between 10% and 80%.

[0036] This embodiment also provides a method for manufacturing a grinding head structure. The method for manufacturing the grinding head structure is used to manufacture any of the above-mentioned grinding head structures. The grinding head structure includes a base plate and a grinding head. The grinding head includes an elastic substrate body. The base plate and the elastic substrate body are arranged coaxially in sequence. The method includes:

[0037] Manufacture the base plate;

[0038] Open a first groove in the middle of the second end face of the elastic substrate body; the first end face of the elastic substrate body is disposed on one end face of the base plate; the second end face of the elastic substrate body is opposite to the first end face of the elastic substrate body;

[0039] Open a plurality of regularly arranged second grooves on the surface of the outer edge boss of the first groove;

[0040] Fill the inside of the second groove with abrasive slurry including abrasives;

[0041] After the abrasive slurry including abrasives filled in the inside of the second groove is cured, perform contour trimming on the outer surface of the grinding head.

[0042] This embodiment also provides a method for processing a grinding head structure. The method for processing the grinding head structure uses any of the above-mentioned grinding head structures to process a workpiece to be processed, and includes:

[0043] Place the workpiece to be processed and any of the above-mentioned grinding head structures on a processing platform, and position the workpiece to be processed;

[0044] Use any of the above-mentioned grinding head structures to perform fine grinding on the workpiece to be processed to obtain fine-ground electronic glass.

[0045] This embodiment also provides another method for processing a grinding head structure. The method for processing the grinding head structure uses any of the above-mentioned grinding head structures to process a workpiece to be processed, and includes:

[0046] Place the workpiece to be processed, a rough grinding head, and any of the above-mentioned grinding head structures on a processing platform, and position the workpiece to be processed;

[0047] Use the rough grinding head to perform rough grinding on the workpiece to be processed that has been positioned to obtain rough-ground electronic glass;

[0048] Use any of the above-mentioned grinding head structures to perform fine grinding on the rough-ground electronic glass to obtain fine-ground electronic glass.

[0049] The grinding head structure provided by the embodiment of the present utility model includes a base plate and a grinding head. The base plate includes a base shaft and a base. The grinding head includes an elastic base body. The base shaft, the base, and the elastic base body are arranged coaxially in sequence. One end face of the base shaft is disposed on the first end face of the base. The second end face of the base is disposed on the first end face of the elastic base body. A first groove is provided in the middle of the second end face of the elastic base body. A plurality of second grooves arranged regularly are provided on the surface of the outer edge boss of the first groove. The second grooves extend along the outer edge of the outer edge boss on the surface of the outer edge boss. Abrasives are filled in the second grooves. The grinding head structure provided by the embodiment of the present utility model, by providing a plurality of second grooves on the upper surface and / or side surface of the outer edge boss of the first groove, and the second grooves extend along the outer edge of the outer edge boss on the surface of the outer edge boss, and filling diamond slurry in the regularly arranged plurality of second grooves to form a grinding head for polishing electronic glass, can perform grinding and polishing processing on the plane, side surface, groove or chamfer of hard and brittle materials such as 3D glass, ceramics, and magnetic materials. The grinding amount can reach 5um / min, and Ra < 0.02um. In addition, seamless switching of the processing part can be carried out in time according to the needs of the processing personnel for the processing part, and high-efficiency fine processing of different parts of the electronic glass product can be realized without replacing the grinding head or the processing platform. Brief Description of the Drawings

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:

[0051] Figure 1a It is a schematic diagram of a grinding head structure provided by an embodiment of the present utility model;

[0052] Figure 1b It is a schematic diagram of another grinding head structure provided by an embodiment of the present utility model;

[0053] Figure 2 It is a schematic diagram of another grinding head structure provided by an embodiment of the present utility model;

[0054] Figure 3 It is a schematic diagram of another grinding head structure provided by an embodiment of the present utility model;

[0055] Figure 4 It is a flowchart of a method for manufacturing a grinding head structure provided by an embodiment of the present utility model;

[0056] Figure 5 It is a flowchart of a method for processing a grinding head structure provided by an embodiment of the present utility model;

[0057] Figure 6 This is a flowchart of a processing method for a grinding head structure provided by an embodiment of the present invention. Specific embodiments

[0058] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0059] The purpose of the present invention is to provide a grinding head structure and its manufacturing and processing methods to solve the processing problems of low efficiency and low quality in polishing electronic glass in the field of grinding processing described above.

[0060] The present invention provides a grinding head structure, including a base plate and a grinding head. The grinding head includes an elastic substrate body, and the base plate and the elastic substrate body are arranged coaxially in sequence;

[0061] The first end face of the elastic substrate body is arranged on one end face of the base plate;

[0062] The second end face of the elastic substrate body is opposite to the first end face of the elastic substrate body, and a first groove is provided in the middle of the second end face of the elastic substrate body;

[0063] A plurality of second grooves arranged regularly are provided on the surface of the outer edge boss of the first groove;

[0064] The second groove extends on the surface of the outer edge boss along the outer edge of the outer edge boss;

[0065] The inside of the second groove is filled with abrasive.

[0066] Preferably, the base plate includes a base shaft and a base, and the base shaft, the base and the elastic substrate body are arranged coaxially in sequence;

[0067] One end face of the base shaft is arranged on the first end face of the base, and the second end face of the base is arranged on the first end face of the elastic substrate body.

[0068] Preferably, the base plate is a base plate made of colloid or magic tape and is directly bonded to the processing machine table.

[0069] The grinding head structure provided by the embodiment of the present utility model includes a base plate and a grinding head. The base plate includes a base shaft and a base. The grinding head includes an elastic base body. A first groove is provided in the middle of the second end face of the elastic base body. A plurality of second grooves arranged regularly are provided on the surface of a boss on the outer edge of the first groove. The second grooves extend along the outer edge of the outer-edge boss on the surface of the outer-edge boss. Abrasives are filled in the second grooves.

[0070] Preferably, the abrasive is an abrasive formed by diamond cement. The diamond cement includes two-component polyurethane glue or epoxy resin glue, and diamond powder formed by one or more particle size combinations of 0.5um and / or 50um, and / or between 0.5um and 50um. The proportion of the diamond powder in the diamond cement is 10% or 80%, or any value between 10% and 80%.

[0071] The grinding head structure provided by the embodiment of the present utility model, by providing a plurality of second grooves on the upper surface and / or side surface of the boss on the outer edge of the first groove, the second grooves extend along the outer edge of the outer-edge boss on the surface of the outer-edge boss, and filling diamond cement in the regularly arranged plurality of second grooves to form a grinding head for polishing electronic glass, can perform grinding and polishing processing on the plane, side surface, groove or chamfer of hard and brittle materials such as 3D glass, ceramics, and magnetic materials. The grinding amount can reach 5um / min, Ra<0.02um, and seamless switching of the processing part can be carried out in a timely manner according to the needs of the processing personnel for the processing part. High-efficiency fine processing of electronic glass products can be achieved without replacing the grinding head or the processing platform.

[0072] Please refer to Figure 1a and Figure 1b , Figure 1a which is a schematic diagram of a grinding head structure provided by the embodiment of the present utility model. As Figure 1a shown, the grinding head structure provided by the embodiment of the present utility model includes a base plate 110 and a grinding head 120. The base plate 110 includes a base shaft 111 and a base 112. The grinding head 120 includes an elastic base body 121. The base shaft 111, the base 112 and the elastic base body 121 are arranged coaxially in sequence.

[0073] One end face of the base shaft 111 is arranged on the first end face 112A of the base 112. The second end face 112B of the base 112 is arranged on the first end face 121A of the elastic base body 121.

[0074] A first groove 122 is provided in the middle of the second end face 121B of the elastic base body 121.

[0075] On the surface of the outer edge boss 122A of the first groove 122, a plurality of second grooves 123 are regularly arranged;

[0076] The second groove 123 extends along the outer edge 122a of the outer edge boss 122A on the surface of the outer edge boss 122A;

[0077] The inside of the second groove 123 is filled with abrasive 124.

[0078] In this embodiment, the material of the elastic substrate body 121 is polyurethane or silica gel or rubber.

[0079] As Figure 1a shown, when the grinding head structure provided by this embodiment is working, the second end face 121B of the elastic substrate body 121 is the working face, and on the upper surface of the outer edge boss 122A of the first groove 122, a plurality of the second grooves 123 are regularly arranged.

[0080] As Figure 1a shown, the shape of the second groove 123 in this embodiment is a rectangular groove.

[0081] As Figure 1a shown, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 in this embodiment is 1:2. The ratio of the width d of the second groove 123 to the thickness h of the second groove 123 in this embodiment is 1.5:1.

[0082] As Figure 1a shown, the elastic substrate body 121 in this embodiment is a cylinder. In other embodiments, the elastic substrate body 121 can be a columnar body of other regular shapes, such as a rectangular column, a square column, or a hexagonal column.

[0083] As Figure 1a shown, the upper edge of the first groove 122 extends towards the outer circumference of the cylinder to form the outer edge boss 122A of the first groove 122. All the second grooves 123 are distributed in a fan shape and are regularly arranged in a circle around the upper surface of the outer edge boss 122A of the first groove 122.

[0084] Figure 1b is a schematic diagram of another grinding head structure provided by an embodiment of the present invention; as Figure 1bAs shown, the first groove 122 is an annular groove, which includes a first inner groove 125 located in the middle of the elastic substrate body. The annular groove further includes a second outer groove 126 surrounding the first inner groove 125. The upper edge 125a of the first inner groove 125 extends towards the outer periphery of the cylinder to form the bottom of the second outer groove 126. The upper edge 126a of the second outer groove 126 extends towards the outer periphery of the cylinder to form the outer edge boss 122A of the first groove 122. All the second grooves 123 are distributed in a fan shape and are regularly arranged in a circle around the upper surface of the outer edge boss 122A of the first groove 122. In this embodiment, the ratio of the width d of the second groove 123 to the interval distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0085] Figure 1a And Figure 1b it is different from the shape of the first groove 122 shown, and the width-to-thickness ratio of the second groove is also different.

[0086] In the above embodiment, the abrasive 124 is the abrasive after the abrasive paste formed by diamond paste is cured. In this embodiment, the diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 50um mixed.

[0087] The proportion of the diamond powder in the diamond paste is 10%.

[0088] In other embodiments, the ratio of the width d of the second groove 123 to the interval distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1. The abrasive 124 is the abrasive formed by diamond paste.

[0089] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 20um mixed.

[0090] The proportion of the diamond powder in the diamond paste is 20%.

[0091] In other embodiments, the ratio of the width d of the second groove 123 to the interval distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1. The abrasive 124 is the abrasive formed by diamond paste.

[0092] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 30um mixed.

[0093] The proportion of the diamond powder in the diamond cement paste is 30%.

[0094] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0095] The abrasive 124 is an abrasive formed by the diamond cement paste.

[0096] The diamond cement paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with a particle size mixture of 0.5um and 40um.

[0097] The proportion of the diamond powder in the diamond cement paste is 40%.

[0098] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0099] The abrasive 124 is an abrasive formed by the diamond cement paste.

[0100] The diamond cement paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with a particle size mixture of 0.5um and 2um.

[0101] The proportion of the diamond powder in the diamond cement paste is 50%.

[0102] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0103] The abrasive 124 is an abrasive formed by the diamond cement paste.

[0104] The diamond cement paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with a particle size mixture of 0.5um and 8um.

[0105] The proportion of the diamond powder in the diamond cement paste is 60%.

[0106] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0107] The abrasive 124 is an abrasive formed by diamond paste.

[0108] The diamond paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with a particle size of 0.5um and 15um mixed.

[0109] The proportion of the diamond powder in the diamond paste is 70%.

[0110] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0111] The abrasive 124 is an abrasive formed by diamond paste.

[0112] The diamond paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with a particle size of 0.5um and 25um mixed.

[0113] The proportion of the diamond powder in the diamond paste is 80%.

[0114] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0115] The abrasive 124 is an abrasive formed by diamond paste.

[0116] The diamond paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with a particle size of 0.5um and 35um mixed.

[0117] The proportion of the diamond powder in the diamond paste is 15%.

[0118] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0119] The abrasive 124 is an abrasive formed by diamond paste.

[0120] The diamond paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with a particle size of 0.5um and 45um mixed.

[0121] The proportion of the diamond powder in the diamond paste is 25%.

[0122] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0123] The abrasive 124 is an abrasive formed by diamond paste.

[0124] The diamond paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with particle sizes of 0.5um, 7um, and 35um mixed.

[0125] The proportion of the diamond powder in the diamond paste is 35%.

[0126] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0127] The abrasive 124 is an abrasive formed by diamond paste.

[0128] The diamond paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with particle sizes of 0.5um, 10um, and 25um mixed.

[0129] The proportion of the diamond powder in the diamond paste is 45%.

[0130] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0131] The abrasive 124 is an abrasive formed by diamond paste.

[0132] The diamond paste includes a two-component polyurethane glue or an epoxy resin glue and diamond powder with particle sizes of 0.5um, 18um, 25um, and 45um mixed. The proportion of the diamond powder in the diamond paste is 55%.

[0133] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0134] The abrasive 124 is an abrasive formed by diamond paste.

[0135] The diamond sizing slurry includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um, 1um, 16um, 25um, 35um, and 48um mixed. The proportion of the diamond powder in the diamond sizing slurry is 65%.

[0136] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0137] The abrasive 124 is an abrasive formed by diamond sizing slurry.

[0138] The diamond sizing slurry includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 5um, 10um, 13um, 17um, 22um, 26um, 31um, 37um, 42um, and 46um mixed. The proportion of the diamond powder in the diamond sizing slurry is 75%.

[0139] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1. The abrasive 124 is an abrasive formed by diamond sizing slurry. The diamond sizing slurry includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 4um, 9um, 13um, 18um, 24um, 29um, 33um, 38um, 44um, and 47um mixed. The proportion of the diamond powder in the diamond sizing slurry is 77%.

[0140] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:1, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1:1. The abrasive 124 is an abrasive formed by diamond sizing slurry.

[0141] The diamond sizing slurry includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 50um mixed.

[0142] The proportion of the diamond powder in the diamond sizing slurry is 10%.

[0143] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:1.5, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 2:1. The abrasive 124 is an abrasive formed by diamond sizing slurry.

[0144] The diamond slurry includes two-component polyurethane glue or epoxy resin glue and diamond powder with a mixed particle size of 0.5um and 20um.

[0145] The proportion of the diamond powder in the diamond slurry is 20%.

[0146] The following uses a table to illustrate the influence of elastic substrate bodies with different hardnesses on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0147] Table 1 Cutting force and roughness data corresponding to hardnesses of 25C / 45C / 55C / 65A / 77A / 85A / 90A / 95A of the elastic body material of the grinding head

[0148]

[0149] As shown in Table 1 above, as the hardness of the elastic body material of the grinding head increases, when using the grinding head structure provided in the above embodiment for planar or side or groove or chamfer grinding and polishing of hard and brittle materials, the grinding amount can reach 5um / min, and Ra < 0.02um.

[0150] The following uses a table to illustrate the influence of elastic substrate bodies with different materials on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0151] Table 2 Cutting force and roughness data corresponding to non-woven fabric / polyurethane / rubber / silicone of the elastic body material of the grinding head

[0152]

[0153] As shown in Table 2 above, for different elastic body materials of the grinding head with the same hardness, when using the grinding head structure provided in the above embodiment for planar or side or groove or chamfer grinding and polishing of hard and brittle materials, the grinding amount can reach 5um / min, and Ra < 0.02um.

[0154] The following uses a table to illustrate the influence of changes in the abrasive particle size on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0155] Table 3 Cutting force and roughness data corresponding to changes in the abrasive particle size

[0156]

[0157] As shown in Table 3 above, with changes in the size of the abrasive particles, when using the grinding head structure provided in the above embodiment for planar or side or groove or chamfer grinding and polishing of hard and brittle materials, the grinding amount can reach 5um / min, and Ra < 0.02um.

[0158] The following uses a table to illustrate the influence of the changes in the proportion of glue and diamond powder in the abrasive slurry on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0159] Table 4 Cutting force and roughness data corresponding to the changes in the proportion of glue and diamond powder in the abrasive slurry

[0160]

[0161] As shown in Table 4 above, when the proportion of glue and diamond powder in the abrasive slurry changes, the grinding head structure provided in the above embodiment is used for grinding and polishing the plane, side surface, groove or chamfer of the brittle material, and the grinding amount can reach 5um / min, Ra < 0.02um.

[0162] Please refer to Figure 2 , Figure 2 which is a schematic diagram of another grinding head structure provided by the embodiment of the present invention. As Figure 2 shown, the grinding head structure provided by the embodiment of the present invention includes a base plate 110 and a grinding head 120. The base plate 110 includes a base shaft 111 and a base 112. The grinding head 120 includes an elastic substrate body 121. The base shaft 111, the base 112 and the elastic substrate body 121 are arranged coaxially in sequence.

[0163] One end face of the base shaft 111 is arranged on the first end face 112A of the base 112, and the second end face 112B of the base 112 is arranged on the first end face 121A of the elastic substrate body 121;

[0164] A first groove 122 is provided in the middle of the second end face 121B of the elastic substrate body 121;

[0165] A plurality of second grooves 123 are regularly arranged on the surface of the outer edge boss 122A of the first groove 122;

[0166] The second groove 123 extends along the outer edge 122a of the outer edge boss 122A on the surface of the outer edge boss 122A;

[0167] The inside of the second groove 123 is filled with abrasive 124.

[0168] The material of the elastic substrate body 121 in this embodiment is polyurethane or silica gel or rubber.

[0169] As Figure 2 shown, when the grinding head structure provided in this embodiment is working, the side surface 121C of the elastic substrate body 121 is the working surface, and a plurality of the second grooves 123 are regularly arranged on the side surface of the outer edge boss 122A of the first groove 122.

[0170] AsFigure 2 As shown, the shape of the second groove 123 in this embodiment is a rectangular groove.

[0171] In this embodiment, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2.

[0172] In this embodiment, the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0173] As Figure 2 shown, the elastic substrate body 121 in this embodiment is a cylinder. In other embodiments, the elastic substrate body 121 can be a columnar body of other regular shapes, such as a rectangular column, a square column, or a hexagonal column.

[0174] The second groove 123 provided on the side surface of the outer edge boss 122A of the first groove 122 extends along the side surface of the elastic substrate body 121 towards the base plate 110.

[0175] As Figure 2 shown, the second groove 123 provided on the side surface of the outer edge boss 122A of the first groove 122 extends along the side surface of the elastic substrate body 121 towards the base 112.

[0176] The upper edge of the first groove 122 extends towards the outer periphery of the cylinder to form the outer edge boss 122A of the first groove 122;

[0177] The long sides of all the second grooves 123 are longitudinally distributed parallel to the axis of the elastic substrate body 121, and all the second grooves 123 regularly surround one week and are arranged and distributed on the side surface of the outer edge boss 122A of the first groove 122.

[0178] In this embodiment, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0179] The abrasive 124 is an abrasive formed by diamond paste.

[0180] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 50um mixed.

[0181] The proportion of the diamond powder in the diamond paste is 10%.

[0182] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:1, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1:1.

[0183] The abrasive 124 is an abrasive formed by diamond paste.

[0184] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5 um and 50 um mixed.

[0185] The proportion of the diamond powder in the diamond paste is 10%.

[0186] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:1.5, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 2:1.

[0187] The abrasive 124 is an abrasive formed by diamond paste.

[0188] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5 um and 50 um mixed.

[0189] The proportion of the diamond powder in the diamond paste is 10%.

[0190] The following shows, through a table, the influence of elastic substrate bodies with different hardnesses on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0191] Table 5 Cutting force and roughness data corresponding to hardnesses of 25C / 45C / 55C / 65A / 77A / 85A / 90A / 95A of the elastic body material of the grinding head

[0192]

[0193] As shown in Table 5 above, as the hardness of the elastic body material of the grinding head increases, when using the grinding head structure provided in the above embodiment for planar or side or groove or chamfer grinding and polishing of brittle materials, the grinding amount can reach 5 um / min, and Ra < 0.02 um.

[0194] The following shows, through a table, the influence of elastic substrate bodies with different materials on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0195] Table 6 Cutting force and roughness data corresponding to non-woven fabric / polyurethane / rubber / silicone of the elastic body material of the grinding head

[0196]

[0197] As shown in Table 6 above, for different abrasive head elastomer materials with the same hardness, when using the abrasive head structure provided in the above embodiments for grinding and polishing the plane, side surface, groove or chamfer of brittle materials, the grinding amount can reach 5 um / min, and Ra < 0.02 um.

[0198] The following uses a table to illustrate the influence of the change in the abrasive particle size on the cutting force and roughness in the abrasive head structure provided in this embodiment.

[0199] Table 7 Cutting force and roughness data corresponding to different changes in the abrasive particle size

[0200]

[0201] As shown in Table 7 above, for the change in the abrasive particle size, when using the abrasive head structure provided in the above embodiments for grinding and polishing the plane, side surface, groove or chamfer of brittle materials, the grinding amount can reach 5 um / min, and Ra < 0.02 um.

[0202] The following uses a table to illustrate the influence of the change in the proportion of glue to diamond powder in the abrasive slurry on the cutting force and roughness in the abrasive head structure provided in this embodiment.

[0203] Table 8 Cutting force and roughness data corresponding to different changes in the proportion of glue to diamond powder in the abrasive slurry

[0204]

[0205] As shown in Table 8 above, for the change in the proportion of glue to diamond powder in the abrasive slurry, when using the abrasive head structure provided in the above embodiments for grinding and polishing the plane, side surface, groove or chamfer of brittle materials, the grinding amount can reach 5 um / min, and Ra < 0.02 um.

[0206] Please refer to Figure 3 , Figure 3 which is a schematic diagram of another abrasive head structure provided by the embodiment of the present invention. As Figure 3 shown, the abrasive head structure provided by the embodiment of the present invention includes a base plate 110 and an abrasive head 120. The base plate 110 includes a base shaft 111 and a base 112. The abrasive head 120 includes an elastic substrate body 121. The base shaft 111, the base 112, and the elastic substrate body 121 are arranged coaxially in sequence.

[0207] One end face of the base shaft 111 is disposed on the first end face 112A of the base 112, and the second end face 112B of the base 112 is disposed on the first end face 121A of the elastic substrate body 121;

[0208] A first groove 122 is provided in the middle of the second end face 121B of the elastic substrate body 121;

[0209] On the surface of the outer edge boss 122A of the first groove 122, a plurality of second grooves 123 are regularly arranged;

[0210] The second groove 123 extends along the outer edge 122a of the outer edge boss 122A on the surface of the outer edge boss 122A;

[0211] The inside of the second groove 123 is filled with abrasive 124.

[0212] In this embodiment, the material of the elastic substrate body 121 is polyurethane or silica gel or rubber.

[0213] As Figure 3 shown, when the grinding head structure provided in this embodiment is working, the second end face 112B and / or the side face 121C of the elastic substrate body 121 is the working face, and on the upper surface of the outer edge boss 122A of the first groove 122, a plurality of the second grooves 123 are regularly arranged, and on the side surface of the outer edge boss 122A of the first groove 122, a plurality of the second grooves 123 are regularly arranged.

[0214] As Figure 3 shown, in this embodiment, the shape of the second groove 123 is a rectangular groove.

[0215] In this embodiment, the ratio of the width d of the second groove 123 to the interval distance L between two adjacent second grooves 123 is 1:2. In other embodiments, the widths d of the plurality of second grooves 123 regularly arranged on the upper surface and the plurality of second grooves 123 regularly arranged on the side surface of the outer edge boss 122A may be the same or different. The interval distance L between two adjacent second grooves 123 among the plurality of second grooves 123 regularly arranged on the upper surface and the interval distance L between two adjacent second grooves 123 among the plurality of second grooves 123 regularly arranged on the side surface of the outer edge boss 122A may be the same or different.

[0216] As Figure 3 shown, in this embodiment, the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1. In other embodiments, the thicknesses of the plurality of second grooves 123 regularly arranged on the upper surface and the plurality of second grooves 123 regularly arranged on the side surface of the outer edge boss 122A may be the same or different.

[0217] As Figure 3As shown, the elastic substrate body 121 in this embodiment is a cylinder. In other embodiments, the elastic substrate body 121 can be a columnar body of other regular shapes, such as a rectangular column, a square column, or a hexagonal column.

[0218] As Figure 3 shown, the first groove 122 is an annular groove. The annular groove includes a first inner groove 125 located in the middle of the elastic substrate body, and the annular groove further includes a second outer groove 126 surrounding the first inner groove 125;

[0219] The upper edge 125a of the first inner groove 125 extends towards the outer periphery of the cylinder to form the bottom of the second outer groove 126, and the upper edge 126a of the second outer groove 126 extends towards the outer periphery of the cylinder to form the outer edge boss 122A of the first groove 122;

[0220] All the second grooves 123 are distributed in a fan shape and are regularly arranged in a circle around the upper surface of the outer edge boss 122A of the first groove 122.

[0221] The second grooves 123 provided on the side surface of the outer edge boss 122A of the first groove 122 extend along the side surface of the elastic substrate body 121 towards the base 112.

[0222] The upper edge of the first groove 122 extends towards the outer periphery of the cylinder to form the outer edge boss 122A of the first groove 122;

[0223] The long sides of all the second grooves 123 are longitudinally distributed parallel to the axis of the elastic substrate body 121, and all the second grooves 123 are regularly arranged in a circle and distributed on the side surface of the outer edge boss 122A of the first groove 122.

[0224] In this embodiment, the ratio of the width d of the second groove 123 to the interval distance L between two adjacent second grooves 123 is 1:2, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1.5:1.

[0225] The abrasive 124 is an abrasive formed by diamond paste.

[0226] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 50um mixed.

[0227] The proportion of the diamond powder in the diamond paste is 10%.

[0228] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:1, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 1:1.

[0229] The abrasive 124 is an abrasive formed by diamond paste.

[0230] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 50um mixed.

[0231] The proportion of the diamond powder in the diamond paste is 10%.

[0232] In other embodiments, the ratio of the width d of the second groove 123 to the spacing distance L between two adjacent second grooves 123 is 1:1.5, and the ratio of the width d of the second groove 123 to the thickness h of the second groove 123 is 2:1.

[0233] The abrasive 124 is an abrasive formed by diamond paste.

[0234] The diamond paste includes two-component polyurethane glue or epoxy resin glue and diamond powder with a particle size of 0.5um and 50um mixed.

[0235] The proportion of the diamond powder in the diamond paste is 10%.

[0236] The following shows, through a table, the influence of elastic substrate bodies with different hardnesses on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0237] Table 9 Cutting force and roughness data corresponding to hardnesses of 25C / 45C / 55C / 65A / 77A / 85A / 90A / 95A of the elastic body material of the grinding head

[0238]

[0239] As shown in Table 9 above, as the hardness of the elastic body material of the grinding head increases, when using the grinding head structure provided in the above embodiment for planar or side or groove or chamfer grinding and polishing of brittle materials, the grinding amount can reach 5um / min, and Ra < 0.02um.

[0240] The following shows, through a table, the influence of elastic substrate bodies with different materials on the cutting force and roughness in the grinding head structure provided in this embodiment.

[0241] Table 10 Cutting force and roughness data corresponding to non-woven fabric / polyurethane / rubber / silicone of the elastic body material of the grinding head

[0242]

[0243] As shown in Table 10 above, for different materials of the grinding head elastomer with the same hardness, when using the grinding head structure provided by the above embodiment to grind and polish the plane, side surface, groove or chamfer of brittle materials, the grinding amount can reach 5 um / min, and Ra < 0.02 um.

[0244] The following is an explanation through a table of the influence of the change in the abrasive particle size on the cutting force and roughness in the grinding head structure provided by this embodiment.

[0245] Table 11 Data of cutting force and roughness corresponding to the change in abrasive particle size

[0246]

[0247] As shown in Table 11 above, for the change in the abrasive particle size, when using the grinding head structure provided by the above embodiment to grind and polish the plane, side surface, groove or chamfer of brittle materials, the grinding amount can reach 5 um / min, and Ra < 0.02 um.

[0248] The following is an explanation through a table of the influence of the change in the proportion of glue to diamond powder in the abrasive slurry on the cutting force and roughness in the grinding head structure provided by this embodiment.

[0249] Table 12 Data of cutting force and roughness corresponding to the change in the proportion of glue to diamond powder in the abrasive slurry

[0250]

[0251] As shown in Table 12 above, for the change in the proportion of glue to diamond powder in the abrasive slurry, when using the grinding head structure provided by the above embodiment to grind and polish the plane, side surface, groove or chamfer of brittle materials, the grinding amount can reach 5 um / min, and Ra < 0.02 um.

[0252] Please refer to Figure 4 , Figure 4 which is a flowchart of a method for manufacturing a grinding head structure provided by an embodiment of the present invention. As Figure 4 shown, the method for manufacturing the grinding head structure provided by the embodiment of the present invention is used to manufacture the grinding head structure described in any of the above embodiments, and includes:

[0253] 410. Manufacture a base plate, where the base plate includes a base shaft, a base, and an elastic substrate body arranged in sequence, and the base shaft, the base, and the elastic substrate body are coaxially arranged; the end face of the base shaft is arranged on the first end face of the base, and the second end face of the base is arranged on the first end face of the elastic substrate body;

[0254] 420. Open a first groove in the middle of the second end face of the elastic substrate body;

[0255] 430. Open a plurality of second grooves arranged regularly on the surface of the outer edge boss of the first groove;

[0256] 440. Fill abrasive in the second groove. Specifically, fill abrasive slurry including abrasive in the second groove.

[0257] After step 440, that is, after the abrasive slurry including abrasive filled in the second groove is cured, perform profile trimming on the outer surface of the grinding head.

[0258] The attribute parameters and characteristics of the grinding head structure in this embodiment are realized with reference to the grinding head structure in the above embodiment, and the specific implementation details will not be elaborated here.

[0259] The present utility model relates to the technical field of grinding processing, and discloses a grinding head structure and a manufacturing and processing method. The grinding head structure includes a base plate and a grinding head. The base plate includes a base shaft and a base. The grinding head includes an elastic base body. The base plate and the elastic base body are arranged coaxially in sequence. A first groove is provided in the middle of the second end face of the elastic base body. By opening a plurality of second grooves on the upper surface and / or side surface of the outer edge boss of the first groove, the second grooves extend along the outer edge of the outer edge boss on the surface of the outer edge boss. Filling diamond glue slurry in the regularly arranged plurality of second grooves forms a grinding head for polishing electronic glass, which can perform grinding and polishing processing on the plane, side surface, groove or chamfer of hard and brittle materials such as 3D glass, ceramics, and magnetic materials. The grinding amount can reach 5um / min, and Ra < 0.02um.

[0260] Please refer to Figure 5 , Figure 5 which is a flowchart of a processing method for a grinding head structure provided by an embodiment of the present utility model. As Figure 5 shown, the grinding head structure processing method uses the grinding head structure described in any of the above embodiments to process the workpiece to be processed, including:

[0261] 510. Place the workpiece to be processed and the grinding head structure on the processing platform, and position the workpiece to be processed; the grinding head structure is the grinding head structure in any of the above embodiments;

[0262] 520. Use the grinding head structure to perform fine grinding on the workpiece to be processed to obtain the fine-ground electronic glass; the grinding head structure is the grinding head structure in any of the above embodiments.

[0263] The attribute parameters and characteristics of the grinding head structure in this embodiment are realized with reference to the grinding head structure in the above embodiment, and the specific implementation details will not be elaborated here.

[0264] The utility model relates to the technical field of grinding processing, and discloses a grinding head structure, a manufacturing method and a processing method. The grinding head structure includes a base plate and a grinding head. The base plate includes a base shaft and a base. The grinding head includes an elastic base body. The base plate and the elastic base body are arranged coaxially in sequence. A first groove is provided in the middle of the second end face of the elastic base body. By providing a plurality of second grooves on the upper surface and / or side surface of the outer edge boss of the first groove, the second grooves extend along the outer edge of the outer edge boss on the surface of the outer edge boss. Diamond glue slurry is filled in the regularly arranged plurality of second grooves to form a grinding head for polishing electronic glass, which can perform grinding and polishing processing on the plane, side surface, groove or chamfer of hard and brittle materials such as 3D glass, ceramics, and magnetic materials. The grinding amount can reach 5um / min, and Ra < 0.02um.

[0265] Please refer to Figure 6 , Figure 6 which is a flowchart of a processing method for a grinding head structure provided by an embodiment of the utility model. As Figure 6 shown, the processing method for the grinding head structure uses the grinding head structure described in any of the above embodiments to process the workpiece to be processed, including:

[0266] 610. Place the workpiece to be processed, the rough grinding processing grinding head, and the grinding head structure on the processing platform, and position the workpiece to be processed; the grinding head structure is the grinding head structure in any of the above embodiments;

[0267] 620. Use the rough grinding processing grinding head to perform rough grinding on the positioned workpiece to be processed to obtain the rough ground electronic glass;

[0268] 630. Use the grinding head structure to perform fine grinding on the rough ground electronic glass to obtain the finely ground electronic glass; the grinding head structure is the grinding head structure in any of the above embodiments.

[0269] The utility model relates to the technical field of grinding processing, and discloses a grinding head structure. The grinding head structure includes a base plate and a grinding head. The base plate includes a base shaft and a base. The grinding head includes an elastic base body. The base plate and the elastic base body are arranged coaxially in sequence. A first groove is provided in the middle of the second end face of the elastic base body. By providing a plurality of second grooves on the upper surface and / or side surface of the outer edge boss of the first groove, the second grooves extend along the outer edge of the outer edge boss on the surface of the outer edge boss. Diamond glue slurry is filled in the regularly arranged plurality of second grooves to form a grinding head for polishing electronic glass, which can perform grinding and polishing processing on the plane, side surface, groove or chamfer of hard and brittle materials such as 3D glass, ceramics, and magnetic materials. The grinding amount can reach 5um / min, and Ra < 0.02um.

[0270] The attribute parameters and characteristics of the grinding head structure in this embodiment are implemented with reference to the grinding head structure in the above embodiment, and the specific implementation details will not be elaborated here.

[0271] The grinding head structure provided by the embodiment of the present invention forms a grinding head for polishing electronic glass by filling diamond cement slurry in a plurality of regularly arranged second grooves opened on the upper surface and / or side surface of the outer edge boss of the first groove. The second grooves extend along the outer edge of the outer edge boss on the surface of the outer edge boss. It can perform grinding and polishing processing on the plane, side, groove or chamfer of hard and brittle materials such as 3D glass, ceramics, and magnetic materials. The grinding amount can reach 5um / min, and Ra < 0.02um. It can seamlessly switch the processing part in a timely manner according to the needs of the processing personnel, and can achieve high-efficiency and fine processing of electronic glass products without replacing the grinding head or the processing platform.

[0272] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present invention.

[0273] In addition, the terms "first", "second", "third", and "fourth" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", and "fourth" may explicitly or implicitly include at least one of such features.

[0274] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "setting", "connection", "fixation", "swivel connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0275] It should be noted that, in this text, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising that element.

[0276] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A grinding head structure, characterized in that, It includes a base plate and a grinding head. The grinding head includes an elastic substrate body, and the base plate and the elastic substrate body are arranged coaxially in sequence; The first end face of the elastic substrate body is arranged on one end face of the base plate; The second end face of the elastic substrate body is opposite to the first end face of the elastic substrate body, and a first groove is provided in the middle of the second end face of the elastic substrate body; A plurality of second grooves arranged regularly are provided on the surface of the outer edge boss of the first groove; The second groove extends along the outer edge of the outer edge boss on the surface of the outer edge boss; The inside of the second groove is filled with abrasive; 2. The grinding head structure according to claim 1, wherein, The material of the elastic substrate body is an elastomer with a Shore hardness of 25C or 95A or between 25C and 95A; The shape of the second groove is a rectangular groove; The ratio of the width of the second groove to the spacing distance between two adjacent second grooves is 1:1 or 1:2, or any ratio between 1:1 and 1:

2. The ratio of the width of the second groove to the thickness of the second groove is 1:1 or 2:1, or any ratio between 1:1 and 2:

1.

3. The grinding head structure according to claim 2, wherein, The material of the elastic substrate body is polyurethane or silica gel or rubber or non-woven polishing leather; When the second end face of the elastic substrate body is the working face, a plurality of the second grooves arranged regularly are provided on the upper surface of the outer edge boss of the first groove.

4. The grinding head structure according to claim 3, characterized in that, The elastic substrate body is a cylinder; The first groove is an annular groove, and the annular groove includes a first inner groove located in the middle of the elastic substrate body. The annular groove also includes a second outer groove surrounding the first inner groove; The upper edge of the first inner groove extends towards the outer circumference of the cylinder to form the bottom of the second outer groove, and the upper edge of the second outer groove extends towards the outer circumference of the cylinder to form the outer edge boss of the first groove; All the second grooves are distributed in a fan shape and are arranged regularly around the upper surface of the outer edge boss of the first groove for one week.

5. The grinding head according to claim 2, characterized in that, The material of the elastic substrate body is polyurethane or silica gel or rubber or non-woven polishing leather; When the side face of the elastic substrate body is the working face, a plurality of the second grooves arranged regularly are provided on the side surface of the outer edge boss of the first groove.

6. The grinding head structure according to claim 5, characterized in that, The second grooves provided on the side surface of the outer edge boss of the first groove extend along the side surface of the elastic substrate body towards the base plate.

7. The grinding head structure according to claim 6, wherein, The elastic substrate body is a cylinder; The upper edge of the first groove extends towards the outer circumference of the cylinder to form the outer edge boss of the first groove; The long sides of all the second grooves are distributed longitudinally parallel to the axis of the elastic substrate body, and all the second grooves are arranged regularly around the side surface of the outer edge boss of the first groove for one week.

8. The grinding head structure according to any one of claims 1-7, characterized in that, The abrasive is an abrasive formed by diamond paste; The diamond paste includes two-component polyurethane glue or epoxy resin glue, and diamond powder formed by one or more particle size combinations of 0.5um and / or 50um, and / or between 0.5um and 50um; The proportion of the diamond powder in the diamond paste is 10% or 80%, or any value between 10% and 80%.

Images