High-temperature curing device for resin product

Abstract

The utility model relates to a high-temperature curing device for resin products, which comprises a drying oven main body and a product bearing frame, a containing cavity is formed in the drying oven main body, the product bearing frame is arranged in the containing cavity in a sliding manner, a plurality of bearing layers are arranged on the product bearing frame, and the bearing layers are used for bearing products. A heat dissipation cover is arranged between the drying oven body and the product bearing frame, the heat dissipation cover is used for diffusing heat generated by a heating part into the containing cavity, and the effect of improving the surface heating balance of the resin product during high-temperature curing is achieved.

Description

Technical Field

[0001] This application relates to the field of resin product production, and particularly to a high-temperature curing device for resin products. Background Art

[0002] Products made of resin are widely used in various fields such as automobile manufacturing, electronic appliances, building materials, furniture decoration, daily necessities, and medical devices due to their excellent corrosion resistance, light weight and high strength, good molding processability, and diverse appearance options, providing efficient, beautiful, and durable solutions for various industries.

[0003] After the production of products made of resin materials is completed, a high-temperature curing process is also required. High-temperature curing helps cross-linking reactions occur between monomer molecules in the resin, forming a stable network structure of high-molecular polymers, thereby improving the physical properties of the products, such as hardness, wear resistance, corrosion resistance, and heat resistance. In addition, high-temperature curing can also promote the volatilization of solvents in the resin, ensuring the purity and quality of the products, and is a key step to achieve complete curing and excellent performance of the products.

[0004] Therefore, the oven plays an important role in the curing process of products. In practical applications, operators need to place the products on the tray in an orderly manner, and then place the tray in the oven. The controller controls the heating components to start working, so that the heating components start to heat the inside of the oven, and the products are cured by means of thermal radiation. However, the heat radiated to the surface of the products by the heating components is in an uneven state during operation, resulting in uneven heating of some areas of the products during the curing process. When the products are taken out of the oven, deformation, cracking, or uneven surfaces may occur, which is not conducive to improving the quality of the products and there is room for improvement. Summary of the Utility Model

[0005] In order to improve the evenness of the surface heating of resin products during high-temperature curing, this application provides a high-temperature curing device for resin products.

[0006] A high-temperature curing device for resin products provided by this application adopts the following technical solutions:

[0007] A high-temperature curing device for resin products includes an oven main body and a product carrier. A cavity is formed inside the oven main body. The product carrier is slidably arranged in the cavity. A plurality of bearing layers are provided on the product carrier, and the bearing layers are used to carry products. A heat dissipation cover is arranged between the oven main body and the product carrier, and the heat dissipation cover is used to diffuse the heat generated by the heating components into the cavity.

[0008] By adopting the above technical solution, a heat dissipation cover is arranged inside the oven main body. The heat dissipation cover is beneficial to evenly diffuse the heat generated by the heating components into the cavity. At the same time, the products are carried by several layers of bearing layers, thereby increasing the distance between any two adjacent products, which is more conducive to increasing the heat receiving area of the products, playing a positive guiding role in improving the evenness of the surface heat reception of resin products during high-temperature curing, and also being beneficial to increasing the number of products that can be cured in the oven main body at the same time and improving the production efficiency of the products.

[0009] Preferably, a buffer area is arranged between the heat dissipation cover and the inner wall of the oven main body, and a blower is arranged in the buffer area.

[0010] By adopting the above technical solution, the blower provides power for the heat generated by the heating components to diffuse into the cavity. Since a buffer area is arranged between the heat dissipation cover and the inner wall of the oven main body, after the heat is diffused by the blower, the heat quickly fills the buffer area, and the heat after being buffered by the buffer area diffuses along the heat dissipation cover into the cavity, reducing the probability of the situation that the heat generated by the heating components directly acts on the product surface and causes uneven heating of the product.

[0011] Preferably, a plurality of through holes are formed in the heat dissipation cover in the thickness direction, and the plurality of through holes are used for gas to pass through.

[0012] By adopting the above technical solution, the efficiency of heat circulation is increased through the plurality of through holes, so that the heat can be quickly diffused into the cavity.

[0013] Preferably, a bearing plate is slidably arranged on the bearing layer, and a supporting fixture is detachably arranged on the bearing plate, and the supporting fixture is used for supporting the product.

[0014] By adopting the above technical solution, the bearing plate is slidably matched with the bearing layer, so that it is convenient to remove the bearing plate along the bearing layer or place the bearing plate on the bearing layer. At the same time, the workpiece is carried by the supporting fixture, so as to facilitate batch removal of the products along the bearing plate or placing the products on the bearing plate, improving the production efficiency.

[0015] Preferably, a communication hole is formed in the oven main body, and the communication hole is used to balance the pressure in the cavity.

[0016] By adopting the above technical solution, since the heat in the cavity is in a flowing state, the communication hole is beneficial to balancing the pressure in the oven main body, reducing the probability of the situation that the heat circulation in the cavity is blocked due to the pressure difference between the cavity and the external environment.

[0017] Preferably, a shielding door is arranged on the oven main body, the shielding door is used to shield the cavity, and a magnetic lock is arranged on the shielding door.

[0018] By adopting the above technical solution, the oven main body is enclosed by the shielding door to reduce the leakage of heat in the cavity, which plays a positive guiding role in maintaining the temperature in the oven main body. At the same time, by the magnetic force provided by the magnetic lock, it is convenient to open or close the shielding door along the oven main body.

[0019] Preferably, a plurality of air dispersion holes are arranged in a rectangular array on the bearing plate, and the air dispersion holes are used for gas to pass through.

[0020] By adopting the above technical solution, when the heat diffuses into the cavity along the circulation holes, the flow direction of the heat in the cavity is in a disordered state. The air dispersion holes are beneficial to enhancing the heat circulation performance, and can further improve the evenness of the surface heating of the product during the curing process.

[0021] Preferably, a plurality of support columns are arranged on the supporting fixture, and the support columns are used for erecting the product.

[0022] By adopting the above technical solution, through the supporting action of a plurality of support columns, when the product is placed on the fixture, a gap for heat circulation is formed between the bottom of the product and the bottom of the fixture, so that the heat received by the bottom of the product is the same as the heat received by the surface of the product, reducing the probability of the situation that the bottom of the product is unevenly heated and the curing degree of the bottom of the product is poor.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. A heat dissipation cover is arranged in the oven main body. The heat dissipation cover is beneficial to relatively evenly diffusing the heat generated by the heating component into the cavity. At the same time, the products are carried by a plurality of bearing layers, thereby increasing the distance between any two adjacent products, which is more beneficial to increasing the heating area of the products and plays a positive guiding role in improving the evenness of the surface heating of the resin products during high-temperature curing;

[0025] 2. The blower provides power for the heat generated by the heating component to diffuse into the cavity. Since a buffer area is arranged between the heat dissipation cover and the inner wall of the oven main body, after the heat is diffused by the blower, the heat diffuses into the cavity along the heat dissipation cover, reducing the probability of the situation that the heat generated by the heating component directly acts on the product surface and causes uneven heating of the product;

[0026] 3. Through the supporting action of a plurality of support columns, the heat received by the bottom of the product is the same as the heat received by the surface of the product, reducing the probability of the situation that the bottom of the product is unevenly heated and the curing degree of the bottom of the product is poor. Description of the Drawings

[0027] Figure 1It is a schematic diagram of the overall structure of a high-temperature curing device for a resin product according to an embodiment of the present application.

[0028] Figure 2 It is a schematic diagram of the structure of a high-temperature curing device for a resin product according to an embodiment of the present application after hiding the oven main body.

[0029] Figure 3 It is a schematic diagram of the cooperation relationship between the carrier plate and the supporting jig in a high-temperature curing device for a resin product according to an embodiment of the present application.

[0030] Explanation of reference numerals: 1, oven main body; 2, carrier rack; 21, slider; 3, cavity; 31, slide rail; 4, carrier layer; 5, heat dissipation cover; 51, circulation hole; 6, buffer zone; 7, carrier plate; 8, communication hole; 9, shielding door; 91, magnetic lock; 10, air vent hole; 11, supporting jig; 12, support pillar; 13, placement area; 14, positioning hole; 15, positioning pin; 16, blower. Detailed implementation manners

[0031] The following further elaborates on the present application in conjunction with the attached Figures 1-3 drawings.

[0032] An embodiment of the present application discloses a high-temperature curing device for a resin product. Referring to Figure 1 and Figure 2 , a high-temperature curing device for a resin product includes an oven main body 1 and a product carrier rack 2. The oven main body 1 is provided with a cavity 3. The product carrier rack 2 is slidably arranged in the cavity 3. A plurality of carrier layers 4 are arranged on the product carrier rack 2. The carrier layers 4 are used for carrying products. A heat dissipation cover 5 is arranged between the oven main body 1 and the product carrier rack 2. The heat dissipation cover 5 is used for diffusing the heat generated by the heating part into the cavity 3.

[0033] Specifically, the oven main body 1 is internally provided with a heating component for heating and raising the temperature of the cavity 3. It is a conventional electric heating component, and its specific composition and working principle will not be elaborated here.

[0034] At the same time, the contour of the cavity 3 is arranged in a cuboid shape, and one end along the length direction of the oven main body 1 is open, and the other end is closed. A shielding door 9 is arranged at the open end of the oven main body 1. The shielding door 9 is used for shielding the cavity 3. A magnetic lock 91 is arranged on the shielding door 9.

[0035] Correspondingly, the contour of the shielding door 9 is adapted to the contour of the cavity 3, so that the shielding door 9 can shield one end of the oven main body 1 that is in an open setting. One end of the shielding door 9 is hinged to the oven main body 1 (such as a hinge), so that the oven main body 1 can be opened or closed along the hinge point. The magnetic lock 91 is arranged at one end of the shielding door 9 away from the hinge point. When the oven main body 1 is working normally, through the magnetic force provided by the magnetic lock 91, the shielding door 9 can be attracted to the oven main body 1, which is convenient for the operator to open or close the shielding door 9.

[0036] On the other hand, communication holes 8 are formed in the oven main body 1. The communication holes 8 are used to balance the pressure in the cavity 3. There are two communication holes 8, and the two communication holes 8 are respectively located on the side walls of the oven main body 1 along the width direction, and the communication holes 8 penetrate through the oven main body 1 and communicate with the cavity 3.

[0037] Its function is that when the shielding door 9 is closed, the cavity 3 is in a closed state, so that the heat flow in the cavity 3 is blocked. Therefore, through the two communication holes 8, it is beneficial to balance the pressure inside the cavity 3 and the pressure outside the oven main body 1, so that the heat can flow smoothly along the inside of the cavity 3, which is beneficial to improving the uniformity of the heat in each part of the cavity 3.

[0038] Therefore, a heat dissipation cover 5 is arranged in the oven main body 1. Through the heat dissipation cover 5, it is beneficial to relatively evenly disperse the heat generated by the heating components into the cavity 3. At the same time, the products are carried by several layers of bearing layers 4, thereby increasing the distance between any two adjacent products, which is more beneficial to increasing the heat receiving area of the products, playing a positive guiding role in improving the uniformity of the surface heat of the resin products during high-temperature curing, and also being beneficial to increasing the number of products that can be cured in the oven main body 1 at the same time and improving the production efficiency of the products.

[0039] In addition, sliders 21 are arranged at the bottom of the carrier 2, and slide rails 31 are arranged at the bottom of the cavity 3 from the open end of the oven main body 1 to the closed end of the oven main body 1. The key point is that when the oven main body 1 is in a working state, the temperature in the cavity 3 is relatively high. Therefore, the sliders 21 and the slide rails 31 are integrally formed by metal materials, rather than using ball-type sliders 21 and slide rails 31, so that the sliders 21 and the slide rails 31 can still work normally under high-temperature conditions, reducing the probability of the situation that the sliders 21 get stuck when carrying the carrier 2 and sliding along the slide rails 31. When the oven main body 1 finishes curing the products on the carrier 2, through the cooperation of the sliders 21 and the slide rails 31, it is convenient to take out the carrier 2 from the cavity 3, and the operation is simple.

[0040] Refer to Figure 1 and Figure 2, a buffer area 6 is provided between the heat dissipation cover 5 and the inner wall of the oven main body 1, and a blower 16 is provided in the buffer area 6.

[0041] Specifically, the cross-sectional shape of the heat dissipation cover 5 is set in a U shape, and the contour area of the heat dissipation cover 5 is smaller than the contour area of the cavity 3. The heat dissipation cover 5 is fixed in the cavity 3 by bolts, thereby forming the buffer area 6. At the same time, the blower 16 is installed on the outer side wall of the oven main body 1, and the air outlet of the blower 16 communicates with the buffer area 6.

[0042] Therefore, when the oven main body 1 is in the working state, the blower 16 provides power for the heat generated by the heating components to diffuse into the cavity 3. Since a buffer area 6 is provided between the heat dissipation cover 5 and the inner wall of the oven main body 1, after the heat is diffused by the blower 16, the heat quickly fills the buffer area 6, and the heat after being buffered by the buffer area 6 diffuses along the heat dissipation cover 5 into the cavity 3, reducing the probability of the situation that the heat generated by the heating part directly acts on the product surface and causes uneven heating of the product.

[0043] Further, a plurality of through holes 51 are formed through the heat dissipation cover 5 in the thickness direction, and the plurality of through holes 51 are used for allowing gas to pass through. The plurality of through holes 51 are arranged in a rectangular array on the surface of the heat dissipation cover 5. Since the number of the through holes 51 is large and all are used for allowing gas to pass through, the number thereof is not limited herein. The plurality of through holes 51 increase the flow efficiency when the heat flows from the buffer area 6 into the cavity 3, so that the heat in the buffer area 6 can be quickly diffused into the cavity 3.

[0044] Refer to Figure 2 and Figure 3 , the number of layers of the bearing layer 4 can be changed according to the size of the cavity 3 and the size of the product to be cured. In this embodiment, the number of the bearing layers 4 is set to three. A bearing plate 7 is slidably arranged on the bearing layer 4, and a supporting jig 11 is detachably arranged on the bearing plate 7, and the supporting jig 11 is used for supporting the product.

[0045] Specifically, since the installation methods and components of each layer of the bearing layer 4 are the same, any one of the bearing layers 4 is taken for description below. Three bearing plates 7 are arranged at equal intervals along the width direction of the bearing layer 4, and the three bearing plates 7 are all slidably matched with the bearing layer 4, so that any one of the bearing plates 7 can be removed along the bearing layer 4 or the bearing plate 7 can be placed on the bearing layer 4, so as to facilitate placing the product on the bearing layer 4.

[0046] Further, a plurality of air holes 10 are arranged in a rectangular array on the bearing plate 7, and the air holes 10 are used for allowing gas to flow through. Its function is that when the heat diffuses into the cavity 3 along the through holes 51, the flow direction of the heat in the cavity 3 is in a disordered state. The air holes 10 are beneficial to enhancing the heat flow performance and can further improve the evenness of the surface heating of the product during the curing process.

[0047] Meanwhile, three supporting jigs 11 are arranged at equal intervals along the length direction of each carrier plate 7. Since the cooperation mode of any one of the supporting jigs 11 and the carrier plate 7 is the same, any one of the supporting jigs 11 is taken for illustration below. Four positioning holes 14 are arranged in a rectangular array on the carrier plate 7. Correspondingly, four positioning pins 15 are installed in a rectangular array on the surface of the supporting jig 11 that abuts against the carrier plate 7. The four positioning pins 15 are inserted into the four positioning holes 14 one by one, so that the supporting jig 11 can be stably placed on the supporting layer.

[0048] Correspondingly, a plurality of support columns 12 are arranged on the supporting jig 11, and the support columns 12 are used to support the product. It should be noted here that four placement areas 13 are formed on the supporting jig 11. The placement areas 13 are formed by the supporting jig 11 being recessed in the thickness direction, so that four products can be placed on one supporting jig 11 at the same time. Meanwhile, a plurality of support columns 12 are located in the placement areas 13, and the support columns 12 are formed by the supporting jig 11 protruding upward along the placement areas 13. Through the supporting action of the plurality of support columns 12, when the product is placed on the jig, a gap for heat circulation is formed between the bottom of the product and the bottom of the jig, so that the heat received by the bottom of the product is the same as the heat received by the surface of the product, reducing the probability of uneven heating at the bottom of the product and resulting in poor curing degree at the bottom of the product.

[0049] The implementation principle of the high-temperature curing device for resin products in the embodiment of the present application is as follows: Through the cooperation of the heat dissipation cover 5 and the blower 16, the heat generated by the heating components is quickly diffused into the cavity 3 along the circulation holes 51 through the buffering of the heat dissipation cover 5. When the heat reaches the cavity 3, since the air vent holes 10 are formed on the carrier plate 7, the heat quickly flows between the air vent holes 10, which is beneficial to improving the evenness of the surface heating during product curing; at the same time, three layers of supporting layers 4 are arranged on the carrier rack 2, and three carrier plates 7 are arranged on each supporting layer 4. Four supporting jigs 11 are placed on the carrier plates 7, and each supporting jig 11 can carry four products, thereby improving the efficiency of product curing.

[0050] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A high-temperature curing device for resin products, characterized in that: It includes an oven main body (1) and a product carrier (2). A cavity (3) is formed inside the oven main body (1). The product carrier (2) is slidably arranged inside the cavity (3). A plurality of bearing layers (4) are arranged on the product carrier (2), and the bearing layers (4) are used to bear products. A heat dissipation cover (5) is arranged between the oven main body (1) and the product carrier (2), and the heat dissipation cover (5) is used to diffuse the heat generated by the heating components into the cavity (3).

2. The high-temperature curing device for a resin product according to claim 1, wherein: A buffer area (6) is arranged between the heat dissipation cover (5) and the inner wall of the oven main body (1), and a blower (16) is arranged inside the buffer area (6).

3. The high-temperature curing device for a resin product according to claim 1, characterized in that: A plurality of through holes (51) are formed through the heat dissipation cover (5) in the thickness direction, and the plurality of through holes (51) are used for gas passage.

4. A high-temperature curing device for a resin product according to claim 1, characterized in that: A bearing plate (7) is slidably arranged on the bearing layer (4), and a supporting fixture (11) is detachably arranged on the bearing plate (7), and the supporting fixture (11) is used to support products.

5. A high-temperature curing device for a resin product according to claim 1, characterized in that: A communication hole (8) is formed in the oven main body (1), and the communication hole (8) is used to balance the pressure inside the cavity (3).

6. The high-temperature curing device for a resin product according to claim 1, wherein: A shielding door (9) is arranged on the oven main body (1), and the shielding door (9) is used to shield the cavity (3), and a magnetic lock (91) is arranged on the shielding door (9).

7. A high-temperature curing device for a resin product according to claim 4, characterized in that: A plurality of air dispersion holes (10) are arranged in a rectangular array on the bearing plate (7), and the air dispersion holes (10) are used for gas passage.

8. An apparatus for high-temperature curing of a resin product according to claim 4, characterized in that: A plurality of support columns (12) are arranged on the supporting fixture (11), and the support columns (12) are used to support products.

Images