Display screen module with good heat dissipation effect

Abstract

The utility model discloses a display screen module with a good heat dissipation effect, which comprises a base layer plate, a heat insulation layer, a circuit board, a film coating layer, a support insulation layer, an organic glass main screen layer, a negative pressure plug body, a negative pressure cavity and a bonding ring layer, the right side surface of the base layer plate is provided with a base layer inner groove, and the heat insulation layer is arranged in the base layer inner groove; a heat insulation cavity is formed in the right side face of the heat insulation layer, the circuit board is installed in the heat insulation cavity, the supporting insulation layer is further arranged on the right side face of the heat insulation layer in a pressed mode, the organic glass main screen layer is installed on the right side face of the supporting insulation layer, and a base layer protruding part is arranged on the right side face of the base layer plate. A supporting convex part is arranged on the left side of the supporting insulating layer, and a gas blocking groove is formed in the base layer convex part. The resistance screen has the beneficial effects that the high-temperature resistance of the resistance screen is improved by reducing the gas density in the cavity and arranging the heat insulation layer, the gas tightness in the cavity is enhanced by the two inserting convex parts, and the resistance screen is convenient to use for a long time.

Description

Technical Field

[0001] The utility model relates to the field of display screens, and particularly to a display screen module with good heat dissipation effect. Background Technique

[0002] Display screens have been applied in all aspects of contemporary society, such as in the fields of office work, gaming, audio-visual entertainment, and even advertising and public welfare. For display screens used indoors, the requirements for dust and water protection are relatively low. However, for display screens used outdoors for a long time, since most of their internal components are electronic components, the requirements for dust and water protection are relatively high. Some display screen casings have good sealing performance, but correspondingly, their heat dissipation performance will decrease. Therefore, there is a need for a fully enclosed display screen that can both ensure dust and water protection effects and take into account heat dissipation performance. Content of the Utility Model

[0003] The purpose of the utility model is to provide a display screen module with good heat dissipation effect in order to solve the above problems.

[0004] The utility model realizes the above purpose through the following technical solutions:

[0005] A display screen module with good heat dissipation effect includes a display screen frame and a fan blade power box. The fan blade power box is installed on the top of the display screen frame. On the front and back sides of the frame of the display screen frame, a display screen body and a protective back plate are respectively installed and fixed. An electronic component cavity is enclosed by the display screen frame, the display screen body, and the protective back plate. A plurality of heat conduction holes are opened on the protective back plate, and multi-contact heat dissipation groove columns are installed in the heat conduction holes. One end of the multi-contact heat dissipation groove column extends into the electronic component cavity and is provided with a plurality of annular multi-contact deep grooves. A cavity surrounding plate is installed at the bottom of the back side of the fan blade power box. A heat dissipation cavity is enclosed between the cavity surrounding plate and the protective back plate. An internal cavity pipe is installed on the fan blade power box, and the inlet pipe orifice of the internal cavity pipe extends into the heat dissipation cavity. A refrigeration hole is opened on the protective back plate, and a refrigeration installation frame is installed in the refrigeration hole. A semiconductor refrigerator is installed in the refrigeration installation frame.

[0006] Further, the semiconductor cooling end of the semiconductor refrigerator is arranged in the electronic component cavity, and the semiconductor heating end of the semiconductor refrigerator is arranged in the heat dissipation cavity.

[0007] Further, a control board assembly is installed in the electronic component cavity through a board rack, and a temperature sensor is installed on the cavity wall of the electronic component cavity.

[0008] Further, a fan assembly is installed in the fan blade power box, and a front screen inclined pipe is installed at the bottom of the front side of the fan blade power box.

[0009] Furthermore, one end of the multi-contact heat dissipation groove column extends into the heat dissipation cavity and is provided with a plurality of vertical air guide channels.

[0010] The beneficial effects are as follows: The display screen module with good heat dissipation performance of the present invention improves the high-temperature resistance performance of the resistive screen by reducing the gas density in the cavity and setting the heat insulation layer, and enhances the air tightness in the cavity through two plug-in convex parts, which is convenient for long-term use. Description of the Drawings

[0011] Figure 1 is an internal schematic diagram of a display screen module with good heat dissipation performance of the present invention;

[0012] Figure 2 is a schematic diagram of the multi-contact heat dissipation groove column of a display screen module with good heat dissipation performance of the present invention.

[0013] The descriptions of the reference numerals are as follows:

[0014] Display screen ring frame; 2, Fan blade power box; 3, Multi-contact heat dissipation groove column; 4, Protective back plate; 5, Cavity surrounding plate; 6, Plate frame; 7, Control board assembly; 8, Refrigeration installation frame; 9, Display screen body; 10, Front screen inclined pipe; 11, Inner cavity pipe; 12, Heat dissipation cavity; 13, Semiconductor refrigeration hot end; 14, Semiconductor refrigeration cold end; 15, Vertical air guide channel; 16, Multi-contact deep groove; 17, Temperature sensor. Specific Embodiments

[0015] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0016] The present invention will be further described below with reference to the drawings:

[0017] As Figure 1 - Figure 2 shown, a display screen module with good heat dissipation performance is composed of a display screen ring frame 1 and a fan blade power box 2;

[0018] The fan blade power box 2 is installed on the top of the display screen ring frame 1. The display screen body 9 and the protective back plate 4 are respectively installed and fixed on the front and back sides of the frame body of the display screen ring frame 1. The protective back plate 4 is a fully enclosed back plate, which has better dust and water resistance. The display screen ring frame 1, the display screen body 9 and the protective back plate 4 enclose a component cavity;

[0019] To improve its heat dissipation performance, a number of heat conduction holes are provided on the protective backplane 4. A multi-contact heat dissipation groove column 3 is installed in the heat conduction holes. The multi-contact heat dissipation groove column 3 is made of a heat conductive material, facilitating the heat in the component cavity to be conducted out. One end of the multi-contact heat dissipation groove column 3 extends into the component cavity and is provided with a number of annular multi-contact deep grooves 16. The setting of the multi-contact deep grooves 16 increases the contact area between the multi-contact heat dissipation groove column 3 and the hot gas in the component cavity, thereby accelerating heat dissipation;

[0020] At the bottom of the back side of the fan blade power box 2, a cavity surrounding plate 5 is installed. A heat dissipation cavity 12 is enclosed between the cavity surrounding plate 5 and the protective backplane 4. Only the bottom air inlet is left on the cavity surrounding plate 5 to facilitate the influx of air flow. An inner cavity pipe 11 is installed on the fan blade power box 2, and the inlet pipe orifice of the inner cavity pipe 11 extends into the heat dissipation cavity 12;

[0021] On the protective backplane 4, a refrigeration hole is provided. A refrigeration mounting frame 8 is installed in the refrigeration hole. A semiconductor refrigerator is installed in the refrigeration mounting frame 8. It is a small refrigeration structure, normally in a non-working state, and starts when the temperature is too high to avoid damage to the internal components caused by excessive temperature.

[0022] As Figure 1 - Figure 2 shown, the present utility model also discloses the following multiple more optimized specific structures:

[0023] The semiconductor refrigeration cold end 14 of the semiconductor refrigerator is arranged in the component cavity, and the semiconductor refrigeration hot end 13 of the semiconductor refrigerator is arranged in the heat dissipation cavity 12.

[0024] A control board assembly 7 is installed in the component cavity through a board rack 6. A temperature sensor 17 is installed on the cavity wall of the component cavity, which is used to detect the temperature in the component cavity.

[0025] A fan assembly is installed in the fan blade power box 2, which is composed of a fan blade, a motor driving the fan blade, and a frame body for fixing the motor and installing the fan blade. It is a disclosed structure and will not be further described here. A front screen inclined pipe 10 is installed at the bottom of the front side of the fan blade power box 2, and the front screen inclined pipe 10 is used to blow air towards the display screen body 9 to reduce dust adhesion.

[0026] One end of the multi-contact heat dissipation groove column 3 extends into the heat dissipation cavity 12 and is provided with a number of air guiding vertical channels 15, increasing the area between the external air flow and the multi-contact heat dissipation groove column 3 and increasing heat dissipation.

[0027] As Figure 1 - Figure 2The display module with good heat dissipation effect shown realizes the gas flow in the heat dissipation cavity 12 mainly through the fan blade assembly of the fan blade power box 2, conducts heat exchange inside and outside the component cavity through the multi-contact heat dissipation groove columns 3, and conducts heat conduction and dissipation quickly through the multi-contact deep grooves 16 and the air guiding vertical channels 15, realizing the rapid heat dissipation of the fully enclosed component cavity, with good heat dissipation effect. At the same time, a small semiconductor refrigerator is equipped to avoid component damage caused by overheating, and the safety factor is high.

[0028] The above has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A display module with good heat dissipation effect, characterized in that: It includes a display screen ring frame and a fan power box. The fan power box is installed on the top of the display screen ring frame. On the front and back sides of the frame body of the display screen ring frame, a display screen body and a protective back plate are respectively installed and fixed. The display screen ring frame, the display screen body and the protective back plate enclose a component cavity. A plurality of heat conduction holes are formed in the protective back plate, and multi-contact heat dissipation groove columns are installed in the heat conduction holes. One end of the multi-contact heat dissipation groove column extends into the component cavity and is provided with a plurality of annular multi-contact deep grooves. A cavity surrounding plate is installed at the bottom of the back side of the fan power box. A heat dissipation cavity is enclosed between the cavity surrounding plate and the protective back plate. An inner cavity pipe is installed on the fan power box, and the inlet pipe orifice of the inner cavity pipe extends into the heat dissipation cavity. A refrigeration hole is formed in the protective back plate, and a refrigeration mounting frame is installed in the refrigeration hole. A semiconductor refrigerator is installed in the refrigeration mounting frame.

2. The display module with good heat dissipation effect according to claim 1, characterized in that: The semiconductor cooling end of the semiconductor refrigerator is arranged in the component cavity, and the semiconductor heating end of the semiconductor refrigerator is arranged in the heat dissipation cavity.

3. The display module with good heat dissipation effect according to claim 1, characterized in that: A control board assembly is installed in the component cavity through a board frame, and a temperature sensor is installed on the cavity wall of the component cavity.

4. The display module with good heat dissipation effect according to claim 1, wherein: A fan assembly is installed in the fan power box, and a front screen inclined pipe is installed at the bottom of the front side of the fan power box.

5. The display module with good heat dissipation effect according to claim 1, wherein: One end of the multi-contact heat dissipation groove column extends into the heat dissipation cavity and is provided with a plurality of air guiding vertical channels.

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