Battery piece film coating carrier plate
By setting up fixing devices and buffer mechanisms of different sizes on the battery cell coated carrier plate, the problem of frequent replacement of carrier plates caused by changes in cell size is solved, efficient utilization of carrier plates and safe removal of battery cells is achieved, and cost and defective rate are reduced.
Patent Information
- Application Number
- CN202421732664.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-07-22
AI Technical Summary
In the photovoltaic industry, with the diversification of cell sizes, carrier plates need to be replaced frequently, resulting in increased costs and increased defective yields.
A battery-coated carrier plate is designed, and battery cell fixing devices of different sizes are provided on the front and back of the carrier plate, including placing slots and buffer air chambers, which can fix battery cells of different sizes at the same time and reduce the frequency of carrier plate replacement.
It improves the utilization rate of carrier plates, reduces the company's carrier plate procurement costs, reduces the risk of battery cells, and improves production efficiency.
Smart Images
Figure CN223155997U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of photovoltaic cells, and particularly relates to a carrier plate for coating battery wafers. Background Technique
[0002] Currently, with the development of the photovoltaic industry, the types and sizes of products are diverse and pluralistic. From the initial 125mm square and single-crystal battery wafers, 156mm single / multi-crystal battery wafers, to the currently popular 182mm whole / half wafers and 210mm whole / half wafers, the sizes of carriers used in the production process will also be updated accordingly. Currently, the 210mm whole / half battery wafers have relatively high advantages in the market. Each enterprise in the industry will switch production among products according to order requirements. During this period, in addition to the switching of the silicon wafers themselves, it is also shown that the tooling fixtures on the production line need to be switched for use according to the corresponding product sizes, including the back-and-forth switching of the carrier plates in the coating process.
[0003] The invention described in this case is mainly applicable to plate-type coating machines, and is suitable for single-sided coating machines during the process, such as the CVD coating machine in the HJT process. When the product size type is switched, the carrier plate also needs to be switched, which also means that it is necessary to purchase twice the number of carrier plates to meet the switching requirements between products. In the long run, the maintenance costs such as cleaning, depreciation, and damage of the carrier plates will be at a relatively high level. However, if the carrier plate does not need to be replaced when the product is switched, the costs of maintenance, depreciation, and renewal can be greatly saved. At the same time, there will be no large number of defective products during the running-in period of a large number of new carrier plates and battery wafers. Therefore, it is necessary to design a double-sided carrier plate to solve the above problems, save costs for enterprises, and indirectly reduce the occurrence of defective products. Content of the Utility Model
[0004] In order to solve the technical problem in the background technique that different carrier plates need to be replaced for different battery wafers, resulting in increased costs, the purpose of the utility model is to provide a carrier plate for coating battery wafers, which can solve the above problems.
[0005] The technical solution for achieving the purpose of the utility model is: a carrier plate for coating battery wafers, and battery wafer fixing devices with different sizes are respectively arranged on the front and back of the carrier plate for fixing battery wafers of different sizes.
[0006] In this solution, taking the coating of 210 whole and half battery wafers as an example, a fixing device for 210 whole battery wafers is arranged on the front of the carrier plate, and a fixing device for 210 half battery wafers is arranged on the back of the carrier plate. That is to say, a carrier plate can at least carry two different sizes of battery wafers on the front and back respectively, which means that the use of one carrier plate can be reduced, the utilization rate of the carrier plate in this solution is improved, and the cost for the enterprise to prepare other carrier plates for different battery wafer sizes is reduced.
[0007] Further, the solar cell fixing device is a placement groove, that is, placement grooves with different sizes are respectively arranged on the front and back of the carrier plate. When it is necessary to carry solar cells of different sizes, the solar cells can be directly placed into the placement grooves, and the fixing device is simple and convenient.
[0008] Further, a buffer mechanism is also arranged in the placement groove to facilitate the extraction of the solar cell from the placement groove. Since the solar cell is placed in the placement groove, and usually, the placement groove is similar in size to the corresponding solar cell, this makes it rather troublesome to extract the solar cell. Even when the solar cell adheres to the placement groove during suction, the instantaneous pressure is too large, resulting in problems such as silicon wafer hidden cracks and breakage. The buffer mechanism can play a buffering effect during wafer extraction to prevent this problem.
[0009] Further, the buffer mechanism is a buffer air chamber with an opening facing the outside of the carrier plate. When the solar cell is initially placed into the placement groove, a part of the air exists in the buffer air chamber. When sucking the solar cell, it will not cause too large an instantaneous pressure difference and result in problems such as silicon wafer breakage.
[0010] Further, the buffer air chamber is located at the center of the placement groove, that is, the size of the buffer air chamber is smaller than that of the placement groove. The buffer air chamber at the center position makes the pressure difference inside the solar cell more balanced during wafer extraction, facilitating the complete extraction of the solar cell and preventing breakage due to uneven local stress.
[0011] Further, there are at least two solar cell fixing devices on the front or back of the carrier plate, that is, the number is multiple, and more solar cells can be placed simultaneously, improving the efficiency.
[0012] Further, the multiple solar cell fixing devices are arranged in an array, and the layout facilitates automatic adjustment of positions in subsequent processes and is also beneficial for picking and placing solar cells in sequence.
[0013] Further, chamfers are provided at the outer peripheral corners of the carrier plate to prevent the carrier plate from colliding with other components and being damaged, and also to protect the operator from being injured after a collision.
[0014] Adopting the above technical solutions, the utility model has the following beneficial effects:
[0015] (1) Multiple placement grooves with different sizes are arranged on both the front and back of the carrier plate. At least two types of solar cells with different sizes can be placed on one carrier plate, improving the utilization rate of the carrier plate and reducing the cost of the enterprise in terms of the carrier plate;
[0016] (2) A buffer air chamber is arranged in the placement groove to prevent damage to the solar cell due to a large instantaneous pressure difference between the upper and lower parts of the solar cell during wafer extraction;
[0017] (3) The buffer air chamber is arranged at the center position of the placement groove to reduce and mitigate problems such as uneven stress caused by local instantaneous pressure difference of the cell during sheet picking.
[0018] (4) Chamfers are provided at the outer peripheral corners of the carrier plate to reduce damage caused by bumping. Description of the Drawings
[0019] To make the content of the present utility model easier to be clearly understood, the following further details the present utility model according to specific embodiments in conjunction with the drawings, where
[0020] Figure 1 is a schematic diagram of the front structure of the carrier plate in the present utility model;
[0021] Figure 2 is a schematic diagram of the back structure of the carrier plate in the present utility model;
[0022] Figure 3 is a partial enlarged view of the front of the carrier plate in the present utility model;
[0023] Figure 4 is a partial enlarged view of the back of the carrier plate in the present utility model;
[0024] Figure 5 is a partial cross-sectional view of the side of the carrier plate in the present utility model.
[0025] The reference numerals in the drawings are: 1 front of the carrier plate; 2 back of the carrier plate; 3 placement groove; 4 buffer air chamber; 5 outer peripheral corners of the carrier plate. Detailed Embodiments
[0026] Embodiment:
[0027] As Figure 1-2 shown, this embodiment provides a carrier plate for cell coating. The front 1 and the back 2 of the carrier plate are respectively provided with cell fixing devices of different sizes for fixing cells of different sizes. In this solution, taking the coating of type 210 whole and half cells as an example, a fixing device for type 210 whole cells is provided on the front 1 of the carrier plate, and a fixing device for type 210 half cells is provided on the back 2 of the carrier plate. That is to say, a carrier plate can carry at least two different sizes of cells on the front 1 and the back 2 of the carrier plate respectively, which can reduce the use of one carrier plate, improve the utilization rate of the carrier plate in this solution, and reduce the cost for the enterprise to prepare other carrier plates for different cell sizes.
[0028] Preferably, the cell fixing device is a placement groove 3, that is, placement grooves 3 of different sizes are respectively provided on the front and the back of the carrier plate. When it is necessary to carry cells of different sizes, the cells can be directly placed into the placement groove 3, and the fixing device is simple and convenient.
[0029] Preferably, chamfers are provided at the outer peripheral corners 5 of the carrier plate to prevent the carrier plate and other components from being damaged by collision, and also protect the operator from being injured after collision.
[0030] Preferably, there are at least two cell fixing devices on the front 1 or the back of the carrier plate, that is, the number is multiple, so that more cells can be placed at the same time, improving efficiency.
[0031] Preferably, the multiple cell fixing devices are arranged in an array, and the layout facilitates automatic adjustment of positions in subsequent processes and is also conducive to picking and placing cells in sequence.
[0032] As Figure 3-5 shown, a buffer mechanism is further provided in the placement groove 3 to facilitate the removal of the cell from the placement groove 3. Since the cell is placed in the placement groove 3, and usually, the placement groove 3 is similar in size to the corresponding cell, this makes it more troublesome to remove the cell. Even when the cell adheres to the placement groove 3 during suction, the instantaneous pressure is too large, causing problems such as silicon wafer hidden cracks and breakages. The buffer mechanism can play a buffering effect during picking to prevent this problem from occurring.
[0033] Preferably, the buffer mechanism is a buffer air chamber 4 with an opening facing the outside of the carrier plate. When initially placing the cell into the placement groove 3, a part of the air exists in the buffer air chamber 4. When sucking the cell, it will not cause too large an instantaneous pressure difference, resulting in problems such as silicon wafer breakage. The buffer air chamber 4 is located at the center of the placement groove 3, that is, the size of the buffer air chamber 4 is smaller than that of the placement groove 3. The buffer air chamber 4 at the center position makes the pressure difference inside the cell more balanced during picking, facilitating the complete removal of the cell without breakage due to uneven local stress.
[0034] Working principle: When in use, the front of the carrier plate can be used to place one size of cell, and for another cell of a different size, the back of the carrier plate can be selected; when specifically placing the cell, the cell can be directly placed into the placement groove 3. When picking up the cell, since air will be stored in the buffer air chamber 4 when initially placing the cell in the placement groove 3, the silicon wafer of the cell will not be damaged due to a large instantaneous air pressure difference on both sides.
[0035] In the above-described specific embodiments, the purpose, technical solutions, and beneficial effects of the present invention have been further described in detail. It should be understood that the above are only specific embodiments of the present invention and do not limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A carrier plate for coating solar cells, characterized in that, The front side (1) and the back side (2) of the carrier board are respectively provided with cell fixing devices of different sizes for fixing cells of different sizes.
2. The coating carrier for battery chips according to claim 1, wherein The cell fixing device is a placement groove (3).
3. The coating carrier for battery wafers according to claim 2, wherein A buffer mechanism is further arranged in the placement groove (3) to facilitate the removal of the cell from the placement groove (3).
4. A battery cell coating carrier according to claim 3, characterized in that, The buffer mechanism is a buffer air chamber (4) with an opening facing the outside of the carrier board.
5. A battery cell coating carrier according to claim 4, characterized in that, The buffer air chamber (4) is located at the center of the placement groove (3).
6. The coating carrier for battery chips according to claim 1, characterized in that, The cell fixing devices on the front side (1) or the back side (2) of the carrier board are at least two.
7. The coating carrier for battery chips according to claim 6, characterized in that, A plurality of the cell fixing devices are arranged in an array.
8. A battery cell coating carrier according to claim 1, characterized in that, A chamfer is provided at the outer peripheral corner (5) of the carrier board.