Multilayer substrate

Abstract

Provided is a multilayer substrate in which a second radiation conductor layer is provided on a laminate so as to be in contact with a second insulator layer, is positioned closer to the positive direction of the Z-axis than a first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in the Z-axis direction. The frequency of the electromagnetic waves radiated or received by the second radiation conductor layer is higher than that of the electromagnetic waves radiated or received by the first radiation conductor layer, or the area of the second radiation conductor layer is smaller than that of the first radiation conductor layer. The first planar ground conductor layer is positioned nearer to the negative direction of the Z axis than the first radiation conductor layer, and overlaps the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction.

Description

Technical Field

[0001] The present utility model relates to a multilayer substrate having a plurality of radiation conductor layers. Background Art

[0002] As a conventional invention related to an antenna element, a patch antenna described in Patent Document 1 is known. The patch antenna includes a dielectric block, a ground electrode, a non-powered electrode, a radiation electrode, and a connection electrode. The dielectric block has a disk shape having an upper main surface and a lower main surface. The ground electrode is provided on the lower main surface of the dielectric block. The radiation electrode is provided near the center of the upper main surface of the dielectric block. The non-powered electrode is provided on the upper main surface of the dielectric block. The non-powered electrode has an annular shape surrounding the periphery of the radiation electrode when viewed in the vertical direction. The connection electrode is provided on the side surface of the dielectric block. The connection electrode electrically connects the ground electrode and the non-powered electrode. In the above patch antenna, the radiation electrode transmits and receives high-frequency signals.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2007-97115 Summary of the Utility Model

[0006] Problems to be Solved by the Utility Model

[0007] However, in the patch antenna described in Patent Document 1, there are times when it is desired to provide a plurality of radiation electrodes. In such a case, there are expectations for miniaturizing the patch antenna and improving the radiation characteristics of the patch antenna.

[0008] Therefore, an object of the present utility model is to miniaturize a multilayer substrate having a plurality of radiation conductor layers and to improve the radiation characteristics of the plurality of radiation conductor layers.

[0009] Technical Solution for Solving the Problem

[0010] A multilayer substrate according to an aspect of the present utility model includes:

[0011] A laminate having a structure in which one or more first insulator layers and one or more second insulator layers are laminated in the Z-axis direction, and the dielectric constant of the one or more second insulator layers is lower than the dielectric constant of the one or more first insulator layers;

[0012] A first radiation conductor layer provided on the laminate so as to be in contact with the first insulator layer;

[0013] A second radiation conductor layer is disposed on the laminate such that it is in contact with the second insulator layer, is located in the positive direction of the Z-axis relative to the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in the Z-axis direction. The frequency of the electromagnetic wave radiated or received by the second radiation conductor layer is higher than that of the electromagnetic wave radiated or received by the first radiation conductor layer, or the area of the second radiation conductor layer is smaller than that of the first radiation conductor layer.

[0014] A first planar ground conductor layer is located in the negative direction of the Z-axis relative to the first radiation conductor layer and overlaps the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction; and

[0015] A first ground conductor layer does not overlap the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction and is located in the positive direction of the Z-axis relative to the first radiation conductor layer.

[0016] Utility Model Effects

[0017] According to the multi-layer substrate of the present utility model, miniaturization of the multi-layer substrate having a plurality of radiation conductor layers can be achieved, and improvement of the radiation characteristics of the plurality of radiation conductor layers can be achieved. Description of the Drawings

[0018] Figure 1 is an exploded perspective view of the multi-layer substrate 10.

[0019] Figure 2 is Figure 1 a cross-sectional view of the multi-layer substrate 10 taken along line A-A of

[0020] Figure 3 is a view of the multi-layer substrate 10 seen from above in perspective.

[0021] Figure 4 is a cross-sectional view of the multi-layer substrate 10a.

[0022] Figure 5 is a cross-sectional view of the multi-layer substrate 10b.

[0023] Figure 6 is an exploded perspective view of the multi-layer substrate 10c.

[0024] Figure 7 is an exploded perspective view of the multi-layer substrate 10d.

[0025] Figure 8 is a view of the multi-layer substrate 10e seen from above in perspective. Detailed Description of the Embodiment

[0026] (Embodiment)

[0027] [Structure of Multilayer Substrate 10]

[0028] Hereinafter, with reference to the drawings, the structure of the multilayer substrate 10 according to an embodiment of the present invention will be described. Figure 1 It is an exploded perspective view of the multilayer substrate 10. Figure 2 Is Figure 1 A cross-sectional view of the multilayer substrate 10 at A-A of Figure 3 It is a view of the multilayer substrate 10 seen from above.

[0029] Hereinafter, the stacking direction of the stacked body 12 of the multilayer substrate 10 is defined as the vertical direction. The vertical direction coincides with the Z-axis direction. The upward direction is the positive direction of the Z-axis. The downward direction is the negative direction of the Z-axis. When observing the multilayer substrate 10 in the vertical direction, the two directions in which the sides of the multilayer substrate 10 extend are defined as the left-right direction and the front-back direction respectively. The left-right direction coincides with the X-axis direction. The front-back direction coincides with the Y-axis direction. The left-right direction is orthogonal to the vertical direction. The front-back direction is orthogonal to the vertical direction and the left-right direction. It should be noted that the definition of the direction in this specification is an example. Therefore, the direction of the multilayer substrate 10 during actual use does not need to be the same as the direction in this specification. In addition, in each figure, the vertical direction can also be reversed. Similarly, in each figure, the left-right direction can also be reversed. In each figure, the front-back direction can also be reversed.

[0030] Hereinafter, X is a component or member of the multilayer substrate 10. In this specification, unless otherwise specified, each part of X is defined as follows. The front part of X refers to the first half of X. The rear part of X refers to the second half of X. The left part of X refers to the left half of X. The right part of X refers to the right half of X. The upper part of X refers to the upper half of X. The lower part of X refers to the lower half of X. The front end of X refers to the end in the front direction of X. The rear end of X refers to the end in the rear direction of X. The left end of X refers to the end in the left direction of X. The right end of X refers to the end in the right direction of X. The upper end of X refers to the end in the upward direction of X. The lower end of X refers to the end in the downward direction of X. The front end portion of X refers to the front end of X and its vicinity. The rear end portion of X refers to the rear end of X and its vicinity. The left end portion of X refers to the left end of X and its vicinity. The right end portion of X refers to the right end of X and its vicinity. The upper end portion of X refers to the upper end of X and its vicinity. The lower end portion of X refers to the lower end of X and its vicinity.

[0031] The multilayer substrate 10 is used for electronic devices such as mobile phones, etc. As Figure 1 shown, the multilayer substrate 10 includes a stacked body 12, a first ground conductor layer 16, a planar ground conductor layer 18, a first radiation conductor layer 20, a second radiation conductor layer 21, external electrodes 24a, 24b, 26a, 26b, and interlayer connection conductors v1 to v8.

[0032] The laminate 12 has a plate shape. As Figure 1 and Figure 2 shown, the laminate 12 has a rectangular shape when viewed in the vertical direction. The laminate 12 has a structure in which insulator layers 14b to 14d (first insulator layers), an insulator layer 14a (second insulator layer), and insulator layers 14e to 14g (third insulator layers) are laminated in the Z-axis direction. The insulator layers 14a to 14g are arranged in order from top to bottom. The dielectric constant of the insulator layer 14a (second insulator layer) is lower than the dielectric constants of the insulator layers 14b to 14d (first insulator layers). The dielectric constants of the insulator layers 14e to 14g (third insulator layers) are lower than the dielectric constants of the insulator layers 14b to 14d (first insulator layers). In the present embodiment, the dielectric constant of the insulator layer 14a is equal to the dielectric constants of the insulator layers 14e to 14g. The materials of the insulator layers 14a to 14g are thermoplastic resins such as polyimide and liquid crystal polymer. Therefore, the laminate 12 has flexibility.

[0033] The first radiation conductor layer 20 radiates and / or receives a first high-frequency signal. The first radiation conductor layer 20 is provided on the laminate 12 so as to be in contact with the insulator layers 14b and 14c (first insulator layers). In the present embodiment, the first radiation conductor layer 20 is located on the upper main surface of the insulator layer 14c. As Figure 3 shown, the first radiation conductor layer 20 has a rhombus shape when viewed in the vertical direction (Z-axis direction), and the rhombus shape has diagonals extending in the left-right direction (X-axis direction) and the front-rear direction (Y-axis direction).

[0034] The second radiation conductor layer 21 radiates and / or receives a second high-frequency signal. The second radiation conductor layer 21 is provided on the laminate 12 so as to be in contact with the insulator layer 14a (second insulator layer). In the present embodiment, the second radiation conductor layer 21 is located on the upper main surface of the insulator layer 14a. Thus, the second radiation conductor layer 21 is located at a position higher (in the positive direction of the Z-axis) than the first radiation conductor layer 20. The vertical distance between the second radiation conductor layer 21 and the first radiation conductor layer 20 is 1 / 4 of the wavelength of the second high-frequency signal.

[0035] In addition, as Figure 3 shown, the second radiation conductor layer 21 overlaps the first radiation conductor layer 20 when viewed in the vertical direction (Z-axis direction). As Figure 3As shown, the second radiation conductor layer 21 has a rhombus shape when viewed in the vertical direction (Z-axis direction), and the rhombus shape has diagonals extending in the left-right direction (X-axis direction) and the front-back direction (Y-axis direction). However, the area of the second radiation conductor layer 21 is smaller than the area of the first radiation conductor layer 20. Therefore, when viewed in the vertical direction, the four sides of the first radiation conductor layer 20 do not overlap with the second radiation conductor layer 21. Thus, the frequency of the second high-frequency signal (electromagnetic wave) radiated or received by the second radiation conductor layer 21 is higher than the frequency of the first high-frequency signal (electromagnetic wave) radiated or received by the first radiation conductor layer 20.

[0036] As Figure 1 and Figure 2 shown, the planar ground conductor layer 18 is provided in the laminate 12. More specifically, the planar ground conductor layer 18 (first planar ground conductor layer) is located below (negative direction of the Z-axis) the first radiation conductor layer 20. The planar ground conductor layer 18 is provided on the lower main surface of the insulator layer 14g. As Figure 1 shown, the planar ground conductor layer 18 has a rectangular shape when viewed in the vertical direction. The long side of the planar ground conductor layer 18 extends in the left-right direction. The short side of the planar ground conductor layer 18 extends in the front-back direction. When viewed in the vertical direction (Z-axis direction), the planar ground conductor layer 18 (first planar ground conductor layer) overlaps with the first radiation conductor layer 20 and the second radiation conductor layer 21. The planar ground conductor layer 18 is connected to the ground potential.

[0037] The first ground conductor layer 16 is provided in the laminate 12. More specifically, the first ground conductor layer 16 is located above (positive direction of the Z-axis) the first radiation conductor layer 20. In the present embodiment, the first ground conductor layer 16 is provided at the same position in the vertical direction (Z-axis direction) as the second radiation conductor layer 21. Therefore, the first ground conductor layer 16 is provided on the upper main surface of the insulator layer 14a.

[0038] In addition, the first ground conductor layer 16 does not overlap with the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the vertical direction (Z-axis direction). In the present embodiment, when viewed in the vertical direction (Z-axis direction), the first ground conductor layer 16 is located to the left (positive direction of the X-axis), right (negative direction of the X-axis), front (positive direction of the Y-axis), and rear (negative direction of the Y-axis) of the first radiation conductor layer 20 and the second radiation conductor layer 21. Therefore, the first ground conductor layer 16 has an annular shape surrounding the periphery of the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the vertical direction (Z-axis direction). In the present embodiment, the first ground conductor layer 16 has an outer edge and an inner edge in a rectangular shape, and the rectangular shape has two sides extending in the front-back direction and two sides extending in the left-right direction.

[0039] The external electrodes 24a, 24b, 26a, and 26b are provided on the lower main surface of the insulator layer 14g. The external electrodes 24a, 24b, 26a, and 26b are not connected to the planar ground conductor layer 18. Therefore, the external electrodes 24a, 24b, 26a, and 26b are located within the openings provided in the planar ground conductor layer 18. The external electrodes 24a and 24b overlap the first radiation conductor layer 20 when viewed in the vertical direction. The external electrodes 26a and 26b overlap the second radiation conductor layer 21 when viewed in the vertical direction. The first high-frequency signal is input and output to and from the external electrodes 24a and 24b. The second high-frequency signal is input and output to and from the external electrodes 26a and 26b.

[0040] The interlayer connection conductor v1 electrically connects the first radiation conductor layer 20 and the external electrode 24a. The interlayer connection conductor v1 penetrates through the insulator layers 14c to 14g in the vertical direction. In addition, the interlayer connection conductor v1 is located near the midpoint of the left front edge of the first radiation conductor layer 20 when viewed in the vertical direction. In the first radiation conductor layer 20, the point where the interlayer connection conductor v1 contacts is the first power supply point P1.

[0041] The interlayer connection conductor v2 electrically connects the first radiation conductor layer 20 and the external electrode 24b. The interlayer connection conductor v2 penetrates through the insulator layers 14c to 14g in the vertical direction. In addition, the interlayer connection conductor v2 is located near the midpoint of the left rear edge of the first radiation conductor layer 20 when viewed in the vertical direction. In the first radiation conductor layer 20, the point where the interlayer connection conductor v2 contacts is the second power supply point P2.

[0042] The interlayer connection conductor v3 electrically connects the second radiation conductor layer 21 and the external electrode 26a. The interlayer connection conductor v3 penetrates through the insulator layers 14a to 14g in the vertical direction. In addition, the interlayer connection conductor v3 is located near the midpoint of the right front edge of the second radiation conductor layer 21 when viewed in the vertical direction. In the second radiation conductor layer 21, the point where the interlayer connection conductor v3 contacts is the third power supply point P3.

[0043] The interlayer connection conductor v4 electrically connects the second radiation conductor layer 21 and the external electrode 26b. The interlayer connection conductor v4 penetrates through the insulator layers 14a to 14g in the vertical direction. In addition, the interlayer connection conductor v4 is located near the midpoint of the right rear edge of the second radiation conductor layer 21 when viewed in the vertical direction. In the second radiation conductor layer 21, the point where the interlayer connection conductor v4 contacts is the fourth power supply point P4.

[0044] The interlayer connection conductors v5 to v8 electrically connect the first ground conductor layer 16 and the planar ground conductor layer 18. The interlayer connection conductors v5 to v8 penetrate through the insulator layers 14a to 14g respectively.

[0045] The first ground conductor layer 16, the planar ground conductor layer 18, the first radiation conductor layer 20, the second radiation conductor layer 21, and the external electrodes 24a, 24b, 26a, 26b are formed, for example, by patterning copper foils pasted on the upper main surface or the lower main surface of the insulator layers 14a to 14g. Additionally, the interlayer connection conductors v1 to v8 are, for example, via conductors. The via conductors are formed by forming through-holes in the insulator layers 14a to 14g, filling the through-holes with a conductive paste, and sintering the conductive paste.

[0046] In the multilayer substrate 10 as described above, the first ground conductor layer 16, the planar ground conductor layer 18, and the first radiation conductor layer 20 function as a patch antenna for radiating or receiving a first high-frequency signal. Additionally, the first ground conductor layer 16, the planar ground conductor layer 18, and the second radiation conductor layer 21 function as a patch antenna for radiating or receiving a second high-frequency signal.

[0047] [Effect]

[0048] According to the multilayer substrate 10, miniaturization of the multilayer substrate 10 having the first radiation conductor layer 20 and the second radiation conductor layer 21 can be achieved. More specifically, when observed in the vertical direction, the second radiation conductor layer 21 overlaps with the first radiation conductor layer 20. Thus, when observed in the vertical direction, the area of the multilayer substrate 10 is smaller than the area of a multilayer substrate in which the two radiation conductors are arranged in the front-rear direction or the left-right direction. Therefore, according to the multilayer substrate 10, miniaturization of the multilayer substrate 10 having the first radiation conductor layer 20 and the second radiation conductor layer 21 can be achieved.

[0049] According to the multilayer substrate 10, improvement of the radiation characteristics of the first radiation conductor layer 20 can be achieved. More specifically, the area of the first radiation conductor layer 20 is larger than the area of the second radiation conductor layer 21. Therefore, when observed in the vertical direction, the first radiation conductor layer 20 is located near the first ground conductor layer 16. In this case, a current flowing in the opposite phase flows in the planar ground conductor layer 18. As a result, the radiation characteristics of the first radiation conductor layer 20 deteriorate.

[0050] Then, in the multilayer substrate 10, the first radiation conductor layer 20 is provided in the laminate 12 so as to be in contact with the insulator layers 14b and 14c. The dielectric constants of the insulator layers 14b and 14c are higher than the dielectric constant of the insulator layer 14a. Thus, due to the wavelength shortening effect, the first radiation conductor layer 20 can be reduced without changing the frequency of the first high-frequency signal radiated or received by the first radiation conductor layer 20. Therefore, when observed in the vertical direction, the first radiation conductor layer 20 is separated from the first ground conductor layer 16. Therefore, it is difficult for a current flowing in the opposite phase to flow in the planar ground conductor layer 18. As described above, according to the multilayer substrate 10, improvement of the radiation characteristics of the first radiation conductor layer 20 can be achieved.

[0051] According to the multilayer substrate 10, improvement in the radiation characteristics of the second radiation conductor layer 21 can be achieved. More specifically, the frequency of the second high-frequency signal radiated or received by the second radiation conductor layer 21 is higher than the frequency of the first high-frequency signal radiated or received by the first radiation conductor layer 20. Therefore, the area of the second radiation conductor layer 21 is smaller than the area of the first radiation conductor layer 20. In this case, it is difficult to achieve improvement in the radiation characteristics of the second radiation conductor layer 21.

[0052] Then, the second radiation conductor layer 21 is disposed in the laminate 12 so as to be in contact with the insulator layer 14a. The dielectric constant of the insulator layer 14a is lower than the dielectric constants of the insulator layers 14b to 14d. Therefore, the wavelength shortening effect is difficult to occur in the second radiation conductor layer 21. Accordingly, the area of the second radiation conductor layer 21 can be increased without changing the frequency of the second high-frequency signal radiated or received by the second radiation conductor layer 21. As a result, according to the multilayer substrate 10, improvement in the radiation characteristics of the second radiation conductor layer 21 can be achieved.

[0053] According to the multilayer substrate 10, the antenna gain of the first radiation conductor layer 20 in the first polarization wave can be made close to the antenna gain of the first radiation conductor layer 20 in the second polarization wave. More specifically, the first radiation conductor layer 20 radiates and receives the first high-frequency signal of the first polarization wave at the first power supply point P1. The first radiation conductor layer 20 radiates and receives the first high-frequency signal of the second polarization wave at the second power supply point P2. In order to make the antenna gain of the first radiation conductor layer 20 in the first polarization wave close to the antenna gain of the first radiation conductor layer 20 in the second polarization wave, it is sufficient to make the distance from the first power supply point P1 to the first ground conductor layer 16 close to the distance from the second power supply point P2 to the first ground conductor layer 16.

[0054] Then, in the multilayer substrate 10, as Figure 3 shown, the first radiation conductor layer 20 and the second radiation conductor layer 21 have a rhombus shape when viewed in the vertical direction, and the rhombus shape has diagonals extending in the left-right direction and the front-back direction. Also, when viewed in the vertical direction, the first ground conductor layer 16 is located on the left, right, front, and rear of the first radiation conductor layer 20 and the second radiation conductor layer 21. Thereby, the distance from the first power supply point P1 to the first ground conductor layer 16 becomes equal to the distance from the second power supply point P2 to the first ground conductor layer 16. As a result, according to the multilayer substrate 10, the antenna gain of the first radiation conductor layer 20 in the first polarization wave can be made close to the antenna gain of the first radiation conductor layer 20 in the second polarization wave. It should be noted that for the same reason, according to the multilayer substrate 10, the antenna gain of the second radiation conductor layer 21 in the first polarization wave can be made close to the antenna gain of the second radiation conductor layer 21 in the second polarization wave.

[0055] According to the multilayer substrate 10, the antenna gain of the second radiation conductor layer 21 can be improved. More specifically, the second radiation conductor layer 21 radiates the second high-frequency signal in the upward and downward directions. The second high-frequency signal radiated in the downward direction travels upward after being reflected by the first radiation conductor layer 20. Here, the vertical distance between the second radiation conductor layer 21 and the first radiation conductor layer 20 is 1 / 4 of the wavelength of the second high-frequency signal. As a result, the phase of the second high-frequency signal is shifted by 180°. Also, the phase of the second high-frequency signal is shifted by 180° during reflection. As a result, the phase of the second high-frequency signal radiated in the downward direction is the same as the phase of the second high-frequency signal radiated in the upward direction. Therefore, according to the multilayer substrate 10, the antenna gain of the second radiation conductor layer 21 can be improved.

[0056] (First modification example)

[0057] Hereinafter, the multilayer substrate 10a according to the first modification example will be described. Figure 4 It is a cross-sectional view of the multilayer substrate 10a.

[0058] The multilayer substrate 10a is different from the multilayer substrate 10 in that the laminate 12 further includes protective layers 15a and 15b. Hereinafter, this difference will be described. The insulator layer 14a (second insulator layer) is located above (in the positive Z-axis direction) the insulator layers 14b to 14d (first insulator layers). The protective layer 15a is located above (in the positive Z-axis direction) the insulator layer 14a (second insulator layer). In the present embodiment, the protective layer 15a covers the upper main surface of the insulator layer 14a. Also, the protective layer 15a covers the second radiation conductor layer 21. The protective layer 15b covers the lower main surface of the insulator layer 14g. Also, the protective layer 15b covers the planar ground conductor layer 18. However, a part of the external electrodes 24a, 24b, 26a, 26b and the planar ground conductor layer 18 is exposed from the protective layer 15b.

[0059] The dielectric constants of the protective layers 15a and 15b are lower than the dielectric constant of the insulator layer 14a (second insulator layer). Moreover, the second radiation conductor layer 21 is embedded in the protective layer 15a. As a result, the area where the second radiation conductor layer 21 is in contact with the protective layer 15a is larger than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). The other configuration of the multilayer substrate 10a is the same as that of the multilayer substrate 10. The multilayer substrate 10a can achieve the same effects as the multilayer substrate 10.

[0060] According to the multilayer substrate 10a, improvement in the radiation characteristics of the second radiation conductor layer 21 can be achieved. More specifically, the dielectric constant of the protective layer 15a is lower than the dielectric constant of the insulator layer 14a (second insulator layer). Moreover, the area where the second radiation conductor layer 21 is in contact with the protective layer 15a is larger than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). Thereby, the wavelength shortening effect is difficult to occur in the second radiation conductor layer 21. Therefore, the area of the second radiation conductor layer 21 can be increased without changing the frequency of the second high-frequency signal radiated or received by the second radiation conductor layer 21. As a result, according to the multilayer substrate 10a, improvement in the radiation characteristics of the second radiation conductor layer 21 can be achieved.

[0061] (Second modification example)

[0062] Hereinafter, the multilayer substrate 10b according to the second modification example will be described. Figure 5 It is a cross-sectional view of the multilayer substrate 10b.

[0063] The multilayer substrate 10b is different from the multilayer substrate 10a in that the dielectric constants of the protective layers 15a and 15b are higher than the dielectric constant of the insulator layer 14a (second insulator layer). Moreover, the second radiation conductor layer 21 is buried in the insulator layer 14a. Thereby, the area where the second radiation conductor layer 21 is in contact with the protective layer 15a is smaller than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). Other configurations of the multilayer substrate 10b are the same as those of the multilayer substrate 10a. The multilayer substrate 10b can achieve the same effects as the multilayer substrate 10a.

[0064] According to the multilayer substrate 10b, a decrease in the radiation characteristics of the second radiation conductor layer 21 can be suppressed. More specifically, the dielectric constants of the protective layers 15a and 15b are higher than the dielectric constant of the insulator layer 14a (second insulator layer). However, the area where the second radiation conductor layer 21 is in contact with the protective layer 15a is smaller than the area where the second radiation conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). Thereby, an excessive wavelength shortening effect in the second radiation conductor layer 21 is suppressed. Therefore, the area of the second radiation conductor layer 21 can be suppressed from becoming smaller without changing the frequency of the second high-frequency signal radiated or received by the second radiation conductor layer 21. As a result, according to the multilayer substrate 10b, a decrease in the radiation characteristics of the second radiation conductor layer 21 can be suppressed.

[0065] (Third modification example)

[0066] Hereinafter, the multilayer substrate 10c according to the third modification example will be described. Figure 6 It is an exploded perspective view of the multilayer substrate 10c.

[0067] The multilayer substrate 10c is different from the multilayer substrate 10 in that it further includes a first matching circuit 50a and a second matching circuit 50b. More specifically, the laminate 12 has a structure in which an insulator layer 14a (second insulator layer), insulator layers 14b to 14d (first insulator layer), and insulator layers 14e, 14h, 14i, 14g (third insulator layer) are arranged in this order toward the downward direction (negative direction of the Z axis). The dielectric constant of the insulator layers 14e, 14h, 14i, 14g (third insulator layer) is lower than the dielectric constant of the insulator layers 14b to 14d (first insulator layer).

[0068] The multilayer substrate 10c further includes a planar ground conductor layer 28, first signal conductor layers 30, 32, second signal conductor layers 34, 36, and interlayer connection conductors v11 to v14. The planar ground conductor layer 28 is located on the upper main surface of the insulator layer 14h.

[0069] The first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are located on the upper main surface of the insulator layer 14i. Therefore, the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are located at a position lower than the planar ground conductor layer 28 and higher than the planar ground conductor layer 18. The first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 overlap with the planar ground conductor layers 18, 28 when viewed in the vertical direction.

[0070] The first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 extend in the left-right direction.

[0071] The interlayer connection conductor v1 electrically connects the first radiation conductor layer 20 to the right end portion of the first signal conductor layer 30. The interlayer connection conductor v11 electrically connects the left end portion of the first signal conductor layer 30 to the external electrode 24a.

[0072] The interlayer connection conductor v2 electrically connects the first radiation conductor layer 20 to the right end portion of the first signal conductor layer 32. The interlayer connection conductor v12 electrically connects the left end portion of the first signal conductor layer 32 to the external electrode 24b.

[0073] The interlayer connection conductor v3 electrically connects the second radiation conductor layer 21 to the left end portion of the second signal conductor layer 34. The interlayer connection conductor v13 electrically connects the right end portion of the second signal conductor layer 34 to the external electrode 26a.

[0074] The interlayer connection conductor v4 electrically connects the second radiation conductor layer 21 to the left end portion of the second signal conductor layer 36. The interlayer connection conductor v14 electrically connects the right end portion of the second signal conductor layer 36 to the external electrode 26b.

[0075] As described above, the first signal conductor layers 30 and 32, the second signal conductor layers 34 and 36, and the planar ground conductor layers 18 and 28 have a stripline structure. Thus, the first signal conductor layers 30 and 32 and the planar ground conductor layers 18 and 28 form a first matching circuit 50a. The second signal conductor layers 34 and 36 and the planar ground conductor layers 18 and 28 form a second matching circuit 50b.

[0076] As described above, the first matching circuit 50a is electrically connected to the first radiation conductor layer 20 via the interlayer connection conductors v1 and v2. The second matching circuit 50b is electrically connected to the second radiation conductor layer 21 via the interlayer connection conductors v3 and v4. Further, the first matching circuit 50a and the second matching circuit 50b are in contact with the insulator layers 14e to 14g (third insulator layer). Since other configurations of the multilayer substrate 10c are the same as those of the multilayer substrate 10, the description thereof is omitted. The multilayer substrate 10c can achieve the same effects as the multilayer substrate 10.

[0077] In the multilayer substrate 10c, the first matching circuit 50a and the second matching circuit 50b are in contact with the insulator layers 14e to 14g (third insulator layer). Further, the dielectric constant of the insulator layers 14e to 14g (third insulator layer) is lower than the dielectric constant of the insulator layers 14b to 14d (first insulator layer). Thus, it is difficult to form a capacitance between the first signal conductor layers 30 and 32 and the planar ground conductor layers 18 and 28. It is also difficult to form a capacitance between the second signal conductor layers 34 and 36 and the planar ground conductor layers 18 and 28. Therefore, even if the line widths of the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 are increased, the capacitance value will not become too large. Accordingly, the characteristic impedances of the first matching circuit 50a and the second matching circuit 50b can be maintained at desired characteristic impedances, and at the same time, the resistance values of the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 can be reduced.

[0078] (Fourth Modification Example)

[0079] Hereinafter, a multilayer substrate 10d according to the fourth modification example will be described. Figure 7 is an exploded perspective view of the multilayer substrate 10d.

[0080] The multilayer substrate 10d is different from the multilayer substrate 10c in the structure of the laminate 12. The laminate 12 has a first region A1 and a second region A2. The first region A1 is a region where the insulator layer 14a (second insulator layer), the insulator layers 14b to 14d (first insulator layer), and the insulator layers 14e, 14h, 14i, 14g (third insulator layer) exist when viewed in the vertical direction (Z-axis direction). The second region A2 is a region where the insulator layer 14a (first insulator layer) and the insulator layers 14b to 14d (second insulator layer) do not exist and the insulator layers 14e, 14h, 14i, 14j (third insulator layer) exist when viewed in the vertical direction (Z-axis direction).

[0081] The first signal conductor layer 30 is electrically connected to the first radiation conductor layer 20 via the interlayer connection conductor v1. The first signal conductor layer 32 is electrically connected to the first radiation conductor layer 20 via the interlayer connection conductor v2. The second signal conductor layer 34 is electrically connected to the second radiation conductor layer 21 via the interlayer connection conductor v3. The second signal conductor layer 36 is electrically connected to the second radiation conductor layer 21 via the interlayer connection conductor v4. Moreover, the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 are in contact with the insulator layers 14h and 14i (third insulator layer) and extend from the first region A1 to the second region A2. Other structures of the multilayer substrate 10d are the same as those of the multilayer substrate 10c, so the description thereof is omitted. The multilayer substrate 10d can achieve the same effects as the multilayer substrate 10c.

[0082] In the multilayer substrate 10d, for the same reason as the multilayer substrate 10c, the resistance values of the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 can be reduced. Thereby, even if the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 become longer, insertion loss is hardly generated in the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36.

[0083] In the multilayer substrate 10d, the thickness in the vertical direction of the second region A2 is smaller than the thickness in the vertical direction of the first region A1. Therefore, the second region A2 is more likely to be deformed than the first region A1. Thus, in the multilayer substrate 10d, the second region A2 can be used in a bent manner.

[0084] (Fifth modification example)

[0085] Hereinafter, the multilayer substrate 10e according to the fifth modification example will be described. Figure 8 It is a view of the multilayer substrate 10e seen from above.

[0086] The multilayer substrate 10e differs from the multilayer substrate 10 in that it further includes a third radiation conductor layer 120 and a fourth radiation conductor layer 121. The third radiation conductor layer 120 is disposed in the laminate 12 so as to be in contact with the insulator layers 14b and 14c (the first insulator layer). The fourth radiation conductor layer 121 is disposed in the laminate 12 so as to be in contact with the insulator layer 14a (the second insulator layer). The fourth radiation conductor layer 121 is located at a position above (in the positive direction of the Z-axis) the third radiation conductor layer 120 and overlaps the third radiation conductor layer 120 when viewed in the vertical direction (Z-axis direction).

[0087] The area of the fourth radiation conductor layer 121 is smaller than the area of the third radiation conductor layer 120. Accordingly, the frequency of the fourth high-frequency signal (electromagnetic wave) radiated or received by the fourth radiation conductor layer 121 is higher than the frequency of the third high-frequency signal (electromagnetic wave) radiated or received by the third radiation conductor layer 120.

[0088] The first ground conductor layer 16 has an annular shape surrounding the periphery of the first radiation conductor layer 20, the second radiation conductor layer 21, the third radiation conductor layer 120, or the fourth radiation conductor layer 121 when viewed in the vertical direction (Z-axis direction). Since the other configuration of the multilayer substrate 10e is the same as that of the multilayer substrate 10, the description thereof is omitted. The multilayer substrate 10e can achieve the same effects as the multilayer substrate 10.

[0089] (Other embodiments)

[0090] The multilayer substrate according to the present utility model is not limited to the multilayer substrates 10, 10a to 10e and can be modified within the scope of its gist. In addition, the configurations of the multilayer substrates 10, 10a to 10e can be arbitrarily combined.

[0091] The number of the first insulator layers may be 1 or more.

[0092] The number of the second insulator layers may be 1 or more.

[0093] The number of the third insulator layers may be 1 or more.

[0094] It should be noted that either one of the following two cases may hold: the frequency of the electromagnetic wave radiated or received by the second radiation conductor layer 21 is higher than the frequency of the electromagnetic wave radiated or received by the first radiation conductor layer 20, or the area of the second radiation conductor layer 21 is smaller than the area of the first radiation conductor layer 20.

[0095] It should be noted that either one of the following two cases may hold: the frequency of the electromagnetic wave radiated or received by the fourth radiation conductor layer 121 is higher than the frequency of the electromagnetic wave radiated or received by the third radiation conductor layer 120, or the area of the fourth radiation conductor layer 121 is smaller than the area of the third radiation conductor layer 120.

[0096] It should be noted that either one of the interlayer connection conductors v1 and v2 can be provided only. Also, either one of the interlayer connection conductors v3 and v4 can be provided only.

[0097] In addition, only the interlayer connection conductor v1 can be provided. In this case, the interlayer connection conductor v1 is connected to both the first radiation conductor layer 20 and the second radiation conductor layer 21, and is also connected to the external electrode 24a. Both the first high-frequency signal and the second high-frequency signal are input to and output from the external electrode 24a. When the first radiation conductor layer 20 receives the first high-frequency signal and the second radiation conductor layer 21 receives the second high-frequency signal, for example, a duplexer is connected to the external electrode 24a. Moreover, the duplexer separates the first high-frequency signal from the second high-frequency signal.

[0098] It should be noted that the dielectric constant of the insulator layer 14a may also be not equal to the dielectric constants of the insulator layers 14e to 14g.

[0099] It should be noted that the first ground conductor layer 16 may not have an annular shape.

[0100] It should be noted that the first radiation conductor layer 20 is sandwiched by the first insulator layer in the vertical direction. However, the first radiation conductor layer 20 may be in contact with only the insulator layer 14b (the first insulator layer), or may be in contact with only the insulator layer 14c (the first insulator layer).

[0101] It should be noted that the second radiation conductor layer 21 may also be sandwiched by the second insulator layer in the vertical direction.

[0102] It should be noted that at least one of the first matching circuit 50a or the second matching circuit 50b may be in contact with the insulator layers 14e to 14g (the third insulator layer).

[0103] It should be noted that at least one of the first signal conductor layers 30 and 32 or the second signal conductor layers 34 and 36 may be in contact with the insulator layers 14h and 14i (the third insulator layer).

[0104] The utility model has the following structure.

[0105] (1) A multilayer substrate, wherein,

[0106] The multilayer substrate includes:

[0107] A laminate having a structure in which one or more first insulator layers and one or more second insulator layers are laminated in the Z-axis direction, and the dielectric constant of the one or more second insulator layers is lower than the dielectric constant of the one or more first insulator layers;

[0108] A first radiation conductor layer disposed on the laminate so as to be in contact with the first insulator layer;

[0109] A second radiation conductor layer disposed on the laminate so as to be in contact with the second insulator layer, located in a position in the positive direction of the Z-axis relative to the first radiation conductor layer, and overlapping with the first radiation conductor layer when viewed in the Z-axis direction. The frequency of the electromagnetic wave radiated or received by the second radiation conductor layer is higher than the frequency of the electromagnetic wave radiated or received by the first radiation conductor layer, or the area of the second radiation conductor layer is smaller than the area of the first radiation conductor layer;

[0110] A first planar ground conductor layer located in a position in the negative direction of the Z-axis relative to the first radiation conductor layer and overlapping with the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction; and

[0111] A first ground conductor layer that does not overlap with the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction and is located in a position in the positive direction of the Z-axis relative to the first radiation conductor layer.

[0112] (2) The multilayer substrate according to (1), wherein

[0113] A direction orthogonal to the Z-axis direction is defined as the X-axis direction,

[0114] A direction orthogonal to the X-axis direction and the Z-axis direction is defined as the Y-axis direction,

[0115] When viewed in the Z-axis direction, the first ground conductor layer is located in the positive and negative directions of the X-axis and the positive and negative directions of the Y-axis of the first radiation conductor layer and the second radiation conductor layer,

[0116] The first radiation conductor layer and the second radiation conductor layer have a rhombus shape when viewed in the Z-axis direction, and the rhombus shape has diagonals extending in the X-axis direction and the Y-axis direction.

[0117] (3) The multilayer substrate according to (1) or (2), wherein

[0118] The laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and one or more third insulator layers are arranged in sequence toward the negative direction of the Z-axis,

[0119] The dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers,

[0120] The multilayer substrate further includes:

[0121] a first matching circuit electrically connected to the first radiation conductor layer; and

[0122] a second matching circuit electrically connected to the second radiation conductor layer,

[0123] at least one of the first matching circuit or the second matching circuit is in contact with the one or more third insulator layers.

[0124] (4) The multilayer substrate according to (1) or (2), wherein

[0125] the laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in this order toward the negative direction of the Z axis,

[0126] the dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers,

[0127] the laminate has a first region in which the one or more first insulator layers, the one or more second insulator layers, and the one or more third insulator layers are present when viewed in the Z-axis direction, and a second region in which the one or more first insulator layers and the one or more second insulator layers are not present and the one or more third insulator layers are present when viewed in the Z-axis direction,

[0128] the multilayer substrate further includes:

[0129] a first signal conductor layer electrically connected to the first radiation conductor layer; and

[0130] a second signal conductor layer electrically connected to the second radiation conductor layer,

[0131] at least one of the first signal conductor layer or the second signal conductor layer is in contact with the one or more third insulator layers and extends from the first region to the second region.

[0132] (5) The multilayer substrate according to any one of (1) to (4), wherein

[0133] the multilayer substrate further includes:

[0134] a third radiation conductor layer provided on the laminate so as to be in contact with the first insulator layer; and

[0135] The fourth radiation conductor layer is disposed on the laminate such that it is in contact with the second insulator layer, is located in the positive direction of the Z-axis relative to the third radiation conductor layer, and overlaps the third radiation conductor layer when viewed in the Z-axis direction. The frequency of the electromagnetic wave radiated or received by the fourth radiation conductor layer is higher than that of the electromagnetic wave radiated or received by the third radiation conductor layer, or the area of the fourth radiation conductor layer is smaller than that of the third radiation conductor layer.

[0136] When viewed in the Z-axis direction, the first ground conductor layer has an annular shape surrounding the first radiation conductor layer, the second radiation conductor layer, the third radiation conductor layer, and the fourth radiation conductor layer.

[0137] (6) The multilayer substrate according to any one of (1) to (5), wherein

[0138] One or more of the second insulator layers are located in the negative direction of the Z-axis relative to the second radiation conductor layer.

[0139] The laminate further includes a protective layer, which is located in the positive direction of the Z-axis relative to one or more of the second insulator layers and covers the second radiation conductor layer.

[0140] The dielectric constant of the protective layer is lower than that of one or more of the second insulator layers.

[0141] The area of contact between the second radiation conductor layer and the protective layer is larger than the area of contact between the second radiation conductor layer and one or more of the second insulator layers.

[0142] (7) The multilayer substrate according to any one of (1) to (5), wherein

[0143] One or more of the second insulator layers are located in the negative direction of the Z-axis relative to the second radiation conductor layer.

[0144] The laminate further includes a protective layer, which is located in the positive direction of the Z-axis relative to one or more of the second insulator layers and covers the second radiation conductor layer.

[0145] The dielectric constant of the protective layer is higher than that of one or more of the second insulator layers.

[0146] The area of contact between the second radiation conductor layer and the protective layer is smaller than the area of contact between the second radiation conductor layer and one or more of the second insulator layers.

[0147] (8) The multilayer substrate according to any one of (1) to (7), wherein

[0148] When viewed in the direction of the Z axis, the first ground conductor layer has an annular shape surrounding the peripheries of the first radiation conductor layer and the second radiation conductor layer.

[0149] Description of Reference Numerals

[0150] 10, 10a to 10e: Multilayer substrate;

[0151] 12: Stacked body;

[0152] 14a to 14j: Insulator layer;

[0153] 15a, 15b: Protective layer;

[0154] 16: First ground conductor layer;

[0155] 18, 28: Planar ground conductor layer;

[0156] 20: First radiation conductor layer;

[0157] 21: Second radiation conductor layer;

[0158] 24a, 24b, 26a, 26b: External electrode;

[0159] 30, 32: First signal conductor layer;

[0160] 34, 36: Second signal conductor layer;

[0161] 50a: First matching circuit;

[0162] 50b: Second matching circuit;

[0163] 120: Third radiation conductor layer;

[0164] 121: Fourth radiation conductor layer;

[0165] A1: First region;

[0166] A2: Second region;

[0167] P1: First power supply point;

[0168] P2: Second power supply point;

[0169] P3: Third power supply point;

[0170] P4: Fourth power supply point;

[0171] v1 to v8, v11 to v14: Interlayer connection conductor.

Claims

1. A multi-layer substrate, characterized in that: The multi-layer substrate includes: A laminate having a structure in which one or more first insulator layers and one or more second insulator layers are laminated in the Z-axis direction, and the dielectric constant of the one or more second insulator layers is lower than the dielectric constant of the one or more first insulator layers; A first radiation conductor layer disposed on the laminate so as to be in contact with the first insulator layer; A second radiation conductor layer disposed on the laminate so as to be in contact with the second insulator layer, located at a position in the positive direction of the Z-axis relative to the first radiation conductor layer, and overlapping the first radiation conductor layer when viewed in the Z-axis direction. The frequency of the electromagnetic wave radiated or received by the second radiation conductor layer is higher than the frequency of the electromagnetic wave radiated or received by the first radiation conductor layer, or the area of the second radiation conductor layer is smaller than the area of the first radiation conductor layer; A first planar ground conductor layer located at a position in the negative direction of the Z-axis relative to the first radiation conductor layer, and overlapping the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction; And A first ground conductor layer that does not overlap the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction, and is located at a position in the positive direction of the Z-axis relative to the first radiation conductor layer.

2. The multi-layer substrate according to claim 1, characterized in that: The direction orthogonal to the Z-axis direction is defined as the X-axis direction, The direction orthogonal to the X-axis direction and the Z-axis direction is defined as the Y-axis direction, When viewed in the Z-axis direction, the first ground conductor layer is located in the positive and negative directions of the X-axis and the positive and negative directions of the Y-axis of the first radiation conductor layer and the second radiation conductor layer, The first radiation conductor layer and the second radiation conductor layer have a rhombus shape when viewed in the Z-axis direction, and the rhombus shape has diagonals extending in the X-axis direction and the Y-axis direction.

3. The multi-layer substrate according to claim 1 or 2, characterized in that: The laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in order toward the negative direction of the Z-axis, The dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers, The multi-layer substrate further includes: A first matching circuit electrically connected to the first radiation conductor layer; and A second matching circuit electrically connected to the second radiation conductor layer, At least one of the first matching circuit or the second matching circuit is in contact with the one or more third insulator layers.

4. The multi-layer substrate according to claim 1 or 2, characterized in that: The laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in order toward the negative direction of the Z-axis, The dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers. The laminate has a first region in which the one or more first insulator layers, the one or more second insulator layers, and the one or more third insulator layers are present when viewed in the Z-axis direction, and a second region in which the one or more first insulator layers and the one or more second insulator layers are not present and the one or more third insulator layers are present when viewed in the Z-axis direction. The multilayer substrate further includes: a first signal conductor layer electrically connected to the first radiation conductor layer; and a second signal conductor layer electrically connected to the second radiation conductor layer, at least one of the first signal conductor layer and the second signal conductor layer is in contact with the one or more third insulator layers and extends from the first region to the second region.

5. The multilayer substrate according to claim 1 or 2, wherein the multilayer substrate further includes: a third radiation conductor layer provided in the laminate so as to be in contact with the first insulator layer; and a fourth radiation conductor layer provided in the laminate so as to be in contact with the second insulator layer, located in a position on the positive Z-axis side with respect to the third radiation conductor layer, and overlapping the third radiation conductor layer when viewed in the Z-axis direction, the frequency of the electromagnetic wave radiated or received by the fourth radiation conductor layer being higher than the frequency of the electromagnetic wave radiated or received by the third radiation conductor layer, or the area of the fourth radiation conductor layer being smaller than the area of the third radiation conductor layer. The first ground conductor layer has an annular shape surrounding the first radiation conductor layer, the second radiation conductor layer, the third radiation conductor layer, and the fourth radiation conductor layer when viewed in the Z-axis direction.

6. The multilayer substrate according to claim 1 or 2, wherein the one or more second insulator layers are located in a position on the negative Z-axis side with respect to the second radiation conductor layer, the laminate further includes a protective layer located in a position on the positive Z-axis side with respect to the one or more second insulator layers and covering the second radiation conductor layer, the dielectric constant of the protective layer is lower than the dielectric constant of the one or more second insulator layers, the area of contact between the second radiation conductor layer and the protective layer is larger than the area of contact between the second radiation conductor layer and the one or more second insulator layers.

7. The multilayer substrate according to claim 1 or 2, wherein the one or more second insulator layers are located in a position on the negative Z-axis side with respect to the second radiation conductor layer, the laminate further includes a protective layer located in a position on the positive Z-axis side with respect to the one or more second insulator layers and covering the second radiation conductor layer, the dielectric constant of the protective layer is higher than the dielectric constant of the one or more second insulator layers. The area where the second radiation conductor layer is in contact with the protective layer is smaller than the area where the second radiation conductor layer is in contact with the one or more second insulator layers.

8. The multilayer substrate according to claim 1 or 2, characterized in that When viewed in the Z-axis direction, the first ground conductor layer has an annular shape surrounding the periphery of the first radiation conductor layer and the second radiation conductor layer.

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