Loudspeaker module and earphone

Abstract

The utility model discloses a loudspeaker module and an earphone, and belongs to the technical field of earphones. The loudspeaker module comprises a first loudspeaker and a second loudspeaker, the first loudspeaker comprises a main body, the main body is provided with an accommodating cavity, the bottom wall of the accommodating cavity is provided with a sinking table, and the bottom wall of the sinking table is provided with a first sound outlet hole; wherein the sinking table protrudes from the bottom wall of the containing cavity to the outside of the containing cavity, the area of the sinking table is smaller than that of the bottom wall of the containing cavity, the second loudspeaker is arranged in the containing cavity, at least one part of the second loudspeaker is located in the sinking table, and the second loudspeaker and the first sound outlet hole are oppositely arranged; and one side of the diaphragm assembly is connected with the side, away from the containing cavity, of the sinking table, and the other side of the diaphragm assembly is connected with the edge of the main body.

Description

Technical Field

[0001] The present application belongs to the field of earphone technology, and specifically relates to a speaker module and earphone. Background Art

[0002] In related technologies, such as Figure 1 and Figure 2 As shown, the speaker module is usually provided with two sound generating units, which may specifically include a high frequency sound generating unit 104' and a low frequency sound generating unit 102', thereby expanding the frequency response range of the speaker module and improving the sound generating effect of the speaker module.

[0003] However, the setting of two sound units will increase the volume of the speaker module, which is not conducive to the miniaturization design of the speaker module. At the same time, the unreasonable relative position setting between the two sound units also affects the sound effect of the two sound units. Therefore, how to set the stacking method between the two sound units to ensure the miniaturization of the speaker module and the sound effect of the speaker module has become a technical problem that needs to be solved urgently. Utility Model Content

[0004] The present application aims to provide a speaker module and earphones, which can solve the technical problem in the related art that the two sound units of the speaker module are irrationally arranged, resulting in an increase in the volume of the speaker module and affecting the sound effect.

[0005] In a first aspect, an embodiment of the present application provides a speaker module, including a first speaker and a second speaker, wherein the first speaker includes:

[0006] The main body is provided with a receiving cavity, the bottom wall of the receiving cavity is provided with a sink, and the bottom wall of the sink is provided with a first sound outlet;

[0007] The sink is protruding from the bottom wall of the accommodating cavity toward the outside of the accommodating cavity, the area of the sink is smaller than the area of the bottom wall of the accommodating cavity, the second speaker is arranged in the accommodating cavity, and at least a part of the second speaker is located in the sink, and the second speaker is arranged opposite to the first sound outlet;

[0008] A diaphragm assembly, one side of the diaphragm assembly is connected to a side of the sink away from the accommodating cavity, and the other side of the diaphragm assembly is connected to the edge of the main body.

[0009] In a second aspect, an embodiment of the present application provides a headset, comprising: a speaker module as in the first aspect.

[0010] In the loudspeaker module according to the embodiment of the present application, a receiving cavity is provided in the main body of the first loudspeaker, and a sunken platform is provided on the bottom wall of the receiving cavity. Thus, a part of the accommodation space is provided for the second loudspeaker through the sunken platform, so that at least a part of the second loudspeaker can be located in the sunken platform, and further the whole of the second loudspeaker will not protrude outside the main body of the first loudspeaker. On the basis of realizing the expansion of the frequency response range of the loudspeaker module by the first loudspeaker and the second loudspeaker, the second loudspeaker can utilize the space in the receiving cavity of the first loudspeaker without occupying a separate space, ensuring the miniaturized design of the loudspeaker module. At the same time, by providing a sunken platform only at a part of the bottom wall of the receiving cavity instead of sinking the entire bottom wall of the receiving cavity, sufficient vibration space is ensured between the diaphragm assembly and the main body of the first loudspeaker, thereby ensuring the sound emission effect of the first loudspeaker.

[0011] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0013] Figure 1 FIG. 1 shows one of the schematic structural diagrams of a loudspeaker module in the related art;

[0014] Figure 2 FIG. 2 shows another schematic structural diagram of a loudspeaker module in the related art;

[0015] Figure 3 FIG. 3 shows one of the schematic structural diagrams of a loudspeaker module according to an embodiment of the present application;

[0016] Figure 4 FIG. 4 shows another schematic structural diagram of a loudspeaker module according to an embodiment of the present application;

[0017] Figure 5 FIG. 5 shows a third schematic structural diagram of a loudspeaker module according to an embodiment of the present application;

[0018] Figure 6 FIG. 6 shows Figure 5 one of the schematic structural diagrams of a middle chassis;

[0019] Figure 7 FIG. 7 shows Figure 5 another schematic structural diagram of a middle chassis;

[0020] Figure 8 FIG. 8 shows one of the schematic structural diagrams of an earphone according to an embodiment of the present application;

[0021] Figure 9Shows the second schematic structural diagram of the earphone according to an embodiment of the present application;

[0022] Figure 10 Shows the third schematic structural diagram of the earphone according to an embodiment of the present application;

[0023] Figure 11 Shows Figure 9 One of the schematic structural diagrams of the first bracket in

[0024] Figure 12 Shows Figure 9 The second schematic structural diagram of the first bracket in

[0025] Figure 13 Shows Figure 9 The third schematic structural diagram of the first bracket in

[0026] Figure 14 Shows the fourth schematic structural diagram of the earphone according to an embodiment of the present application;

[0027] Figure 15 Shows the schematic diagram of the sound wave frequency curve of the speaker module according to an embodiment of the present application;

[0028] Figure 16 Shows the fifth schematic structural diagram of the earphone according to an embodiment of the present application;

[0029] Figure 17 Shows the schematic diagram of the harmonic distortion curve of the second speaker in the embodiment of the present application.

[0030] Reference numerals:

[0031] 102' Low-frequency sound generating unit, 104' High-frequency sound generating unit;

[0032] 100 Speaker module, 102 First speaker, 104 Second speaker, 106 Main body, 108 Accommodating cavity, 110 Sunk platform, 112 First sound outlet hole, 114 Diaphragm assembly, 116 Basin frame, 118 First sound outlet pipe, 120 Outer shell, 122 First fixing ring, 124 Second fixing ring, 126 Diaphragm, 128 First accommodating cavity, 130 Magnetic part, 132 Voice coil, 134 Electrical connecting part, 136 Moving iron speaker, 138 Coil, 140 Armature, 200 Earphone, 202 Housing, 204 First bracket, 206 Second sound outlet pipe, 208 Third sound outlet pipe, 210 Third sound outlet hole, 212 Second sound outlet hole, 214 Sealing part, 216 Second bracket, 218 Second accommodating cavity, 220 Fourth sound outlet hole, 222 Fifth sound outlet hole, 224 Battery, 226 Mounting part, 228 Microphone, 230 Temperature sensor, 232 Mounting groove. Detailed implementation manners

[0033] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0034] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0035] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application may be understood according to specific circumstances.

[0036] The following will be described in conjunction with Figures 3 to 17 a loudspeaker module and an earphone according to an embodiment of the present application.

[0037] In some embodiments of the present application, a loudspeaker module is provided. Figure 3 FIG. 1 shows one of the schematic structural diagrams of the loudspeaker module according to an embodiment of the present application; Figure 4 FIG. 2 shows another schematic structural diagram of the loudspeaker module according to an embodiment of the present application; Figure 5 FIG. 3 shows still another schematic structural diagram of the loudspeaker module according to an embodiment of the present application; as Figure 3 、 Figure 4 and Figure 5As shown, the speaker module 100 includes a first speaker 102 and a second speaker 104, the first speaker 102 includes: a main body 106, the main body 106 is provided with a receiving cavity 108, the bottom wall of the receiving cavity 108 is provided with a sink 110, and the bottom wall of the sink 110 is provided with a first sound outlet 112; wherein, the sink 110 is protruded from the bottom wall of the receiving cavity 108 toward the outside of the receiving cavity 108, the area of the sink 110 is smaller than the area of the bottom wall of the receiving cavity 108, the second speaker 104 is arranged in the receiving cavity 108, and at least a part of the second speaker 104 is located in the sink 110, and the second speaker 104 is arranged opposite to the first sound outlet 112; a diaphragm assembly 114, one side of the diaphragm assembly 114 is connected to a side of the sink 110 away from the receiving cavity 108, and the other side of the diaphragm assembly 114 is connected to the edge of the main body 106.

[0038] In the embodiment of the present application, the speaker module 100 includes a first speaker 102 and a second speaker 104, that is, the speaker module 100 includes two sound-emitting units, wherein the first speaker 102 can be a low-frequency speaker and the second speaker 104 can be a high-frequency speaker, thereby expanding the frequency response range of the speaker module 100 and improving the sound effect of the speaker module 100.

[0039] Further, the first speaker 102 includes a main body 106, the main body 106 is provided with a receiving cavity 108, and the bottom wall of the receiving cavity 108 is provided with a sink 110, the second speaker 104 can be arranged in the receiving cavity 108, and at least a part of the second speaker 104 is located in the sink 110 of the bottom wall of the receiving cavity 108. That is, by providing the sink 110 on the bottom wall of the receiving cavity 108, more accommodation space can be provided for the second speaker 104, so as to ensure that the entire second speaker 104 can be arranged inside the receiving cavity 108, and avoid that part of the second speaker 104 protrudes from the main body 106 of the first speaker 102, and on the basis of realizing the expansion of the frequency response range of the speaker module 100 by the first speaker 102 and the second speaker 104, the second speaker 104 can utilize the space in the receiving cavity 108 of the first speaker 102 without occupying a separate space, thereby ensuring the miniaturization design of the speaker module 100.

[0040] At the same time, a first sound hole 112 is opened on the bottom wall of the sink 110, and the second speaker 104 is opposite to the first sound hole 112, so as to ensure that the sound waves emitted by the second speaker 104 can be transmitted through the first sound hole 112, thereby ensuring the sound effect of the second speaker 104.

[0041] Furthermore, the first speaker 102 further includes a diaphragm assembly 114, one side of the diaphragm assembly 114 is connected to the side of the sink away from the accommodating cavity 108, and the other side of the diaphragm assembly 114 is connected to the edge of the body 106. At the same time, the sink 110 of the bottom wall of the accommodating cavity 108 is protruded from the bottom wall of the accommodating cavity 108 to the outside of the accommodating cavity 108, that is, the sink 110 is protruded toward the direction of the diaphragm assembly 114. In addition, the area of the sink 110 is smaller than the area of the bottom wall of the accommodating cavity 108.

[0042] It is understandable that during the operation of the first speaker 102 , sound is produced through the vibration of the diaphragm assembly 114 . Therefore, during the vibration of the diaphragm assembly 114 , there needs to be sufficient vibration space to ensure the sound effect of the first speaker 102 .

[0043] Therefore, the area of the sink 110 is set to be smaller than the area of the bottom wall of the accommodating cavity 108, that is, the sink 110 is only provided on a part of the bottom wall of the accommodating cavity 108. While the second speaker 104 is placed on the sink 110, the volume of the sink 110 protruding from the bottom wall of the accommodating cavity 108 can be reduced, so as to avoid the part of the sink 110 protruding from the bottom wall affecting the vibration of the diaphragm assembly 114, that is, to ensure that there is enough vibration space between the diaphragm assembly 114 and the main body 106 of the first speaker 102. Figure 5 The position indicated by the arrow in the middle thereby ensuring the sound effect of the first speaker 102.

[0044] That is, by only providing a sinking platform 110 on a part of the bottom wall of the accommodating cavity 108, instead of sinking the bottom wall of the accommodating cavity 108 as a whole, a stepped structure is formed between the bottom wall of the accommodating cavity 108 and the sinking platform 110 between the main body 106 of the first speaker 102 and the diaphragm assembly 114, thereby ensuring that there is sufficient vibration space between the diaphragm assembly 114 and the main body 106 of the first speaker 102, thereby ensuring the sound effect of the first speaker 102.

[0045] In the loudspeaker module 100 according to the embodiment of the present application, by providing a receiving cavity 108 in the main body 106 of the first loudspeaker 102 and simultaneously providing a sunken platform 110 on the bottom wall of the receiving cavity 108, a part of the accommodation space is provided for the second loudspeaker 104 through the sunken platform 110, so that at least a part of the second loudspeaker 104 can be located within the sunken platform 110, and further the whole of the second loudspeaker 104 will not protrude outside the main body 106 of the first loudspeaker 102. On the basis of expanding the frequency response range of the loudspeaker module 100 by the first loudspeaker 102 and the second loudspeaker 104, the second loudspeaker 104 can utilize the space within the receiving cavity 108 of the first loudspeaker 102 without occupying a separate space, ensuring the miniaturized design of the loudspeaker module 100. At the same time, by providing the sunken platform 110 only locally on the bottom wall of the receiving cavity 108 instead of sinking the entire bottom wall of the receiving cavity 108, sufficient vibration space is ensured between the diaphragm assembly 114 and the main body 106 of the first loudspeaker 102, and further the sound production effect of the first loudspeaker 102 is ensured.

[0046] In addition, Figure 15 shows a schematic diagram of the sound wave frequency curve of the loudspeaker module according to the embodiment of the present application; as Figure 15 shown, the loudspeaker module according to the embodiment of the present application can effectively expand the bandwidth of high-frequency sound waves compared with the loudspeaker module in the related art, that is, when the frequency of the sound wave is above 2000 Hz, the bandwidth of the sound wave is greatly expanded.

[0047] In some embodiments of the present application, the main body 106 includes: a chassis 116, and the chassis 116 is provided with a receiving cavity 108; a first sound outlet duct 118, one end of the first sound outlet duct 118 is connected to the side of the sunken platform 110 facing away from the receiving cavity 108, and the first sound outlet duct 118 is opposite to the first sound outlet hole 112.

[0048] In the embodiment of the present application, Figure 6 shows Figure 5 one of the structural schematic diagrams of the chassis; Figure 7 shows Figure 5 another structural schematic diagram of the chassis; as Figure 5 、 Figure 6 and Figure 7As shown, the main body 106 may include a chassis 116. The chassis 116 is provided with a receiving cavity 108, and a sunken platform 110 is provided on the bottom wall of the receiving cavity 108. At the same time, the main body 106 further includes a first sound output pipe 118. One end of the first sound output pipe 118 is connected to the side of the sunken platform 110 facing away from the receiving cavity 108, and the first sound output pipe 118 is opposite to the first sound output hole 112. That is, the first sound output pipe 118 is located outside the receiving cavity 108, and the first sound output pipe 118 is opposite to the first sound output hole 112 on the sunken platform 110. In this way, the sound waves emitted by the second speaker 104 in the receiving cavity 108 can be propagated through the first sound output pipe 118, so as to isolate the sound waves emitted by the first speaker 102 from the sound waves emitted by the second speaker 104 through the first sound output pipe 118, thereby avoiding interference between the sound waves emitted by the first speaker 102 and the sound waves emitted by the second speaker 104, ensuring the effects of low-frequency sound waves and high-frequency sound waves, that is, ensuring the sound-emitting effect of the speaker module 100.

[0049] In addition, the diameter of the first sound output pipe 118 can be set to be greater than or equal to 1 mm, so as to ensure that the first sound output pipe 118 has sufficient propagation space, and further ensure the sound-emitting effect of the second speaker 104.

[0050] In some embodiments of the present application, the main body 106 further includes: a housing 120, which is connected to the edge of the chassis 116; the diaphragm assembly 114 includes: a first fixing ring 122, sleeved on the first sound output pipe 118; a second fixing ring 124, arranged on the housing 120, and the second fixing ring 124 is coaxially arranged with the first fixing ring 122; a diaphragm 126, one side of the diaphragm 126 is connected to the first fixing ring 122, and the other side of the diaphragm 126 is connected to the second fixing ring 124.

[0051] In the embodiments of the present application, as Figure 5 shown, the main body 106 may further include a housing 120, and the housing 120 is connected to the edge of the chassis 116. Specifically, the first speaker 102 may be a moving coil speaker. Correspondingly, the shape of the chassis 116 may be circular, the receiving cavity 108 may be located in the middle of the circular chassis 116, and correspondingly, the first sound output hole 112 on the bottom wall of the sunken platform 110 is also located in the middle of the circular chassis 116, and the first sound output pipe 118 is coaxially arranged with the circular chassis 116. The shape of the housing 120 may be annular, and the housing 120 is connected to the edge of the chassis 116.

[0052] Meanwhile, the diaphragm assembly 114 may include a first fixing ring 122, a second fixing ring 124, and a diaphragm 126. The first fixing ring 122 is sleeved on the first sound outlet duct 118, and the second fixing ring 124 is disposed on the housing 120, so that the first fixing ring 122 and the second fixing ring 124 can be coaxially arranged. Further, one side of the diaphragm 126 is connected to the first fixing ring 122, and the other side of the diaphragm 126 is connected to the second fixing ring 124. That is to say, the shape of the diaphragm 126 is also annular, and both ends of the diaphragm 126 are supported by the first fixing ring 122 and the second fixing ring 124 respectively, thus ensuring the stability of the diaphragm 126 during vibration, avoiding noise during the vibration of the diaphragm 126, and ensuring the sound production effect of the first speaker 102.

[0053] In some embodiments of the present application, the diaphragm 126, the housing 120, and the chassis 116 enclose a first accommodation cavity 128. The first speaker 102 further includes: a magnetic member 130 disposed in the first accommodation cavity 128; a voice coil 132 disposed in the first accommodation cavity 128, and the voice coil 132 is connected to the diaphragm 126; wherein, the voice coil 132 is used to drive the diaphragm 126 to vibrate in cooperation with the magnetism of the magnetic member 130 when powered on.

[0054] In the embodiments of the present application, as Figure 5 shown, the first speaker 102 may further include a magnetic member 130 and a voice coil 132. The voice coil 132 is connected to the diaphragm 126. When the voice coil 132 is powered on, the voice coil 132 can generate a magnetic field. Through the mutual cooperation between the change of the magnetic field generated by the voice coil 132 and the magnetic field of the magnetic member 130, the voice coil 132 can be caused to vibrate, and then the diaphragm 126 is driven to vibrate by the voice coil 132, and then the sound production function of the first speaker 102 is realized through the vibration of the diaphragm 126.

[0055] Specifically, the diaphragm 126, the housing 120, and the chassis 116 enclose a first accommodation cavity 128, and both the magnetic member 130 and the voice coil 132 are located in the first accommodation cavity 128.

[0056] In some embodiments of the present application, the first speaker 102 further includes: an electrical connector 134 disposed on the housing 120 and located outside the first accommodation cavity 128, and the electrical connector 134 is electrically connected to the voice coil 132.

[0057] In the embodiments of the present application, as Figure 5As shown, the first speaker 102 further includes an electrical connector 134. Through the electrical connector 134, the electrical connection of the voice coil 132 can be achieved. Specifically, the electrical connector 134 can be connected to the control chip of the speaker module 100, and then the current in the voice coil 132 can be controlled through the control chip of the speaker module 100, and then the different amplitudes and frequencies of the diaphragm 126 can be controlled to achieve the sound generation function of the first speaker 102. Exemplarily, the voice coil 132 and the electrical connector 134 can be connected through a connecting wire, and the connecting wire can pass through the housing 120 of the first speaker 102 to achieve the connection between the voice coil 132 and the electrical connector 134.

[0058] Furthermore, the electrical connector 134 can be disposed on the housing 120 of the first speaker 102, and the electrical connector 134 is located outside the first accommodation space. Thereby, it can be avoided that the electrical connector 134 is located in the first accommodation space and affects the sound generation effect of the first speaker 102, and at the same time, it is also convenient for the connection between the electrical connector 134 and the control chip of the speaker module 100.

[0059] In some embodiments of the present application, the speaker frame 116 includes a magnetic speaker frame.

[0060] In the embodiments of the present application, the speaker frame 116 can include a magnetic speaker frame, that is, the speaker frame 116 can be made of a magnetic material, such as stainless steel or neodymium iron boron, so that the speaker frame 116 can be combined with the magnetic member 130 into a dual magnetic circuit, thereby improving the sound generation performance of the first speaker 102.

[0061] In some embodiments of the present application, the second speaker 104 includes a moving iron speaker 136, and the housing of the moving iron speaker 136 is an anti-magnetic housing.

[0062] In the embodiments of the present application, Figure 16 FIG. 5 shows a schematic structural diagram of the earphone according to the embodiments of the present application; as Figure 16 shown, the second speaker 104 can be a moving iron speaker 136, and the housing of the moving iron speaker 136 is an anti-magnetic housing. Specifically, the housing of the moving iron speaker 136 can be made of an anti-magnetic material such as ferrite. Thereby, it can be avoided that the magnetic field in the accommodation cavity 108 interferes with the moving iron speaker 136 and ensure the sound generation effect of the moving iron speaker 136.

[0063] It can be understood that, as Figure 16As shown, when the moving iron speaker 136 is placed in the accommodation groove, the sound hole and the vibrating diaphragm of the moving iron speaker 136 need to be opposite to the first sound outlet hole 112 on the bottom wall of the sunken platform 110, so as to ensure that the sound waves emitted by the moving iron speaker 136 can be effectively transmitted through the first sound outlet hole 112. At this time, the coil 138 and the armature 140 of the moving iron speaker 136 are perpendicular to the direction of the magnetic field diffused by the first speaker 102. As Figure 16 shown by the arrows in the figure, during the operation of the first speaker 102, the magnetic field diffused by the first speaker 102 will generate an additional force on the armature 140 of the moving iron speaker 136, thereby interfering with the operation of the moving iron speaker 136 and causing an increase in harmonic distortion. Therefore, by setting the housing of the moving iron speaker 136 as an anti-magnetic housing, the interference of the magnetic field diffused by the first speaker 102 on the operation of the moving iron speaker 136 can be effectively avoided, and the sound effect of the moving iron speaker 136 can be ensured.

[0064] Exemplarily, Figure 17 shows a schematic curve diagram of the harmonic distortion of the second speaker in the embodiment of the present application. As Figure 17 shown, when the housing of the moving iron speaker 136 does not adopt an anti-magnetic housing, during the operation of the speaker module 100, the harmonic distortion of the moving iron speaker 136 reaches 100%, while when the housing of the moving iron speaker 136 is set as an anti-magnetic housing, during the operation of the speaker module 100, the harmonic distortion of the moving iron speaker 136 can be reduced to 3%.

[0065] In addition, the second speaker 104 can also be set as a sound generating device that does not adopt the electromagnetic principle, such as a micro-electromechanical system sound generating device or a ceramic sound generating device. These sound generating devices do not rely on electromagnetic induction to generate sound, so the magnetic field diffused by the first speaker 102 will not affect these sound generating devices, and thus will not interfere with the second speaker 104.

[0066] Alternatively, the second speaker 104 can also be set as a planar sound generating unit that adopts the moving coil speaker principle. During the operation of this sound generating unit, the coil 138 is parallel to the magnetic field diffused by the first speaker 102 during vibration. Therefore, the coil 138 will not cut the magnetic field diffused by the first speaker 102, and thus will not be affected by the magnetic field diffused by the first speaker 102.

[0067] The embodiment of the present application also provides a headset 200. Figure 8 shows one of the schematic structural diagrams of the headset in the embodiment of the present application; as Figure 8 shown, the headset 200 includes a housing 202 and a speaker module 100 as described in any one of the above embodiments. The speaker module 100 is disposed in the housing 202.

[0068] The earphone 200 proposed in this embodiment has the beneficial effects of any of the above embodiments because it has the speaker module 100 of any of the above embodiments, and details are not repeated here.

[0069] In some embodiments of the present application, the earphone 200 further includes: a first bracket 204 disposed on the housing 202, the speaker module 100 is disposed on the first bracket 204, the first bracket 204 includes a second sound outlet duct 206, and the second sound outlet duct 206 communicates with the first sound outlet duct 118; the housing 202 further includes a third sound outlet duct 208, a third sound outlet hole 210 is formed at an end of the third sound outlet duct 208, the second sound outlet duct 206 passes through the third sound outlet duct 208, and an end of the second sound outlet duct 206 is flush with the third sound outlet hole 210; the first bracket 204 is further provided with a plurality of second sound outlet holes 212, the plurality of second sound outlet holes 212 face the diaphragm assembly 114 of the first speaker 102, and the plurality of second sound outlet holes 212 communicate with the third sound outlet duct 208.

[0070] In the embodiments of the present application, Figure 9 FIG. 2 shows a second schematic structural diagram of the earphone according to the embodiment of the present application; Figure 10 FIG. 3 shows a third schematic structural diagram of the earphone according to the embodiment of the present application; As Figure 9 and Figure 10 shown, the earphone 200 may further include a first bracket 204. The first bracket 204 is disposed inside the housing 202. By means of the first bracket 204, the speaker module 100 can be supported, ensuring the stability of the position of the speaker module 100 inside the housing 202 of the earphone 200. Specifically, an installation groove 232 may be provided on the first bracket 204, and the speaker module 100 may be installed on the first bracket 204 through the installation groove 232.

[0071] Furthermore, the first bracket 204 may further include a second sound outlet duct 206, and the second sound outlet duct 206 communicates with the first sound outlet duct 118 of the speaker module 100. That is, the sound waves emitted by the second speaker 104 can be propagated through the first sound outlet duct 118 and the second sound outlet duct 206.

[0072] Specifically, the second sound output duct 206 is coaxially arranged with the first sound output duct 118. Moreover, the diameter of the second sound output duct 206 can be set to be greater than or equal to 1 mm. At the same time, the length of the second sound output duct 206 can be set to be less than or equal to 5 mm to ensure the propagation effect of the sound waves of the second speaker 104. It can be understood that the second speaker 104 is a high-frequency speaker. According to the principle of sound wave radiation, high-frequency sound waves have short wavelengths and poor directivity, so they are prone to attenuation due to the damping of air during propagation in the air, and they will also attenuate when encountering obstacles due to poor diffraction ability. Therefore, the second sound output duct 206 is set to be less than or equal to 5 mm to prevent the sound wave performance from being overly attenuated due to the excessive length of the second sound output duct 206. At the same time, setting the diameter of the second sound output duct 206 to be greater than or equal to 1 mm can prevent the diameter of the second sound output duct 206 from being too small, resulting in large frictional damping between the sound waves and the tube wall of the second sound output duct 206 and causing performance attenuation.

[0073] Furthermore, the housing 202 further includes a third sound output duct 208. A third sound output hole 210 is provided at the end of the third sound output duct 208. When the user wears the earphone 200, the third sound output hole 210 is used to face the user's ear canal, so as to transmit the sound waves generated by the speaker module 100 to the user's ear canal.

[0074] Furthermore, as Figure 10 shown, the first bracket 204 is also provided with a plurality of second sound output holes 212. The second sound output holes 212 face the diaphragm assembly 114 of the first speaker 102. The second sound output holes 212 are communicated with the third sound output duct 208, so that the sound waves generated by the first speaker 102 can be transmitted to the third sound output duct 208 through the second sound output holes 212, and then be transmitted through the third sound output hole 210.

[0075] At the same time, as Figure 9 shown, the second sound output duct 206 passes through the third sound output duct 208, and the end of the second sound output duct 206 is flush with the third sound output hole 210. That is, inside the third sound output duct 208, the high-frequency sound waves emitted by the second speaker 104 can be directly transmitted to the position of the third sound output hole 210 through the second sound output duct 206. In this way, inside the third sound output duct 208, the high-frequency sound waves emitted by the second speaker 104 and the low-frequency sound waves emitted by the first speaker 102 can be isolated, thereby avoiding the mutual interference between the high-frequency sound waves and the low-frequency sound waves and ensuring the sound emission effect of the earphone 200.

[0076] In some embodiments of the present application, the earphone 200 further includes: a seal 214, and the seal 214 is arranged between the first sound output duct 118 and the second sound output duct 206.

[0077] In the embodiments of the present application, as Figure 9 shown, between the first sound output duct 118 and the second sound output duct 206, a seal 214 may be further provided. Through the seal 214, the connection between the first sound output duct 118 and the second sound output duct 206 can be sealed, preventing the sound waves emitted by the second speaker 104 from leaking at the connection between the first sound output duct 118 and the second sound output duct 206, and preventing the sound waves emitted by the second speaker 104 from interfering with the sound waves emitted by the first speaker 102.

[0078] Specifically, the seal 214 may be a compression foam.

[0079] In some embodiments of the present application, the earphone 200 further includes: a second bracket 216, connected to the first bracket 204. The second bracket 216 and the first bracket 204 enclose a second accommodation cavity 218, and the speaker module 100 is located in the second accommodation cavity 218. A fourth sound output hole 220 is provided in the chassis 116 of the first speaker 102, and a fifth sound output hole 222 is provided in the housing 120 of the first speaker 102. The first accommodation cavity 128 of the first speaker 102 is communicated with the third sound output duct 208 through the fourth sound output hole 220 and the fifth sound output hole 222.

[0080] In the embodiments of the present application, as Figure 8 and Figure 9 shown, the earphone 200 may further include a second bracket 216. The second bracket 216 is connected to the first bracket 204, so that a second accommodation space can be enclosed by the first bracket 204 and the second bracket 216, enabling the speaker module 100 to be located in the second accommodation space to protect the speaker module 100.

[0081] Furthermore, Figure 14 shows a fourth schematic structural diagram of the earphone according to the embodiments of the present application; as Figure 6 , Figure 7 and Figure 14 shown, a fourth sound output hole 220 may further be provided in the chassis 116 of the first speaker 102, and a fifth sound output hole 222 may further be provided in the housing 120 of the first speaker 102. In this way, the first accommodation cavity 128 enclosed by the diaphragm 126, the housing 120 and the chassis 116 of the first speaker 102 can be communicated with the third sound output duct 208 through the fourth sound output hole 220 and the fifth sound output hole 222.

[0082] That is, as Figure 14 shown, during the operation of the first speaker 102, the sound waves generated by the vibration of the diaphragm 126 can enter the third sound output duct 208 through two propagation paths. Among them, a part of the sound waves directly enter the third sound output duct 208 through a plurality of second sound output holes 212, asFigure 14 As shown by the solid arrows in the figure, another part of the sound waves can pass through the fourth sound outlet hole 220 on the speaker frame 116, be reflected by the second bracket 216, and enter the fifth sound outlet hole 222 on the housing 120. Since the speaker module 100 is disposed within the housing 202 of the earphone 200, as Figure 14 shown by the dashed arrows in the figure. Therefore, after passing through the fifth sound outlet hole 222, the sound waves can propagate to the third sound outlet duct 208. At this time, the two parts of the sound waves will partially cancel each other out, thereby reducing the coloring of the low-frequency sound waves to further improve the low-frequency sound generation effect of the first speaker 102.

[0083] In some embodiments of the present application, the fifth sound outlet hole 222 is covered with a tuning mesh (not shown in the figure), and the tuning mesh is used to adjust the amount of sound waves propagating from the first accommodation cavity 128 to the third sound outlet duct 208.

[0084] In the embodiments of the present application, a tuning mesh can be covered on the surface of the fifth sound outlet hole 222, so that the amount of sound waves passing through the fifth sound outlet hole 222 can be adjusted. Furthermore, the amount of sound waves transmitted to the third sound outlet duct 208 can be adjusted, that is, the cancellation amount of the sound waves directly entering the third sound outlet duct 208 through the plurality of second sound outlet holes 212 can be adjusted to further improve the sound generation effect of the first speaker 102.

[0085] Specifically, the mesh number of the tuning mesh can be set to adjust the damping of the tuning mesh for sound wave transmission. The larger the mesh number, the greater the damping, and it is more difficult for the sound waves in the first accommodation cavity 128 to be transmitted to the third sound outlet duct 208, and the degree of sound wave cancellation will become smaller. On the contrary, the smaller the mesh number, the smaller the damping, and the greater the degree of sound wave cancellation.

[0086] In some embodiments of the present application, the earphone 200 further includes: a battery 224, disposed on a side of the second bracket 216 facing away from the second accommodation cavity 218.

[0087] In the embodiments of the present application, as Figure 9 shown, the earphone 200 may further include a battery 224. Through the battery 224, the operation process of the speaker module 100 can be powered, so that there is no need to supply power to the speaker module 100 through a transmission cable, and a wireless power supply mode of the earphone 200 can be achieved, thereby making the use of the earphone 200 more flexible.

[0088] In some embodiments of the present application, the first bracket 204 is further provided with a mounting portion 226, and the earphone 200 further includes: a microphone 228, disposed on the mounting portion 226; a temperature sensor 230, disposed on the mounting portion 226.

[0089] In the embodiments of the present application, Figure 11 shows Figure 9One of the schematic structural diagrams of the first bracket in Figure 12 shows Figure 9 Another schematic structural diagram of the first bracket in Figure 13 shows Figure 9 The third schematic structural diagram of the first bracket in; as Figure 11 , Figure 12 and Figure 13 As shown, an installation part 226 can also be provided on the first bracket 204. Correspondingly, the earphone 200 further includes a microphone 228 and a temperature sensor 230, and both the microphone 228 and the temperature sensor 230 can be provided on the installation part 226. By providing the installation part 226, the integration of the microphone 228 and the temperature sensor 230 can be achieved, ensuring the compactness of the structure of the earphone 200 and being beneficial to the miniaturized design of the earphone 200.

[0090] Specifically, the installation part 226 can be provided at a position on the first bracket 204 close to the side, so as to realize the setting of the microphone 228 and the temperature sensor 230 on the basis of not affecting the setting position of the speaker module 100.

[0091] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0092] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A loudspeaker module, characterized in that, The speaker module includes a first speaker and a second speaker, wherein the first speaker includes: A main body, wherein the main body is provided with a containing cavity, a bottom wall of the containing cavity is provided with a sink, and a first sound outlet hole is opened on the bottom wall of the sink; The sink is protruding from the bottom wall of the accommodating cavity toward the outside of the accommodating cavity, the area of the sink is smaller than the area of the bottom wall of the accommodating cavity, the second speaker is arranged in the accommodating cavity, and at least a part of the second speaker is located in the sink, and the second speaker is arranged opposite to the first sound outlet hole; A diaphragm assembly, one side of which is connected to a side of the sink away from the accommodating cavity, and the other side of which is connected to an edge of the main body.

2. The loudspeaker module according to claim 1, characterized in that, The subject includes: A basin frame, wherein the basin frame is provided with the accommodating cavity; A first sound outlet pipe, one end of which is connected to a side of the sink away from the accommodating cavity, and the first sound outlet pipe is opposite to the first sound outlet hole.

3. The loudspeaker module according to claim 2, wherein The subject also includes: A shell connected to an edge of the basin frame; The diaphragm assembly comprises: A first fixing ring, sleeved on the first sound outlet pipe; A second fixing ring, disposed on the housing, the second fixing ring being coaxially disposed with the first fixing ring; A diaphragm, one side of the diaphragm is connected to the first fixing ring, and the other side of the diaphragm is connected to the second fixing ring.

4. The loudspeaker module according to claim 3, wherein The diaphragm, the housing and the basin frame form a first accommodating cavity, and the first speaker further includes: A magnetic member, disposed in the first accommodating cavity; A voice coil is disposed in the first accommodating cavity, and the voice coil is connected to the diaphragm; Wherein, the voice coil is used to drive the diaphragm to vibrate in cooperation with the magnetism of the magnetic component when power is turned on.

5. The loudspeaker module according to claim 4, wherein, The first speaker also includes: An electrical connector is disposed on the housing and located outside the first accommodating cavity, and the electrical connector is electrically connected to the voice coil.

6. The loudspeaker module according to claim 2, wherein The basin rack comprises a magnetic basin rack.

7. The loudspeaker module according to any one of claims 1 to 6, characterized in that The second speaker comprises a moving iron speaker, and the housing of the moving iron speaker is a diamagnetic housing.

8. A headset, characterized in that, include: case; The speaker module according to any one of claims 1 to 7, wherein the speaker module is arranged in the shell.

9. The earphone according to claim 8, wherein, Also includes: a first bracket, disposed on the housing, the speaker module being disposed on the first bracket, the first bracket comprising a second sound outlet pipe, the second sound outlet pipe being connected to the first sound outlet pipe of the speaker module; The housing further comprises a third sound outlet pipe, an end of the third sound outlet pipe is provided with a third sound outlet hole, the second sound outlet pipe passes through the third sound outlet pipe, and an end of the second sound outlet pipe is flush with the third sound outlet hole; The first bracket is further provided with a plurality of second sound outlet holes, the second sound outlet holes are opposite to the diaphragm assembly of the first speaker, and the plurality of second sound outlet holes are connected to the third sound outlet pipe.

10. The earphone according to claim 9, wherein, Also includes: A sealing member is disposed between the first sound outlet pipe and the second sound outlet pipe.

11. The earphone according to claim 9, characterized in that, Also includes: A second bracket is connected to the first bracket, the second bracket and the first bracket enclose a second accommodating cavity, and the speaker module is located in the second accommodating cavity; The basin frame of the first speaker is provided with a fourth sound outlet hole, the shell of the first speaker is provided with a fifth sound outlet hole, and the first accommodating cavity of the first speaker is connected with the third sound outlet pipe through the fourth sound outlet hole and the fifth sound outlet hole.

12. The earphone according to claim 11, characterized in that, The fifth sound outlet hole is covered with a tuning net, and the tuning net is used to adjust the amount of sound waves propagating from the first accommodating cavity to the third sound outlet pipe.

13. The earphone according to claim 11, characterized in that, Also includes: The battery is arranged on a side of the second bracket away from the second accommodating cavity.

14. The earphone according to claim 9, wherein The first bracket is further provided with a mounting portion, and the headset further comprises: A microphone, disposed on the mounting portion; The temperature sensor is arranged on the installation portion.

Images