Quartz glass preparation equipment
The heating components and non-contact temperature measurement components of the quartz glass preparation equipment are accurately controlled, which solves the problem of bubble defects in the preparation of quartz glass and achieves high-quality and efficient quartz glass production.
Patent Information
- Application Number
- CN202422363226.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-09-26
Smart Images
Figure CN223163346U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of material preparation, and more particularly to equipment for preparing quartz glass. Background Art
[0002] The preparation methods of quartz glass mainly include one-step synthesis methods such as electric melting, gas melting, chemical vapor deposition, and plasma vapor deposition. However, the one-step synthesis method can only prepare the following quartz columns. Usually, it is necessary to melt the quartz glass ingot again to obtain plate-shaped quartz glass. However, during the re-melting process, bubbles are likely to occur in the quartz glass, resulting in poor production quality of the quartz glass. Summary of the Utility Model
[0003] This application provides equipment for preparing quartz glass to solve some technical problems of poor preparation quality of known quartz glass.
[0004] The embodiments of this application are implemented as follows:
[0005] This application provides an equipment for preparing quartz glass, including a housing, a carrying component, a heating component, a heat insulation component, and a non-contact temperature measurement component. The housing defines a closed receiving cavity. The carrying component includes a carrier and a driving member. The carrier is disposed in the receiving cavity and is used for carrying the quartz glass ingot. The driving member is connected to the carrier and is used for driving the carrier to rotate around a rotation axis. The heating component is disposed in the receiving cavity and is located outside the carrying component, and is used for heating the quartz glass ingot. The heat insulation component is disposed in the receiving cavity and is disposed outside the heating component. The non-contact temperature measurement component is disposed in the housing and is used for detecting the temperature of the surface of the quartz glass ingot and / or the temperature of the surface of the heating component.
[0006] When the equipment for preparing quartz glass of this application works, place the quartz glass ingot on the carrier, turn on the heating component, and the heating component heats the quartz glass ingot through thermal radiation, gradually increasing the temperature of the quartz glass ingot and softening the quartz glass ingot. Among them, the heat insulation component can ensure that most of the thermal radiation generated by the heating component remains in the receiving cavity, playing a role in increasing the heating rate and preparation efficiency. At the same time, the driving member drives the carrier to rotate around a rotation axis, applying a centrifugal force to the quartz glass ingot. The softened quartz glass ingot extends under the action of the centrifugal force and its thickness decreases, forming plate-shaped quartz glass. After processing is completed, turn off the heating component, and take the material after the quartz glass cools to room temperature.
[0007] Among them, the non-contact temperature measurement component can directly obtain the surface temperature of the fused silica bobbin during the processing. The temperature detection data is relatively accurate, and the heating power of the heating component can be adjusted according to the actual processing requirements to adjust the actual heating curve of the fused silica bobbin, which is beneficial to improving the heating quality of the fused silica and reducing bubbles and bright spots caused by inaccurate temperature of the fused silica. Moreover, by precisely controlling the temperature of the fused silica, the production yield of the fused silica bobbin can be further improved, as well as the production uniformity and production size of the fused silica.
[0008] In a possible implementation manner:
[0009] The heating component includes a metal braided mesh heating layer.
[0010] In a possible implementation manner:
[0011] The housing includes: a furnace body that defines a cavity with one end open, and the carrier is disposed in the cavity; a cover body that is hermetically covered on the open end of the furnace body so that the cavity forms a sealed receiving cavity.
[0012] In a possible implementation manner:
[0013] The heating component includes a bottom heating member and a surrounding wall heating member. The bottom heating member is disposed at the open end, the surrounding wall heating member surrounds the inner side of the furnace body, and the carrier is disposed on a side of the bottom heating member away from the opening.
[0014] In a possible implementation manner:
[0015] The heat insulation component includes a bottom heat insulation member and a surrounding wall heat insulation member. The bottom heat insulation member is disposed on a side of the bottom heating member away from the carrier, and the surrounding wall heat insulation member is disposed between the surrounding wall heating member and the furnace body.
[0016] In a possible implementation manner:
[0017] The non-contact temperature measurement component includes a first temperature measurement member and a second temperature measurement member. Both the first temperature measurement member and the second temperature measurement member are disposed on the furnace body. The first temperature measurement member is used to detect the surface temperature of an object at the open end, and the second temperature measurement member is used to detect the surface temperature of an object at the inner surface of the furnace body.
[0018] In a possible implementation manner:
[0019] The non-contact temperature measurement component includes an infrared thermometer.
[0020] In a possible implementation manner:
[0021] The carrier includes: a carrier base connected to the driving member; and a loading crucible disposed on a side of the carrier base away from the driving member for loading the quartz glass ingot.
[0022] In a possible implementation:
[0023] The housing includes an inner layer and an outer layer, and a cooling flow channel is defined between the inner layer and the outer layer for introducing a coolant to cool the housing.
[0024] In a possible implementation:
[0025] The heat insulation assembly includes a plurality of reflective screens stacked between the heating assembly and the housing, and the reflective screens are used for reflecting the thermal radiation in the accommodation cavity. Description of the Drawings
[0026] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0027] Figure 1 It is a schematic structural diagram of a quartz glass manufacturing device according to an embodiment of the present application.
[0028] Figure 2 For Figure 1 it is an internal structural schematic diagram of the housing of the quartz glass manufacturing device in
[0029] Figure 3 For Figure 1 it is an internal structural schematic diagram of the reflective screen of the quartz glass manufacturing device in
[0030] Figure 4 For Figure 1 it is an internal structural schematic diagram of the metal braided mesh heating layer of the quartz glass manufacturing device in
[0031] Main Element Symbol Description:
[0032]
[0033] Detailed Embodiments
[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.
[0035] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments, and are not intended to limit this application. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.
[0037] Some embodiments of the present application will be described in detail. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0038] Refer to Figure 1 , this embodiment provides a quartz glass preparation device 100, including a housing 10, a carrier assembly 20, a heating assembly 30, a heat insulation assembly 40 and a non-contact temperature measurement assembly 50. The housing 10 defines a closed receiving cavity 11. The carrier assembly 20 includes a carrier 21 and a driving member 22. The carrier 21 is disposed in the receiving cavity 11. The carrier 21 is used to carry the quartz glass ingot 200. The driving member 22 is connected to the carrier 21. The driving member 22 is used to drive the carrier 21 to rotate around a rotation axis M. The heating assembly 30 is disposed in the receiving cavity 11 and is located outside the carrier assembly 20. The heating assembly 30 is used to heat the quartz glass ingot 200. The heat insulation assembly 40 is disposed in the receiving cavity 11. The heat insulation assembly 40 is disposed outside the heating assembly 30. The non-contact temperature measurement assembly 50 is disposed in the housing 10. The non-contact temperature measurement assembly 50 is used to detect the temperature of the surface of the quartz glass ingot 200 and / or the temperature of the surface of the heating assembly 30.
[0039] When the quartz glass preparation device 100 of the present application is working, the quartz glass ingot 200 is placed on the carrier 21, and the heating component 30 is turned on. The heating component 30 heats the quartz glass ingot 200 through thermal radiation, gradually increasing the temperature of the quartz glass ingot 200 and softening the quartz glass ingot 200. Among them, the heat insulation component 40 can ensure that most of the thermal radiation generated by the heating component 30 remains in the accommodation cavity 11, playing a role in increasing the heating rate and preparation efficiency. At the same time, the driving member 22 drives the carrier 21 to rotate around a rotation axis M, applying a centrifugal force to the quartz glass ingot 200. The softened quartz glass ingot 200 extends under the action of the centrifugal force and its thickness decreases, forming a plate-shaped quartz glass. After the processing is completed, the heating component 30 is turned off, and the material is taken after the quartz glass is cooled to room temperature.
[0040] Among them, the non-contact temperature measurement component 50 can directly obtain the surface temperature of the quartz glass ingot 200 during the processing. The temperature detection data is relatively accurate, and the heating power of the heating component 30 can be adjusted according to the actual processing requirements to adjust the actual heating curve of the quartz glass ingot 200, which is beneficial to improving the heating quality of the quartz glass and reducing bubbles and bright spots caused by inaccurate temperature of the quartz glass. Moreover, by precisely controlling the temperature of the quartz glass, the production yield rate of the quartz glass ingot 200 can be further increased, as well as the production uniformity and production size of the quartz glass.
[0041] In this embodiment, referring to Figure 1 , the housing 10 includes a furnace body 12 and a cover body. The furnace body 12 defines a cavity 121 with an open end, and the carrier 21 is disposed in the cavity 121. The cover body is hermetically covered on the open end of the furnace body 12, so that the cavity 121 forms a sealed accommodation cavity 11.
[0042] By providing the cover body, it is convenient for the operator to open the furnace body 12 to place the quartz glass ingot 200 on the carrier assembly 20. Moreover, the heating component 30 and the heat insulation component 40 can also be taken out from the opening of the cavity 121, so as to facilitate the replacement or adjustment of the heating component 30 and the heat insulation component 40.
[0043] Optionally, referring to Figure 1 , the cavity 121 has a first open end 122 and a second open end 123, and the first open end 122 and the second open end 123 are oppositely arranged along the length direction of the housing 10. The cover body includes a top cover 13 and a bottom cover 14. The top cover 13 is hermetically covered on the first open end 122. The bottom cover 14 is hermetically covered on the second open end 123, so that the cavity 121 forms a sealed accommodation cavity 11. In other embodiments, the furnace body 12 can also be provided with only a single opening, and the opening of the furnace body 12 can also be provided on the side of the furnace body 12.
[0044] In this embodiment, referring toFigure 1 Moreover, the quartz glass preparation device 100 further includes an air extraction device 62. The housing 10 is provided with an exhaust port 161, and the exhaust port 161 is communicated with the air extraction device 62. The air extraction device 62 is configured to extract the air in the accommodation cavity 11 to form a vacuum environment in the accommodation cavity 11, so as to ensure that no gas enters the quartz glass ingot 200 during the processing of the quartz glass ingot 200, thereby greatly reducing the bubbles and bright spots in the prepared quartz glass. In addition, since there is no gas applying pressure to the quartz glass, the collapse problem on the surface of the quartz glass can also be reduced, thereby greatly improving the processing quality of the quartz glass. For example, in this embodiment, through the air extraction device 62, a vacuum environment of 0.1 Pa to 1 Pa can be formed in the accommodation cavity 11.
[0045] Optionally, the air extraction device 62 includes a vacuum pump.
[0046] Optionally, referring to Figure 1 the housing 10 further includes a vacuum pipeline 162 and an opening / closing member 163. The vacuum pipeline 162 is communicated with the exhaust port 161, and the opening / closing member 163 is disposed in the vacuum pipeline 162 and is configured to open or close the vacuum pipeline 162. Specifically, during the air extraction process, the opening / closing member 163 opens the vacuum pipeline 162, and after the air extraction is completed, the opening / closing member 163 closes the vacuum pipeline 162. Optionally, the opening / closing member 163 can be a vacuum ball valve.
[0047] In this embodiment, referring to Figure 1 the exhaust port 161 is disposed on the side surface of the furnace body 12.
[0048] In this embodiment, referring to Figure 1 the furnace body 12 is further provided with an air inlet 171 and an air inlet pipe 172. The air inlet 171 is communicated with an inert gas source 61 through the air inlet pipe 172. The inert gas source 61 is configured to introduce an inert gas into the accommodation cavity 11 to facilitate the formation of a slightly positive pressure environment in the accommodation cavity 11.
[0049] Optionally, the air inlet 171 is disposed at the top cover 13. The inert gas introduced by the inert gas source 61 can be helium, argon, nitrogen, or the like.
[0050] In this embodiment, referring to Figure 2 the housing 10 includes an inner layer 151 and an outer layer 152, and a cooling flow channel 153 is disposed between the inner layer 151 and the outer layer 152. The cooling flow channel 153 is configured to introduce a coolant, and the coolant is used to cool the housing 10.
[0051] After the processing of the quartz glass is completed, it is necessary to cool down the housing 10. In this embodiment, the housing 10 is provided with a cooling flow channel 153, which can improve the cooling efficiency of the housing 10. Optionally, the coolant can be cooling water.
[0052] In this embodiment, the cooling channel 153 can be formed between the surface of the inner layer 151 and the surface of the outer layer 152, or a cooling pipe can be arranged between the inner layer 151 and the outer layer 152, and the cooling channel 153 is arranged inside the cooling pipe.
[0053] In this embodiment, referring to Figure 1 , the heating assembly 30 includes a bottom heating element 31 and a surrounding wall heating element 32. The bottom heating element 31 is arranged at the second open end 123, the surrounding wall heating element 32 surrounds the inner side of the furnace body 12, and the carrier 21 is arranged on the side of the bottom heating element 31 close to the first open end 122.
[0054] The bottom heating element 31 and the surrounding wall heating element 32 can form a relatively surrounding heating environment for the quartz glass ingot 200, thereby improving the heating efficiency of the quartz glass ingot 200.
[0055] Among them, the bottom heating element 31 can directly heat the bottom of the quartz glass ingot 200 through the carrier 21, and the surrounding wall heating element 32 can heat the side and top of the quartz glass ingot 200. In this way, the heat uniformity of the quartz glass ingot 200 can be ensured, so that the quartz glass ingot 200 can be uniformly extended, and the uniformity of the processed quartz glass is improved.
[0056] In this embodiment, referring to Figure 4 , the heating assembly 30 includes a metal braided mesh heating layer 30a.
[0057] Optionally, the metal of the metal braided mesh heating layer 30a is tungsten, which has good cleaning characteristics and will not generate particulate matter during long-term heating, thereby greatly reducing the amount of foreign matter in the receiving cavity 11 during the heating process, avoiding foreign matter splashing into the quartz glass ingot 200, and further greatly reducing the number of bubbles in the processed quartz glass, improving the production quality of the quartz glass.
[0058] In addition, the metal braided mesh heating layer 30a also has good strength and is not easy to stretch or deform after long-term heating use, so it has a long service life.
[0059] The metal braided structure in the figure is only an example, and the specific braided structure of the metal braided mesh heating layer 30a can be adjusted according to actual needs.
[0060] In this embodiment, referring to Figure 1 , the heat insulation assembly 40 includes a bottom heat insulation element 41 and a surrounding wall heat insulation element 42. The bottom heat insulation element 41 is arranged on the side of the bottom heating element 31 where the carrier 21 is located, and the surrounding wall heat insulation element 42 is arranged between the surrounding wall heating element 32 and the furnace body 12.
[0061] The bottom heat insulation member 41 can isolate the thermal radiation of the bottom heating member 31, and the sidewall heat insulation member 42 can isolate the thermal radiation of the sidewall heating member 32. In other embodiments, the heat insulation assembly 40 may further include an additional heat insulation member, and the heat insulation member is disposed at the second open end 123, so as to further improve the heat insulation effect.
[0062] In this embodiment, referring to Figure 3 , the heat insulation assembly 40 includes a plurality of reflective screens 40a, and the plurality of reflective screens 40a are stacked between the heating assembly 30 and the housing 10. The reflective screens 40a are used to reflect the thermal radiation in the receiving cavity 11.
[0063] Stacking the plurality of reflective screens 40a can improve the reflection effect on thermal radiation, so as to reduce the amount of thermal radiation transmitted to the housing 10, thereby improving the heat insulation effect of the heat insulation assembly 40.
[0064] In this embodiment, both the sidewall heat insulation member 42 and the bottom heat insulation member 41 include a plurality of reflective screens 40a.
[0065] Optionally, referring to Figure 3 , the number of the reflective screens 40a is not less than 12 layers to ensure the heat insulation effect of the heat insulation assembly 40. Specifically, when the temperature in the receiving cavity 11 reaches the range of 1800 °C to 2000 °C, after setting 12 layers of reflective screens 40a, the temperature of the housing 10 is not higher than 200 °C. In other embodiments, according to the actual heat insulation requirements, the number of the reflective screens 40a can also be adjusted adaptively.
[0066] Optionally, the thickness of the reflective screen 40a is 2 mm to 3 mm. In other embodiments, the thickness of the reflective screen 40a can also be adjusted adaptively according to the actual heat insulation requirements.
[0067] Optionally, the material of the reflective screen 40a can be set as tungsten or molybdenum, which has a good thermal radiation reflection effect.
[0068] In this embodiment, referring to Figure 1 , the non-contact temperature measurement assembly 50 includes a first temperature measurement member 51 and a second temperature measurement member 52. The first temperature measurement member 51 and the second temperature measurement member 52 are both disposed on the top cover 13. The first temperature measurement member 51 is used to detect the surface temperature of the object at the first open end 122, and the second temperature measurement member 52 is used to detect the surface temperature of the object at the inner surface of the furnace body 12.
[0069] By providing the first temperature measurement member 51 and the second temperature measurement member 52, the temperature measurement range of the non-contact temperature measurement assembly 50 can be improved, so as to further improve the temperature measurement accuracy of the quartz glass ingot 200 and reduce the temperature detection error. In other embodiments, the non-contact temperature measurement assembly may further include other numbers of temperature measurement members, for example, it may include three, four or more temperature measurement members.
[0070] In this embodiment, the non-contact temperature measurement component 50 includes an infrared thermometer 50a. The infrared thermometer 50a can stably implement non-contact temperature measurement.
[0071] In this embodiment, the maximum temperature measurement of the infrared thermometer 50a is not less than 2200°C, and the infrared wavelength range generated by the infrared thermometer 50a is between 5um and 8um.
[0072] In other embodiments, the non-contact temperature measurement component 50 can also be configured as an infrared thermal imager.
[0073] In this embodiment, see Figure 1 The carrier 21 includes a carrier base 211 and a carrier crucible 212. The carrier base 211 is connected to the driving member 22. The carrier crucible 212 is located on a side of the carrier base 211 away from the driving member 22, and is used to carry the quartz glass ingot 200.
[0074] Optionally, the thickness of the support base 211 ranges from 3 mm to 5 mm. For example, the thickness of the support base 211 can be any one of 3 mm, 3.5 mm, 4 mm, 4.5 mm, and 5 mm. In other embodiments, the thickness of the support base 211 can also be adjusted according to the actual processing requirements of the quartz glass.
[0075] Optionally, the thickness of the carrier crucible 212 ranges from 0.5 mm to 2 mm. For example, the thickness of the carrier crucible 212 can be any one of 0.5 mm, 1 mm, 1.5 mm, and 2 mm. In other embodiments, the thickness of the carrier crucible 212 can also be adjusted according to actual processing requirements of the quartz glass.
[0076] In this embodiment, by dividing the carrier 21 into two parts, it is convenient to replace different carrier crucibles 212 according to actual processing requirements.
[0077] Optionally, the surface of the carrier crucible 212 that supports the quartz glass ingot 200 may be a plane, a rectangular groove, an arc-shaped groove, or the like.
[0078] Optionally, the material of the supporting base 211 may be tungsten or molybdenum. The material of the carrier crucible 212 may be tungsten or molybdenum.
[0079] In this embodiment, see Figure 1 The driving member 22 includes a driving portion 222 and a connecting portion 221 . The connecting portion 221 is connected between the driving portion 222 and the supporting base 211 . The driving member 22 drives the supporting base 211 to rotate through the connecting portion 221 .
[0080] Optionally, the driving unit 222 may be configured as a motor.
[0081] In this embodiment, seeFigure 1 , a cooling channel 2211 is provided inside the connecting part 221. The cooling channel 2211 is used to introduce a coolant to lower the temperature of the connecting rod, so as to prevent the connecting part 221 from deforming in a high-temperature environment and improve the reliability of the driving part 222 to drive the carrier 21 to rotate through the connecting part 221. The shape of the cooling channel 2211 can be set according to actual needs. In this embodiment, the connecting part 221 can be set as a double-layer structure, and the cooling channel 2211 is defined between the inner layer 151 structure and the outer layer 152 structure.
[0082] Optionally, the material of the connecting part 221 can be set as stainless steel, which has relatively high strength.
[0083] In this embodiment, refer to Figure 1 , the connecting part 221 passes through the bottom cover 14. During actual processing, the bottom cover 14 can slide relative to the connecting part 221 to open the second open end 123 of the furnace body 12, so as to facilitate the operator to place the quartz glass bob 200.
[0084] In this embodiment, refer to Figure 1 , the quartz glass preparation device 100 further includes a direct temperature detector, and the direct temperature detector is used to connect to the heating component 30 to detect the temperature of the heating component 30. In this way, according to the preparation requirements in the quartz glass processing process, the detection data of the direct temperature detector and / or the detection data of the non-contact temperature measurement component 50 can be called to achieve the purpose of optimizing the processing flow of the quartz glass.
[0085] Optionally, refer to Figure 1 , the direct temperature detector includes a first thermocouple 63 and a second thermocouple 64. The first thermocouple 63 passes through the housing 10 and is connected to the bottom heating element 31 to realize the temperature detection of the bottom heating element 31. The second thermocouple 64 passes through the housing 10 and is connected to the wall heating element 32 to realize the temperature detection of the wall heating element 32.
[0086] Optionally, the material of the first thermocouple 63 can be set as tungsten or rhenium, and the material of the second thermocouple 64 can be set as tungsten or rhenium.
[0087] In other embodiments, the direct temperature detector can also be set as other contact temperature sensors.
[0088] The above embodiments are only used to illustrate the technical solutions of the present application and are not restrictive. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.
Claims
1. A quartz glass preparation device, characterized in that, include: a housing defining a sealed receiving cavity; A bearing assembly, the bearing assembly comprising a bearing member and a driving member, the bearing member being disposed in the receiving cavity and used to carry the quartz glass ingot, the driving member being connected to the bearing member and used to drive the bearing member to rotate around a rotation axis; A heating assembly is provided in the receiving cavity and outside the supporting assembly, and is used to heat the quartz glass ingot; A heat insulation component, the heat insulation component is arranged in the receiving cavity, and the heat insulation component is arranged outside the heating component; A non-contact temperature measurement component is provided in the housing and is used to detect the temperature of the surface of the quartz glass ingot and / or the temperature of the surface of the heating component.
2. The quartz glass preparation equipment according to claim 1, characterized in that: The heating assembly includes a metal woven mesh heating layer.
3. The quartz glass preparation equipment according to claim 1, characterized in that: The housing comprises: a furnace body, the furnace body defining a cavity with one end open, the bearing member being disposed in the cavity; The cover body is sealed and arranged on the open end of the furnace body so that the cavity forms a sealed receiving cavity.
4. The quartz glass preparation equipment according to claim 3, characterized in that: The heating assembly includes a bottom heating element and a surrounding wall heating element. The bottom heating element is arranged at the open end, the surrounding wall heating element is arranged around the inner side of the furnace body, and the supporting element is arranged on a side of the bottom heating element away from the open end.
5. The quartz glass preparation equipment according to claim 4, characterized in that: The heat insulation assembly includes a bottom heat insulation component and a surrounding wall heat insulation component. The bottom heat insulation component is arranged on a side of the bottom heating component away from the supporting component, and the surrounding wall heat insulation component is arranged between the surrounding wall heating component and the furnace body.
6. The quartz glass preparation equipment according to claim 3, characterized in that: The non-contact temperature measuring component includes a first temperature measuring component and a second temperature measuring component. The first temperature measuring component and the second temperature measuring component are both arranged on the furnace body. The first temperature measuring component is used to detect the surface temperature of the object at the open end, and the second temperature measuring component is used to detect the surface temperature of the object at the inner surface of the furnace body.
7. The quartz glass preparation equipment according to claim 1, characterized in that: The non-contact temperature measurement component includes an infrared thermometer.
8. The quartz glass preparation equipment according to claim 1, characterized in that: The carrier comprises: a bearing base connected to the driving member; A carrier crucible is provided on a side of the carrying base away from the driving member, and is used for carrying the quartz glass ingot.
9. The quartz glass preparation equipment according to claim 1, characterized in that: The shell includes an inner layer and an outer layer. A cooling channel is defined between the inner layer and the outer layer. The cooling channel is used to allow a coolant to flow in. The coolant is used to cool the shell.
10. The quartz glass preparation equipment according to claim 1, characterized in that: The heat insulation component includes a plurality of reflective screens, and the plurality of reflective screens are stacked between the heating component and the housing, and the reflective screens are used for reflecting the thermal radiation in the accommodation cavity.