Soldering flux removing mechanism, soldering flux coating device and welding strip feeding device

Abstract

The utility model discloses a scaling powder removing mechanism, a scaling powder coating device and a welding strip feeding device, and relates to the technical field of battery piece welding. The soldering flux removing mechanism comprises an adsorption block, the adsorption block is provided with a first side face, a second side face and a third side face, a plurality of vacuum ports are formed in the first side face, and airflow channels which correspond to the vacuum ports in a one-to-one mode and extend to the third side face from the second side face are formed in the adsorption block. Each airflow channel comprises an air inlet section close to the second side face and an air outlet section close to the third side face, and the aperture of the air inlet section is smaller than that of the air outlet section. The tail ends of the vacuum ports extend to the side faces of the corresponding air outlet sections and communicate with the air outlet sections. When high-pressure gas is introduced into the airflow channel from the starting end of the gas inlet section, the high-pressure gas can suck away air in the vacuum opening in the process of penetrating through the gas outlet section, then a very low vacuum degree is formed in the vacuum opening, and when the welding strip passes through the starting end of the vacuum opening in the moving process, redundant scaling powder on the welding strip can be sucked away from the vacuum opening.

Description

Technical Field

[0001] This application relates to the technical field of solar cell soldering, and particularly to a flux removing mechanism, a flux coating device, and a solder tape feeding device. Background Art

[0002] In order to ensure the soldering quality between solar cells and solder tapes, it is necessary to coat flux on the solder tapes first. The conventional flux coating method is to make the solder tape pass through a flux liquid tank during the traction process of the solder tape, so that the surface of the solder tape is wrapped with flux. However, there is a large amount of flux on the solder tape coming out of the liquid tank, which is likely to cause flux splashing during the subsequent solder tape transmission process, and flux crystallization or residue will also be formed on the solar cells, affecting the soldering quality. Summary of the Utility Model

[0003] This application aims to solve at least one of the technical problems existing in the prior art. Therefore, this application provides a flux removing mechanism, a flux coating device, and a solder tape feeding device to solve the problem that the excess flux on the solder tape affects the soldering quality in the prior art.

[0004] The objectives of this application can be achieved through the following technical solutions:

[0005] In a first aspect, this application provides a flux removing mechanism, including an adsorption block. The adsorption block has a first side, a second side, and a third side. A plurality of vacuum ports are provided on the first side. Air flow channels corresponding to each vacuum port one by one and extending from the second side to the third side are provided inside the adsorption block. Each air flow channel includes an air inlet section close to the second side and an air outlet section close to the third side, and the aperture of the air inlet section is smaller than that of the air outlet section. The end of the vacuum port extends to the side of the corresponding air outlet section and is communicated with the air outlet section.

[0006] By providing vacuum ports and air flow channels on the adsorption block, and setting the air flow channels to have a large-diameter air outlet section and a small-diameter air inlet section, and communicating the vacuum ports with the air outlet section from the side of the air outlet section, when high-pressure gas is introduced into the air flow channel from the start end of the air inlet section, the high-pressure gas can suck the air in the vacuum port during the process of passing through the air outlet section, thereby forming a very low vacuum degree in the vacuum port. When the solder tape passes through the start end of the vacuum port during movement, the excess flux on the solder tape can be sucked away from the vacuum port.

[0007] In an embodiment of the application: An adsorption groove is provided at the start end of each vacuum port, and the aperture of the adsorption groove is larger than that of the vacuum port.

[0008] By providing an adsorption groove at the start end of the vacuum port, the adsorption area of the vacuum port along the traveling direction of the solder tape to be processed is increased, the adsorption duration of the solder tape to be processed is extended, and the removal effect of the flux on the solder tape is enhanced.

[0009] In an embodiment of the application: In addition to the solder flux removing mechanism, it further includes a cover plate which is installed on one side of the first side surface of the adsorption block. There are a number of solder strip limiting grooves corresponding to a number of vacuum ports one by one between the cover plate and the adsorption block, and the number of solder strip limiting grooves are arranged on the cover plate and / or the adsorption block.

[0010] By setting the solder strip limiting grooves to guide the movement of the solder strip to be processed, the solder strip to be processed can move along a preset direction.

[0011] In an embodiment of the application: A sponge is press-fitted between the cover plate and the first side surface of the adsorption block, and the sponge covers each vacuum port. When the solder flux removing mechanism works, the solder strip passes through between the sponge and the vacuum port.

[0012] By setting the sponge, the solder flux on the solder strip is further adsorbed, enhancing the ability of the solder flux removing mechanism to remove the solder flux.

[0013] In an embodiment of the application: A sponge installation groove adapted to the sponge is opened on the cover plate and / or the adsorption block.

[0014] By setting the sponge installation groove, it is convenient for the loading and unloading of the sponge.

[0015] In an embodiment of the application: A number of vacuum ports are all arranged at the bottom of the sponge installation groove, and a number of solder strip limiting grooves all include a first solder strip limiting groove and a second solder strip limiting groove respectively arranged on both sides of the sponge installation groove.

[0016] A specific design style of the solder strip limiting groove is provided, with a simple structure and convenient for processing and manufacturing.

[0017] In an embodiment of the application: The cover plate and the adsorption block are adsorbed and connected by a magnet.

[0018] By setting the cover plate and the adsorption block to be magnetically fixed, it is convenient for the loading and unloading between the cover plate and the adsorption block.

[0019] In an embodiment of the application: A baffle is installed on the adsorption block on one side of the third side surface. There is a diversion cavity between the baffle and the third side surface. The air outlet sections of each air flow channel are all communicated with the diversion cavity, and the diversion cavity is used for diverting the solder flux ejected from the air outlet section towards a preset direction;

[0020] Or,

[0021] A drainage pipe communicated with the air outlet sections of each air flow channel is installed on the adsorption block, and the drainage pipe is used for diverting the solder flux ejected from the air outlet section towards a preset direction.

[0022] By setting the diversion cavity or the drainage pipe, the adsorbed solder flux can be diverted to a preset position, facilitating the collection of the adsorbed solder flux.

[0023] In one embodiment of the application: A side plate is hermetically connected to the second side surface, a gas collecting groove is formed between the side plate and the second side surface, the starting ends of the intake sections are all communicated with the gas collecting groove, an air inlet communicated with the gas collecting groove is formed on the side plate, and the air inlet is communicated with an external high-pressure gas source;

[0024] Or,

[0025] An intake pipe communicated with the intake sections of the air flow channels is installed on the adsorption block, and the intake pipe is communicated with an external high-pressure gas source.

[0026] Two specific ways of supplying gas to the air flow channels are provided. By arranging the gas collecting groove, the air flow channels are centrally supplied with gas through the gas collecting groove, and the structure is simple and convenient for processing and manufacturing; by arranging the intake pipes respectively communicated with the air flow channels, separate gas supply to each air flow channel can be realized, which is convenient for realizing targeted gas volume adjustment.

[0027] In a second aspect, the present application provides a flux coating device for coating flux on a solder tape, including a flux liquid tank and the flux removing mechanism as described above, and the flux removing mechanism is arranged in the flux liquid tank and close to the outlet end of the flux liquid tank.

[0028] By using the flux coating device provided by the present application, the solder tape to be processed can be coated with flux while the excess flux on the solder tape to be processed can be adsorbed, avoiding the influence of the excess flux on the solder tape to be processed on the subsequent welding quality.

[0029] In a third aspect, the present application provides a solder tape feeding device, including a solder tape reel, a coating mechanism, the flux removing mechanism as described above, and a solder tape traction mechanism, wherein:

[0030] The solder tape reel is used to provide a plurality of solder tapes;

[0031] The solder tape traction mechanism is used to clamp the ends of the solder tapes and traction the solder tapes, so that the solder tapes pass through the coating mechanism and the flux removing mechanism in sequence;

[0032] The coating mechanism is used to coat flux on the solder tapes;

[0033] The flux removing mechanism is used to adsorb the excess flux on the solder tapes.

[0034] During the process of feeding the solder tape by using the solder tape feeding device provided by the present application, the flux removing mechanism can suck away the excess flux on the solder tape to be processed, avoiding flux splashing during the transmission of the solder tape to be processed, or forming flux crystallization or residue on the battery chip, which affects the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The following further describes the present application with reference to the drawings.

[0036] Figure 1 is a perspective view of the flux removing mechanism in an embodiment of the present application;

[0037] Figure 2 is a top view of the flux removing mechanism in an embodiment of the present application;

[0038] Figure 3 is Figure 2 a cross-sectional view taken along B-B in

[0039] Figure 4 is Figure 3 a cross-sectional view taken along C-C in

[0040] Figure 5 is a perspective view of the adsorption block in an embodiment of the present application;

[0041] Figure 6 is a perspective view of the cover plate in an embodiment of the present application;

[0042] Figure 7 is a perspective view of the flux coating device in an embodiment of the present application.

[0043] Explanation of reference numerals:

[0044] 10. Adsorption block; 101. Vacuum port; 1011. Adsorption groove; 102. Air flow channel; 1021. Intake section; 1022. Outlet section; 103. First side; 104. Second side; 105. Third side; 11. Cover plate; 12. Solder tape limiting groove; 121. First solder tape limiting groove; 122. Second solder tape limiting groove; 13. Sponge; 14. Sponge installation groove; 15. Side plate; 151. Intake port; 16. Air collecting groove; 17. Intake joint; 18. Sealing ring; 19. Baffle; 20. Diversion cavity; 21. Magnet; 100. Flux removing mechanism; 200. Flux coating device; 300. Flux liquid tank; 400. Solder tape. Detailed implementation manners

[0045] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0046] As Figures 1-4As shown in the figure, an embodiment of the present application is a flux removing mechanism 100, which includes an adsorption block 10. The adsorption block 10 is generally rectangular parallelepiped. The adsorption block 10 has a first side surface 103 at the top and second side surfaces 104 and third side surfaces 105 that are located on both sides and are oppositely arranged. A plurality of vacuum ports 101 are formed on the first side surface 103. The plurality of vacuum ports 101 are arranged at equal intervals along the length direction of the adsorption block 10. The number of the vacuum ports 101 is the same as the number of the solder tapes 400 to be processed and their positions correspond one by one. An air flow channel 102 that corresponds to each vacuum port 101 one by one and extends from the second side surface 104 to the third side surface 105 is formed inside the adsorption block 10. Among them, each air flow channel 102 includes an air inlet section 1021 close to the second side surface 104 and an air outlet section 1022 close to the third side surface 105. The air inlet section 1021 and the air outlet section 1022 are coaxially arranged, and the aperture of the air inlet section 1021 is smaller than the aperture of the air outlet section 1022. The end of the vacuum port 101 extends to the side surface of the corresponding air outlet section 1022 and is communicated with the air outlet section 1022. When high-pressure gas is introduced into the air flow channel 102 from the starting end of the air inlet section 1021, the high-pressure gas passes through the air inlet section 1021 and then enters the air outlet section 1022, and flows out from the end of the air outlet section 1022. When the high-pressure gas passes through the air outlet section 1022, the air in the vacuum port 101 is sucked away, so that a very low vacuum degree is formed in the vacuum port 101. When the solder tape 400 passes through the starting end of the vacuum port 101 during movement, the excess flux on it can be sucked away.

[0047] In one embodiment, as Figure 3 and Figure 5 shown, an adsorption groove 1011 is provided at the starting end of each vacuum port 101. Along the advancing direction of the solder tape 400 to be processed (such as Figure 2 the direction indicated by the arrow in the figure), the caliber of the adsorption groove 1011 is larger than that of the vacuum port 101. Through the setting of the adsorption groove 1011, the adsorption area of the vacuum port 101 for the solder tape 400 to be processed is increased, and the time duration for the solder tape 400 to be processed to pass through the adsorption area formed by the vacuum port 101 is extended, thereby increasing the removal effect of the flux on the solder tape 400.

[0048] In one embodiment, as Figure 1 、 Figure 4 and Figure 5As shown, in addition to the flux removing mechanism 100, it further includes a cover plate 11. The cover plate 11 is generally in the shape of a rectangular plate. The cover plate 11 is installed on the first side 103 of the adsorption block 10 and covers the first side 103. There are a number of solder strip limiting grooves 12 corresponding one-to-one with a number of vacuum ports 101 between the cover plate 11 and the adsorption block 10. The number of solder strip limiting grooves 12 is provided on the cover plate 11 and / or the adsorption block 10. Optionally, each solder strip limiting groove 12 is formed by the cover plate 11 and the adsorption block 10 being closed, and is provided on both the cover plate 11 and the adsorption block 10. The solder strip 400 to be processed passes through the corresponding solder strip limiting groove 12 during the traveling process, so that each solder strip limiting groove 12 guides the movement of the corresponding solder strip 400 to be processed, and further enables the solder strip 400 to be processed to move along a preset direction.

[0049] In one embodiment, as Figure 3 and Figure 4 shown, a sponge 13 is press-fitted between the cover plate 11 and the first side 103 of the adsorption block 10. The sponge 13 covers each vacuum port 101. When the flux removing mechanism 100 works, the solder strip 400 passes through between the sponge 13 and the vacuum port 101. The sponge 13 can further adsorb the flux on the solder strip 400, enhancing the ability of the flux removing mechanism 100 to remove the flux.

[0050] In one embodiment, as Figure 5 and Figure 6 shown, a sponge installation groove 14 adapted to the sponge 13 is provided on the cover plate 11 and / or the adsorption block 10. Optionally, the sponge installation groove 14 is formed by the cover plate 11 and the adsorption block 10 being closed, and is provided on both the cover plate 11 and the adsorption block 10. The sponge 13 is assembled in the sponge installation groove 14 to fix the sponge 13.

[0051] Furthermore, the sponge installation groove 14 is arranged along the length direction of the adsorption block 10. Each vacuum port 101 is provided at the bottom of the sponge installation groove 14. Each solder strip limiting groove 12 includes a first solder strip limiting groove 121 and a second solder strip limiting groove 122 respectively provided on both sides of the sponge installation groove 14. The solder strip 400 to be processed penetrates into the flux removing mechanism 100 from the first solder strip limiting groove 121, passes through between the sponge 13 and the vacuum port 101, and then exits from the second solder strip limiting groove 122 out of the flux removing mechanism 100.

[0052] In one embodiment, as Figure 4 shown, for the convenience of loading and unloading between the cover plate 11 and the adsorption block 10, the cover plate 11 and the adsorption block 10 are adsorbed and connected by magnets 21. Among them, magnets 21 are provided at both ends of the side surface of the cover plate 11 close to the adsorption block 10. The cover plate 11 is adsorbed and fixed on the first side 103 of the adsorption block 10 through the magnets 21 provided at both ends. Optionally, the number of magnets 21 can be selectively set according to the actual size of the cover plate 11 and the required adsorption strength.

[0053] In some other embodiments, the cover plate 11 and the adsorption block 10 can also be screwed together by screws or other common detachable connection means.

[0054] In one embodiment, as Figure 1 and Figure 4 shown, a side plate 15 is covered on the second side surface 104 of the adsorption block 10, and a gas collecting groove 16 is formed between the side plate 15 and the second side surface 104. Optionally, the gas collecting groove 16 is formed on the second side surface 104 of the adsorption block 10. A sealing ring 18 is arranged outside the gas collecting groove 16, and the side plate 15 and the second side surface 104 of the adsorption block 10 are hermetically connected through the sealing ring 18. The starting ends of the respective intake sections 1021 are all communicated with the gas collecting groove 16, and an air inlet 151 communicated with the gas collecting groove 16 is formed on the side plate 15. The number of the air inlets 151 can be specifically set according to actual conditions. An intake joint 17 is installed on each air inlet 151. The external high-pressure gas source is docked with the intake joint 17 and then communicated with the air inlet 151. The high-pressure gas source introduces high-pressure gas into the gas collecting groove 16 through the air inlet 151, and the high-pressure gas is then diverted from the gas collecting groove 16 into the respective air flow channels 102. The high-pressure gas forms a negative pressure in each vacuum port 101 during the process of passing through the respective air flow channels 102, so that each vacuum port 101 can suck the redundant flux on the corresponding solder strip 400 to be processed.

[0055] It should be noted that, in another embodiment, an intake pipe (not shown) communicated with the intake sections 1021 of the respective air flow channels 102 can also be installed on the adsorption block 10, so that the high-pressure gas source is directly communicated with the intake sections 1021 of the respective air flow channels 102 through the respective intake pipes.

[0056] In one embodiment, as Figure 1 and Figure 3 shown, a baffle 19 is installed on the adsorption block 10 on one side of the third side surface 105 of the adsorption block 10. A diversion cavity 20 is arranged between the baffle 19 and the third side surface 105. The outlet sections 1022 of the respective air flow channels 102 are all communicated with the diversion cavity 20. The diversion cavity 20 is used for diverting the flux ejected from the outlet sections 1022 of the respective air flow channels 102 towards a preset direction (such as Figure 3 the downward direction shown), so that the flux ejected from the outlet sections 1022 of the respective air flow channels 102 can be centrally diverted, facilitating subsequent collection of the diverted flux. It should be noted that, in another embodiment, a diversion pipe communicated with the outlet sections 1022 of the respective air flow channels 102 can also be installed on the adsorption block 10, so that the respective diversion pipes (not shown) divert the flux ejected from the corresponding air flow channels 102 towards the preset direction one by one.

[0057] As Figure 7As shown in the figure, the present application further provides a flux coating device 200 for applying flux to the solder tape 400, which includes a flux liquid tank 300 and the flux removing mechanism 100 as described above. The flux removing mechanism 100 is disposed in the flux liquid tank 300 and near the outlet end of the flux liquid tank 300.

[0058] During use, the flux liquid tank 300 is filled with flux. When the solder tape is moving, it first passes through the flux, so that a layer of flux is wrapped on the surface of the solder tape 400, and then it enters the flux removing mechanism 100 to suck away the excess flux.

[0059] Through the flux coating device 200 provided by the present application, the solder tape 400 to be processed can be coated with flux while the excess flux on the solder tape 400 to be processed can be adsorbed, avoiding the influence of the excess flux on the solder tape 400 to be processed on the subsequent welding quality. And by disposing the flux removing mechanism 100 in the flux liquid tank 300 and near the outlet end of the flux liquid tank 300, it is convenient for the flux removing mechanism 100 to guide the excess flux adsorbed from the solder tape 400 to be processed back to the flux liquid tank 300.

[0060] The present application further provides a solder tape feeding device, which includes a solder tape reel (not shown), a coating mechanism, the flux removing mechanism 100 as described above, and a solder tape traction mechanism (not shown), wherein:

[0061] The solder tape reel is used to provide a plurality of solder tapes 400;

[0062] The solder tape traction mechanism is used to clamp the ends of the solder tapes 400 and traction the solder tapes 400, so that the solder tapes 400 pass through the coating mechanism and the flux removing mechanism 100 in sequence;

[0063] The coating mechanism is used to apply flux to each solder tape 400;

[0064] The flux removing mechanism 100 is used to adsorb the excess flux on each solder tape 400.

[0065] Among them, the flux removing mechanism 100 can be located inside or outside the flux liquid tank 300.

[0066] Through the solder tape feeding device provided by the present application, it can be used to supply the solder tapes 400 coated with flux to a battery string welding device (not shown), and during the process of supplying the solder tapes 400, the excess flux on the solder tapes 400 can be sucked away by the flux removing mechanism 100, avoiding the flux splashing during the transmission of the solder tapes 400 to be processed, or forming flux crystallization or residue on the battery chips, which affects the welding quality.

[0067] The above has described in detail an embodiment of the present application. However, the above content is only a preferred embodiment of the present application and should not be considered as limiting the scope of implementation of the present application. Any equivalent changes and improvements made within the scope of the application of the present application should still fall within the scope covered by the patent of the present application.

[0068] It should be noted that the "first", "second" and similar terms used in the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. The descriptions of directions such as "left", "right", "left side", "right side", "upper part", "lower part", "top", "bottom" in the present application are all defined based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the described structure must be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. In the description of the present application, the meaning of "a plurality of" is more than two, unless otherwise specifically defined.

[0069] In the description of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

Claims

1. A flux removing mechanism, characterized in that, It includes an adsorption block which has a first side, a second side and a third side. A number of vacuum ports are provided on the first side. Air flow channels corresponding to each of the vacuum ports one by one and extending from the second side to the third side are provided inside the adsorption block. Wherein, each of the air flow channels includes an air inlet section close to the second side and an air outlet section close to the third side, and the aperture of the air inlet section is smaller than that of the air outlet section. The end of the vacuum port extends to the side of the corresponding air outlet section and is communicated with the air outlet section.

2. The flux removing mechanism according to claim 1, wherein An adsorption groove is provided at the starting end of each of the vacuum ports, and the diameter of the adsorption groove is larger than that of the vacuum port.

3. The flux removing mechanism according to claim 1, characterized in that, The flux removing mechanism further includes a cover plate which is installed on one side of the first side of the adsorption block. A number of solder strip limiting grooves corresponding to the number of the vacuum ports one by one are provided between the cover plate and the adsorption block, and the number of the solder strip limiting grooves is provided on the cover plate and / or the adsorption block.

4. The flux-removing mechanism according to claim 3, characterized in that, A sponge is press-fitted between the cover plate and the first side of the adsorption block, and the sponge covers each of the vacuum ports. When the flux removing mechanism works, the solder strip passes through between the sponge and the vacuum port.

5. The flux removal mechanism according to claim 4, wherein, A sponge installation groove adapted to the sponge is provided on the cover plate and / or the adsorption block.

6. The flux removing mechanism according to claim 5, wherein, A number of the vacuum ports are all provided at the bottom of the sponge installation groove. A number of the solder strip limiting grooves all include a first solder strip limiting groove and a second solder strip limiting groove respectively provided on both sides of the sponge installation groove.

7. The flux removing mechanism according to claim 3, characterized in that, The cover plate and the adsorption block are adsorbed and connected by a magnet.

8. The flux removing mechanism according to claim 1, wherein, A baffle is installed on one side of the third side of the adsorption block. A diversion cavity is provided between the baffle and the third side. The air outlet sections of each of the air flow channels are all communicated with the diversion cavity, and the diversion cavity is used for diverting the flux ejected from the air outlet section towards a preset direction; Or, A drainage pipe communicated with the air outlet sections of each of the air flow channels is installed on the adsorption block, and the drainage pipe is used for diverting the flux ejected from the air outlet section towards a preset direction.

9. A flux removing mechanism according to any one of claims 1 to 8, characterized in that, A side plate is hermetically connected to the second side. An air collecting groove is provided between the side plate and the second side. The starting ends of each of the air inlet sections are all communicated with the air collecting groove. An air inlet communicated with the air collecting groove is provided on the side plate, and the air inlet is communicated with an external high-pressure air source; Or, An air inlet pipe communicated with the air inlet sections of each of the air flow channels is installed on the adsorption block, and the air inlet pipe is communicated with an external high-pressure air source.

10. A flux coating device for applying flux to a solder strip, characterized in that, It includes a flux liquid tank and the flux removing mechanism according to any one of claims 1 to 9, and the flux removing mechanism is arranged in the flux liquid tank and close to the outlet end of the flux liquid tank.

11. A solder tape feeding device, characterized in that, It includes a solder strip coil, a coating mechanism, the flux removing mechanism according to any one of claims 1 to 9 and a solder strip traction mechanism, wherein: The solder strip coil is used for providing a number of solder strips; The solder strip traction mechanism is used for clamping the ends of each of the solder strips and traction the solder strips to make the solder strips pass through the coating mechanism and the flux removing mechanism in sequence; The coating mechanism is used for coating flux on each solder strip; The solder flux removing mechanism is used to adsorb the excess solder flux on each of the solder tapes.

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