Novel notebook computer foot pad

Abstract

The utility model provides a novel notebook computer foot pad which comprises a lower cover aluminum sheet, the lower cover aluminum sheet comprises an upper cover and a lower cover, the upper cover and the lower cover are installed together, the root portion of an inner foot pad penetrates through a punched hole formed in the upper cover in a penetrating mode and penetrates into the upper cover, and the head portion of the inner foot pad protrudes outwards. Lip gluing surfaces arranged on two sides of the root part of the inner foot pad are glued with the inner wall of the upper cover; punching is used for replacing punching of convex hulls, the die structure is simplified, the yield and production efficiency are improved, the stability of the inner foot pad lip gluing face is enhanced, assembling is convenient, the service life is prolonged, the strength and durability of the foot pad are enhanced through the bijection integrated forming technology, loosening and falling are avoided, the heat dissipation module heat pipes are optimized in layout, the heat dissipation efficiency is improved, space is saved, and cost is reduced. The light and thin design is assisted, finally, the height difference is remarkably reduced through structural optimization of the foot pad, portability and attractiveness are improved, and the light and thin requirements of the market are met.

Description

Technical Field

[0001] The utility model belongs to the technical field of laptop feet, and particularly relates to a new type of laptop footpad. Background Art

[0002] In the laptop manufacturing industry, in order to balance anti-slip, shock absorption and heat dissipation performance, traditional designs often layout the footpad structure on the aluminum skin of the laptop's lower cover. As Figures 4-5 shown, this traditional design directly shapes the footpad boss A on the aluminum skin of the lower cover through complex stamping processes and precision die technologies. Subsequently, heat capacity holes C are formed using punching technologies to ensure that the footpad B can be firmly and stably fixed to the boss by hot melting. However, this process flow not only increases the complexity of the production line but also brings multiple challenges in material processing.

[0003] It is particularly noteworthy that there is a significant 5.4 - millimeter height difference between the outer surface of the aluminum skin of the lower cover and the footpad B in the traditional design. This design feature to a certain extent restricts the further reduction of the overall thickness of the laptop. In today's pursuit of product thinness and portability, such a design has become one of the restrictive factors. If one wants to reduce the overall thickness of the machine, the traditional approach is often to sacrifice the wall thickness of the main components (such as the four major outer shell parts) to reduce weight, but this will undoubtedly weaken the strength and durability of the structure; or compress the heat dissipation space, which may affect the stable operation and performance of the system.

[0004] Therefore, it is very necessary to invent a new type of laptop footpad. Content of the Utility Model

[0005] To solve the above - mentioned technical problems, the utility model provides a new type of laptop footpad, including the aluminum skin of the lower cover. The aluminum skin of the lower cover includes an upper cover and a lower cover, which are installed together. The root of the inner footpad passes through the punching holes formed through the upper cover and penetrates into the upper cover. The head of the inner footpad protrudes outside, and the lip gluing surfaces provided on both sides of the root of the inner footpad are glued to the inner wall of the upper cover.

[0006] Preferably, a heat dissipation module heat pipe is installed inside between the upper cover and the lower cover. The heat dissipation module heat pipe is located below the punching hole and is hidden directly below the inner footpad.

[0007] Preferably, an outer footpad is integrally provided on the outer surface of the head of the inner footpad protruding outside the upper cover. The inner footpad and the outer footpad are integrally formed by double - shot molding.

[0008] Preferably, the cross - section of the inner footpad is a "convex" - shaped structure, and the cross - section of the outer footpad provided on its outside is an inverted "U" - shaped structure.

[0009] Preferably, the height difference between the outer surfaces of the outer foot pad and the upper cover that are parallel to each other is not greater than 4.10 mm.

[0010] Preferably, the punching holes penetrating through the upper cover are rectangular through holes.

[0011] Compared with the prior art, the present utility model has the following beneficial effects:

[0012] In the present utility model, the die design of the lower cover aluminum skin is changed from the traditional convex package punching to punching. This change not only simplifies the die structure and reduces the complexity of die manufacturing, but also significantly improves the qualified rate in the production process. The punching process is more direct and accurate than the convex package punching, reducing the possibility of material deformation and error accumulation, thereby improving production efficiency and product quality.

[0013] In the present utility model, the inner foot pad is tightly glued to the inner wall of the upper cover through the lip glue joint surfaces provided on both sides of its root. This design makes the assembly process of the foot pad more convenient and efficient. At the same time, the lip structure increases the contact area between the foot pad and the upper cover, improves the stability of gluing, ensures that the foot pad is not easily detached during use, and extends the service life of the product.

[0014] The inner foot pad and the outer foot pad of the present utility model adopt the double-shot integral molding technology, which not only realizes the compactness and beauty of the structure, but also enhances the overall strength and durability of the foot pad. The double-shot molding technology can ensure the tight combination between the inner foot pad and the outer foot pad, avoiding the possible loosening or detachment problems of the traditional split foot pads, and further improving the reliability of the product.

[0015] The heat pipe of the heat dissipation module of the present utility model is cleverly designed under the foot pad area and hidden directly under the foot pad. This layout not only makes full use of the space of the lower cover aluminum skin, but also optimizes the heat dissipation path. The heat pipe can more effectively conduct the heat inside the notebook to the outside, improving the heat dissipation efficiency. At the same time, due to the design of the heat pipe position, the wall thickness space of the lower cover aluminum skin is saved, providing more possibilities for the thin and light design of the notebook computer.

[0016] By optimizing the foot pad structure and the layout of the heat dissipation module, the present utility model successfully controls the height difference between the outer surfaces of the outer foot pad and the upper cover within 4.10 mm, which is significantly reduced by 1.3 mm compared with the traditional design. This improvement helps to reduce the overall thickness of the notebook computer, improve the portability and beauty of the product, and meet the market demand for thin and light products. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic cross-sectional structure diagram of the present utility model.

[0018] Figure 2It is a schematic explosion structure diagram of the present utility model.

[0019] Figure 3 It is a schematic overall structure diagram of the present utility model.

[0020] Figure 4 It is a schematic explosion structure diagram of the foot pad in a prior art notebook computer.

[0021] Figure 5 It is a schematic cross-sectional structure diagram of the foot pad in a prior art notebook computer.

[0022] In the figure:

[0023] Lower cover aluminum skin 1, upper cover 11, lower cover 12, inner foot pad 2, punching 3, lip gluing surface 4, outer foot pad 5, heat dissipation module heat pipe 6. Specific embodiments

[0024] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0025] In the description of the embodiments, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In the description of the utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0026] Embodiment 1:

[0027] As shown in the appendix Figure 1 To the appendix Figure 3As shown in the figure: A new type of laptop foot pad provided by the utility model includes an aluminum skin for the lower cover 1, and the aluminum skin for the lower cover 1 includes an upper cover 11 and a lower cover 12, which are installed together. Among them, the root of the inner foot pad 2 passes through the punching hole 3 opened through the upper cover 11 and penetrates into the upper cover 11, and the head of the inner foot pad 2 protrudes outward. The lip gluing surfaces 4 provided on both sides of the root of the inner foot pad 2 are glued to the inner wall of the upper cover 11.

[0028] Furthermore, to optimize its heat dissipation performance, a heat dissipation module heat pipe 6 is ingeniously installed in the internal space between the upper cover 11 and the lower cover 12. This heat pipe is located below the punching hole 3 and is ingeniously hidden directly below the inner foot pad 2. This layout not only makes full use of the space inside the aluminum skin for the lower cover 1 but also ensures that the heat dissipation module heat pipe 6 can efficiently conduct the heat generated inside the laptop to the outside, thereby improving the overall heat dissipation efficiency. At the same time, due to the position design of the heat dissipation module heat pipe 6, it also saves valuable space for the wall thickness space of the aluminum skin for the lower cover 1, providing more possibilities for the thin and light design of the laptop.

[0029] Furthermore, the inner foot pad 2 and the outer foot pad 5 adopt a double-shot one-piece molding technology. This technology enables the outer surface of the part of the inner foot pad 2 protruding from the upper cover 11 to be directly integrally provided with the outer foot pad 5. The combination between the inner foot pad 2 and the outer foot pad 5 is tight and firm, avoiding the possible loosening or falling off problems of traditional split foot pads. At the same time, the double-shot one-piece molding also gives the foot pad a more beautiful and compact appearance, enhancing the overall texture of the product.

[0030] Furthermore, to further improve the stability and durability of the foot pad, the cross-sectional structures of the inner foot pad 2 and the outer foot pad 5 are carefully designed. The cross-section of the inner foot pad 2 presents a "convex" shape structure. This design not only enhances the supporting force of the foot pad but also enables it to be more firmly installed on the upper cover 11. The cross-section of the outer foot pad 5 is designed as an inverted "U" shape structure. This design not only forms a good complement with the inner foot pad 2 but also increases the contact area between the foot pad and the desktop, enhancing the anti-slip effect.

[0031] Furthermore, to meet the market demand for thin and light products, the design precisely controls the height difference between the outer surface of the outer foot pad 5 and the upper cover 11. By optimizing the foot pad structure and the heat dissipation module layout, this height difference is successfully controlled within a range not greater than 4.10 mm. This improvement not only significantly reduces the overall thickness of the laptop but also enhances the portability and aesthetics of the product, making it more competitive in the market.

[0032] Further, to ensure that the inner foot pad 2 can smoothly pass through the upper cover 11 and be tightly connected to the structure inside the lower cover aluminum skin, a rectangular through-hole 3 is drilled through the upper cover 11 in this design. The punching of this shape not only facilitates processing and production but also ensures the accuracy and stability of the foot pad installation. At the same time, the design of the rectangular through-hole 3 also takes into account the heat dissipation performance requirements, enabling heat to be more smoothly conducted to the outside through the punching area.

[0033] Example 2:

[0034] As shown in the attached Figure 1 to the attached Figure 3 figures: This Example 2 is a processing flow and technology provided based on the content of Example 1: Use a stamping machine to stamp the raw material of the lower cover aluminum skin 1 into the shapes of the upper cover 11 and the lower cover 12, and stamp a rectangular through-hole 3 on the upper cover 11. Perform surface treatment on the lower cover aluminum skin 1, such as deburring, cleaning, and drying, to ensure the surface is flat and smooth.

[0035] Precisely install the heat pipe 6 of the heat dissipation module inside the inner space of the lower cover aluminum skin 1 and fix it with a fixing bracket to ensure that the heat pipe is located below the through-hole 3 and hidden directly below the inner foot pad 2.

[0036] Use the double-shot one-piece molding technology to integrally mold the inner foot pad 2 and the outer foot pad 5. In this step, it is necessary to ensure that the root of the inner foot pad 2 is designed with a lip gluing surface 4 for subsequent gluing to the upper cover 11.

[0037] The molded foot pads need to be subjected to quality inspections, including checks on dimensions, appearance, and strength.

[0038] Pass the root of the inner foot pad 2 through the through-hole 3 of the upper cover 11 and ensure that it completely penetrates into the upper cover 11. Use special glue or bonding processes such as heat fusion to tightly bond the lip gluing surfaces 4 on both sides of the root of the inner foot pad 2 to the inner wall of the upper cover 11 to ensure that the foot pad is stable and does not fall off.

[0039] Install the upper cover 11 with the installed foot pads and the lower cover 12 together to form a complete lower cover aluminum skin structure. Conduct a final quality inspection on the entire structure, including tests on heat dissipation performance, stability, and aesthetics. After ensuring that all components meet the design requirements, carry out packaging and warehousing preparations for shipment.

[0040] The production process flow or processing flow of Example 2 is a general description, and in actual production, it needs to be adjusted and optimized according to specific circumstances. For example, quality control and inspection between steps, selection and debugging of equipment, control of the production environment, etc. all need to be carefully planned and implemented according to actual situations.

[0041] Any technical solution that makes use of the technical solution of the present utility model, or any technical solution designed by those skilled in the art inspired by the technical solution of the present utility model and achieving the above technical effects, shall fall within the protection scope of the present utility model.

Claims

1. A new type of laptop foot pad, characterized in that, It includes a lower cover aluminum sheet (1), and the lower cover aluminum sheet (1) includes an upper cover (11) and a lower cover (12), which are installed together. The root of the inner foot pad (2) passes through the punching hole (3) penetratingly opened in the upper cover (11) and penetrates into the upper cover (11), while the head of the inner foot pad (2) protrudes outside. The lip gluing surfaces (4) provided on both sides of the root of the inner foot pad (2) are glued to the inner wall of the upper cover (11).

2. The novel laptop foot pad according to claim 1, characterized in that: A heat dissipation module heat pipe (6) is installed inside between the upper cover (11) and the lower cover (12). The heat dissipation module heat pipe (6) is located below the punching hole (3) and is hidden directly below the inner foot pad (2).

3. The novel laptop foot pad according to claim 1, characterized in that: An outer foot pad (5) is integrally provided on the outer surface of the head of the inner foot pad (2) protruding outside the upper cover (11). The inner foot pad (2) and the outer foot pad (5) are integrally formed by double injection molding.

4. The novel laptop foot pad according to claim 3, characterized in that: The cross section of the inner foot pad (2) is a "convex" - shaped structure, and the cross section of the outer foot pad (5) provided on its outside is an inverted "U" - shaped structure.

5. The novel laptop foot pad according to claim 4, characterized in that: The height difference between the mutually parallel outer surfaces of the outer foot pad (5) and the upper cover (11) is not greater than 4.10 millimeters.

6. The novel laptop foot pad according to claim 2, characterized in that: The punching hole (3) penetratingly opened in the upper cover (11) is a rectangular through - hole.

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