Full screen module

Abstract

According to the full screen module, the IC is welded to the FPC, the FPC is directly bound and attached to the single-layer non-display area, compared with the traditional technology that the IC and the FPC are sequentially bound to the single-layer non-display area from top to bottom, the single-layer non-display area of the module can be narrower, the proportion of the display area is increased, the full screen can be made to be more extremely, and the display effect is better. And moreover, the FPC is bound in the single-layer non-display area after the IC is welded on the FPC, so that the trouble of multiple times of counterpoint binding in the single-layer non-display area is reduced.

Description

Technical Field

[0001] The utility model relates to a full-screen module, in particular to a full-screen module with an increased screen-to-body ratio. Background Art

[0002] With the improvement of living standards, the competition of products is becoming increasingly fierce, and the appearance requirements for display screens are also getting higher and higher. Nowadays, terminal manufacturers all hope to increase the screen-to-body ratio of products according to market demands, and such products require the use of display modules with ultra-narrow borders. For full-screen displays, it is even more desirable to reduce the border to the limit. However, for such display modules, the border is difficult to reduce due to the binding size and position of the driving IC and FPC. Currently, the FPC binding position in the conventional display module of this type is designed below the driving IC. However, this connection method increases the area of the non-display region, resulting in a reduced screen ratio. Summary of the Utility Model

[0003] An object of the utility model is to overcome the deficiencies in the prior art and provide a full-screen module that further increases the screen-to-body ratio.

[0004] The object of the utility model is achieved by the following technical solutions:

[0005] A full-screen module includes a full-screen body, an IC, and an FPC. The full-screen body includes an upper glass and a lower glass. The upper glass and the lower glass are adhered to each other. The lower glass is larger than the upper glass. The FPC is bound to the side of the adhesion surface of the lower glass and the upper glass, which is larger than the single-layer non-display area of the upper glass. The IC is fixedly connected to the FPC.

[0006] As a preferred solution of the utility model, the FPC is bound to the lower glass through anisotropic conductive adhesive.

[0007] As a preferred solution of the utility model, ITO metal traces are provided on the full-screen body and are electrically connected to the FPC.

[0008] As a preferred solution of the utility model, the IC is an SMT high-integration IC, or a combination of a low-integration IC and a bare chip.

[0009] As a preferred solution of the utility model, the IC is connected to the FPC by welding.

[0010] A welding area is provided at the FPC near the adhesion step of the upper and lower glasses. The welding area includes a substrate and a solder pad, and there is at least one welding area.

[0011] As a preferred embodiment of the present utility model, before welding, the attachment surface of the IC is preliminarily fixed to the welding area by applying heat-dissipating epoxy glue, and then welding is carried out.

[0012] As a preferred embodiment of the present utility model, after the IC is welded, a layer of high-temperature insulating coating is applied to its outer surface.

[0013] As a preferred embodiment of the present utility model, the full-screen body is a TFT screen or an OLED screen.

[0014] In the TFT display module of the present utility model, the IC is welded on the FPC, and the FPC is directly bonded and attached to the single-layer non-display area. Compared with the traditional technology in which the IC and the FPC are sequentially bonded up and down on the single-layer non-display area, the single-layer non-display area of the module of the present utility model can be made narrower, thereby increasing the proportion of the display area, making the full screen more perfect, improving the competitiveness of the display screen product. Moreover, after the IC is welded on the FPC and then bonded to the single-layer non-display area, the trouble of multiple alignment and bonding in the single-layer non-display area is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 Schematic diagram of the module of the present utility model;

[0017] Figure 2 is Figure 1 Enlarged side view of part A. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being "fixedly connected" to another element, it can be directly on the other element or there can also be an intermediate element. The terms "upper", "lower", "outer" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiment.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs. The terms used in the description of this utility model herein are for the purpose of describing specific embodiments only and are not intended to limit this utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0021] Referring to Figures 1 to 2 , a full-screen module. Specifically, in this embodiment, it includes a full-screen body 10, an IC 20, and an FPC 30. The full-screen body includes an upper glass 11 and a lower glass 12. The upper glass 11 and the lower glass 12 are attached to each other. The lower glass 12 is larger than the upper glass 11. The FPC 30 is bonded to the side of the bonding surface of the lower glass 12 that is larger than the single-layer non-display area 121 of the upper glass 11. The IC 20 is fixedly connected to the FPC 30.

[0022] In this embodiment, the IC 20 is fixed on the FPC 30, and then the FPC 30 is directly bonded and attached to the single-layer non-display area 121. The two do not need to be sequentially bonded up and down on the single-layer non-display area 121. Therefore, the module can be made narrower in its single-layer non-display area 121, thereby increasing the proportion of the display area (i.e., increasing the screen-to-body ratio). Compared with the case where the two are juxtaposed and bonded to the single-layer non-display area 121, the trouble of multiple alignment and bonding can be saved.

[0023] In this embodiment, the FPC 30 is bonded to the lower glass 12 through anisotropic conductive adhesive.

[0024] In this embodiment, ITO metal traces are provided on the full-screen body 10 and are electrically connected to the FPC 30.

[0025] In this embodiment, the IC 20 uses an SMT high-integration IC, or a combination of a low-integration IC and a bare chip can also be used to save costs and reduce the thickness.

[0026] In this embodiment, the IC 20 is connected to the FPC 30 by welding.

[0027] In this embodiment, on the bonding area of the FPC 30 and the full-screen body 10, a welding area 31 is provided near the bonding steps of the upper and lower glasses 11 and 12. The welding area 31 includes a substrate and a solder pad. There is 1 welding area 31. It should be noted that if there is a demand for 2 or more IC 20s, 2 or more welding areas 31 can also be provided correspondingly.

[0028] Specifically, before welding, the IC 20 is preliminarily fixed on the welding area 31 by coating a heat-dissipating epoxy adhesive on the attachment surface of the IC 20 before welding to prevent the IC 20 from shifting during the welding process and improve its heat conduction and heat dissipation capabilities during use.

[0029] Specifically, after the IC20 is welded, a high-temperature insulating coating is applied to its outer surface. On the one hand, it can effectively prevent electrical contact between the IC20 and other conductive components, thus avoiding safety hazards such as short circuits and electric leakage. On the other hand, it further improves the stability of the IC20 during operation.

[0030] Preferably, the full-screen body 10 of this embodiment is a TFT screen or an OLED screen.

[0031] In summary, the present utility model uses ICs welded on the FPC, and the FPC is directly bonded and attached to the single-layer non-display area. Compared with the traditional technology where the IC and the FPC are sequentially bonded up and down on the single-layer non-display area, the single-layer non-display area of the module can be made narrower, thereby increasing the proportion of the display area (i.e., increasing the screen-to-body ratio), making the full screen more perfect and improving the competitiveness of the display screen product.

[0032] The above-described embodiments merely represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.

Claims

1. A full-screen module, comprising a full-screen body, an IC and an FPC, wherein the full-screen body includes an upper glass and a lower glass, the upper glass and the lower glass are attached to each other, and the lower glass is larger than the upper glass, characterized in that, The FPC is bonded to the side of the fitting surface of the lower glass that is larger than the single-layer non-display area of the upper glass, and the IC is fixedly connected to the FPC.

2. The full-screen module according to claim 1, characterized in that, The FPC is bonded to the lower glass through anisotropic conductive adhesive.

3. The full-screen module according to claim 1, characterized in that, ITO metal traces are provided on the full-screen body and are electrically connected to the FPC.

4. The full-screen module according to claim 1, wherein The IC is an SMT high-integration IC, or a combination of a low-integration IC and a bare chip.

5. The full-screen module according to claim 1, wherein The IC is connected to the FPC by soldering.

6. The full-screen module according to claim 5, wherein, A soldering area is provided at the FPC near the fitting step of the upper and lower glasses, and the soldering area includes a substrate and a pad.

7. The full-screen module according to claim 6, wherein There is at least one soldering area.

8. The full-screen module according to claim 7, wherein Before soldering, the IC is preliminarily fixed in the soldering area by coating heat-dissipating epoxy glue and then soldered.

9. The full-screen module according to claim 8, wherein, After the IC is soldered, a layer of high-temperature insulating coating is coated on it.

10. The full-screen module according to any one of claims 1-8, characterized in that The full-screen body is a TFT screen or an OLED screen.

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