Feeding mechanism for nickel-palladium-gold immersion of circuit board

Abstract

The utility model discloses a circuit board nickel-palladium-gold immersion feeding mechanism which comprises a machine frame, a sliding module, a plurality of movable frames and a circuit board hanging tool, a plurality of chemical cylinders are arranged on the machine frame, and the chemical cylinders are used for containing solutions; a transfer frame is arranged at the output end of the sliding module, and the sliding module drives the transfer frame to move in the arrangement direction and the vertical direction of the chemical cylinders; the multiple movable frames are arranged on the peripheral side of the chemical cylinder, multiple fixing parts are arranged on the movable frames, and the lower ends of the transfer frames are clamped in the fixing parts; the circuit board hanging tool is separably arranged on the transfer frame, and the sliding module transfers the circuit board hanging tool through the transfer frame so that the circuit board hanging tool can move in the chemical cylinder. The transferring frame is driven by the sliding module to move in the arrangement direction and the vertical direction of the chemical cylinders, so that the circuit board hanging tool is driven to move in the different chemical cylinders, meanwhile, the transferring frame is fixed through the movable frame, the circuit board hanging tool is fixed in the chemical cylinders for a long time, and the process requirement for nickel, palladium and gold deposition is met.

Description

Technical Field

[0001] The utility model relates to the technical field of surface treatment of circuit boards, and particularly relates to a nickel-palladium-gold feeding mechanism for circuit boards. Background Art

[0002] In the process of PCB production, there are many production processes and technologies, among which surface treatment is one of the most important steps. Nickel-palladium-gold is a latest surface treatment technology, and its principle is to coat a layer of nickel, palladium and gold on the surface of the copper layer of the circuit board. The main technological processes include: degreasing - micro-etching - pre-impregnation - activation - nickel deposition - palladium deposition - gold deposition - drying, and multi-stage water washing treatment is carried out between each link.

[0003] Since the nickel-palladium-gold technological process is relatively long and multi-stage water washing treatment is required between each link, it is necessary to frequently move the position of the circuit board to enable it to quickly undergo the nickel-palladium-gold process. Therefore, a mechanism for quickly moving the circuit board is needed to improve the process efficiency. Summary of the Utility Model

[0004] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a nickel-palladium-gold feeding mechanism for circuit boards, which can quickly move the position of the circuit board and facilitate the circuit board to undergo the nickel-palladium-gold process.

[0005] According to an embodiment of the utility model, the nickel-palladium-gold feeding mechanism for circuit boards includes:

[0006] A frame, on which a plurality of chemical tanks are arranged in sequence along the horizontal direction, and the chemical tanks are used for containing solutions;

[0007] A sliding module, which is arranged on the frame and on one side of the chemical tanks. A transfer frame is arranged at the output end of the sliding module, and the transfer frame is located above the chemical tanks. The sliding module drives the transfer frame to move along the arrangement direction of the chemical tanks and in the vertical direction;

[0008] A plurality of movable frames, which are respectively movably arranged on the outer peripheral sides of the chemical tanks. The movable frames are arranged in sequence along the horizontal direction, and adjacent movable frames are movably connected to each other. A plurality of fixing parts are arranged on the movable frames, and the plurality of fixing parts are arranged at intervals along the arrangement direction of the chemical tanks on the movable frames. The lower end of the transfer frame is clamped in the fixing parts; and

[0009] Circuit board fixture, the circuit board fixture is detachably arranged on the transfer rack, and the sliding module transports the circuit board fixture through the transfer rack so that the circuit board fixture moves positions in the chemical tank, and the circuit board fixture is used for storing circuit boards.

[0010] The nickel, palladium and gold electroplating feeding mechanism for circuit boards according to the embodiments of the present invention has at least the following beneficial effects: The sliding module drives the transfer rack to move along the arrangement direction and the vertical direction of the chemical tanks, thereby driving the circuit board fixture to move in different chemical tanks. At the same time, the transfer rack is fixed by the movable frame, so that the circuit board fixture is fixed in the subsequent chemical tank for a long time, meeting the process requirements of nickel, palladium and gold electroplating for circuit boards.

[0011] According to some embodiments of the present invention, two connecting rods are arranged between adjacent movable frames, the two connecting rods are connected to each other, and the other ends of the two connecting rods are respectively connected to the two movable frames. A plurality of movable frames are respectively connected to the output end of a driving structure, and the driving structure drives the movable frames to move.

[0012] According to some embodiments of the present invention, the driving structure includes:

[0013] A driving frame, the driving frame is fixedly connected to the movable frame; and

[0014] A driving member, the driving member is movably connected to the driving frame through a cam structure, the output end of the driving member is connected to the cam structure, the cam structure is rotatably arranged in the driving frame, and the driving member is used to drive the cam structure to rotate.

[0015] According to some embodiments of the present invention, the two connecting rods are connected to each other through a connecting block, the connecting block is slidably arranged in the two connecting rods through a limiting key, the limiting key can be in the limiting groove arranged in the connecting rod, and the limiting groove is arranged at one end where the connecting rods are connected to each other.

[0016] According to some embodiments of the present invention, the transfer rack includes:

[0017] A support cross beam, one end of the support cross beam is arranged on the output end of the sliding module,

[0018] Support seats, there are two support seats, the two support seats are arranged at intervals on the support cross beam, and lifting parts are arranged on the outer sides of the two support seats; and

[0019] Lifting frame, the lifting frame includes support arms and a lifting crossbeam, the support arms are connected to both ends of the lifting crossbeam through vertical rods, the support arms are detachably clamped in the lifting part, the upper end of the circuit board hanger is detachably hung on the lifting crossbeam, and both ends of the lifting crossbeam are detachably clamped in the fixing part.

[0020] According to some embodiments of the present invention, the lifting part is arranged in a "V" shape, and the support arm is arranged in a wedge shape.

[0021] According to some embodiments of the present invention, the fixing part includes two relatively arranged fixing blocks, there is a gap between the two fixing blocks, the fixing blocks are provided with guiding inclined surfaces, the two guiding inclined surfaces are relatively arranged, and the bottom of the transfer frame is clamped in the gap between the two fixing blocks.

[0022] According to some embodiments of the present invention, the number of the chemical tanks is the same as the number of the movable frames, and the chemical tanks and the movable frames are arranged in one-to-one correspondence.

[0023] According to some embodiments of the present invention, the chemical tank includes a plurality of accommodating cavities, the accommodating cavities are arranged in sequence along the arrangement direction of the chemical tanks, and the accommodating cavities are used for accommodating different solutions.

[0024] According to some embodiments of the present invention, the sliding module includes a lifting sliding module and a horizontal sliding module, the horizontal sliding module is arranged on the frame, and the lifting sliding module is arranged on the output end of the horizontal sliding module.

[0025] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0026] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0027] Figure 1 is a schematic diagram of a circuit board nickel immersion palladium gold feeding mechanism according to an embodiment of the present invention;

[0028] Figure 2 is Figure 1 a partially enlarged schematic diagram of the circuit board nickel immersion palladium gold feeding mechanism shown;

[0029] Figure 3 is Figure 1 a schematic diagram of the movable frame of the circuit board nickel immersion palladium gold feeding mechanism shown;

[0030] Figure 4 isFigure 3 Schematic diagram of the drive structure of the movable frame shown

[0031] Figure 5 is Figure 1 Schematic diagram of the chemical tank of the nickel immersion palladium gold feeding mechanism for the circuit board shown

[0032] Reference numerals:

[0033] Chemical tank 10; accommodation cavity 11

[0034] Sliding module 20; transfer rack 21; support cross beam 211; support seat 212; lifting part 2121; lifting frame 213; support arm 2131; lifting cross beam 2132; vertical rod 2133; lifting and sliding module 22; horizontal sliding module 23

[0035] Movable frame 30; fixing part 31; fixing block 311; connecting rod 32; connecting block 321; limiting groove 322; drive structure 33; drive frame 331; drive part 332; cam structure 333

[0036] Circuit board hanger 40 Detailed implementation manners

[0037] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention

[0038] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention

[0039] In the description of the present invention, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If the first and second are described only for the purpose of distinguishing technical features, they should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features

[0040] In the description of the present utility model, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0041] Referring to Figures 1 to 3 , according to the circuit board electroless nickel palladium gold feeding mechanism of the embodiment of the present utility model, the circuit board electroless nickel palladium gold feeding mechanism includes a frame (not shown in the figure), a sliding module 20, a plurality of movable frames 30, and a circuit board hanger 40. A plurality of chemical tanks 10 are arranged on the frame in sequence along the horizontal direction, and the chemical tanks 10 are used to contain solutions; the sliding module 20 is arranged on the frame and on one side of the chemical tanks 10, and a transfer frame 21 is arranged at the output end of the sliding module 20. The transfer frame 21 is located above the chemical tanks 10, and the sliding module 20 drives the transfer frame 21 to move along the arrangement direction and the vertical direction of the chemical tanks 10; a plurality of movable frames 30 are respectively arranged on the outer peripheral sides of the chemical tanks 10, and the movable frames 30 are arranged in sequence along the horizontal direction. Adjacent movable frames 30 are movably connected to each other. A plurality of fixing parts 31 are arranged on the movable frames 30, and the plurality of fixing parts 31 are arranged at intervals along the arrangement direction of the chemical tanks 10 on the movable frames 30. The lower end of the transfer frame 21 is clamped in the fixing parts 31; the circuit board hanger 40 is detachably arranged on the transfer frame 21, and the sliding module 20 transports the circuit board hanger 40 through the transfer frame 21 so that the circuit board hanger 40 moves positions in the chemical tanks 10. The circuit board hanger 40 is used to store circuit boards.

[0042] Specifically, a plurality of chemical tanks 10 are arranged on the rack, and these chemical tanks 10 are arranged in sequence in the horizontal direction (the left-right direction as shown in the figure). Each chemical tank 10 is used to accommodate different solutions to meet the requirements of different steps in the process of nickel-palladium-gold immersion plating on the circuit board. The sliding module 20 is arranged on the rack and is located on one side of the chemical tanks 10. A transfer rack 21 is arranged at the output end of the sliding module 20, and the transfer rack 21 is located above the chemical tanks 10. The sliding module 20 can drive the transfer rack 21 to move along the arrangement direction of the chemical tanks 10 and in the vertical direction, so as to realize the transfer of the circuit board fixture 40 between different chemical tanks 10. A plurality of movable racks 30 are respectively arranged on the outer peripheral sides of the chemical tanks 10, and the movable racks 30 are arranged in sequence in the horizontal direction. Adjacent movable racks 30 are movably connected to each other, so that the entire structure of the movable racks 30 has a certain flexibility and adaptability, and thus can drive the circuit board fixture 40 to move in the chemical tanks 10, accelerating the process efficiency of nickel-palladium-gold immersion plating on the circuit board. A plurality of fixing parts 31 are arranged on each movable rack 30, and these fixing parts 31 are arranged at intervals on the movable rack 30 along the arrangement direction of the chemical tanks 10. The lower end of the transfer rack 21 can be clamped in these fixing parts 31, so as to realize the stable support and positioning of the transfer rack 21 on the movable rack 30. The circuit board fixture 40 is detachably arranged on the transfer rack 21. When the transfer rack 21 moves to the designated position, the circuit board fixture 40 can be conveniently mounted or unloaded onto the transfer rack 21. The sliding module 20 transfers the circuit board fixture 40 through the transfer rack 21, so that the circuit board fixture 40 moves its position in the chemical tanks 10. The circuit board fixture 40 is used to store the circuit board to ensure that the circuit board can be stably immersed in the solution during the nickel-palladium-gold immersion plating process.

[0043] Specific implementation steps: Mount the circuit board to be processed onto the circuit board fixture 40. Mount the circuit board fixture 40 onto the transfer rack 21. The sliding module 20 drives the transfer rack 21 to move along the arrangement direction of the chemical tanks 10, and moves the circuit board fixture 40 above the designated chemical tank 10. The sliding module 20 drives the transfer rack 21 to descend, so that the circuit board fixture 40 is completely immersed in the solution in the chemical tank 10. After the immersion is completed, the sliding module 20 drives the transfer rack 21 to rise and moves to above the next chemical tank 10. Repeat the previous steps until the circuit board completes all the nickel-palladium-gold immersion plating process steps. Unload the processed circuit board from the circuit board fixture 40.

[0044] Therefore, it can be understood that the circuit board nickel-palladium-gold feeding mechanism according to the embodiment of the present invention has at least the following beneficial effects: The sliding module 20 drives the transfer rack 21 to move along the arrangement direction of the chemical tanks 10 and in the vertical direction, thereby driving the circuit board fixture 40 to move in different chemical tanks 10. At the same time, the transfer rack 21 is fixed by the movable rack 30, so that the circuit board fixture 40 is fixed in the subsequent chemical tank 10 for a long time, meeting the process requirements of nickel-palladium-gold immersion plating on the circuit board.

[0045] Referring to Figure 1 and Figure 3 , in some embodiments of the present utility model, two connecting rods 32 are provided between adjacent movable frames 30. The two connecting rods 32 are connected to each other, and the other ends of the two connecting rods 32 are respectively connected to two movable frames 30. A plurality of movable frames 30 are respectively connected to the output end of a driving structure 33, and the driving structure 33 drives the movable frames 30 to move.

[0046] This embodiment further describes in detail the connection structure between adjacent movable frames 30 and the relationship between the movable frames 30 and the driving structure 33. Specifically, two connecting rods 32 are provided between adjacent movable frames 30. The two connecting rods 32 are connected to each other to form a stable connection structure. The other ends of the two connecting rods 32 are respectively connected to two adjacent movable frames 30 to ensure that the movable frames 30 can move relatively flexibly while maintaining overall stability. A plurality of movable frames 30 are respectively connected to the output end of a driving structure 33. This driving structure 33 can be a motor, a cylinder or other devices that can provide linear or rotational motion. The driving structure drives the movable frames 30 to move. When the driving structure is started, motion is transmitted to the movable frames 30 through the output end, so that the movable frames 30 move in a predetermined manner, thereby driving the circuit board fixture 40 to move in a predetermined manner in the chemical tank 10, facilitating the nickel palladium gold plating process of the circuit board.

[0047] Referring to Figure 4 , further, in some embodiments of the present utility model, the driving structure 33 includes a driving frame 331 and a driving member 332. The driving frame 331 is fixedly connected to the movable frame 30; the driving member 332 is movably connected to the driving frame 331 through a cam structure 333. The output end of the driving member 332 is connected to the cam structure 333. The cam structure 333 is rotatably disposed in the driving frame 331, and the driving member 332 is used to drive the cam structure 333 to rotate.

[0048] The driving structure 33 can be disposed on one side of each movable frame 30, so as to drive each movable frame 30 individually, facilitating the individual shaking of the circuit boards on each movable frame 30 in the chemical tank 10; of course, all the movable frames 30 can also be connected as a whole, so that only one driving structure 33 can shake all the movable frames 30 simultaneously, and then drive all the circuit boards on the movable frames 30 to shake in the chemical tank 10.

[0049] Specifically, the drive structure 33 mainly includes a drive frame 331 and a drive member 332. Among them, the drive frame 331 is fixedly connected to the movable frame 30, ensuring a stable connection between the drive frame 331 and the movable frame 30, so that the drive frame 331 can drive the movable frame 30 to move or rotate. The drive member 332 is movably connected to the drive frame 331 through a cam structure 333. Specifically, the output end of the drive member 332 is connected to the cam structure 333, which enables the drive member 332 to drive the cam structure 333 to rotate. The cam structure 333 is rotatably arranged in the drive frame 331, ensuring the stability and smoothness of the cam structure 333 during rotation. In practical applications, when it is necessary to drive the movable frame 30 to move, only need to start the drive member 332, so that its output end drives the cam structure 333 to rotate. The rotation of the cam structure 333 will be further converted into a linear motion of the drive frame 331, thereby driving the movable frame 30 to move accordingly. Through such a design, the drive structure 33 can achieve an efficient and stable driving effect, ensuring the normal operation of the PCB electroless nickel palladium gold feeding mechanism. At the same time, the drive structure 33 also has the advantages of simple structure and easy maintenance, providing strong support for the application of the PCB electroless nickel palladium gold feeding mechanism.

[0050] Furthermore, referring to Figure 3 , in some embodiments of the present utility model, the two connecting rods 32 are connected to each other through a connecting block 321. The connecting block 321 is slidably arranged in the two connecting rods 32 through a limit key. The limit key can be in the limit groove 322 arranged in the connecting rod 32. The limit groove 322 is arranged at one end of the connecting rod 32 where they are connected to each other.

[0051] Specifically, the two connecting rods 32 are connected to each other through a connecting block 321. This connecting block 321 is an independent component used to fix the two connecting rods 32 together while allowing a certain relative movement between them. The design of the connecting block 321 should ensure that the two connecting rods 32 can be stably connected together and will not separate from each other during movement. The connecting block 321 is slidably arranged in the two connecting rods 32 through a limit key. The limit key is a protruding part that is inserted into the interior of the connecting rod 32 and cooperates with the limit groove 322 inside the connecting rod 32. The limit key can slide in the limit groove 322 arranged in the connecting rod 32. This limit groove 322 is a groove extending along the length direction of the connecting rod 32, which limits the sliding range of the limit key (and the connecting block 321 connected thereto) on the connecting rod 32. The limit groove 322 is arranged at one end of the connecting rod 32 where they are connected to each other. This means that the limit groove 322 is located at the part where the two connecting rods 32 contact and connect to each other, ensuring that the connecting block 321 (and the connecting rods 32 connected thereto) will not separate from the connecting rod 32 during sliding.

[0052] Referring to Figures 1 to 2, in some embodiments of the present utility model, the transfer rack 21 includes a support cross beam 211, a support seat 212, and a lifting rack 213. One end of the support cross beam 211 is disposed on the output end of the sliding module 20. There are two support seats 212, and the two support seats 212 are spaced apart on the support cross beam 211. Lifting portions 2121 are disposed on the outer sides of the two support seats 212; the lifting rack 213 includes support arms 2131 and a lifting cross beam 2132. The support arms 2131 are connected to both ends of the lifting cross beam 2132 through vertical rods 2133. The support arms 2131 are detachably clamped in the lifting portions 2121. The upper end of the circuit board hanger 40 is detachably hung on the lifting cross beam 2132, and both ends of the lifting cross beam 2132 are detachably clamped in the fixing portion 31.

[0053] Specifically, this embodiment further describes in detail the specific structure of the transfer rack 21. One end of the support cross beam 211 is disposed on the output end of the sliding module 20. The sliding module 20 drives the entire transfer rack 21 to move along the arrangement direction and the vertical direction of the chemical tanks 10 through the support cross beam 211. There are two support seats 212, and the two support seats 212 are spaced apart on the support cross beam 211. These two support seats 212 provide stable support for the transfer rack 21 and ensure the stability of the circuit board hanger 40 during the transfer process. Lifting portions 2121 are disposed on the outer sides of the two support seats 212. These lifting portions 2121 are used for connecting with the lifting rack 213, enabling the lifting rack 213 to move up and down relative to the support seat 212. The lifting rack 213 includes support arms 2131, and these support arms 2131 are connected to both ends of the lifting cross beam 2132 through vertical rods 2133. The design of the support arms 2131 enables the lifting rack 213 to stably support the circuit board hanger 40. The lifting cross beam 2132 is the main part of the lifting rack 213 and is used for hanging the circuit board hanger 40. The upper end of the circuit board hanger 40 is detachably hung on the lifting cross beam 2132, which enables the circuit board hanger 40 to be conveniently mounted or unmounted. The support arms 2131 are detachably clamped in the lifting portions 2121, which enables the lifting rack 213 to be connected or separated from the support seat 212 when needed. At the same time, both ends of the lifting cross beam 2132 are also detachably clamped in the fixing portion 31, which further enhances the stability of the lifting rack 213 during the transfer process.

[0054] Hang the upper end of the circuit board fixture 40 on the lifting cross beam 2132 to ensure that the circuit board fixture 40 is stably mounted on the lifting frame 213. The sliding module 20 drives the support cross beam 211 (and the connected lifting frame 213 and circuit board fixture 40) to move along the arrangement direction of the chemical tanks 10, and moves the circuit board fixture 40 above the designated chemical tank 10. The sliding module 20 drives the support cross beam 211 to descend, and at the same time the lifting frame 213 descends relative to the support seat 212 (since the support arm 2131 is detachably clamped in the lifting part 2121), so that the circuit board fixture 40 is completely immersed in the solution in the chemical tank 10. After the immersion is completed, the sliding module 20 drives the support cross beam 211 to rise, and at the same time the lifting frame 213 rises relative to the support seat 212, and takes out the circuit board fixture 40 from the chemical tank 10. The sliding module 20 drives the support cross beam 211 to move above the next chemical tank 10, and repeats the foregoing steps until the circuit board completes all the electroless nickel palladium gold process steps. Finally, unload the processed circuit board from the circuit board fixture 40.

[0055] Refer to Figure 2 , in some embodiments of the present invention, the lifting part 2121 is arranged in a "V" shape, and the support arm 2131 is arranged in a wedge shape. The lifting part 2121 is arranged in a "V" shape. This design enables the lifting part 2121 to provide more stable support and guiding functions when cooperating with the support arm 2131. When the support arm 2131 is inserted into the lifting part 2121, the "V"-shaped lifting part 2121 can effectively limit the lateral movement of the support arm 2131, ensuring the stability of the lifting frame 213 during the lifting and lowering process. The support arm 2131 is arranged in a wedge shape. The wedge-shaped design of the support arm 2131 enables it to be conveniently inserted into the "V"-shaped lifting part 2121 and achieve a tight fit. When the support arm 2131 is subjected to an upward force, the wedge shape will make the contact between it and the lifting part 2121 closer, further enhancing the stability of the lifting frame 213 during the lifting and lowering process.

[0056] Refer to Figures 1 to 3 , in some embodiments of the present invention, the fixing part 31 includes two relatively arranged fixing blocks 311, there is a gap between the two fixing blocks 311, a guiding inclined surface is arranged on the fixing block 311, the two guiding inclined surfaces are relatively arranged, and the bottom of the transfer frame 21 is clamped in the gap between the two fixing blocks 311.

[0057] Specifically, the fixing part 31 includes two relatively arranged fixing blocks 311. These two fixing blocks 311 are the main components of the fixing part 31. They are arranged at intervals to form an interval space for clamping the transfer rack 21. A guiding inclined surface is provided on the fixing block 311. The guiding inclined surface is an inclined plane, which helps the transfer rack 21 to be more smoothly clamped or separated. The two guiding inclined surfaces are arranged relatively, which means they are respectively located on the two fixing blocks 311 and the inclined directions are opposite. The bottom of the transfer rack 21 is clamped in the interval between the two fixing blocks 311. This clamping method enables the transfer rack 21 to be stably fixed on the fixing part 31 in the vertical direction and can also be conveniently separated when needed. When the transfer rack 21 needs to be clamped on the fixing part 31, the bottom of the transfer rack 21 can be aligned with the interval between the two fixing blocks 311, and the transfer rack 21 is pushed into the interval along the guiding inclined surface until the bottom of the transfer rack 21 is completely clamped in the interval. When it is necessary to separate the transfer rack 21 and the fixing part 31, the transfer rack 21 can be pulled out of the interval along the guiding inclined surface to achieve rapid separation.

[0058] Referring to Figure 5 , in some embodiments of the present utility model, the number of chemical vats 10 is the same as the number of movable frames 30, and the chemical vats 10 and the movable frames 30 are arranged in one-to-one correspondence. The number of chemical vats 10 is the same as the number of movable frames 30. This means that when designing the feeding mechanism, it is necessary to ensure that each movable frame 30 corresponds to a chemical vat 10 so that the circuit board hanger 40 can sequentially enter each chemical vat 10 for processing. The chemical vats 10 and the movable frames 30 are arranged in one-to-one correspondence. This arrangement ensures that each movable frame 30 can be accurately positioned above the corresponding chemical vat 10 when moving, so that the circuit board hanger 40 can be accurately immersed in the correct chemical solution.

[0059] Furthermore, in some embodiments of the present utility model, the chemical vat 10 includes a plurality of accommodating cavities 11, and the accommodating cavities 11 are arranged in sequence along the arrangement direction of the chemical vat 10, and the accommodating cavities 11 are used for accommodating different solutions.

[0060] Specifically, the chemical tank 10 includes a plurality of accommodating cavities 11. These accommodating cavities 11 are the main components of the chemical tank 10 and are used to accommodate different solutions so that the circuit board fixture 40 can be successively immersed in these solutions during the nickel-palladium-gold immersion process. The accommodating cavities 11 are arranged in sequence along the arrangement direction of the chemical tank 10. This arrangement ensures that the circuit board fixture 40 can enter each accommodating cavity 11 in sequence when moving, thereby completing the entire nickel-palladium-gold immersion process. Each accommodating cavity 11 is used to accommodate a different solution. These solutions may include nickel solution, palladium solution, gold solution, or cleaning solution, etc., which are specifically determined according to the requirements of the nickel-palladium-gold immersion process. When the circuit board fixture 40 enters a certain accommodating cavity 11, it will be completely immersed in the solution in that accommodating cavity 11, thereby completing the corresponding chemical treatment step.

[0061] Referring to Figure 1 , in some embodiments of the present invention, the sliding module 20 includes a lifting and sliding module 22 and a horizontal sliding module 23. The horizontal sliding module 23 is arranged on the frame, and the lifting and sliding module 22 is arranged on the output end of the horizontal sliding module 23.

[0062] The sliding module 20 includes a lifting and sliding module 22 and a horizontal sliding module 23. These two modules together constitute the sliding module 20, which is used to drive the transfer rack 21 (and the connected circuit board fixture 40) to move in the horizontal and vertical directions. The horizontal sliding module 23 is arranged on the frame. The frame is the basic support structure of the feeding mechanism. The horizontal sliding module 23 is fixed at a predetermined position through the frame and can move stably in the horizontal direction. The lifting and sliding module 22 is arranged on the output end of the horizontal sliding module 23. This means that the lifting and sliding module 22 will move along with the movement of the horizontal sliding module 23, and at the same time, it can also move up and down in the vertical direction. The horizontal sliding module 23 is used to drive the transfer rack 21 to move in the horizontal direction. This movement is usually to enable the circuit board fixture 40 to enter each chemical tank 10 in sequence for processing. The lifting and sliding module 22 is used to drive the transfer rack 21 to move up and down in the vertical direction. This up and down movement is usually to enable the circuit board fixture 40 to be completely immersed in the solution in the chemical tank 10 or to rise from the solution.

[0063] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the relevant technical field, various changes can be made without departing from the gist of the present invention.

Claims

1. A feeding mechanism for electroless nickel palladium gold plating on a circuit board, characterized in that, Including: A frame, on which a plurality of chemical tanks are arranged. The plurality of chemical tanks are arranged in sequence in the horizontal direction and are used for containing solutions. A sliding module, which is arranged on the frame and on one side of the chemical tanks. A transfer rack is arranged at the output end of the sliding module. The transfer rack is located above the chemical tanks. The sliding module drives the transfer rack to move along the arrangement direction and the vertical direction of the chemical tanks. A plurality of movable racks, which are respectively movably arranged on the outer peripheral sides of the chemical tanks. The movable racks are arranged in sequence in the horizontal direction. Adjacent movable racks are movably connected to each other. A plurality of fixing parts are arranged on the movable racks. The plurality of fixing parts are arranged at intervals along the arrangement direction of the chemical tanks on the movable racks. The lower end of the transfer rack is clamped in the fixing parts; and A circuit board hanger, which is detachably arranged on the transfer rack. The sliding module transports the circuit board hanger through the transfer rack so that the circuit board hanger moves positions in the chemical tanks. The circuit board hanger is used for storing circuit boards.

2. The nickel palladium gold electroplating feeding mechanism for circuit boards according to claim 1, wherein Two connecting rods are arranged between adjacent movable racks. The two connecting rods are connected to each other. The other ends of the two connecting rods are respectively connected to the two movable racks. The plurality of movable racks are respectively connected to the output end of a driving structure. The driving structure drives the movable racks to move.

3. The nickel palladium gold electroplating feeding mechanism for circuit boards according to claim 2, wherein The driving structure includes: A driving frame, which is fixedly connected to the movable rack; and A driving member, which is movably connected to the driving frame through a cam structure. The output end of the driving member is connected to the cam structure. The cam structure is rotatably arranged in the driving frame. The driving member is used for driving the cam structure to rotate.

4. The nickel-palladium-gold electroplating feeding mechanism for circuit boards according to claim 2, wherein, [[ID=...]]The two connecting rods are connected to each other through a connecting block. The connecting block is slidably arranged in the two connecting rods through a limiting key. The limiting key can be in the limiting groove arranged in the connecting rods. The limiting groove is arranged at one end where the connecting rods are connected to each other.

5. The nickel-palladium-gold electroplating feeding mechanism for printed circuit boards according to claim 1, characterized in that, The transfer rack includes: A support cross beam, one end of which is arranged at the output end of the sliding module. Support seats, there are two support seats. The two support seats are arranged at intervals on the support cross beam. Lifting parts are arranged on the outer sides of the two support seats; and A lifting frame, which includes support arms and a lifting cross beam. The support arms are connected to both ends of the lifting cross beam through vertical rods. The support arms are detachably clamped in the lifting parts. The upper end of the circuit board hanger is detachably hung on the lifting cross beam. Both ends of the lifting cross beam are detachably clamped in the fixing parts.

6. The nickel-palladium-gold electroplating feeding mechanism for circuit boards according to claim 5, wherein The lifting part is arranged in a "V" shape, and the support arm is arranged in a wedge shape.

7. The nickel-palladium-gold electroplating feeding mechanism for circuit boards according to claim 1, wherein The fixing part includes two relatively arranged fixing blocks. There is an interval between the two fixing blocks. Guide inclined surfaces are arranged on the fixing blocks. The two guide inclined surfaces are relatively arranged. The bottom of the transfer rack is clamped in the interval between the two fixing blocks.

8. The nickel-palladium-gold electroplating feeding mechanism for circuit boards according to claim 1, wherein, The number of the chemical tanks is the same as the number of the movable racks. The chemical tanks and the movable racks are arranged in one-to-one correspondence.

9. The nickel palladium gold electroplating feeding mechanism for circuit boards according to claim 1, characterized in that The chemical tank includes a plurality of accommodating cavities which are arranged in sequence along the arrangement direction of the chemical tank, and the accommodating cavities are used for accommodating different solutions.

10. The nickel-palladium-gold electroplating feeding mechanism for circuit boards according to claim 1, wherein, The sliding module includes a lifting and sliding module and a horizontal sliding module. The horizontal sliding module is arranged on the frame, and the lifting and sliding module is arranged at the output end of the horizontal sliding module.

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