Electronic equipment

Abstract

The utility model provides an electronic device which comprises a first structural member and a second structural member, the first structural member comprises a first metal matrix, the second structural member comprises a second metal matrix and a decoration layer arranged on one side of the second metal matrix, and the first metal matrix is electrically connected with the second metal matrix. The corrosion potential of the first metal matrix is lower than that of the second metal matrix; an insulating layer is further arranged on the side, away from the second metal base body, of the decorative layer, the insulating layer is a transparent or semitransparent layer, and the impedance of the insulating layer is larger than or equal to 2000 ohms. The insulating layer is arranged on the decorative layer on the second metal matrix with high corrosion potential, so that a potential difference caused by a closed loop formed between the metal matrixes with different chemical activities can be prevented in a sweat environment or a salt mist environment, and the probability of electrocorrosion of the first metal matrix with low corrosion potential is further reduced; and the long-term use requirement of the electronic equipment is well met.

Description

Technical Field

[0001] This application relates to the technical field of electronic products, and particularly to an electronic device. Background Art

[0002] Currently, metal structural parts of different materials are usually present in electronic devices such as mobile phones. For example, in a mobile phone, there is an anodized aluminum alloy middle frame and a titanium alloy rotating shaft back cover with a decorative layer plated on the surface at the same time, and the two are electrically connected. Due to the different chemical activities of the two metal structural parts, a potential difference is generated between them in a sweat environment or a salt spray environment, and the metal structural part with high activity (such as the aluminum alloy middle frame) is prone to electrochemical corrosion and will fail after long-term use. Summary of the Utility Model

[0003] In view of this, the embodiments of this application provide an electronic device to solve the problem that the metal structural part with high activity in an electronic device with metal structural parts of different activities is prone to electrochemical corrosion.

[0004] Specifically, in the first aspect of the embodiments of this application, an electronic device is provided, which includes a first structural part and a second structural part. The first structural part includes a first metal matrix, and the second structural part includes a second metal matrix and a decorative layer provided on one side of the second metal matrix. The first metal matrix is electrically connected to the second metal matrix, and the corrosion potential of the first metal matrix is lower than that of the second metal matrix; an insulating layer is further provided on the side of the decorative layer facing away from the second metal matrix, the insulating layer is a transparent or semi-transparent layer, and the impedance of the insulating layer is greater than or equal to 2000Ω.

[0005] There are two structural parts with different matrix chemical activities and electrically connected to each other in this electronic device. In this application, an insulating layer with good transparency and high impedance is provided on the decorative layer on the surface of the metal matrix with low chemical activity, so as to prevent a closed loop from being formed between the metal matrices with different chemical activities and a potential difference from being generated in a sweat environment or a salt spray environment containing chloride ions by means of this insulating layer, thereby reducing the probability of electrochemical corrosion of the first structural part with high metal matrix activity and preferably meeting the long-term use requirements of the electronic device.

[0006] In some embodiments of this application, the insulating layer includes a first inorganic insulating material layer and a second inorganic insulating material layer that are alternately stacked, and the refractive index of the first inorganic insulating material layer is greater than that of the second inorganic insulating material layer. Thus, an insulating layer with good optical transparency can be obtained, and the wear resistance of the insulating layer formed by alternately stacking two inorganic insulating material layers with different refractive indices is relatively excellent.

[0007] In some possible embodiments of this application, the thickness of the insulating layer is 500nm - 2000nm. This is beneficial to ensure that the above insulating layer can provide a high enough impedance and wear resistance.

[0008] In some possible embodiments of the present application, the first inorganic insulating material layer includes a silicon nitride layer, an aluminum nitride layer, a niobium oxide layer, a silicon oxynitride layer, an aluminum oxynitride layer, a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, or a silicon niobium oxynitride layer; the second inorganic insulating material layer includes a silicon oxide layer, an aluminum oxide layer, a silicon aluminum oxide layer, or a silicon niobium oxide layer.

[0009] In some embodiments of the present application, the second structural member further includes an intermediate layer disposed between the decorative layer and the insulating layer; wherein, the intermediate layer includes one or more of a titanium layer, a chromium layer, a tungsten layer, and a niobium layer. With such an intermediate layer, it is possible to ensure a strong film layer bonding force between the insulating layer formed by alternately laminating two inorganic insulating material layers and the decorative layer, greatly reducing the risk of the insulating layer peeling off from the decorative layer.

[0010] In some possible embodiments of the present application, the thickness of the intermediate layer is 1 nm - 50 nm. An intermediate layer with a suitable thickness can ensure a strong bonding force between the above-mentioned insulating layer and the decorative layer.

[0011] In some embodiments of the present application, a superhard layer is further provided on a side of the insulating layer facing away from the second metal substrate. The hardness of the superhard layer is greater than that of the insulating layer, and the superhard layer can improve the scratch resistance of the insulating layer formed by alternately laminating two inorganic insulating material layers.

[0012] In some other embodiments of the present application, the insulating layer is an organic insulating layer. The organic insulating layer has a very low impedance and is relatively easy to form on the above-mentioned decorative layer without damaging the appearance of the decorative layer.

[0013] In some possible embodiments of the present application, the thickness of the organic insulating layer is 1 μm - 10 μm. An organic insulating layer with a suitable thickness can ensure a good surface insulation effect on the decorative layer and endow it with a certain degree of wear resistance.

[0014] In some possible embodiments of the present application, the organic insulating layer includes a sprayed epoxy resin layer, or an electrophoretic epoxy resin layer, or an acrylic resin cured layer.

[0015] In some embodiments of the present application, the second structural member further includes an anti-fingerprint layer located on a side of the insulating layer facing away from the second metal substrate. The anti-fingerprint layer can make the surface of the second structural member easy to clean and has excellent fingerprint resistance.

[0016] In an embodiment of the present application, the water contact angle on the surface of the anti-fingerprint layer is above 80°. This reflects that the surface energy of the anti-fingerprint layer is very low and it has excellent anti-fouling performance.

[0017] In the embodiments of the present application, the decorative layer includes a carbide layer containing a metal element, a nitride layer containing a metal element, or a carbonitride layer containing a metal element. By adjusting the material composition of the decorative layer, different appearance colors can be given to it.

[0018] In some embodiments of the present application, the second structural member further includes a primer layer, and the primer layer is located between the second metal substrate and the decorative layer. The primer layer can increase the bonding force between the decorative layer and the second metal substrate.

[0019] In some possible embodiments of the present application, the primer layer includes one or more of Ti, Cr, W, Nb, Ni, Mo layers or alloy layers thereof.

[0020] In some embodiments of the present application, the first metal substrate includes an aluminum alloy substrate, and the second metal substrate includes a stainless steel substrate, a titanium alloy substrate, or a zirconium alloy substrate. The corrosion potential of aluminum alloy is relatively low, its chemical activity is high, and it is prone to electrochemical corrosion. In the present application, the above-mentioned insulating layer is provided on the second metal substrate with low chemical activity that is electrically connected to it, which can solve the problem of easy electrochemical corrosion of aluminum alloy.

[0021] In some embodiments of the present application, one of the first structural member and the second structural member is the middle frame of the electronic device, and the other is the camera decorative part or the back cover of the rotating shaft of the electronic device. Among them, the back cover of the rotating shaft generally only exists in foldable electronic devices. For example, in some embodiments, the electronic device includes a middle frame and a camera decorative part; one of the first structural member and the second structural member is the middle frame, and the other is the camera decorative part. For another example, in another embodiment, the electronic device is a foldable electronic device, the foldable electronic device includes a rotating shaft and at least two middle frames, and the rotating shaft includes a back cover of the rotating shaft; wherein, one of the first structural member and the second structural member is the middle frame, and the other is the back cover of the rotating shaft. Description of the Drawings

[0022] Figure 1 A common structural schematic diagram of the electronic device 1000 provided for the related art.

[0023] Figure 2 A structural schematic diagram of the electronic device 1000 provided by the embodiment of the present application.

[0024] Figure 3A A structural schematic diagram of the electronic device 1000 provided by some embodiments of the present application.

[0025] Figure 3B Another structural schematic diagram of the electronic device 1000 provided by some embodiments of the present application.

[0026] Figure 4AA schematic structural diagram of an electronic device 1000 provided for some other embodiments of the present application.

[0027] Figure 4B Another schematic structural diagram of the electronic device 1000 provided for some other embodiments of the present application.

[0028] Figure 4C Yet another schematic structural diagram of the electronic device 1000 provided for some other embodiments of the present application.

[0029] Figure 5A A schematic structural diagram of a foldable electronic device provided for some embodiments of the present application in a first state.

[0030] Figure 5B A schematic structural diagram of a foldable electronic device provided for some embodiments of the present application in a second state.

[0031] Figure 6 A schematic rear view of the electronic device 1000 provided for some other embodiments of the present application.

[0032] Figure 7 Is Figure 6 A partial cross-sectional structural diagram of the electronic device 1000 taken along the A-A in

[0033] Main reference numeral description:

[0034] 1000 - Electronic device, 10 - First structural member, 11 - First metal matrix, 12 - Surface treatment layer; 20 - Second structural member, 21 - Second metal matrix, 22 - Decorative layer, 23 - Insulating layer, 231 - First inorganic insulating material layer, 232 - Second inorganic insulating material layer, 24 - Anti-fingerprint layer, 25 - Primer layer, 26 - Intermediate layer, 27 - Superhard layer. Detailed implementation manners

[0035] Next, the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application.

[0036] Currently, electronic devices such as mobile phones are developing towards being thinner and lighter. To improve the reliability of electronic devices under the condition of being thinner and lighter, and / or to achieve rich appearance effects. There are usually two structural members made of different materials in electronic devices. Please refer to Figure 1 , Figure 1 A common schematic structural diagram of the electronic device 1000 provided for the related art. The electronic device 1000 can be a mobile phone, a tablet computer, a notebook computer, an e-reader, a wearable device (such as a watch, a bracelet, etc.), or an electronic device such as virtual reality. In the embodiments of the present application, the electronic device 1000 is taken as an example of a mobile phone for introduction.

[0037] AsFigure 1 As shown, the electronic device 1000 includes a first structural member 10 and a second structural member 20. The first structural member 10 includes a first metal substrate 11, and the second structural member 20 includes a second metal substrate 21 and a decorative layer 22 provided on one side of the second metal substrate 21. The first metal substrate 11 is electrically connected to the second metal substrate 21, and the corrosion potential of the first metal substrate 11 is lower than that of the second metal substrate 21 (that is, the metal activity of the first metal substrate 11 is higher than that of the second metal substrate 21). Exemplarily, the first metal substrate 11 may be an aluminum alloy, and the second metal substrate 21 may be a stainless steel, a titanium alloy, a zirconium alloy, or the like. The decorative layer 22 may be a metal nitride, a metal carbide, a metal carbonitride, or the like deposited by physical vapor deposition (PVD for short). The first metal substrate 11 may also have a surface treatment layer 12, such as an anodic oxidation layer or a decorative layer deposited by PVD, specifically.

[0038] Exemplarily, when the electronic device 1000 is a foldable mobile phone, the first structural member 10 for electrically connecting the metal substrates may be an anodized aluminum alloy middle frame, and the second structural member 20 may be a stainless steel or titanium alloy rotating shaft back cover with a decorative layer on the surface of the foldable mobile phone; or, the first structural member 10 may be a titanium alloy middle frame with a decorative layer on the surface, and the second structural member 20 may be an anodized aluminum alloy camera decorative member, etc.

[0039] As Figure 1 shown, the metal substrates of the two structural members are electrically connected, but their metal activities are different. In a sweat environment or a salt spray environment, there will be a potential difference between them. For example, when a user touches the first structural member 10 and the second structural member 20 with a sweaty hand, a closed loop will be formed between the first structural member 10 and the second structural member 20, a potential difference will be generated between them, and a galvanic cell reaction will occur. Chloride ions (Cl -) It will accelerate the attack on the first structural member 10 with high activity, causing the surface treatment layer 12 to rupture. Over time, the first metal matrix 11 undergoes electrochemical corrosion, and the first structural member 10 fails. In addition, although there is a decorative layer 22 formed by PVD on the surface of the second structural member 20 with low activity, this decorative layer is usually a carbide, nitride, or carbonitride containing metal elements and has certain metal-like characteristics with a relatively low film resistance. Therefore, in an environment containing chloride ions such as a sweat environment or a salt spray environment, the second structural member 20 is basically conductive along its thickness direction. There is still a potential difference between the second structural member 20 with the decorative layer 22 on its surface and the first structural member 10 with high activity, and the first structural member 10 with higher activity will still be attacked by chloride ions and corroded or even fail due to electricity. Therefore, the embodiment of the present application provides a technical solution for the problem that the metal structural member with high activity in an electronic device with two metal structural members with different activities is prone to electrochemical corrosion.

[0040] Please refer to Figure 2 , Figure 2 which is a schematic structural diagram of an electronic device 1000 provided by an embodiment of the present application. As Figure 2 shown, the electronic device 1000 includes a first structural member 10 and a second structural member 20. The first structural member 10 includes a first metal matrix 11, and the second structural member 20 includes a second metal matrix 21 and a decorative layer 22 provided on one side of the second metal matrix 21. The first metal matrix 11 is electrically connected to the second metal matrix 21, and the corrosion potential of the first metal matrix 11 is lower than the corrosion potential of the second metal matrix 21. Among them, in the second structural member 20, an insulating layer 23 is further provided on the side of the decorative layer 22 facing away from the second metal matrix 21. The insulating layer 23 is a transparent or semi-transparent layer, and the impedance of the insulating layer 23 is greater than or equal to 2000 Ω.

[0041] In two different electrically connected structural members, in the present application, a decorative layer and an insulating layer 23 with good transparency and high impedance are laminated on the surface of the metal matrix with low chemical activity (specifically, the second metal matrix 21). In a sweat environment or a salt spray environment containing chloride ions, such an insulating layer 23 can block the electron flow along the thickness direction of the second structural member 20, thereby preventing the formation of a closed loop between the first metal matrix 11 of the first structural member 10 and the second metal matrix 21 of the second structural member 20 to generate a potential difference, and further preventing the electrochemical corrosion phenomenon caused by chloride ions attacking the first structural member 10 with higher metal matrix activity, and improving the service life of the first structural member 10 with high activity in the electronic device 1000. In addition, due to the good transparency of the insulating layer 23, when it is provided on the decorative layer 22, it will not have an obvious impact on the appearance effect of the second structural member 20.

[0042] It should be noted that Figure 2In the electronic device 1000, a first structural member 10 and a second structural member 20 are schematically shown. However, it can be understood that the number of the first structural member 10 or the second structural member 20 in the electronic device 1000 may be more than one. For example, for a two-fold foldable electronic device, the number of the middle frames may be 2.

[0043] In an embodiment of the present application, the first metal matrix 11 includes an aluminum alloy matrix, and the second metal matrix 21 includes a stainless steel matrix, a titanium alloy matrix, a zirconium alloy matrix, etc. Among them, the corrosion potential of the aluminum alloy is lower than that of the stainless steel, titanium alloy or zirconium alloy. Here, the corrosion potential refers to the potential value with a negative sign. For example, the corrosion potential of the aluminum alloy in an acidic environment is generally -2V, the corrosion potential of the stainless steel in an acidic environment is generally greater than -2V, such as -0.5mV to -0.3mV, and the corrosion potential of the titanium alloy in an acidic environment is -0.1mV to +0.1mV.

[0044] Specifically, the impedance of the above-mentioned insulating layer 23 is ≥3000Ω, ≥5000Ω, ≥10 4 Ω, ≥2×10 4 Ω, ≥5×10 4 Ω, ≥10 5 Ω, ≥5×10 5 Ω, etc. In some embodiments, the impedance of the insulating layer 23 is greater than or equal to 10 6 Ω (i.e., 1 megohm). In this case, the impedance of the insulating layer 23 is very low, and the insulating barrier effect on the surface of the decorative layer 22 is very good, so that the circuit formed between the first metal matrix 11 and the second metal matrix 21 in a sweat or salt spray environment can be effectively blocked, preventing the first structural member 10 from being corroded.

[0045] Figure 3A 、 Figure 3B FIGS. 24 and 25 are two structural schematic diagrams of the electronic device 1000 provided in some embodiments of the present application. Among them, Figure 3A than Figure 2 has the following AF layer 24 added. Figure 3B than Figure 2 has the following AF layer 24 and primer layer 25 added.

[0046] In some embodiments of the present application, such as Figure 3AAs shown, the second structural member 20 further includes an anti-fingerprint film (AF film for short) 24, and the AF film 24 is located on the side of the insulating layer 23 away from the second metal substrate 21 (which is also the side of the insulating layer 23 away from the decorative layer 22). Among them, the material of the AF film 24 includes fluorine-containing compounds and / or silicon-containing compounds. These two types of compounds have hydrophobic and oleophobic properties, making the surface of the second structural member 20 easy to clean and having excellent fingerprint resistance. Exemplarily, the fluorine-containing compounds may include polytetrafluoroethylene, chlorfluazuron, etc. The surface energy of the fluorine-containing compounds is very low, and the AF film 24 containing them has stronger anti-fingerprint residue ability.

[0047] In the embodiments of the present application, the water contact angle on the surface of the AF film 24 can be above 80°. The relatively high water contact angle on the surface of the AF film 24 can reflect that the surface of the AF film has excellent anti-fouling performance. Specifically, this water contact angle refers to the water contact angle on the surface of the AF film 24 away from the second metal substrate 21. In some embodiments, the water contact angle on the surface of the AF film 24 can be above 90°, and further can be above 100° or above 110°.

[0048] In some embodiments of the present application, as Figure 3B shown, the second structural member 20 further includes an underlayer 25, and the underlayer 25 is located between the second metal substrate 21 and the decorative layer 22. The underlayer 25 is used to increase the adhesion between the decorative layer 22 and the second metal substrate 21.

[0049] The underlayer 25 is commonly made of a metal material. Exemplarily, the material of the underlayer 25 may include one or more of titanium (Ti), chromium (Cr), tungsten (W), niobium (Nb), nickel (Ni), molybdenum (Mo), or their alloys. The underlayer 25 can be a single metal layer, or a stack of two or more single metal layers, or a metal alloy layer, or a stack of a single metal layer and a metal alloy layer, etc. In some embodiments of the present application, the underlayer 25 includes a Ti layer, a Cr layer, a W layer, a Nb layer, a Ni layer, a Mo layer, or their alloy layers (such as a TiAl alloy layer). Optionally, the thickness of the underlayer 25 can be 5 nm - 200 nm, for example, specifically 10 nm, 20 nm, 30 nm, 50 nm, 80 nm, 100 nm, 120 nm, or 150 nm, etc.

[0050] In an embodiment of the present application, the decorative layer 22 includes a carbide containing a metal element, a nitride containing a metal element, or a carbonitride containing a metal element. These carbides, nitrides, or carbonitrides can give the decorative layer 22 a certain color, so that the second structural member 20 has a certain appearance effect. In some embodiments of the present application, the decorative layer 22 includes a carbide layer containing a metal element, a nitride layer containing a metal element, or a carbonitride layer containing a metal element. The impedance of these decorative layers 22 is low (generally below 10Ω), so the present application sets an insulating layer 23 thereon, which can isolate the second metal substrate 21 with the decorative layer 22 and the above-mentioned first metal substrate from generating a potential difference under certain conditions.

[0051] The metal elements contained in the decorative layer 22 may include one or more of Ti, Cr, W, Al, and Nb, but are not limited thereto. For example, the decorative layer 22 may include a TiAlC layer, a CrWC layer, or a TiCrCN layer. Furthermore, in some cases, the decorative layer 22 may also include Si. In the embodiment of the present application, the thickness of the decorative layer 22 may be 300 nm to 5 μm, for example, 400 nm, 500 nm, 1 μm, 2 μm, 3 μm, 4 μm, etc.

[0052] In the present application, the decorative layer 22 and the primer layer 25 may be formed by a PVD process, wherein the specific PVD process may include but is not limited to magnetron sputtering, vacuum evaporation, or ion plating (such as arc ion plating, radio frequency ion plating), etc.

[0053] In this application, Figure 2 、 Figure 3A 、 Figure 3B The insulating layer 23 shown in FIG can be an organic insulating layer or an inorganic insulating layer.

[0054] In some embodiments of the present application, the above Figure 2 、 Figure 3A 、 Figure 3B The insulating layer 23 shown in the figure may be an organic insulating layer. Organic insulating layers have very low impedance and are easily formed on the decorative layer without damaging the structure of the decorative layer 22. Organic insulating layers are typically transparent to avoid affecting the appearance of the decorative layer 22. In some possible embodiments, the organic insulating layer may include an epoxy resin layer, an acrylic resin layer, or a polyamide layer. Methods for forming the organic insulating layer include, but are not limited to, brushing, spraying, or electrophoresis.

[0055] In some embodiments, the insulating layer 23 is an epoxy resin layer, for example, specifically a sprayed epoxy resin layer or an electrophoretic epoxy resin layer. The epoxy resin layer has good insulation properties, good wear resistance, strong bonding force with the decorative layer 22, and good water and chemical corrosion resistance. Among them, when spraying a raw material containing epoxy resin and an optional curing agent on the decorative layer 22, heat treatment can be performed after spraying to cure the raw material and form an organic insulating layer with a relatively high bonding force with the decorative layer 22. In another embodiment, the insulating layer 23 is an acrylic resin layer. It can be obtained by curing a liquid coating material containing acrylic resin and a photoinitiator through ultraviolet irradiation.

[0056] In some possible implementation manners, the thickness of the above organic insulating layer can be 1 μm - 10 μm. Exemplarily, the thickness of the organic insulating layer can specifically be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, or 9 μm, etc. An organic insulating layer with a suitable thickness can ensure a good surface insulation effect on the decorative layer 22 without reducing the wear resistance of the decorative layer 22.

[0057] In some other embodiments of the present application, the above Figure 2 , Figure 3A , Figure 3B The insulating layer 23 shown in includes an alternating laminated structure of two inorganic insulating material layers along its thickness direction. Figure 4A , Figure 4B , Figure 4C Show several specific structural schematic diagrams of the electronic device 1000 in this case.

[0058] As D , Figure 4A , Figure 4B Shown, the insulating layer 23 specifically includes at least one first inorganic insulating material layer 231 and at least one second inorganic insulating material layer 232, along the thickness direction of the insulating layer 23 (for example Figure 4C , Figure 4A , Figure 4BIn the direction indicated by the arrow, the first inorganic insulating material layer 231 and the second inorganic insulating material layer 232 are alternately stacked. The refractive indices of the first inorganic insulating material layer 231 and the second inorganic insulating material layer 232 are different. For example, the refractive index of the first inorganic insulating material layer 231 is greater than that of the second inorganic insulating material layer 232. By alternately stacking two inorganic insulating material layers with different refractive indices, an insulating layer 23 with good optical transparency can be obtained, and the optical reflectivity of the insulating layer 23 can be adjusted within a lower range. In addition, the insulating layer 23 formed by alternately stacking two inorganic insulating material layers has excellent wear resistance. In some common embodiments, the number of film layers of the insulating layer 23 is greater than or equal to 3. That is, the number of layers of the first inorganic insulating material layer 231 and / or the second inorganic insulating material layer 232 is greater than or equal to 2.

[0059] In the embodiments of the present application, the above-mentioned insulating layer 23 formed by alternately stacking two inorganic insulating material layers can meet the following wear resistance requirements: after 1000 reciprocating friction tests with a steel wool under a load of 1000 g, the appearance of the insulating layer 23 is not scratched, and the insulation impedance of the insulating layer 23 is still ≥2000 Ω.

[0060] If the first inorganic insulating material layer 231 is denoted as layer A and the second inorganic insulating material layer 232 is denoted as layer B, then in the insulating layer 23, the total number of layers of layer A can be equal to or different from the total number of layers of layer B. It should be noted that Figure 4C , Figure 4A , Figure 4B in, the actual positions and actual structures of the first inorganic insulating material layer 231 and the second inorganic insulating material layer 232 are not limited by these drawings. For example, in the direction from the decorative layer 22 to the insulating layer 23, the film layer arrangement form of the insulating layer 23 can be (A - B) n (as Figure 4C shown), or (A - B) n -A, or (B - A) n , or (B - A) n -B; where n is an integer greater than or equal to 1. The thicknesses of each layer A can be the same or different. The thicknesses of each layer B can be the same or different.

[0061] In the embodiments of the present application, the thickness of the alternating stacked structure (that is, the insulating layer 23) is 500 nm - 2000 nm. Exemplarily, the thickness of the insulating layer 23 can be specifically 600 nm, 800 nm, 900 nm, 1000 nm, 1200 nm, 1500 nm, 1800 nm, or 2000 nm, etc. In this case, the insulating layer has an appropriate thickness, which is beneficial to ensuring that the insulating layer can provide a sufficiently high impedance and good wear resistance, and will not be easily detached from the decorative layer 22 due to excessive thickness.

[0062] In the embodiments of the present application, the first inorganic insulating material layer 231 may include one of a silicon nitride layer, an aluminum nitride layer, a niobium oxide layer, a silicon oxynitride layer, an aluminum oxynitride layer, a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, and a silicon niobium oxynitride layer. The second inorganic insulating material layer 232 includes one of a silicon oxide layer, an aluminum oxide layer, a silicon aluminum oxide layer, and a silicon niobium oxide layer.

[0063] Exemplarily, when forming a silicon oxynitride layer by a magnetron sputtering process, the target used may be a Si target, and an inert gas (such as argon), nitrogen (N2), and oxygen (O2) are introduced to deposit and form a silicon oxynitride layer. When forming a silicon aluminum nitride layer by a magnetron sputtering process, the targets used include a Si target and an Al target, and argon and N2 are introduced to deposit the target coating. When forming a silicon aluminum oxynitride layer by a magnetron sputtering process, the targets used include a Si target and an Al target, and argon, N2, and O2 are introduced to deposit the target coating.

[0064] In some embodiments of the present application, the first inorganic insulating material layer 231 includes one of a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, and a silicon niobium oxynitride layer. The second inorganic insulating material layer 232 includes a silicon aluminum oxide layer or a silicon niobium oxide layer. In this case, the insulating layer 23 formed by alternately laminating such a first inorganic insulating material layer 231 and a second inorganic insulating material layer 232 in sequence not only has good optical transparency, but also has higher hardness and more excellent wear resistance.

[0065] In some embodiments of the present application, as Figure 4A and Figure 4B shown, the second structural member 20 further includes an intermediate layer 26, and the intermediate layer 26 is disposed between the decorative layer 22 and the insulating layer 23. Among them, the intermediate layer 26 may include one or more of a Ti layer, a Cr layer, a W layer, and a Nb layer. The applicant has found through a series of studies that when the intermediate layer 26 disposed between the decorative layer 22 and the insulating layer 23 is selected from these metal layers, the film layer bonding force between the above-mentioned insulating layer 23 formed by alternately laminating two inorganic insulating material layers and the decorative layer 22 made of a material including a metal nitride, a metal carbide, or a metal carbonitride can be ensured to be relatively strong, and the risk of the insulating layer 23 peeling off from the decorative layer 22 can be greatly reduced.

[0066] In the embodiments of the present application, the thickness of the intermediate layer 26 may be 1 nm - 50 nm. Exemplarily, the thickness of the intermediate layer 26 may specifically be, for example, 2 nm, 3 nm, 5 nm, 8 nm, 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, or 45 nm, etc. An intermediate layer 26 with a suitable thickness can ensure relatively strong bonding force between the insulating layer 23 and the decorative layer 22, and will not affect the color of the decorative layer 22 due to the too large thickness of the intermediate layer 26.

[0067] In some cases, such as Figure 4C , Figure 4A and Figure 4B shown, the second structural member 20 further includes an AF layer 24, and the AF layer 24 is located on a side of the insulating layer 23 away from the second metal matrix 21. The AF layer 24 can improve the fingerprint resistance of the exposed surface of the second structural member 20 (i.e., the surface that can be touched by a user's finger). In some cases, such as Figure 4C and Figure 4B shown, the second structural member 20 further includes a primer layer 25, and the primer layer 25 is located between the second metal matrix 21 and the decorative layer 22. The primer layer 25 is used to increase the bonding force between the decorative layer 22 and the second metal matrix 21. Regarding the primer layer 25 and the AF layer 24, reference may be made to the description in the foregoing of this application. In addition, it should be noted that Figure 4C in, a primer layer 25 may also be provided between the second metal matrix 21 and the decorative layer 22.

[0068] In some embodiments of the present application, such as Figure 4A shown, a superhard layer 27 is further provided on a side of the insulating layer 23 away from the second metal matrix 21. Figure 4C in, the superhard layer 27 is located between the insulating layer 23 and the anti-fingerprint layer 24. The superhard layer 27 can improve the scratch resistance of the insulating layer 23 formed by alternately laminating two inorganic insulating material layers. Among them, the hardness of the superhard layer 27 is greater than that of the insulating layer 23. In order to avoid affecting the appearance effect presented by the decorative layer 22, the superhard layer 27 is preferably a transparent layer. Exemplarily, the superhard layer 27 may be a diamond-like carbon (DLC) layer.

[0069] It should be noted that, without conflict, the features in each embodiment of the present application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. That is to say, the above-described multiple embodiments can also be arbitrarily combined according to actual needs. For example, Figure 4C in, a primer layer 25 may also be provided between the second metal matrix 21 and the decorative layer 22. For another example, Figure 4A in, an intermediate layer 26 may also be provided between the decorative layer 22 and the insulating layer 23. For another example, Figure 4A in, a superhard layer 27 may also be provided between the insulating layer 23 and the anti-fingerprint layer 24. For another example, Figure 4A in, the primer layer 25 may not exist either.

[0070] As described in the foregoing of this application, the aforementioned first metal substrate 11 may be an aluminum alloy substrate, and the second metal substrate 21 may be a stainless steel substrate, a titanium alloy substrate, a zirconium alloy substrate, or the like. The first metal substrate 11 of the first structural member 10 is electrically connected to the second metal substrate 21 of the second structural member 20. This application does not limit the first structural member 10 and the second structural member 20 in the electronic device 1000 whose metal substrates are electrically connected.

[0071] In some embodiments of this application, the aforementioned electronic device 1000 includes a middle frame and a camera decorative member; one of the first structural member 10 and the second structural member 20 is the middle frame of the electronic device, and the other is the camera decorative member of the electronic device. The electronic device may be a foldable or non-foldable electronic device. In some other embodiments of this application, the aforementioned electronic device 1000 is a foldable electronic device, which includes a rotating shaft and at least two middle frames, and the rotating shaft includes a rotating shaft back cover; wherein, one of the first structural member 10 and the second structural member 20 is the middle frame, and the other is the rotating shaft back cover.

[0072] In this application, the electrical connection between the first metal substrate 11 and the second metal substrate 21 can be understood as that the two are in physical contact and electrically conductive; it can also be understood as that they are indirectly electrically connected through an intermediate medium, for example, connected through a conductive connector (such as a screw, a spring piece, a conductive cloth, a solder pad, etc.), or indirectly conductively connected through a printed circuit board (PCB). The electrical connection situation between them will be introduced below.

[0073] Please refer to Figure 4B and Figure 5A , Figure 5B are schematic structural diagrams of the foldable electronic device 1000 provided by some embodiments of this application in the first state, Figure 5A are schematic structural diagrams of the foldable electronic device 1000 provided by some embodiments of this application in the second state. Figure 5B The electronic device 1000 shown is in a folded state, Figure 5A The electronic device 1000 shown is in an unfolded state, Figure 5B and the unfolding angle in

[0074] is 180°. Figure 5B and Figure 5AAs shown, the electronic device 1000 includes a first housing 110, a second housing 120, and a rotating shaft 200. The rotating shaft 200 is disposed between the first housing 110 and the second housing 120 and fixedly connected to them, enabling the first housing 110 and the second housing 120 to rotate relative to each other through the rotating shaft 200, so that the electronic device 1000 can switch between a folded state and an unfolded state. Among them, both the first housing 110 and the second housing 120 can be a middle frame. The middle frame generally includes a middle plate and a border (reference numerals not shown in the figure), and the border is arranged around the outer periphery of the middle plate.

[0075] As Figure 5B shown, the rotating shaft 200 includes a rotating shaft cover 210, a plurality of swing arms 220, and a plurality of mounting members 230. Some of the mounting members 230 are close to the first housing 110, and some of the mounting members 230 are close to the second housing 120. Among them, a swing arm 220 is disposed between the rotating shaft cover 210 and a mounting member 230. One side of the swing arm 220 is rotatably connected to the rotating shaft cover 210, and the other side of the swing arm 220 is rotatably connected to the mounting member 230. An exemplary mounting member 230 can be a wedge block. Under the action of a driving force, the rotating shaft 200 rotates, and the relative rotation of the first housing 110 and the second housing 120 can be achieved by means of the swing arm 220. Among them, when the electronic device 1000 is in the folded state, the back of the rotating shaft cover 210 can be exposed outside the electronic device 1000 and can be directly observed or touched by the user, while the swing arms 220, mounting members 230, etc. cannot be observed or touched by the user, and can be called internal components of the rotating shaft 200.

[0076] Among them, the above-mentioned rotating shaft cover 210, swing arms 220, and mounting members 230 can all be made of metal materials. In some possible implementation manners, as Figure 5B shown, between each mounting member 230 and the first housing 110, or between each mounting member 230 and the second housing 120, they can be locked by screws. Specifically, it can be that between the mounting member 230 and the middle plate of the first housing 110 or between the mounting member 230 and the middle plate of the second housing 120, they are locked by screws. Thus, an electrical connection can be achieved between the first housing 110 or the second housing 120 and the rotating shaft cover 210. In some other possible implementation manners, between each mounting member 230 and the middle plate of the first housing 110 or between the mounting member 230 and the middle plate of the second housing 120, an electrical connection can be achieved by spot welding, or can also be achieved by means of conductive cloth, conductive adhesive, or metal elastic sheet, etc. In this way, an electrical connection can also be achieved between the first housing 110 or the second housing 120 and the rotating shaft cover 210.

[0077] In some embodiments, the first housing 110 or the second housing 120 is the above-mentioned first structural member 10 of the embodiments of the present application. For example, it is an anodized aluminum alloy middle frame. The rotating shaft cover 210 is the above-mentioned second structural member 20 of the embodiments of the present application, and its metal matrix can be stainless steel, titanium alloy, zirconium alloy, etc. Of course, in other embodiments, it can also be that the first housing 110 or the second housing 120 is the above-mentioned second structural member 20 of the embodiments of the present application, and its metal matrix can be stainless steel, titanium alloy, zirconium alloy, etc., and the rotating shaft cover 210 is the above-mentioned first structural member 10 of the embodiments of the present application, for example, an anodized aluminum alloy rotating shaft cover.

[0078] The electronic device provided by the embodiments of the present application has at least two structural members with different metal matrix activities and electrically connected to each other. By providing an insulating layer with good transparency and high impedance on the decorative layer on the surface of the structural member with low chemical activity metal matrix, the insulating layer can be used to prevent the formation of a closed circuit and generate a potential difference between metal matrices with different chemical activities in a sweat environment containing chloride ions or a salt spray environment, thereby reducing the probability of electrocorrosion of the structural member with high metal matrix activity and better meeting the long-term use requirements of the electronic device.

[0079] The following examples the electrical connection between the middle frame of the electronic device and the camera decorative member. It can be understood that in the above-mentioned foldable electronic device, there are also some middle frames that are electrically connected to the camera decorative member.

[0080] Please refer to Figure 5B , Figure 6 which is a schematic diagram of the rear structure of the electronic device 1000 provided by some other embodiments of the present application. Figure 6 is Figure 7 a partial cross-sectional structural schematic diagram of the electronic device 1000 in

[0081] Please refer to Figure 6 and Figure 6 Figure 7 together. The electronic device 1000 includes a display screen 300, a middle frame 100, a rear cover 400, a camera module 500, and a camera decorative member 600. The camera module 500 can be a rear camera module or a front camera module. In the embodiments of the present application, the camera module 500 is taken as an example of the rear camera module 500 for introduction.

[0082] The rear cover 400 is fixedly connected to the middle frame 100. The middle frame 100 is located between the display screen 300 and the rear cover 400. The middle frame 100 mainly plays a supporting role for the whole machine. The middle frame 100 may include a frame 101 and a middle plate 102, and the frame 101 is arranged around the outer periphery of the middle plate 102 for one week. The display screen 300, the frame 101 and the rear cover 400 jointly enclose the interior of the electronic device 1000. The interior of the electronic device can be used to place electronic components such as a battery, a camera module, a speaker, etc. (not shown in the figure). Among them, the frame 101 is located on the periphery of the electronic device 1000 and can be directly observed or touched by the user. The frame 101 and the middle plate 102 can be made of metal materials, such as anodized aluminum alloy or titanium alloy with a decorative layer, etc. Among them, the connection manner between the frame 101 and the middle plate 102 includes but is not limited to welding or snap connection, etc.; or the two can be integrally formed.

[0083] Among them, the electronic device 1000 further includes a main board 700, for example, a PCB board. The main board 700 is housed in the housing space jointly defined by the middle frame 100 and the rear cover 400. Exemplarily, in some embodiments, the main board 700 is arranged on the surface of the middle plate 102 of the middle frame 100 facing the rear cover 400. Among them, the main board 700 can be fixed on the middle plate 102 by means of screwing, and of course, it can also be electrically connected to the middle plate 102 through conductive adhesive, conductive cloth, elastic sheet, welding, etc.

[0084] The camera module 500 can be located inside the electronic device 1000, for example, it can be arranged on the surface facing the rear cover 400. In some embodiments, the camera module 500 may include a module circuit board 51, a bracket 52, a lens 53 and an image sensor 54. Among them, the bracket 52 is fixed to the module circuit board 51, a motor (not shown in the figure) can be installed on the bracket 52, the lens 53 is installed on the motor, and the motor can drive the lens 53 to move. The image sensor 54 is fixed to the module circuit board 51 and is electrically connected to it, and signals can be transmitted between the two. The image sensor 54 and the bracket 52 are located on the same side of the module circuit board 51. An exemplary bracket 52 can be a metal bracket. Among them, the module circuit board 51 can be electrically connected to the main board 700, for example, the two can be electrically connected by means of welding or conductive adhesive, etc. In some embodiments, the module circuit board 51 can be arranged on the main board 700, or both are arranged on the middle plate 102.

[0085] The camera decoration 600 can be installed on the rear cover 400 to decorate the lens 53 of the camera module 500. Among them, light-transmitting holes (as indicated by the arrows) can be opened on the rear cover 400 and the camera decoration 600, so that light outside the electronic device 1000 can enter the interior of the electronic device 1000 through the light-transmitting holes.

[0086] In some embodiments, the camera decorative member 600 can be elastically connected to the module circuit board 51 through the first conductive elastic sheet 61. One end of the first conductive elastic sheet 61 can be fixed to the module circuit board 51 by means such as welding or conductive adhesive. The first conductive elastic sheet 61 can be deformed under stress, and the other end thereof can be in contact with the camera decorative member 600, so as to realize the elastic connection between the camera decorative member 600 and the module circuit board 51. Among them, the material of the first conductive elastic sheet 61 can be phosphor bronze, tin bronze, or the like.

[0087] Since the module circuit board 51 is electrically connected to the main board 700, and the main board 700 can be conductively connected to the middle plate of the middle frame 100, the camera decorative member 600 can indirectly realize electrical connection with the middle frame 100. In addition, in other embodiments, the camera decorative member 600 can also be elastically connected to the bracket 52 of the camera module 500 through another conductive elastic sheet. Since the bracket 52 is electrically connected to the main board 700 through the module circuit board 51, the camera decorative member 600 can also indirectly realize electrical connection with the middle frame 100.

[0088] In some possible embodiments, the camera decorative member 600 is an anodized aluminum alloy camera decorative member, and the middle frame 100 has a metal matrix with a corrosion potential higher than that of the aluminum alloy, such as a titanium alloy. In this case, that is, the camera decorative member 600 is the above-mentioned first structural member 10 of the embodiment of the present application, and the middle frame 100 is the above-mentioned second structural member 20 of the embodiment of the present application. The insulating layer of the embodiment of the present application can be provided on the decorative layer of the metal matrix of the middle frame 100.

[0089] In the present application, an insulating layer with good transparency and high impedance is provided on the decorative layer of the middle frame matrix with a high corrosion potential. By means of this insulating layer, a closed loop can be prevented from being formed between the middle frame matrix and the matrix of the camera decorative member 600 electrically connected thereto in a sweat environment or a salt spray environment containing chloride ions, so as to generate a potential difference, and further reduce the probability of electrocorrosion of the camera decorative member 600 with a high metal matrix activity, better meeting the long-term use requirements of electronic devices.

[0090] In other embodiments, it can also be that the middle frame 100 is an anodized aluminum alloy middle frame, and the camera decorative member 600 has a metal matrix with a corrosion potential higher than that of the aluminum alloy, such as a titanium alloy, stainless steel, etc. In this case, that is, the middle frame 100 is the above-mentioned first structural member 10 of the embodiment of the present application, and the camera decorative member 600 is the above-mentioned second structural member 20 of the embodiment of the present application. The insulating layer of the embodiment of the present application can be provided on the decorative layer of the metal matrix of the camera decorative member 600.

[0091] The embodiments of the present application will be further described below with multiple embodiments.

[0092] Embodiment 1

[0093] A foldable mobile phone includes a rotating shaft back cover and a middle frame. The middle frame is made of anodized aluminum alloy. The rotating shaft back cover includes a SUS316L stainless steel substrate, and a primer layer (specifically a TiAl layer), a gold decorative layer (specifically a TiAlC layer), an insulating layer, and an anti-fingerprint layer that are sequentially stacked on the substrate. The substrate of the rotating shaft back cover is electrically connected to the middle frame. The insulating layer is formed by alternately depositing silicon aluminum oxide layers and silicon aluminum nitride layers on the gold decorative layer, that is, the insulating layer includes alternately stacked silicon aluminum oxide layers and silicon aluminum nitride layers, and the total number of layers of the two is 20 layers, and each of the two has 10 layers. The insulating layer is a transparent layer with a thickness of 1300 nm. The impedance of the insulating layer ≥ 1 megaohm.

[0094] Upon visual observation, after the above-mentioned insulating layer is provided on the gold decorative layer, the appearance effect of the above-mentioned rotating shaft back cover is still gold. This shows that the insulating layer does not affect the appearance effect.

[0095] The foldable mobile phone sample of Example 1 was subjected to an electro-corrosion test, specifically including: using a dust-free cloth to adsorb acidic sweat or alkaline sweat to completely wrap the appearance surface of the foldable mobile phone as a whole, and placing it in a high-temperature and high-humidity incubator at a temperature of 55 °C and a relative humidity of 95% for 48 h, and then checking whether the appearance of the structural parts of the whole machine is corroded. It was found that the aluminum alloy middle frame electrically connected to the substrate of the rotating shaft back cover of Example 1 did not show an electro-corrosion phenomenon.

[0096] The coating reliability test was carried out on the rotating shaft back cover used in Example 1, specifically including boiling water cross-cut test, high-temperature and high-humidity test, alternate damp-heat test, acid / alkali sweat test, salt spray test, vibration friction test, steel wool test, etc. It was found that all of them could pass the above-mentioned coating reliability test, which indicates that the insulating layer in the rotating shaft back cover used in Example 1 is not easily detached from the decorative layer and has high reliability. Among them, in the steel wool test under a load of 1000 g, after 1000 reciprocating frictions, the appearance of the insulating layer has no wear and the impedance is still ≥ 2000 Ω.

[0097] Example 2

[0098] A foldable mobile phone, which is different from that of Example 1 in that: in the rotating shaft back cover, an intermediate layer is further provided between the gold decorative layer and the insulating layer, specifically a Ti layer with a thickness of 20 nm.

[0099] According to the method described in Example 1, the foldable mobile phone sample of Example 2 was subjected to an electro-corrosion test. It was found that the foldable mobile phone sample of Example 2 could pass the electro-corrosion test, and the aluminum alloy middle frame electrically connected to the substrate of the rotating shaft back cover did not show an electro-corrosion phenomenon.

[0100] In addition, the rotating shaft back covers used in Example 2 can all pass coating reliability tests such as boiling water cross-cut test, high temperature and high humidity test, damp heat, cyclic test, acid / alkali sweat test, salt spray test, vibration friction test, steel wool test, etc. Moreover, after the rotating shaft back cover of Example 2 undergoes the boiling water cross-cut test, the surface film layer can reach the 4B grade of the cross-cut test, which is higher than that of Example 1 above (the grade reached in the boiling water cross-cut test in Example 1 is 3B grade). This indicates that the bonding strength between the insulating layer and the gold decorative layer in Example 2 is higher than that in Example 1, and the insulating layer is less likely to peel off from the gold decorative layer.

[0101] Example 3

[0102] A foldable mobile phone includes a rotating shaft back cover and a middle frame. The middle frame is anodized aluminum alloy. The rotating shaft back cover includes a SUS316L stainless steel substrate, and a primer layer (specifically the W layer), a black decorative layer (specifically the CrWC layer), an insulating layer, and an anti-fingerprint layer that are sequentially stacked on the substrate. The substrate of the rotating shaft back cover is electrically connected to the middle frame. Among them, the insulating layer is a transparent electrophoretic epoxy resin layer with a thickness of 5 μm. The surface impedance of the insulating layer is ≥2000 Ω.

[0103] According to the method described in Example 1, the foldable mobile phone sample of Example 3 was subjected to an electro-corrosion test. The results showed that in the mobile phone of Example 3, no electro-corrosion occurred in the aluminum alloy middle frame electrically connected to the substrate of the rotating shaft back cover. Moreover, in the rotating shaft back cover of Example 3, the bonding strength between the insulating layer and the black decorative layer is high, and it can pass various coating reliability tests.

[0104] Example 4

[0105] A mobile phone includes a middle frame and a camera decorative part. The camera decorative part is anodized aluminum alloy. The middle frame includes a titanium alloy middle frame substrate, and a primer layer (specifically the Cr layer), a gold decorative layer (specifically the TiCrCN layer), an insulating layer, and an anti-fingerprint layer that are sequentially stacked on the substrate. The substrate of the rotating shaft back cover is electrically connected to the middle frame. The insulating layer is formed by alternately depositing niobium silicon oxide layer and niobium silicon nitride layer on the gold decorative layer, that is, the insulating layer includes alternately stacked niobium silicon oxide layer and niobium silicon nitride layer, and the total number of layers of the two is 16 layers. The insulating layer is a transparent layer with a thickness of 1100 nm. The impedance of the insulating layer is ≥1 MΩ.

[0106] In the middle frame of Example 4, setting the above-mentioned insulating layer on the gold decorative layer on the titanium alloy middle frame substrate does not affect the appearance effect of the middle frame. In addition, according to the method described in Example 1, the mobile phone sample of Example 4 was subjected to an electro-corrosion test. The results showed that in the mobile phone of Example 4, no electro-corrosion occurred in the camera decorative part.

[0107] Comparative Example 1

[0108] The foldable mobile phone of Comparative Example 1 is different from that of Example 1 in that there is no insulating layer between the gold decorative layer and the fingerprint-resistant layer.

[0109] According to the method described in Example 1, the foldable mobile phone samples of Comparative Example 1 were respectively subjected to electrocorrosion tests in an acidic sweat environment and an alkaline sweat environment. The results showed that after 24 hours of electrocorrosion test of the foldable mobile phone of Comparative Example 1 under high temperature and high humidity, serious electrocorrosion occurred in the aluminum alloy middle frame electrically connected to the rotating shaft back cover substrate. This indicates that setting an insulating layer with high impedance on the decorative layer of a metal substrate with a high corrosion potential in this application can well solve the electrocorrosion problem of another metal part electrically connected to the metal substrate.

[0110] The above only expresses the exemplary embodiments of this application, and the description is relatively specific and detailed, but it should not be construed as a limitation of the patent scope of this application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several deformations and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application shall be subject to the appended claims.

[0111] In the description of the embodiments of this application, it should be noted that unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected and the relative position relationship after connection remains unchanged. "Rotational connection" means that the two are connected and can rotate relative to each other after connection. The orientation terms mentioned in the embodiments of this application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", etc., are only references to the direction of the attached drawings. Therefore, the orientation terms used are for better and clearer explanation and understanding of the embodiments of this application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the embodiments of this application.

[0112] In addition, in the embodiments of this application, the limitations of the relative position relationship are mentioned, such as parallel, perpendicular, alignment, etc. These limitations are all in view of the current process level and are not absolutely strict limitations. A small deviation is allowed, and approximate parallel, approximate perpendicular, approximate alignment, etc. are all acceptable. For example, A is parallel to B means that A is parallel to B or approximately parallel to B, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, A is perpendicular to B means that A is perpendicular to B or approximately perpendicular to B, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0113] In this application, "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, or B exists alone, where A and B may be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0114] In the description of this application, unless otherwise specified, the meaning of "multiple (kinds)" refers to two (kinds) or more. "At least one (kind)" means one (kind) or more. "At least one of the following" or its similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can both represent: a, b, c, a - b (i.e., a and b), a - c, b - c, or a - b - c, where a, b, and c can be single or multiple respectively. The terms "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of such features.

[0115] In addition, the numerical range represented by "-" in this application refers to the range that includes the numerical values recorded before and after "-" as the minimum value and the maximum value respectively. Expressions regarding parameter ranges in this application, such as "greater than or equal to (≥)", "less than or equal to (≤)", "above...", and "below..." all include the number itself. The numerical values and numerical ranges involved in the embodiments of this application are approximate values. Affected by manufacturing processes / testing methods, etc., there may be a certain range of errors, which can be considered negligible by those skilled in the art.

Claims

1. An electronic device (1000), characterized in that, The electronic device (1000) includes: A first structural member (10), including a first metal substrate (11); A second structural member (20), including a second metal substrate (21), a decorative layer (22) and an insulating layer (23) provided on one side of the second metal substrate (21), where the decorative layer (22) is located between the second metal substrate (21) and the insulating layer (23); wherein, the second metal substrate (21) is electrically connected to the first metal substrate (11), and the corrosion potential of the first metal substrate (11) is lower than that of the second metal substrate (21); the insulating layer (23) is a transparent or semi-transparent layer, and the impedance of the insulating layer (23) is greater than or equal to 2000 Ω.

2. The electronic device according to claim 1, wherein The insulating layer (23) includes a first inorganic insulating material layer (231) and a second inorganic insulating material layer (232) alternately stacked, and the refractive index of the first inorganic insulating material layer (231) is greater than that of the second inorganic insulating material layer (232).

3. The electronic device according to claim 2, wherein The thickness of the insulating layer (23) is 500 nm - 2000 nm.

4. The electronic device according to claim 2, characterized in that, The first inorganic insulating material layer (231) includes a silicon nitride layer, an aluminum nitride layer, a niobium oxide layer, a silicon oxynitride layer, an aluminum oxynitride layer, a silicon aluminum nitride layer, a silicon niobium nitride layer, a silicon aluminum oxynitride layer, or a silicon niobium oxynitride layer; The second inorganic insulating material layer (232) includes a silicon oxide layer, an aluminum oxide layer, a silicon aluminum oxide layer, or a silicon niobium oxide layer.

5. The electronic device according to claim 2, wherein The second structural member (20) further includes an intermediate layer (26), and the intermediate layer (26) is provided between the decorative layer (22) and the insulating layer (23); wherein, the intermediate layer (26) includes one or more of a titanium layer, a chromium layer, a tungsten layer, and a niobium layer.

6. The electronic device according to claim 5, wherein The thickness of the intermediate layer (26) is 1 nm - 50 nm.

7. The electronic device according to claim 2, characterized in that, A superhard layer (27) is further provided on the side of the insulating layer (23) facing away from the second metal substrate.

8. The electronic device according to claim 1, characterized in that, The insulating layer (23) is an organic insulating layer.

9. The electronic device according to claim 8, wherein, The thickness of the organic insulating layer is 1 μm - 10 μm.

10. The electronic device according to claim 8, wherein The organic insulating layer includes a sprayed epoxy resin layer, or an electrophoretic epoxy resin layer, or an acrylic resin cured layer.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The second structural member (20) further includes an anti-fingerprint layer (24), and the anti-fingerprint layer (24) is located on the side of the insulating layer (23) facing away from the second metal substrate (21).

12. The electronic device according to claim 11, wherein The surface water contact angle of the anti-fingerprint layer (24) is above 80°.

13. The electronic device according to any one of claims 1 to 10, characterized in that, The decorative layer (22) includes a carbide layer containing a metal element, a nitride layer containing a metal element, or a carbonitride layer containing a metal element.

14. The electronic device according to any one of claims 1-10, characterized in that, The second structural member (20) further includes an underlayer (25), and the underlayer (25) is located between the second metal substrate (21) and the decorative layer (22).

15. The electronic device according to claim 14, characterized in that, The underlayer (25) includes one or more of Ti, Cr, W, Nb, Ni, Mo layers or their alloy layers.

16. The electronic device according to any one of claims 1-10, characterized in that, The first metal substrate (11) includes an aluminum alloy substrate, and the second metal substrate (21) includes a stainless steel substrate, a titanium alloy substrate, or a zirconium alloy substrate.

17. The electronic device according to any one of claims 1 to 10, characterized in that One of the first structural member (10) and the second structural member (20) is a middle frame of the electronic device, and the other is a camera decorative member or a rotating shaft back cover of the electronic device.

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