Light-emitting device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a luminescent device, which comprises a substrate, a resin cup, a luminescent chip, a light-transmitting glue layer and a gold wire. The resin cup is arranged on the substrate, and a cavity with an opening in one side is defined by the resin cup and the substrate. The light-emitting chip is arranged on the substrate and in the resin cup. The light-transmitting glue layer at least covers part of the upper surface of the light-emitting chip. And the gold wire is connected with the substrate and the light-emitting chip. The inner wall of the periphery of the resin cup is provided with a protruding structure close to the light-emitting chip. And concave structures far away from the light-emitting chip are arranged between the convex structures. The inwards-concave structure is used for containing gold threads. According to the utility model, the convex structure and the concave structure are arranged, so that the use amount of filling glue can be reduced, and the production cost is reduced; meanwhile, the bonding area of the filling glue and the resin cup is increased, and the reliability of the product is greatly improved. The light-emitting device is simple in manufacturing process, high in production efficiency and high in product yield.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor lighting, and particularly relates to a light-emitting device. Background Art

[0002] The brackets of the existing light-emitting devices mainly include plate-shaped brackets and bowl-shaped brackets. One of the forming methods of the existing bowl-shaped brackets: a bowl-shaped metal cup 7 is formed by accumulating a metal layer around the periphery of a planar ceramic substrate 1, referring to Figure 6 、 7 . The light-emitting chip 3 is fixed on the substrate 1 and inside the metal cup 7. According to needs, a light-transmitting glue layer 4 can be covered on the light-emitting chip 3, and a filling glue 9 is arranged between the periphery of the light-emitting chip 3 and the light-transmitting glue layer 4 and the metal cup 7 to protect the gold wire 5 and make the whole structure more stable.

[0003] Existing problems: 1. Since the metal cup 7 has conductivity, an insulating groove 8 needs to be arranged between the metal cup 7 and the electrode of the substrate 1. Therefore, the internal cavity size of the metal cup 7 is large, the amount of the filling glue 9 used is large, and the overall cost is high. 2. The cross-section of the internal cavity of the metal cup 7 is usually rectangular or quasi-rectangular, and the filling glue 9 is not firmly bonded to the metal cup 7, and the gold wire 5 is easily exposed, which will lead to a reduction in the product yield. 3. The cup shape consistency of the metal cup 7 is poor. Referring to Figure 7 , the sizes of the inner walls of the metal cup 7 formed by accumulating the metal layer are not uniform, and the filling heights and shapes of the filling glue 9 with the same amount of glue in different metal cups 7 are inconsistent, and the manufacturing process is complex.

[0004] Based on the above, the problems to be solved currently: provide a light-emitting device with reliable structure, less filling glue amount, low production cost, high yield, and simple production process. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a light-emitting device, aiming to solve the problems in the prior art that the structure reliability of the light-emitting device is poor, the production cost is high, the yield is low, and the production process is complex.

[0006] The utility model is realized as follows. The light-emitting device includes:

[0007] A substrate;

[0008] A resin cup, which is arranged on the substrate and encloses a cavity with one side open with the substrate;

[0009] A light-emitting chip, which is arranged on the substrate and inside the resin cup;

[0010] A light-transmitting glue layer, which at least covers a part of the upper surface of the light-emitting chip;

[0011] A gold wire, which connects the substrate and the light-emitting chip;

[0012] The inner walls around the resin cup are provided with raised structures close to the light-emitting chip; there are concave structures away from the light-emitting chip between the raised structures, and the concave structures are used to accommodate the gold wires.

[0013] Furthermore, a highly reflective adhesive layer is provided between the periphery of the light-emitting chip, the periphery of the light-transmitting adhesive layer and the inner wall of the resin cup; the highly reflective adhesive layer at least covers the side surface of the light-transmitting adhesive layer.

[0014] Furthermore, the upper surface of the resin cup is provided with a groove for accommodating the highly reflective adhesive layer, and the highly reflective adhesive layer covers the inner wall of the resin cup and extends into the groove.

[0015] Furthermore, the substrate and the resin cup are of an integrally formed structure, or the substrate and the resin cup are a combined structure formed by separate independent molding and then bonding.

[0016] Furthermore, the light-transmitting adhesive layer is a fluorescent adhesive layer.

[0017] Furthermore, the upper surface of the raised structure is higher than or equal to the upper surface of the light-transmitting adhesive layer.

[0018] Compared with the prior art, the light-emitting device provided by the present utility model has the following beneficial effects:

[0019] The resin cup 2 of the present utility model is provided with a raised structure 21 and a concave structure 22 more than the prior art. The concave structure 22 can accommodate the gold wire 5 to protect the gold wire 5. The raised structure 21 reduces the space between the resin cup 2, the light-emitting chip 3 and the light-transmitting adhesive layer 4, that is, reduces the amount of filling glue used, and can reduce the production cost. At the same time, the raised structure 21 increases the inner wall area of the resin cup 2, increases the bonding area between the filling glue and the resin cup 2, makes the combination more stable, and also reduces the stress between the filling glue and the resin cup 2, greatly improving the reliability of the product.

[0020] The resin cup 2 itself is insulated, and there is no need to set an insulating groove 8 compared with the metal cup 7 of the prior art, so the internal cavity size of the resin cup 2 is small. At the same time, the setting of the raised structure 21 further reduces the size of the internal cavity, greatly reduces the amount of filling glue (highly reflective glue) used, and greatly reduces the cost. In addition, the resin cup 2 and the filling glue material (highly reflective glue) are similar, and the stress between the two after bonding is much smaller than the stress between the metal cup 7 and the filling glue. The structure of the present utility model is more reliable.

[0021] The utility model can be completed at one time by first batch-injection molding a hollow resin cup 2 and then aligning and bonding the resin cup 2 with a planar ceramic substrate 1. The above manufacturing method has the following advantages: 1. The resin cup 2 is formed by a mold, and the cup shape can be customized, with flexible design and stable cup shape; 2. The appearance, structure and stress can be balanced, and the structure is more stable and reliable; 3. The process is simple and the production efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a three-dimensional structural schematic diagram of a light-emitting device provided by the utility model;

[0023] Figure 2 is a three-dimensional structural schematic diagram of the light-emitting device of Embodiment 1 provided by the utility model;

[0024] Figure 3 is a three-dimensional structural schematic diagram of the light-emitting device of Embodiment 2 provided by the utility model;

[0025] Figure 4 is provided by the utility model Figure 2 cross-sectional structural schematic diagram of the light-emitting device;

[0026] Figure 5 is provided by the utility model Figure 3 cross-sectional structural schematic diagram of the light-emitting device;

[0027] Figure 6 is a three-dimensional structural schematic diagram of a light-emitting device of the prior art;

[0028] Figure 7 is a cross-sectional structural schematic diagram of a light-emitting device of the prior art;

[0029] In the figure: 1 - substrate; 2 - resin cup; 21 - convex structure; 22 - concave structure; 23 - groove; 24 - boss; 3 - light-emitting chip; 4 - light-transmitting adhesive layer; 5 - gold wire; 6 - high-reflection adhesive layer; 7 - metal cup; 8 - insulating groove; 9 - filling adhesive. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0031] The implementation of the present utility model will be described in detail below with reference to specific embodiments.

[0032] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0033] Referring to Figures 1-7 as shown, it is a preferred embodiment provided by the present utility model.

[0034] A light-emitting device includes a substrate 1, a resin cup 2, a light-emitting chip 3, a light-transmitting glue layer 4, and a gold wire 5. Referring to Figure 1 . The resin cup 2 is provided on the substrate 1, and the resin cup 2 and the substrate 1 enclose a cavity that is open on the side away from the light-emitting chip 3. The cavity is used to accommodate the light-emitting chip 3, the light-transmitting glue layer 4, and the gold wire 5.

[0035] The light-emitting chip 3 is fixed on the substrate 1 and inside the resin cup 2. The light-transmitting glue layer 4 covers part or all of the upper surface of the light-emitting chip 3, and according to needs, it can also cover the side surface of the light-emitting chip 3. Fluorescent particles, diffusion particles, etc. can be provided in the light-transmitting glue layer 4 as needed, that is, the light-transmitting glue layer 4 can be a fluorescent glue layer or a diffusion glue layer, etc. The gold wire 5 is electrically connected to the substrate 1 and the light-emitting chip 3. The outer contour of the upper surface of the light-transmitting glue layer 4 can be set to a circle, a rectangle, a rhombus, etc. according to the application scenario. The upper surface (i.e., the light-emitting interface) of the light-transmitting glue layer 4 can be set to a plane or a curved surface.

[0036] The inner walls around the resin cup 2 are provided with protruding structures 21 extending towards the light-emitting chip 3. There are concave structures 22 recessed in the direction away from the light-emitting chip 3 between the protruding structures 21. The resin cup 2 of the present utility model is provided with protruding structures 21 and concave structures 22 more than the prior art. The concave structure 22 can accommodate the gold wire 5 and protect the gold wire 5. The protruding structure 21 reduces the space between the resin cup 2 and the light-emitting chip 3 and the light-transmitting glue layer 4, that is, reduces the amount of filling glue used, and can reduce production costs; at the same time, the protruding structure 21 increases the inner wall area of the resin cup 2, increases the bonding area between the filling glue and the resin cup 2, and the stress between the filling glue and the resin cup 2 is small, making the combination of the two more stable and greatly improving the reliability of the product. Preferably, the concave structure 22 is provided at the top corners of the inner cavity of the resin cup 2, that is, at the top corners of the top view of the resin cup 2. The cross-section of the concave structure 22 can be set to a triangle, a quasi-triangle, a circular arc, an elliptical arc, etc. The cross-section of the protruding structure 21 can be set to a rectangle, a quasi-rectangle, a trapezoid, etc.

[0037] The specific embodiments are as follows:

[0038] Example 1, refer to Figure 2 、 4 A highly reflective adhesive layer 6 is provided around the perimeter of the light-emitting chip 3, around the perimeter of the transparent adhesive layer 4, and between the inner wall of the resin cup 2. The highly reflective adhesive layer 6 covers all or part of the gold wire 5, effectively protecting the gold wire 5 and ensuring product reliability. The highly reflective adhesive layer 6 covers part or all of the side surfaces of the transparent adhesive layer 4, but does not cover the top surface (i.e., the light-emitting interface) of the transparent adhesive layer 4, ensuring that light is emitted from the top surface of the transparent adhesive layer 4, thereby improving light energy utilization. Preferably, the top surface of the raised structure 21 is higher than or equal to the top surface of the transparent adhesive layer 4.

[0039] The substrate 1 and the resin cup 2 can be set as an integrally formed structure. The substrate 1 and the resin cup 2 can also be set to be formed separately and then bonded into a combined structure by adhesive. The preferred manufacturing method is: First, prefabricate the hollow resin cup 2. Use molds for batch injection molding. Then, align and fit the resin cup 2 with the flat ceramic substrate 1 of the substrate, and complete it in one go. The above manufacturing method has the following advantages: 1. The resin cup 2 is formed by a mold, the cup shape can be personalized, the design is flexible, and the cup shape is stable; 2. The appearance, structure and stress can be balanced, and the structure is more stable and reliable; 3. The process is simple and the production efficiency is high.

[0040] Example 2, refer to Figure 3 、 5 , the upper surface of the resin cup 2 is provided with a groove 23 for accommodating a high-reflective adhesive layer 6. The surface of the groove 23 is connected to the surface of the convex structure 21 and the concave structure 22. The amount of high-reflective adhesive is controlled so that the high-reflective adhesive fills the space between the resin cup 2 and the light-emitting chip 3, and the space between the resin cup 2 and the light-transmitting adhesive layer 4, and then overflows into the groove 23. After curing, the high-reflective adhesive layer 6 covers the inner wall and part of the top of the resin cup 2. On the one hand, the bonding area between the high-reflective adhesive layer 6 and the resin cup 2 is increased. In addition, the resin cup 2 is bonded to the high-reflective adhesive layer 6 at an angle through multiple surfaces, so the stress is small, the bonding is more stable, and the stability of the entire structure is higher. The upper surface of the resin cup 2 and the outer periphery of the groove 23 are provided with a boss 24 higher than the groove 23. The boss 24 is used to protect the internal structure of the resin cup 2, including the light-emitting chip 3, the gold wire 5 and the light-transmitting adhesive layer 4.

[0041] This does not limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A light-emitting device, characterized in that, Comprising: A substrate (1); A resin cup (2), which is arranged on the substrate (1) and encloses a cavity with one side open with the substrate (1); A light-emitting chip (3), which is arranged on the substrate (1) and inside the resin cup (2); A light-transmitting glue layer (4), which at least covers a part of the upper surface of the light-emitting chip (3); A gold wire (5), which connects the substrate (1) and the light-emitting chip (3); Convex structures (21) close to the light-emitting chip (3) are arranged on the inner walls around the resin cup (2); Concave structures (22) far from the light-emitting chip (3) are arranged between the convex structures (21), and the concave structures (22) are used for accommodating the gold wire (5).

2. The light-emitting device according to claim 1, wherein, A high-reflection glue layer (6) is arranged between the periphery of the light-emitting chip (3), the periphery of the light-transmitting glue layer (4) and the inner wall of the resin cup (2); The high-reflection glue layer (6) at least covers the side surface of the light-transmitting glue layer (4).

3. The light-emitting device according to claim 2, characterized in that, A groove (23) for accommodating the high-reflection glue layer (6) is arranged on the upper surface of the resin cup (2), and the high-reflection glue layer (6) covers the inner wall of the resin cup (2) and extends into the groove (23).

4. The light-emitting device according to claim 1, wherein, The substrate (1) and the resin cup (2) are a combined structure formed by bonding after being independently molded respectively.

5. The light-emitting device according to claim 1, wherein The light-transmitting glue layer (4) is a fluorescent glue layer.

6. The light-emitting device according to claim 1, characterized in that, The upper surface of the convex structure (21) is higher than or equal to the upper surface of the light-transmitting glue layer (4).

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