Semiconductor thermoelectric power generation warm cup

Abstract

The utility model discloses a semiconductor thermoelectric power generation warm cup which comprises a cup body, and the cup body is composed of an outer shell, a stainless steel inner container, an inner container base, a heat dissipation base and a bottom shell. The storage cavity is formed in the handle, the front cover covers the storage cavity, and the illuminating lamp is clamped in the storage cavity through the elastic hoop, so that carrying is convenient, loss is effectively prevented, during use, hot water is added into the stainless steel inner container, temperature difference is converted into electric energy, then power is supplied to the USB socket panel through the boosting electronic module, and the electric energy is saved. After the front cover is opened, the illuminating lamp is taken out, the illuminating lamp is inserted into the USB panel to provide illumination, the flexible support on the illuminating lamp enables the illuminating direction of the LED lamp holder to be conveniently adjusted, and practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of water cups, in particular to a semiconductor temperature difference power generation warming cup. Background Art

[0002] Nowadays, outdoor travel is popular among young and middle-aged people, who often carry a large number of electronic devices, making it imperative to carry charging devices. However, under certain conditions, charging devices cannot be replenished in a timely manner, rendering them useless. For example, in the case of outdoor lighting, if the charging device cannot be charged or maintained, it will result in staying in dark or dim conditions, which will inevitably affect the travel experience.

[0003] In the existing technology, there is a technology that proposes to use the temperature difference between the hot water in the cup and the external environment to achieve self-generation of power-generating cup warmers through a semiconductor power generation module. The temperature difference is converted into electrical energy, and then through a boost module to achieve the purpose of using electricity. Combined with LED lights, the effect of backup lighting can be achieved. However, the existing warm cups that use temperature difference power generation for lighting have LED lights that are either fixed on the bottom or lid of the cup or are separately prepared lighting lamps. Fixed LED lights are not convenient for adjusting the lighting direction, and additional separately prepared LED lights are very easy to lose. Therefore, it is necessary to optimize and improve the structure of the semiconductor temperature difference power generation warm cup. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor temperature difference power generation warming cup.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a semiconductor thermoelectric power generation warming cup, comprising a cup body, the cup body consisting of an outer shell, a stainless steel liner, an inner liner base, a heat dissipation base and a bottom shell, the stainless steel liner, the inner liner base and the heat dissipation base are fixedly connected to the inner side wall of the outer shell in order from top to bottom, the bottom shell is detachably connected to the bottom of the outer shell, an upper cover is provided on the upper end of the inner liner base, a thermoelectric power generation structure is provided between the inner liner base and the stainless steel liner, a heat dissipation structure is provided between the heat dissipation base and the outer shell, a handle is provided on the front wall of the outer shell, and the handle is provided on the front wall and near the upper end A window that passes through the inside and outside is provided at the position, and a USB socket panel is fixedly connected to the front wall of the stainless steel inner liner. The end of the USB socket panel away from the stainless steel inner liner passes through the inner wall of the window and the front wall of the USB socket panel is flush with the front wall of the handle. A boost electronic module is integrated inside the USB socket panel, and a storage cavity is provided on the front wall of the handle and below the window. A lighting lamp is clamped on the inner rear wall of the storage cavity through a clamping structure, and the lighting lamp consists of a USB plug, a flexible bracket and an LED lamp head distributed in sequence up and down. A front cover for shielding the storage cavity is provided on the front wall of the handle and at the mouth of the storage cavity.

[0006] As a further description of the above technical solution:

[0007] The temperature difference power generation structure is a semiconductor power generation module. The lower inner wall of the inner tank base is provided with a mounting groove. The semiconductor power generation module is fixedly connected to the inner wall of the mounting groove. The upper wall of the semiconductor power generation module is tightly pressed against the lower wall of the stainless steel inner tank.

[0008] As a further description of the above technical solution:

[0009] The heat dissipation structure includes multiple groups of heat sinks and two groups of ventilation covers. The multiple groups of heat sinks are fixedly connected to the lower wall of the heat dissipation base. Openings are provided on the left and right side walls of the outer shell and at one end close to the bottom shell. The two groups of ventilation covers are respectively clamped on the inner side walls of a group of openings. The inner walls of the two groups of ventilation covers are provided with multiple groups of ventilation openings that are through-through inside and outside, and the multiple groups of ventilation openings are all at the same horizontal height as the multiple groups of heat sinks.

[0010] As a further description of the above technical solution:

[0011] The clamping structure includes multiple groups of elastic clamps, which are fixedly connected to the inner rear wall of the storage cavity in an upper and lower distribution. The front ends of the multiple groups of elastic clamps are all provided with openings. The flexible bracket is clamped to the inner walls of the multiple groups of elastic clamps, and the lighting lamp is clamped to the inner rear wall of the storage cavity through the multiple groups of elastic clamps.

[0012] As a further description of the above technical solution:

[0013] The left and right side walls of the front cover are both provided with rotation pins near the lower end, and the inner left wall and the inner right wall of the storage cavity are both provided with rotation holes corresponding to the two groups of rotation pins near the inner lower wall. The ends of the two groups of rotation pins away from the front cover are respectively rotatably connected to the two groups of rotation holes.

[0014] As a further description of the above technical solution:

[0015] The upper wall of the front cover is provided with a spring buckle, the upper wall of the spring buckle is provided with a semicircular boss, the upper wall inside the storage cavity is provided with a pit adapted to the semicircular boss, and the front cover is connected to the storage cavity through the semicircular boss and the pit.

[0016] The utility model has the following beneficial effects:

[0017] Compared with the existing technology, this semiconductor thermoelectric power warming cup has a storage cavity set in the handle, and the storage cavity is covered by a front cover. The lighting lamp is clamped in the storage cavity by an elastic clamp, which is easy to carry and effectively prevents loss. When in use, hot water is added to the stainless steel inner tank, and the temperature difference is converted into electrical energy, which is then powered to the USB port panel through the boost electronic module. After opening the front cover, the lighting lamp is taken out and plugged into the USB panel to provide lighting. The flexible bracket on the lighting lamp makes it easier to adjust the lighting direction of the LED lamp head, thereby improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor thermoelectric power generation warming cup proposed by the present invention;

[0019] Figure 2 This is an exploded view of the overall structure of a semiconductor thermoelectric power generation warming cup proposed in the present invention;

[0020] Figure 3 This is a partial sectional side view of the internal structure of the handle of a semiconductor thermoelectric power warming cup proposed in the present invention;

[0021] Figure 4 This is a semiconductor thermoelectric power generation cup warmer proposed by the utility model Figure 3 A partial enlarged view of point A in the middle;

[0022] Figure 5 This is a semiconductor thermoelectric power generation cup warmer proposed by the utility model Figure 3 A partial enlarged view of point B in the middle;

[0023] Figure 6 This is a schematic diagram of the top structure of the elastic clamp of the semiconductor thermoelectric power generation warming cup proposed by the present invention.

[0024] Legend:

[0025] 1. Outer shell; 2. Handle; 3. USB port panel; 4. Top cover; 5. Stainless steel liner; 6. Inner liner base; 7. Heat dissipation base; 8. Ventilation hood; 9. Bottom shell; 10. Mounting slot; 11. Semiconductor power generation module; 12. Heat sink; 13. Ventilation port; 14. Front cover; 15. Storage cavity; 16. Elastic clamp; 17. USB plug; 18. Flexible bracket; 19. LED lamp holder; 20. Window; 1401. Spring buckle; 1402. Semicircular boss; 1403. Turn pin. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Reference Figures 1 to 6 The present invention provides a semiconductor thermoelectric power generation warming cup: comprising a cup body, which is composed of an outer shell 1, a stainless steel inner liner 5, an inner liner base 6, a heat dissipation base 7, and a bottom shell 9. The stainless steel inner liner 5, the inner liner base 6, and the heat dissipation base 7 are fixedly connected to the inner side wall of the outer shell 1 in order from top to bottom. The bottom shell 9 is detachably connected to the bottom of the outer shell 1. An upper cover 4 is provided on the upper end of the inner liner base 6.

[0028] To achieve thermoelectric power generation, a thermoelectric power generation structure is provided between the inner liner base 6 and the stainless steel inner liner 5. The thermoelectric power generation structure is a semiconductor power generation module 11. A mounting groove 10 is provided on the inner lower wall of the inner liner base 6. The semiconductor power generation module 11 is fixedly connected to the inner wall of the mounting groove 10. The upper wall of the semiconductor power generation module 11 is tightly pressed against the lower wall of the stainless steel inner liner 5. When hot water is contained in the stainless steel inner liner 5, the temperature of the hot water contacts the semiconductor power generation module 11, which converts the temperature difference into electrical energy.

[0029] In order to increase the temperature difference between the upper and lower surfaces of the semiconductor power generation module 11, a heat dissipation structure is provided between the heat dissipation base 7 and the shell 1. The heat dissipation structure includes multiple groups of heat sinks 12 and two groups of ventilation covers 8. The multiple groups of heat sinks 12 are fixedly connected to the lower wall of the heat dissipation base 7. The left and right side walls of the shell 1 and one end close to the bottom shell 9 are provided with openings. The two groups of ventilation covers 8 are respectively snapped into the inner side walls of a group of openings. The inner walls of the two groups of ventilation covers 8 are provided with multiple groups of ventilation openings 13 that are through-through. The multiple groups of ventilation openings 13 are all at the same horizontal height as the multiple groups of heat sinks 12. The heat from the lower surface of the semiconductor power generation module 11 is diffused through the heat dissipation base 7 and the multiple groups of heat sinks 12. After diffusing to the inside of the shell 1, it is transferred outward through the multiple groups of ventilation openings 13 to achieve the purpose of heat dissipation.

[0030] To facilitate power supply, a handle 2 is provided on the front wall of the housing 1. A window 20 is provided on the front wall of the handle 2 near the upper end thereof. A USB socket panel 3 is fixedly connected to the front wall of the stainless steel inner liner 5. The end of the USB socket panel 3 away from the stainless steel inner liner 5 passes through the inner wall of the window 20, and the front wall of the USB socket panel 3 is flush with the front wall of the handle 2. A boost electronic module is integrated inside the USB socket panel 3. After the semiconductor power generation module 11 generates electricity through temperature difference, the voltage is boosted by the boost electronic module and then supplied to the USB socket panel 3.

[0031] In order to facilitate the storage of the lighting lamp, a storage cavity 15 is provided on the front wall of the handle 2 and below the window 20. The inner rear wall of the storage cavity 15 is clamped with the lighting lamp through a clamping structure. The clamping structure includes multiple sets of elastic clamps 16. The multiple sets of elastic clamps 16 are fixedly connected to the inner rear wall of the storage cavity 15 in an upper and lower distribution. The front ends of the multiple sets of elastic clamps 16 are all provided with openings. The flexible brackets 18 are clamped on the inner walls of the multiple sets of elastic clamps 16. The lighting lamp is clamped to the inner rear wall of the storage cavity 15 through the multiple sets of elastic clamps 16. The lighting lamp is fixed by the elastic clamps 16. When carrying the lighting lamp, it will not shake or collide, thereby avoiding damage and increasing its service life. Storing the lighting lamp in the storage cavity 15 can prevent the lighting lamp from being lost.

[0032] For convenient lighting, the lighting lamp is composed of a USB plug 17, a flexible bracket 18 and an LED lamp head 19 which are distributed in sequence from top to bottom. The flexible bracket 18 can facilitate the LED lamp head 19 to switch the lighting direction, thereby improving practicality.

[0033] In order to facilitate the removal of the lighting lamp while maintaining the integrity of the handle 2, a front cover 14 for covering the storage cavity 15 is provided on the front wall of the handle 2 and at the mouth of the storage cavity 15. Rotary pins 1403 are provided on the left and right side walls of the front cover 14 near the lower end. Rotary holes corresponding to the two groups of rotary pins 1403 are provided on the inner left wall and the inner right wall of the storage cavity 15 near the inner lower wall. The ends of the two groups of rotary pins 1403 away from the front cover 14 are rotatably connected to the two groups of rotating holes respectively. A spring buckle 1401 is provided on the upper wall of the front cover 14. A semicircular boss 1402 is provided on the upper wall of the spring buckle 1401, and a pit matched with the semicircular boss 1402 is provided on the inner upper wall of the storage cavity 15. The front cover 14 is clamped with the storage cavity 15 through the semicircular boss 1402 and the pit. After pressing the spring buckle 1401 to disengage the semicircular boss 1402 from the pit, the front cover 14 can be rotated forward to open the front cover 14, so as to take out or put back the lighting lamp. When the front cover 14 is reset, it is clamped and fixed by the semicircular boss 1402 and the pit, which can maintain the integrity of the handle 2 without affecting the normal use of the cup warmer.

[0034] Working principle: When the stainless steel inner tank 5 is filled with hot water, the temperature of the hot water contacts the semiconductor power generation module 11, and the semiconductor power generation module 11 converts the temperature difference into electrical energy. After the semiconductor power generation module 11 generates electrical energy through the temperature difference, it is boosted by the boost electronic module and then supplies power to the USB socket panel 3. The heat on the lower surface of the semiconductor power generation module 11 diffuses through the heat dissipation base 7 and multiple groups of heat sinks 12, diffuses into the interior of the shell 1, and then transfers outward through multiple groups of ventilation holes 13 to achieve the purpose of heat dissipation. The lighting lamp is fixed by an elastic clamp 16. When carried, the lighting lamp will not shake or collide, thus avoiding damage and increasing its service life. By storing it in the storage cavity 15, the lighting lamp can be prevented from being lost. The flexible bracket 18 can facilitate the LED lamp head 19 to switch the lighting direction, thereby improving practicality. After pressing the spring buckle 1401 to disengage the semicircular boss 1402 from the pit, the front cover 14 can be rotated forward to open the front cover 14 to take out or put back the lighting lamp. When the front cover 14 is reset, it is fixed by the semicircular boss 1402 and the pit, which can maintain the integrity of the handle 2 and does not affect the normal use of the cup warmer.

[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor thermoelectric power warming cup, characterized by: The invention comprises a cup body, wherein the cup body is composed of an outer shell (1), a stainless steel inner liner (5), an inner liner base (6), a heat dissipation base (7) and a bottom shell (9), wherein the stainless steel inner liner (5), the inner liner base (6) and the heat dissipation base (7) are fixedly connected to the inner side wall of the outer shell (1) in order from top to bottom, and the bottom shell (9) is detachably connected to the bottom of the outer shell (1), an upper cover (4) is provided at the upper end of the inner liner base (6), a temperature difference power generation structure is provided between the inner liner base (6) and the stainless steel inner liner (5), a heat dissipation structure is provided between the heat dissipation base (7) and the outer shell (1), a handle (2) is provided on the front wall of the outer shell (1), a window (20) which is through-through is provided on the front wall of the handle (2) and near the upper end, and the stainless steel inner liner is provided on the upper end of the handle (2). A USB socket panel (3) is fixedly connected to the front wall of the inner container (5), and the end of the USB socket panel (3) away from the stainless steel inner container (5) passes through the inner wall of the window (20) and the front wall of the USB socket panel (3) is flush with the front wall of the handle (2). A boost electronic module is integrated inside the USB socket panel (3). A storage cavity (15) is provided on the front wall of the handle (2) and below the window (20). A lighting lamp is connected to the inner rear wall of the storage cavity (15) through a snap-fit structure. The lighting lamp consists of a USB plug (17), a flexible bracket (18) and an LED lamp head (19) distributed in sequence from top to bottom. A front cover (14) for shielding the storage cavity (15) is provided on the front wall of the handle (2) and at the mouth of the storage cavity (15).

2. The semiconductor thermoelectric power warming cup according to claim 1, characterized in that: The temperature difference power generation structure is a semiconductor power generation module (11), the inner lower wall of the inner liner base (6) is provided with a mounting groove (10), the semiconductor power generation module (11) is fixedly connected to the inner wall of the mounting groove (10), and the upper wall of the semiconductor power generation module (11) is tightly pressed against the lower wall of the stainless steel inner liner (5).

3. The semiconductor thermoelectric power warming cup according to claim 1, characterized in that: The heat dissipation structure includes multiple groups of heat sinks (12) and two groups of ventilation covers (8). The multiple groups of heat sinks (12) are fixedly connected to the lower wall of the heat dissipation base (7). The left and right side walls of the shell (1) and one end close to the bottom shell (9) are provided with openings. The two groups of ventilation covers (8) are respectively clamped on the inner side walls of one group of openings. The inner walls of the two groups of ventilation covers (8) are provided with multiple groups of ventilation holes (13) that are through-through inside and outside. The multiple groups of ventilation holes (13) are all at the same level as the multiple groups of heat sinks (12).

4. The semiconductor thermoelectric power warming cup according to claim 1, characterized in that: The clamping structure includes multiple groups of elastic clamps (16), and the multiple groups of elastic clamps (16) are fixedly connected to the inner rear wall of the storage cavity (15) in an upper and lower distribution. The front ends of the multiple groups of elastic clamps (16) are all provided with openings. The flexible bracket (18) is clamped to the inner wall of the multiple groups of elastic clamps (16), and the lighting lamp is clamped to the inner rear wall of the storage cavity (15) through the multiple groups of elastic clamps (16).

5. The semiconductor thermoelectric power warming cup according to claim 1, characterized in that: The left and right side walls of the front cover (14) are both provided with rotation pins (1403) near the lower end, and the inner left wall and the inner right wall of the storage cavity (15) are both provided with rotation holes corresponding to the two groups of rotation pins (1403) near the inner lower wall. The ends of the two groups of rotation pins (1403) away from the front cover (14) are rotatably connected to the two groups of rotation holes respectively.

6. The semiconductor thermoelectric power warming cup according to claim 1, characterized in that: The upper wall of the front cover (14) is provided with a spring buckle (1401), the upper wall of the spring buckle (1401) is provided with a semicircular boss (1402), the inner upper wall of the storage cavity (15) is provided with a recess matched with the semicircular boss (1402), and the front cover (14) is connected to the storage cavity (15) through the semicircular boss (1402) and the recess.

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