Diamond laser cutting device

Abstract

The utility model discloses a diamond laser cutting device, and belongs to the field of diamond and diamond artificial synthesis. Comprising a laser cutting machine and an atmosphere gas pipeline, and a closed laser cutting cavity used for diamond cutting is formed in the laser cutting machine; one end of the atmosphere gas pipeline communicates with the interior of the laser cutting cavity, and the atmosphere gas pipeline is further connected with an oxygen generator. Compared with the prior art, the laser cutting device has the advantages that oxidizing gas is introduced into the laser cutting cavity through the oxygen generator, C and steam in the cutting process are quickly converted into CO2 or CO, deformation and power loss of laser beams are reduced, constant cutting reaction is kept, and the cutting efficiency is improved. Therefore, the cutting surface quality reduction caused by high-power laser is avoided.

Description

Technical Field

[0001] The utility model belongs to the field of artificial synthesis of diamond and diamond, and particularly relates to a diamond laser cutting device. Background Art

[0002] As a concentrated excellent basic material, diamond has characteristics such as high hardness, high thermal conductivity, high breakdown electric field, high carrier mobility, and high bandwidth, so it is known as the ultimate semiconductor. At the same time, diamond also has excellent chemical stability and optical properties. These material properties make diamond widely used in many fields. These fields include solid-state power devices, heat dissipation devices, optical windows, electrochemical motors, machining, etc. Although diamond has good application prospects, the reserves of natural diamond are limited and the price is expensive. Therefore, the research on artificial synthesis of diamond has always been at the forefront of research.

[0003] The earliest artificial synthesis used the high-temperature and high-pressure method. After decades of development and optimization, this method can now also produce large single crystals. However, these single crystals have deficiencies in terms of purity and defect concentration, etc., and are not sufficient for use in the above high-end technology directions. Especially for high-temperature and high-pressure crystals, both natural crystals have size limitations and cannot be expanded in a two-dimensional plane to form a structure similar to a silicon wafer. Therefore, later the growth of diamond has shifted to the chemical vapor deposition method. Through the method of vacuum gas-phase growth, the quality of the crystal can be improved in terms of material purity and defect concentration. Especially, the microwave plasma chemical vapor deposition (MPCVD) diamond growth technology is gradually becoming the mainstream method for artificial diamond due to its advantages such as pollution-free microwave energy, pure gas raw materials, and no incorporation of catalysts and impurities.

[0004] In the current production process of diamond crystals, laser cutting is another important process besides crystal growth, including: cutting of finished crystals, cutting of crystals during the production process, surface trimming, especially the treatment of seed crystals. The process of laser cutting is mainly: laser irradiation on diamond causes graphitization, and graphite continues to heat up and is ablated and removed.

[0005] As the size of the crystal continues to increase, the laser cutting time also increases accordingly. For the earliest crystal with a size of 7x7mm, it takes 30 minutes to cut one side. For the current crystal with a size of 15x15mm, the time required to cut one side has reached 2 hours. During the ablation process, graphite and the graphite vapor generated during the ablation process will cause deformation and power loss of the laser beam. In order to improve the cutting efficiency, higher laser output power is applied to the cutting process. However, a side effect of high-power laser is that the surface quality of the cutting will be reduced, and the surface will directly affect the quality of crystal growth. Content of the Utility Model

[0006] To solve the above problems, the purpose of the present utility model is to provide a diamond laser cutting device, which introduces an oxidizing gas through an oxygen generator to quickly convert C and steam during the cutting process into CO2 or CO, thereby reducing the deformation and power loss of the laser beam, maintaining a constant cutting reaction, and avoiding the reduction of the cutting surface quality caused by using a high-power laser.

[0007] To achieve the above purpose, the technical solution of the present utility model is as follows:

[0008] The present utility model also provides a diamond laser cutting device, including: a laser cutting machine and an atmosphere gas pipeline. The laser cutting machine has a sealed laser cutting cavity for diamond cutting; one end of the atmosphere gas pipeline is connected to the inside of the laser cutting cavity, and an oxygen generator is also connected to the atmosphere gas pipeline.

[0009] Further, the end of the atmosphere gas pipeline away from the laser cutting cavity is connected to compressed air.

[0010] Further, an ozone generator is also connected to the atmosphere gas pipeline.

[0011] Further, the laser cutting machine includes a machine body, a loading table, and a laser cutting head. The loading table and the laser cutting head are both arranged inside the laser cutting cavity, and the laser cutting head is located above the loading table. The end of the atmosphere gas pipeline connected to the laser cutting cavity extends above the loading table.

[0012] Further, a hanging piece for fixing the atmosphere gas pipeline is also arranged inside the laser cutting cavity.

[0013] Further, the diamond laser cutting device also includes a vacuum pump and an ozone destroyer. The inlet of the vacuum pump is connected to the laser cutting cavity, the outlet of the vacuum pump is connected to the inlet of the ozone destroyer, and the outlet of the ozone destroyer is connected to the external air.

[0014] Compared with the prior art, the beneficial effect of the present utility model is that by introducing an oxidizing gas into the laser cutting cavity through an oxygen generator, C and steam during the cutting process are quickly converted into CO2 or CO, thereby reducing the deformation and power loss of the laser beam, maintaining a constant cutting reaction, and avoiding the reduction of the cutting surface quality caused by using a high-power laser. Description of the Drawings

[0015] Figure 1 is a schematic structural diagram of the diamond laser cutting device of this embodiment.

[0016] Figure 2 is a process flow block diagram of the usage method of the diamond laser cutting device of this embodiment.

[0017] Figure 3 It is the process flow block diagram of step S2 in this embodiment. Specific implementation manners

[0018] In order to make the purpose, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0019] To achieve the above object, the technical solution of the present utility model is as follows:

[0020] As Figure 1 shown, this embodiment provides a diamond laser cutting device, including: a laser cutting machine 1, an atmosphere gas pipeline 2. There is a sealed laser cutting cavity 3 for diamond cutting in the laser cutting machine 1; one end of the atmosphere gas pipeline 2 is connected to the inside of the laser cutting cavity 3, and an oxygen generator 4 is also connected to the atmosphere gas pipeline 2.

[0021] In this embodiment, the oxygen generator 4 can generate oxygen and introduce it into the laser cutting area in the laser cutting cavity 3 through the atmosphere gas pipeline 2, which can convert the graphitized C and the C vapor generated by ablation during the diamond cutting process into CO2 and CO, avoiding the deformation and power loss of the laser beam caused by graphite and vapor, thereby maintaining a constant cutting reaction, and thus avoiding the reduction of the cutting surface quality caused by using a high-power laser and improving the quality of diamond laser cutting.

[0022] Further, the end of the atmosphere gas pipeline 2 far from the laser cutting cavity 3 is connected to compressed air, which can be generated by an air compressor and serves as the main body of the atmosphere gas to provide a stable gas environment for diamond laser cutting.

[0023] Further, an ozone generator 5 is also connected to the atmosphere gas pipeline 2. The ozone generator 5 generates ozone, which is introduced into the laser cutting cavity 3 through the atmosphere gas pipeline 2 and mixed with the atmosphere gas and then introduced into the cutting area of the laser cutting equipment. Under high-temperature environment, through chemical reaction, C and CO in the cutting process are converted into CO2, further improving the effect of the chemical reaction.

[0024] Further, the laser cutting machine 1 includes a machine body 11, a loading platform 12, and a laser cutting head 13. The laser cutting head 13 is connected to the machine body 11. The loading platform 12 and the laser cutting head 13 are both arranged in the laser cutting cavity 3, and the laser cutting head 13 is located above the loading platform 12. The end of the atmosphere gas pipeline 2 connected to the laser cutting cavity 3 extends above the loading platform 12.

[0025] Furthermore, a hanging member 6 for fixing the atmosphere gas pipeline 2 is also provided in the laser cutting chamber 3 .

[0026] Furthermore, the diamond laser cutting apparatus also includes a vacuum pump 7 and an ozone destroyer 8. The inlet of the vacuum pump 7 is connected to the laser cutting chamber 3, and the outlet of the vacuum pump 7 is connected to the inlet of the ozone destroyer 8. The outlet of the ozone destroyer 8 is connected to the outside air. The vacuum pump 7 guides the cutting waste gas generated in the cutting area into the ozone destroyer 8, where the ozone is reduced to oxygen. At this point, the cutting waste gas is mainly composed of N2, CO2, and O2, and is then exhausted to the atmosphere by an exhaust fan to avoid environmental pollution.

[0027] like Figure 2 As shown, the method for using the diamond laser cutting device comprises the following steps:

[0028] S1: Place the diamond crystal into the laser cutting equipment, turn on the laser cutting equipment, set the power to 10-50W, set the wavelength to 200-1064nm, and perform laser cutting on the diamond crystal;

[0029] S2: Oxidizing gas is introduced during the laser cutting process. The oxidizing gas is mixed with compressed air and introduced into the cutting area of the laser cutting equipment as an atmosphere gas. The oxidizing gas improves the laser cutting effect by chemically reacting with diamond.

[0030] S3: Seal the cutting area and create a negative pressure environment by vacuuming.

[0031] S4: The cutting exhaust gas generated in the cutting area is introduced into the ozone destroyer through a vacuum pump to reduce the ozone into oxygen.

[0032] S5: The cutting waste gas after passing through the ozone destroyer is discharged through the exhaust fan.

[0033] In this embodiment, the diamond in step S1 will be graphitized after laser cutting, and the atmospheric gas is introduced in step S2. The atmospheric gas can not only convert the graphite and the steam generated during the ablation process into CO2 and CO, thereby reducing the deformation and power loss of the laser beam, thereby maintaining a constant cutting reaction, thereby avoiding the use of high-power lasers and causing a decrease in the cutting surface quality; it can also take away the heat generated during the laser cutting process, making the temperature of the diamond sample more suitable, the laser cutting reaction more uniform, and the cutting effect better; in addition, the atmospheric gas can also take away the waste chips generated during the cutting process, providing a stable environment for cutting.

[0034] Specifically, such as Figure 3 As shown, step S2 includes:

[0035] S21: Introducing oxygen during the laser cutting process, the oxygen is passed into the cutting area of the laser cutting equipment, and the graphite C and graphite vapor in the cutting process are converted into CO2 and CO through chemical reactions;

[0036] S22: Ozone is introduced during the laser cutting process. The ozone is connected to the gas supply pipe and mixed with the ambient gas and then passed into the cutting area of the laser cutting equipment. In a high-temperature environment, the C and CO in the cutting process are converted into CO2 through chemical reactions, further improving the effect of the chemical reaction.

[0037] The chemical reaction equation of step S21 is:

[0038] (1) C + O2 = CO2

[0039] (2) 2C + O2 = 2CO

[0040] The chemical reaction equation of step S22 is:

[0041] (3)CO+O3=CO2+O2

[0042] (4) C + 2O3 = 3CO2

[0043] In step S21, by introducing oxygen into the compressed air, the graphitized C and the C vapor generated by ablation can be converted into CO2 and CO, avoiding deformation of the laser beam and power loss caused by graphite and vapor, thereby maintaining a constant cutting reaction and avoiding the use of high-power lasers causing a decrease in cutting surface quality.

[0044] In step S22, by further introducing ozone into the compressed air, C and CO can be completely oxidized and converted into CO2 under high temperature environment, further improving the oxidation effect, thereby maintaining a constant cutting reaction.

[0045] Specifically, in step S21, an industrial oxygen generator is connected to a compressed air supply pipeline. The oxygen generated by the industrial oxygen generator is mixed with the compressed air and introduced into the cutting area as the atmosphere gas for diamond laser cutting. The oxygen content in the atmosphere gas is 20 to 100%.

[0046] In step S22, in one implementation, ozone is excited by an ultraviolet lamp, and the wavelength of the ultraviolet lamp is less than 240nm; in another implementation, ozone is generated by an external ozone generator.

[0047] In this embodiment, in step S3, the cutting area is sealed and a negative pressure is formed to prevent the cutting personnel from inhaling excessive O2 (safe concentration range 29%-37%) or ozone poisoning, and also reduce ozone pollution to the environment.

[0048] In this embodiment, in step S4, an air pump is used to introduce the cutting waste gas into an ozone destructor to reduce O3 to O2, avoiding environmental pollution caused by the discharge of O3.

[0049] In this embodiment, in step S5, after passing through the ozone destructor, the components of the cutting waste gas are mainly N2, CO2, and O2, and then an exhaust fan is used to discharge it, which will not cause pollution to the environment.

[0050] In this embodiment, a cutting experiment is carried out on a 10x10mm diamond sample:

[0051] (1) Cutting machine settings:

[0052] Power: 12W

[0053] Cutting set depth: 5.5mm

[0054] (2) Cutting test, cutting from two parallel sides respectively:

[0055] Experimental group: On one side, laser cutting is carried out by introducing an atmosphere gas with an oxidizing gas through the above method;

[0056] Control group: On the other side, only compressed air is introduced as the atmosphere gas for laser cutting.

[0057] Method of introducing the atmosphere gas: Spray once for every 1 round trip (about 1 - 1.5S) of the laser; The spraying position is between the cooling air nozzle and the diamond sample.

[0058] 3) Cutting effect:

[0059] It can be known through measurement that the cutting depth of the experimental group is 4.82mm, and the cutting depth of the control group is 4.45mm. From this, it can be seen that after adding oxygen to the atmosphere gas in the experimental group, it helps laser cutting. Under the same conditions, the cutting amount can be increased by (4.82 - 4.45) / 4.45 ≈ 8%.

[0060] The above is only a preferred embodiment of the present invention, and it is not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A diamond laser cutting device, characterized in that: include: A laser cutting machine and an atmosphere gas pipeline. The laser cutting machine has a sealed laser cutting chamber for diamond cutting. One end of the atmosphere gas pipeline is connected to the laser cutting chamber, and the atmosphere gas pipeline is also connected to an oxygen generator.

2. A diamond laser cutting device according to claim 1, characterized in that: The end of the atmosphere gas pipeline away from the laser cutting chamber is connected to compressed air.

3. A diamond laser cutting device as claimed in claim 2, characterized in that: The atmosphere gas pipeline is also connected to an ozone generator.

4. A diamond laser cutting device according to claim 1, characterized in that: The laser cutting machine includes a machine body, a worktable, and a laser cutting head. The worktable and the laser cutting head are both arranged in a laser cutting chamber, and the laser cutting head is located above the worktable. One end of the atmosphere gas pipe connected to the laser cutting chamber extends above the worktable.

5. The diamond laser cutting device according to claim 1, wherein: The laser cutting chamber is also provided with a hanging piece for fixing the atmosphere gas pipeline.

6. The diamond laser cutting device according to claim 1, characterized in that: The diamond laser cutting device further includes a vacuum pump and an ozone destroyer. The inlet of the vacuum pump is communicated with the laser cutting cavity, the outlet of the vacuum pump is connected to the inlet of the ozone destroyer, and the outlet of the ozone destroyer is connected to the external air.

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