Alignment feeding device for wafer polishing test

Abstract

The utility model provides a wafer polishing test alignment feeding device which comprises a bottom bracket, an abutting positioning ring, a lifting bracket and a lifting driving piece, the abutting positioning ring is erected above the bottom bracket through a supporting column, and the lifting driving piece is connected to the bottom bracket and located below the abutting positioning ring. The lifting bracket is connected to the upper portion of the lifting driving part and used for bearing the wafer, and the lifting bracket can be driven by the lifting driving part to move upwards so as to be coaxially aligned with the polishing head and adsorbed to the lower portion of the polishing head. According to the alignment feeding device for the wafer polishing test, the bottom bracket is used for driving the abutting positioning ring to move upwards so that the abutting positioning ring can be arranged on the periphery of the polishing head in a sleeving mode, the abutting positioning ring and the polishing head can be concentrically aligned, the effective positioning effect is achieved, the lifting driving piece is used for driving the lifting bracket and the wafer to move upwards, and the wafer ascends and is adsorbed to the polishing head; according to the wafer feeding device, precise feeding of wafers is completed, the feeding precision and the feeding efficiency are improved, the feeding safety is improved, and the wafer feeding device has good practicability.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing and testing, and more specifically relates to a wafer polishing test alignment and loading device. Background Art

[0002] As chemical mechanical polishing equipment lines mature and new processes become increasingly common, the need to use a specific machine specification to test polishing wafers of different specifications requires replacing the corresponding polishing head and manually loading the material.

[0003] When loading wafers, it's difficult to precisely align the center of the wafer and polishing head manually. This operation is difficult and can easily scratch or even damage the wafer under test, affecting the normal test process. Even more seriously, if the equipment malfunctions, the polishing head can press against the polishing plate, causing crushing injuries to the operator's hands, which is extremely dangerous. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer polishing test alignment and loading device, which can accurately load wafers, help improve test efficiency, and enhance operational safety.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a wafer polishing test alignment and loading device, including a bottom bracket, an abutment positioning ring, a lifting bracket and a lifting drive member, the abutment positioning ring is mounted on the top of the bottom bracket through a support column, the abutment positioning ring can be sleeved on the outer periphery of the polishing head to be coaxially positioned with the polishing head, the lifting drive member is connected to the bottom bracket and is located below the abutment positioning ring, the lifting bracket is connected to the top of the lifting drive member and is used to support the wafer, and the lifting bracket can be moved upward under the drive of the lifting drive member to be coaxially aligned with the polishing head and adsorbed below the polishing head.

[0006] In one possible implementation, the lifting bracket includes a lower bracket and an upper tray. The upper tray is connected to the top of the lower bracket and is used to support the wafer. The lifting drive is connected to the bottom of the lower bracket and is coaxially arranged with the upper tray. The lifting drive is used to drive the lower bracket, the upper tray and the wafer to move upward synchronously so that the wafer is adsorbed on the polishing head.

[0007] In some embodiments, a limiting ring is provided on the top surface of the upper tray and is upwardly protruding and used to limit the wafer. The limiting ring extends along the circumference of the upper tray, and the height of the limiting ring is less than the height of the wafer.

[0008] In a possible implementation, the lower bracket is a square frame that passes through from top to bottom. The lower bracket is provided with cross-arranged supporting rods inside. The lifting drive has a lifting end extending upward, and the supporting rod is connected above the lifting end.

[0009] In a possible implementation, a limiting step is provided on the inner circumference of the abutting positioning ring. The limiting step extends along the circumference of the abutting positioning ring, and the top surface of the limiting step is used for abutting and positioning with the bottom surface of the polishing head.

[0010] In a possible implementation, at least two support columns are provided, and the support columns are spaced apart along the circumference of the abutment positioning ring, and the abutment positioning ring is connected to the upper ends of the support columns.

[0011] In some embodiments, the bottom bracket is provided with an extension portion extending outward in a radial direction abutting against the positioning ring, and a gripping handle is provided at an outer end of the extension portion.

[0012] In some embodiments, the grip handle is provided with an anti-slip layer.

[0013] In a possible implementation, the abutment positioning ring is detachably connected to the upper end of the support column, a horizontally extending installation slot is provided on the lower bracket, and the lifting drive member is connected to the bottom bracket via a connector passing through the installation slot.

[0014] In a possible implementation, the wafer polishing test alignment loading device further includes a controller, which is electrically connected to the lifting drive component, and the controller is used to send control instructions to the lifting drive component.

[0015] Compared with the prior art, the solution shown in the embodiment of the present application provides a wafer polishing test alignment and loading device, which utilizes a bottom bracket to drive the abutment positioning ring to move upward so that it is sleeved on the outer periphery of the polishing head, so that the two are concentrically aligned to achieve effective positioning, and then utilizes a lifting drive component to drive the lifting bracket and the wafer to move upward, so that the wafer rises and is adsorbed on the polishing head, completing the precise loading of the wafer, improving the loading accuracy and efficiency, improving the loading safety, and having good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 A schematic diagram of the structure of the wafer polishing test alignment and loading device in use provided by an embodiment of the present utility model;

[0018] Figure 2 For the embodiment of the utility model Figure 1 Schematic diagram of the top view of the wafer polishing test alignment loading device;

[0019] Figure 3 For the embodiment of the utility model Figure 1 Schematic diagram of the cross-sectional structure of AA;

[0020] Figure 4 For the embodiment of the utility model Figure 1 Schematic diagram of the main cross-section structure of the wafer polishing test alignment loading device;

[0021] Figure 5 For the embodiment of the utility model Figure 4 Schematic diagram of the cross-sectional structure of the middle BB;

[0022] Figure 6 For the embodiment of the utility model Figure 4 A schematic diagram of the top structure of the middle upper tray;

[0023] Figure 7 For the embodiment of the utility model Figure 4 A schematic diagram of the top view of the middle and lower bracket;

[0024] Figure 8 For the embodiment of the utility model Figure 4 Schematic diagram of the top view of the midsole bracket.

[0025] Among them, the reference numerals in the figures are:

[0026] 1. Bottom bracket; 11. Extension; 12. Grip; 13. Anti-slip layer; 14. Mounting slot; 2. Abutment positioning ring; 21. Support column; 22. Limiting step; 3. Lifting bracket; 31. Lower bracket; 32. Upper tray; 33. Limiting ring; 34. Support rod; 4. Lifting drive; 5. Grinding disc; 6. Wafer; 7. Polishing head. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or indirectly on the other element. It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "several" means two or more, unless otherwise clearly and specifically defined.

[0029] Please also refer to Figures 1 to 8 The wafer polishing test alignment and loading device provided by the present invention is now described. The wafer polishing test alignment and loading device includes a bottom bracket 1, an abutment positioning ring 2, a lifting bracket 3, and a lifting drive 4. The abutment positioning ring 2 is mounted on the top of the bottom bracket 1 through a support column 21. The abutment positioning ring 2 can be sleeved on the outer periphery of the polishing head 7 to be coaxially positioned with the polishing head 7. The lifting drive 4 is connected to the bottom bracket 1 and is located below the abutment positioning ring 2. The lifting bracket 3 is connected above the lifting drive 4 and is used to support the wafer 6. The lifting bracket 3 can be moved upward under the drive of the lifting drive 4 to be coaxially aligned with the polishing head 7 and adsorbed below the polishing head 7.

[0030] The wafer polishing test alignment loading device provided in this embodiment is compared with the prior art. The wafer polishing test alignment loading device provided in this embodiment uses the bottom bracket 1 to drive the abutment positioning ring 2 to move upward so that it is sleeved on the outer periphery of the polishing head 7, so that the two are concentrically aligned to achieve effective positioning, and then uses the lifting drive part 4 to drive the lifting bracket 3 and the wafer 6 to move upward, so that the wafer 6 rises and is adsorbed with the polishing head 7, completing the precise loading of the wafer 6, improving the loading accuracy and loading efficiency, improving the loading safety, and having good practicality.

[0031] In this embodiment, the wafer polishing test alignment loading device is used to support the wafer 6 and drive the wafer 6 to move between the grinding disc 5 and the polishing head 7. Then, the bottom bracket 1 is moved upward so that the abutment positioning ring 2 is sleeved on the outer periphery of the polishing head 7 to form axial alignment with the polishing head 7. Finally, the lifting drive part 4 is used to drive the wafer 6 to move upward so that the polishing head 7 adsorbs the wafer 6 to complete precise loading.

[0032] The abutment and positioning ring 2 can be made of a flexible material, such as rubber, silicone, etc. The inner diameter of the abutment and positioning ring 2 is set according to the outer diameter of the polishing head 7, so that the inner diameter of the abutment and positioning ring 2 is equal to the polishing head 7. The abutment and positioning ring 2 can be easily placed on the outer circumference of the polishing head 7, and a certain friction force is generated between the two, so that circumferential movement can occur when the operator applies greater force.

[0033] When the wafer polishing test alignment loading device is moved upward as a whole, the abutment positioning ring 2 can contact the polishing head 7, and the horizontal position of the abutment positioning ring 2 is adjusted so that it can be sleeved on the outer periphery of the polishing head 7. At this time, the abutment positioning ring 2 and the axis of the polishing head 7 coincide with each other, and at the same time, the axis of the lifting drive 4, the lifting bracket 3 and the wafer 6 can also coincide with the axis of the polishing head 7. At this time, the lifting drive 4 drives the lifting bracket 3 and the wafer 6 to move upward synchronously until the wafer 6 moves to contact the polishing head 7 and can be effectively adsorbed by the polishing head 7. The lifting drive 4 drives the lifting bracket 3 to move down and return to its position. After that, the operator moves the entire wafer polishing test alignment loading device downward to separate the abutment positioning ring 2 and the polishing head 7 from each other, completing the loading process.

[0034] In one possible implementation, please also refer to Figures 1 to 8 The lifting bracket 3 includes a lower bracket 31 and an upper tray 32. The upper tray 32 is connected to the top of the lower bracket 31 and is used to support the wafer 6. The lifting drive 4 is connected to the bottom of the lower bracket 31 and is coaxially arranged with the upper tray 32. The lifting drive 4 is used to drive the lower bracket 31, the upper tray 32 and the wafer 6 to move upward synchronously so that the wafer 6 and the polishing head 7 are adsorbed.

[0035] In this embodiment, the lifting bracket 3 is supported by the lower bracket 31 below the upper tray 32. The lower bracket 31 provides a stable support base for the upper tray 32. The upper tray 32 is used to support the wafer 6. When the wafer 6 is loaded onto the upper tray 32, it should be aligned with the axis of the upper tray 32 to ensure that the wafer 6 and the polishing head 7 are aligned vertically during the upward movement of the upper tray 32, ensuring the accuracy of the subsequent loading position.

[0036] In some embodiments, please refer to Figures 1 to 8 A limiting ring 33 is provided on the top surface of the upper tray 32 and is used to limit the wafer 6. The limiting ring 33 extends along the circumference of the upper tray 32, and the height of the limiting ring 33 is less than the height of the wafer 6.

[0037] In this embodiment, the limit ring 33 can effectively limit the outer edge of the wafer 6. The limit ring 33 extends circumferentially along the upper tray 32 and is consistent with the outer diameter of the wafer 6. When the wafer 6 is placed on the upper tray 32, it is limited by the limit ring 33 to ensure the correspondence between the wafer 6 and the axis of the upper tray 32, which also ensures the correspondence between the wafer 6 and the axis of the polishing head 7 above.

[0038] It should be noted that the height of the limit ring 33 should be smaller than the height of the wafer 6 to ensure that the wafer 6 protrudes upward from the top surface of the limit ring 33, so that the polishing head 7 can effectively adsorb the wafer 6 and improve the loading efficiency.

[0039] In one possible implementation, please also refer to Figures 1 to 8 The lower bracket 31 is a square frame that passes through from top to bottom. A cross-arranged supporting rod 34 is provided inside the lower bracket 31. The lifting drive member 4 has a lifting end extending upward, and the supporting rod 34 is connected to the top of the lifting end.

[0040] In this embodiment, the lower bracket 31 adopts a square frame structure, which can effectively support the bottom of the upper tray 32. The cross-shaped support rods 34 arranged inside the lower bracket 31 further enhance the support effect on the upper tray 32, and also realize an effective connection with the lifting drive member 4 below, ensuring the reliability of the driving action.

[0041] In one possible implementation, please also refer to Figures 1 to 8 A limiting step 22 is provided on the inner circumference of the abutting and positioning ring 2. The limiting step 22 extends along the circumference of the abutting and positioning ring 2. The top surface of the limiting step 22 is used to abut and position the bottom surface of the polishing head 7. When the abutting and positioning ring 2 and the polishing head 7 are positioned using them, in addition to ensuring that their axes coincide, the upper and lower positions of the abutting and positioning ring 2 are also limited to prevent the abutting and positioning ring 2 from being separated from the polishing head 7 due to excessive or insufficient upward movement.

[0042] Specifically, by providing the limiting step 22, the bottom surface of the polishing head 7 abuts against the top surface of the limiting step 22. The operator can clearly feel the abutment between the two, effectively limiting the upward movement of the abutment positioning ring 2 and improving positioning accuracy. More importantly, it prevents interference between the wafer 6 and the polishing head 7 caused by excessive upward movement of the abutment positioning ring 2, thus protecting the wafer 6.

[0043] In one possible implementation, please also refer to Figures 1 to 8 At least two support columns 21 are provided. The support columns 21 are arranged at intervals along the circumference of the abutment positioning ring 2, and the abutment positioning ring 2 is connected to the upper end of the support columns 21. In order to allow the abutment positioning ring 2 to be suspended above the lifting bracket 3, the support columns 21 are used for support. Two or more support columns 21 can be provided. When two support columns 21 are provided, a larger space can be provided below the abutment positioning ring 2, which facilitates the loading of the wafer 6 onto the lifting bracket 3 and improves the convenience of operation.

[0044] Furthermore, the two support columns 21 are located on the same side below the abutment positioning ring 2 , so that the abutment positioning ring 2 is in a suspended state, leaving sufficient space for loading the wafer 6 , thereby facilitating the loading operation of the wafer 6 .

[0045] In some embodiments, please refer to Figures 1 to 8 The bottom bracket 1 is provided with an extension portion 11 extending outward in a radial direction in contact with the positioning ring 2. A gripping handle 12 is provided at the outer end of the extension portion 11. The gripping handle 12 is provided with an anti-slip layer 13. The gripping handle 12 at the outer end of the extension portion 11 is convenient for human hand grasping, improving the convenience of operation. The anti-slip layer 13 provided on the gripping handle 12 can prevent the problem of human hand slipping affecting the loading of the wafer 6.

[0046] In one possible implementation, please also refer to Figures 1 to 8 The abutment positioning ring 2 is detachably connected to the upper end of the support column 21, and a horizontally extending installation slot 14 is provided on the lower bracket 31. The lifting drive member 4 is connected to the bottom bracket 1 through a connecting member passing through the installation slot 14, so that the lifting drive member 4 and the abutment positioning ring 2 are coaxially arranged.

[0047] In this embodiment, in order to make the device applicable to polishing heads 7 of different specifications and sizes, the abutment positioning ring 2 can be provided with multiple specifications. When used, the ground positioning ring can be detachably connected to the top of the support column 21. The two can be connected in the form of claws and holes, or in the form of connecting parts such as bolts or screws.

[0048] As the diameter of the abutment positioning ring 2 changes, the center position of the abutment positioning ring 2 also changes. Correspondingly, the axis position of the lifting drive member 4 should be adjusted to ensure that the lifting tray corresponds to the axis of the abutment positioning ring 2. The installation slot 14 provided on the bottom bracket 1 extends radially away from the gripping handle 12 along the abutment positioning ring 2. The lifting drive member 4 is installed at different positions of the installation slot 14 through a connecting member to meet the needs of small differences and to disassemble and replace the abutment positioning ring 2. At the same time, the lifting drive member 4 is connected to the installation slot 14 through a connecting member, and its position can be adjusted so that the axis of the lifting drive member 4 corresponds to the axis of the abutment positioning ring 2 up and down, ensuring the accuracy of wafer 6 loading.

[0049] In one possible implementation, please also refer to Figures 1 to 8 The wafer polishing test alignment loading device also includes a controller, which is electrically connected to the lifting drive 4. The controller is used to send control instructions to the lifting drive 4, and the lifting action of the lifting drive 4 is controlled by the controller to realize automatic loading of the wafer 6.

[0050] On this basis, it also includes a pressure sensor electrically connected to the controller. The pressure sensor is arranged on the lifting bracket 3 and is used to monitor the pressure between the lifting bracket 3 and the wafer 6 and generate pressure parameters. The controller is electrically connected to the pressure sensor. The controller is used to receive the pressure parameters and generate control instructions according to a preset program, and then send the control instructions to the lifting drive 4.

[0051] During use, the wafer 6 is first mounted on the lifting bracket 3. Then, the wafer polishing test alignment loading device is moved upward as a whole, and the horizontal position of the abutment positioning ring 2 is adjusted so that it can be placed on the outer periphery of the polishing head 7. At this time, the axis of the abutment positioning ring 2 and the polishing head 7 coincide with each other, and the axis of the lifting drive 4, the lifting bracket 3, and the wafer 6 can also coincide with the axis of the polishing head 7.

[0052] Afterwards, the lifting drive 4 drives the lifting bracket 3 and the wafer 6 to move upward synchronously until the wafer 6 moves to contact the polishing head 7 and can be effectively adsorbed by the polishing head 7. The lifting drive 4 drives the lifting bracket 3 to move down and return to its position. Finally, the operator moves down the entire wafer polishing test and aligns the loading device, so that the abutment positioning ring 2 and the polishing head 7 are separated from each other, completing the loading process.

[0053] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Wafer polishing test alignment loading device, characterized in that: The invention comprises a bottom bracket (1), an abutting positioning ring (2), a lifting bracket (3) and a lifting drive member (4); the abutting positioning ring (2) is mounted on the top of the bottom bracket (1) through a support column (21); the abutting positioning ring (2) can be sleeved on the outer periphery of the polishing head (7) to be coaxially positioned with the polishing head (7); the lifting drive member (4) is connected to the bottom bracket (1) and is located below the abutting positioning ring (2); the lifting bracket (3) is connected above the lifting drive member (4) and is used to support the wafer (6); the lifting bracket (3) can be moved upward under the drive of the lifting drive member (4) to be coaxially aligned with the polishing head (7) and adsorbed below the polishing head (7).

2. The wafer polishing test alignment and loading device according to claim 1, characterized in that: The lifting bracket (3) includes a lower bracket (31) and an upper tray (32), wherein the upper tray (32) is connected to the upper part of the lower bracket (31) and is used to support the wafer (6), and the lifting drive (4) is connected to the lower part of the lower bracket (31) and is coaxially arranged with the upper tray (32), and the lifting drive (4) is used to drive the lower bracket (31), the upper tray (32) and the wafer (6) to move upward synchronously so that the wafer (6) and the polishing head (7) are adsorbed.

3. The wafer polishing test alignment and loading device according to claim 2, characterized in that: A limiting ring (33) is provided on the top surface of the upper tray (32) and is used to limit the wafer (6). The limiting ring (33) extends along the circumference of the upper tray (32). The height of the limiting ring (33) is less than the height of the wafer (6).

4. The wafer polishing test alignment and loading device according to claim 3, characterized in that: The lower bracket (31) is a square frame that passes through from top to bottom. A cross-arranged supporting rod (34) is provided inside the lower bracket (31). The lifting drive member (4) has a lifting end extending upward, and the supporting rod (34) is connected above the lifting end.

5. The wafer polishing test alignment and loading device according to claim 1, characterized in that: The inner circumference of the abutting positioning ring (2) is provided with a limiting step (22), the limiting step (22) extending along the circumference of the abutting positioning ring (2), and the top surface of the limiting step (22) is used for abutting and positioning with the bottom surface of the polishing head (7).

6. The wafer polishing test alignment and loading device according to claim 1, characterized in that: At least two support columns (21) are provided. The support columns (21) are arranged at intervals along the circumference of the abutment positioning ring (2). The abutment positioning ring (2) is connected to the upper end of the support column (21).

7. The wafer polishing test alignment and loading device according to claim 6, characterized in that: The bottom bracket (1) is provided with an extension portion (11) extending outwardly along the radial direction of the abutting positioning ring (2), and a gripping handle (12) is provided at the outer end of the extension portion (11).

8. The wafer polishing test alignment and loading device according to claim 7, characterized in that: The gripping handle (12) is provided with an anti-slip layer (13).

9. The wafer polishing test alignment and loading device according to claim 4, characterized in that: The abutting positioning ring (2) is detachably connected to the upper end of the supporting column (21); a horizontally extending mounting slot (14) is provided on the lower bracket (31); and the lifting drive member (4) is connected to the bottom bracket (1) via a connecting member passing through the mounting slot (14).

10. The wafer polishing test alignment and loading device according to claim 1, characterized in that: The wafer polishing test alignment loading device further comprises a controller, the controller being electrically connected to the lifting drive member (4), and the controller being used to send control instructions to the lifting drive member (4).

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