Wax liquid sheet taking machine

Abstract

The utility model discloses a wax liquid sheet taking machine which comprises a base, a heating platform, a micro-vibration platform, a liquid accumulation disc, a grinding platform, a fixing support, a control display screen, a rotating motor, a Z-axis driving platform and a material box. The heating platform is arranged on the upper surface of the base, and the micro-vibration platform is arranged on the upper surface of the heating platform; the liquid accumulation disc is of a hollow cylindrical structure with the top open and is arranged on the upper surface of the micro-vibration platform, the grinding platform is of a cylindrical structure and is arranged in the liquid accumulation disc, the fixing support is fixed to the base, and the control display screen is arranged on one side of the fixing support. A rotating motor rotating longitudinally is arranged on the fixing support through a horizontally-distributed supporting rod, a Z-axis driving platform is arranged at the driving end of the rotating motor through a rotating frame, and a material box is arranged at the driving end of the Z-axis driving platform. According to the utility model, the synchronous grinding of a plurality of wafers can be realized, the wafers can be conveniently taken, the operation is convenient, the labor intensity is low, and the working efficiency is high.

Description

Technical Field

[0001] The utility model relates to a wax liquid film taking machine. Background Art

[0002] Wafers often require grinding during the production process. However, existing wafers are typically placed directly on a grinding platform, with wax added continuously to aid grinding. Because the wax is added directly during the grinding process, the correct temperature cannot be maintained, and the wax easily solidifies, affecting the proper grinding process. Furthermore, after grinding, the wafers are difficult to remove, which is time-consuming and labor-intensive, impacting wafer processing efficiency. Excessive force can easily damage the wafers, making them inconvenient to use. Utility Model Content

[0003] The main technical problem solved by the utility model is to provide a wax liquid wafer taking machine with a simple, reasonable and reliable structure, which can realize the synchronous grinding of multiple wafers, ensure the grinding quality of the wafers, and facilitate the wafer taking. It is easy to operate, has low labor intensity and high work efficiency.

[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a wax liquid film removal machine for removing materials after wafer grinding, including a base, a heating platform, a micro-vibration platform, a liquid collection plate, a grinding platform, a fixed bracket, a control display screen, a rotating motor, a Z-axis drive platform and a material box. The base is horizontally arranged, the heating platform is arranged on the upper surface of the base, the micro-vibration platform is arranged on the upper surface of the heating platform, the liquid collection plate is a hollow cylindrical structure with an open top and is arranged on the upper surface of the micro-vibration platform, the grinding platform is a cylindrical structure and is arranged inside the liquid collection plate, the fixed bracket is fixed on the base, the control display screen is arranged on one side of the fixed bracket, and a longitudinally rotating rotating motor is arranged on the fixed bracket through horizontally distributed support rods, the driving end of the rotating motor is provided with a Z-axis drive platform through a rotating frame, and the driving end of the Z-axis drive platform is provided with a material box.

[0005] In a preferred embodiment of the present invention, the liquid accumulation tray, the grinding platform and the rotating motor are arranged in concentric circles.

[0006] In a preferred embodiment of the present invention, a handle is provided on the grinding platform.

[0007] In a preferred embodiment of the present invention, the grinding platform is further equipped with a film removal clamp.

[0008] In a preferred embodiment of the present invention, the end of the wafer removal clamp is provided with an arc surface corresponding to the wafer.

[0009] In a preferred embodiment of the present invention, the material box is arranged in the gap between the inner wall of the liquid accumulation tray and the outer wall of the grinding platform.

[0010] In a preferred embodiment of the present invention, the material box is provided with horizontally distributed material troughs arranged longitudinally and spaced apart on one side of the grinding platform.

[0011] The beneficial effects of the utility model are as follows: the wax liquid wafer taking machine pointed out by the utility model has a simple, reasonable and reliable structure, can realize the synchronous grinding of multiple wafers, ensure the grinding quality of the wafers, and can facilitate the wafer taking, with easy operation, low labor intensity and high work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. Among them:

[0013] Figure 1 This is a three-dimensional diagram of a preferred embodiment of a wax liquid film extractor of the utility model;

[0014] Figure 2 yes Figure 1 A partial enlarged view of part A. DETAILED DESCRIPTION

[0015] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] See also Figure 1-Figure 2 As shown, the embodiment of the utility model includes:

[0017] A wax liquid wafer removal machine is used to remove materials after wafer 1 is ground, including a base 2, a heating platform 3, a micro-vibration platform 4, a liquid accumulation tray 5, a grinding platform 6, a fixed bracket 7, a control display screen 8, a rotating motor 9, a Z-axis drive platform 10 and a material box 11.

[0018] The base 2 is arranged horizontally and placed on a workbench to facilitate the installation of various components.

[0019] The heating platform 3 is provided on the upper surface of the base 2 and is used to provide heating and heat preservation for the wax liquid when the wafer 1 is being polished.

[0020] The micro-vibration platform 4 is disposed on the upper surface of the heating platform 3 and is used to provide a vibration release effect on the ground wafer 1 .

[0021] The liquid collection tray 5 is a hollow cylindrical structure with an open top and is arranged on the upper surface of the micro-vibration platform 4. Wax liquid is placed in the liquid collection tray 5.

[0022] The grinding platform 6 is a cylindrical structure disposed inside the liquid collection tray 5 for grinding the wafer 1. The grinding platform 6 is provided with a handle 12 for easy transportation.

[0023] The grinding platform 6 is further equipped with a wafer removal clamp 13 . The end of the wafer removal clamp 13 is provided with an arc surface 14 corresponding to the wafer 1 for conveniently shoveling off the ground wafer 1 .

[0024] The fixing bracket 7 is fixed on the base 2 to provide installation for the upper component.

[0025] The control display screen 8 is arranged on one side of the fixing bracket 7 and is used to set the operating parameters of each component.

[0026] The fixing bracket 7 is provided with a longitudinally rotating rotary motor 9 via horizontally distributed support rods 15 , and the rotary motor 9 is used to provide a driving force for the longitudinal rotation.

[0027] The driving end of the rotary motor 9 is provided with a Z-axis driving platform 10 via a rotating frame 16 , and the Z-axis driving platform 10 is driven by the rotary motor 9 to perform a rotary motion.

[0028] A material box 11 is provided at the driving end of the Z-axis driving platform 10 , and the material box 11 moves longitudinally under the action of the Z-axis driving platform 10 .

[0029] The liquid collection tray 5 , the grinding platform 6 and the rotating motor 9 are arranged in concentric circles, and the material box 11 is arranged in the gap between the inner wall of the liquid collection tray 5 and the outer wall of the grinding platform 6 , so that the material box 11 rotates around the grinding platform 6 to collect the wafer 1 .

[0030] The material box 11 is provided with horizontally distributed material troughs 17 arranged longitudinally at intervals on one side of the grinding platform 6. When the wafer 1 is ground, the material box 11 moves to the corresponding position under the action of the rotating motor 9 and the Z-axis drive platform 10, and the wafer 1 is shoveled from the grinding platform 6 to the material trough 17 through the wafer removal clamp 13.

[0031] To sum up, the wax liquid wafer removal machine pointed out in the utility model has a simple, reasonable and reliable structure, can realize the synchronous grinding of multiple wafers, ensure the grinding quality of the wafers, and facilitate the removal of wafers. It is easy to operate, has low labor intensity and high work efficiency.

[0032] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wax liquid wafer removal machine, used for removing wafers after grinding, characterized in that: It includes a base, a heating platform, a micro-vibration platform, a liquid accumulation tray, a grinding platform, a fixed bracket, a control display screen, a rotating motor, a Z-axis drive platform and a material box. The base is horizontally arranged, the heating platform is arranged on the upper surface of the base, the micro-vibration platform is arranged on the upper surface of the heating platform, the liquid accumulation tray is a hollow cylindrical structure with an open top and is arranged on the upper surface of the micro-vibration platform, the grinding platform is a cylindrical structure arranged inside the liquid accumulation tray, the fixed bracket is fixed on the base, the control display screen is arranged on one side of the fixed bracket, and a longitudinally rotating rotating motor is arranged on the fixed bracket through horizontally distributed support rods. The driving end of the rotating motor is provided with a Z-axis drive platform through a rotating frame, and the driving end of the Z-axis drive platform is provided with a material box.

2. The wax liquid film extractor according to claim 1, characterized in that: The liquid accumulation tray, the grinding platform and the rotating motor are arranged in concentric circles.

3. The wax liquid film extractor according to claim 1, characterized in that: A handle is provided on the grinding platform.

4. The wax liquid film extractor according to claim 1, characterized in that: The grinding platform is also equipped with a film taking clamp.

5. The wax liquid film extractor according to claim 4, characterized in that: The end of the wafer taking clamp is provided with an arc surface corresponding to the wafer.

6. The wax liquid film extractor according to claim 1, characterized in that: The material box is arranged in the gap between the inner wall of the liquid accumulation tray and the outer wall of the grinding platform.

7. The wax liquid film extractor according to claim 6, characterized in that: The material box is provided with horizontally distributed material troughs arranged at intervals in the vertical direction on one side of the grinding platform.

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