Refrigeration system

Abstract

The utility model relates to the technical field of refrigeration, and discloses a refrigeration system which comprises a cooling unit and a refrigeration unit. The cooling unit is configured to provide a refrigerant to the refrigeration unit, and is provided with a first refrigerant inlet and a first refrigerant outlet. The refrigeration unit is configured to perform refrigeration by using the refrigerant provided by the cooling unit, and is provided with a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is communicated with the first refrigerant outlet, and the second refrigerant outlet is communicated with the first refrigerant inlet. In the refrigeration system, the refrigeration unit directly utilizes the low-temperature refrigerant provided by the cooling unit, so that heat exchange refrigeration can be carried out at the heat exchanger, and heat exchange refrigeration can be carried out at the liquid cooling server. In this way, refrigeration can be achieved without the need for a plate heat exchanger in the cold liquid distribution unit to conduct heat exchange in the refrigeration unit. Therefore, a cold liquid distribution unit does not need to be arranged in the refrigerating system, and the deployment cost of the refrigerating system is reduced.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to a refrigeration system. Background Art

[0002] Currently, as server performance improves, the heat generated by servers in data centers also increases, and the cooling needs of data centers also increase accordingly.

[0003] In the related art, data centers usually use a refrigeration system including a cold plate liquid cooling server to solve the heat dissipation problem. However, the cold plate liquid cooling server and the liquid cooling unit in the refrigeration system can only dissipate heat for components with large heat generation (such as the CPU). For components in the server with small heat generation (such as hard disks and power modules, etc.), it is necessary to use the air cooling unit in the refrigeration system to dissipate heat. In addition, a cold liquid distribution unit needs to be configured in the refrigeration system to distribute the cooling capacity between the liquid cooling unit and the air cooling unit. This makes the configuration of the refrigeration system more complicated and increases the deployment cost of the refrigeration system.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0005] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0006] The embodiments of the present disclosure provide a refrigeration system that can simplify the configuration of the refrigeration system, thereby reducing the deployment cost of the refrigeration system.

[0007] An embodiment of the present disclosure provides a refrigeration system, comprising: a cooling unit and a refrigeration unit; wherein:

[0008] The cooling unit is configured to provide refrigerant to the refrigeration unit and is provided with a first refrigerant inlet and a first refrigerant outlet; the refrigerant pipeline between the first refrigerant inlet and the first refrigerant outlet is provided with a compressor, a condensing device and a refrigerant pump;

[0009] The refrigeration unit is configured to utilize the refrigerant provided by the cooling unit for refrigeration, and is provided with a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is communicated with the first refrigerant outlet, and the second refrigerant outlet is communicated with the first refrigerant inlet; the refrigerant pipeline between the second refrigerant inlet and the second refrigerant outlet is provided with a first electronic expansion valve, a heat exchanger and a plurality of liquid cooling cabinets connected in parallel; the inlet of the first electronic expansion valve is connected to the second refrigerant inlet through a refrigerant pipeline, the outlet of the first electronic expansion valve is connected to the inlet of the heat exchanger, and the outlet of the heat exchanger is connected to the refrigerant pipe. The refrigerant pipeline is respectively connected to each liquid cooling cabinet; each liquid cooling cabinet includes a liquid distribution manifold, multiple liquid cooling components and a gas collecting manifold; each liquid cooling component includes a second electronic expansion valve and a liquid cooling server, and the outlet of the second electronic expansion valve is connected to the inlet of the liquid cooling server; the inlet of the liquid distribution manifold is connected to the outlet of the heat exchanger through the refrigerant pipeline, each outlet of the liquid distribution manifold is connected to the inlet of the second electronic expansion valve in a liquid cooling component, each inlet of the gas collecting manifold is connected to the outlet of the liquid cooling server in a liquid cooling component, and the outlet of the gas collecting manifold is connected to the second refrigerant outlet through the refrigerant pipeline.

[0010] Optionally, the condensing device is an air-cooled condenser or an evaporative condenser.

[0011] Optionally, the evaporative condenser includes a condenser body, a cooling water pipeline, a first circulating water pump, a spray device, a filler and a fan; wherein: the spray device and the filler are arranged inside the condenser body; the cooling water pipeline, the first circulating water pump and the fan are arranged outside the condenser body; one end of the cooling water pipeline is connected to the spray device, and the other end is connected to the bottom of the condenser body; the first circulating water pump is arranged in the cooling water pipeline and is configured to provide power for cooling water circulation.

[0012] Optionally, the condensing device includes a second circulating water pump, a cooling tower and a water-cooled condenser forming a cooling water loop; wherein: the water-cooled condenser includes a first branch and a second branch; the first branch is connected to the second circulating water pump and the cooling tower respectively, and the second branch is connected to the refrigerant pipeline; the cooling water in the first branch and the refrigerant in the second branch exchange heat; the cooling tower is configured to provide cooling water to the first branch of the water-cooled condenser; the second circulating water pump is configured to provide power for the cooling water circulation.

[0013] Optionally, a first pressure sensor and a first temperature sensor are provided at the outlet of the heat exchanger; the first pressure sensor is configured to detect a first pressure at the outlet of the heat exchanger; the first temperature sensor is configured to detect a first temperature at the outlet of the heat exchanger; wherein, the superheat of the heat exchanger is determined based on the first pressure and the first temperature, and the opening of the first electronic expansion valve is adjusted based on the superheat of the heat exchanger.

[0014] Optionally, a temperature and humidity sensor is provided in the liquid cooling cabinet; a second pressure sensor and a second temperature sensor are provided at the outlet of the liquid cooling server; wherein: the temperature and humidity sensor is configured to detect the temperature and humidity in the liquid cooling cabinet; the second pressure sensor is configured to detect the second pressure at the outlet of the liquid cooling server; the second temperature sensor is configured to detect the second temperature at the outlet of the liquid cooling server; wherein, the dew point temperature in the liquid cooling cabinet is determined according to the temperature and humidity in the liquid cooling cabinet; the overheating degree of the liquid cooling server is determined according to the second pressure and the second temperature; and the opening degree of the second electronic expansion valve is adjusted according to the dew point temperature in the liquid cooling cabinet and the overheating degree of the liquid cooling server.

[0015] Optionally, each liquid cooling assembly further comprises: a quick connector, arranged between the outlet of the second electronic expansion valve and the inlet of the liquid cooling server; wherein, when the liquid cooling server is disconnected from the refrigerant circuit, the quick connector is in a blocked state.

[0016] Optionally, the cooling unit further includes: a gas-liquid separator, which is arranged at the inlet of the compressor.

[0017] The refrigeration system provided by the embodiments of the present disclosure can achieve the following technical effects:

[0018] The compressor in the cooling unit compresses low-pressure, high-temperature gaseous refrigerant into high-pressure, high-temperature gaseous refrigerant, which is then fed into the condensing unit. This high-temperature, high-pressure gaseous refrigerant is then condensed into low-temperature, high-pressure liquid refrigerant. Under the action of the refrigerant pump, the low-temperature, high-pressure liquid refrigerant flows through the first refrigerant outlet into the second refrigerant inlet of the cooling unit. It then flows through the refrigerant piping and into the first electronic expansion valve, where it is throttled. After throttling, the refrigerant absorbs heat in the heat exchanger before being converted to medium-temperature refrigerant. The medium-temperature refrigerant then flows through the refrigerant piping into each liquid-cooled cabinet. The second electronic expansion valve within the cabinet throttles the medium-temperature refrigerant, which then absorbs heat again within the liquid-cooled servers before being converted to low-pressure, high-temperature refrigerant. The low-pressure, high-temperature refrigerant then flows through the refrigerant piping, returns through the second refrigerant outlet of the cooling unit, and returns to the first refrigerant inlet of the cooling unit. From there, it flows back through the refrigerant piping to the compressor, completing the cooling process of the refrigeration system.

[0019] In the disclosed embodiments, the refrigeration unit directly utilizes the low-temperature refrigerant provided by the cooling unit to perform heat exchange and cooling at the heat exchanger, as well as heat exchange and cooling at the liquid-cooled server. This eliminates the need for the plate heat exchanger in the cold liquid distribution unit to achieve cooling. Consequently, the cold liquid distribution unit is no longer required in the refrigeration system, simplifying the refrigeration system configuration and reducing the deployment cost of the refrigeration system.

[0020] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0022] Figure 1 This is an environmental diagram of a traditional refrigeration system;

[0023] Figure 2 is a schematic diagram of a refrigeration system provided by an embodiment of the present disclosure;

[0024] Figure 3 is a schematic diagram of a cooling unit in a refrigeration system provided by an embodiment of the present disclosure;

[0025] Figure 4 is a schematic diagram of a refrigeration unit in a refrigeration system provided by an embodiment of the present disclosure;

[0026] Figure 5 is a schematic diagram of a liquid cooling cabinet in a refrigeration unit provided by an embodiment of the present disclosure;

[0027] Figure 6 is a schematic diagram of a refrigeration unit provided by an embodiment of the present disclosure;

[0028] Figure 7 is a schematic diagram of another refrigeration unit provided by an embodiment of the present disclosure;

[0029] Figure 8 is a schematic diagram of another refrigeration unit provided by an embodiment of the present disclosure;

[0030] Figure 9 is a schematic diagram of a heat exchanger provided by an embodiment of the present disclosure;

[0031] Figure 10 is a schematic diagram of a liquid cooling cabinet in another refrigeration unit provided by an embodiment of the present disclosure;

[0032] Figure 11 is a schematic diagram of another refrigeration unit provided in an embodiment of the present disclosure.

[0033] Reference numerals:

[0034] Refrigeration system: 200; Cooling unit: 201; Refrigeration unit: 202;

[0035] First refrigerant inlet: 31; first refrigerant outlet: 32; compressor: 33; condensing device: 34; refrigerant pump: 35; gas-liquid separator: 36; liquid storage tank: 37; first one-way valve: 38; second one-way valve: 39;

[0036] Second refrigerant inlet: 41; second refrigerant outlet: 42; first electronic expansion valve: 43; heat exchanger: 44; liquid cooling cabinet: 45; second electronic expansion valve: 46; liquid cooling server: 47; temperature and humidity sensor: 48;

[0037] First pressure sensor: 441; First temperature sensor: 442;

[0038] Liquid distribution manifold: 451; liquid cooling assembly: 452; gas collecting manifold: 453; quick connector: 454; needle valve: 455;

[0039] Second pressure sensor: 471; Second temperature sensor: 472;

[0040] Condenser body: 71; cooling water pipeline: 72; first circulating water pump: 73; spray device: 74; filler: 75; fan: 76;

[0041] Water-cooled condenser: 81; cooling tower: 82; second circulating water pump: 83; first branch: 811; second branch: 812. DETAILED DESCRIPTION

[0042] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0043] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate to describe the embodiments of the present disclosure herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0044] Unless otherwise specified, the term "plurality" means two or more. The term "multiple" means two or more.

[0045] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0046] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0047] The term "correspondence" may refer to an association relationship or a binding relationship. The correspondence between A and B means that there is an association relationship or a binding relationship between A and B.

[0048] Currently, as server performance improves, the heat generated by servers in data centers also increases, and the cooling needs of data centers also increase accordingly.

[0049] Traditionally, data centers typically use cold plate liquid cooling systems to solve heat dissipation problems. Figure 1 As shown, a schematic diagram of a conventional refrigeration system is provided, which includes a cabinet, a supply and return manifold, a cold liquid distribution unit, and a cold source.

[0050] The cabinet contains multiple liquid-cooled servers, each with its inlet and outlet connected to the supply and return manifold. The cooling distribution unit includes a first circulating water pump and a heat exchanger. The outlet of the first circulating water pump is connected to inlet a of the heat exchanger. The inlet of the first circulating water pump is connected to the outlet of the supply and return manifold, and outlet b of the heat exchanger is connected to the inlet of the supply and return manifold. The cooling source includes a cooling tower and a second circulating water pump. The outlet of the cooling tower is connected to the inlet of the second circulating water pump. The outlet of the second circulating water pump is connected to inlet c of the heat exchanger, and outlet d of the heat exchanger is connected to the inlet of the cooling tower.

[0051] However, in traditional methods, cold plate liquid-cooled servers, combined with the liquid cooling unit in the refrigeration system, can only dissipate heat from components that generate a lot of heat (such as the CPU). For components in the server that generate less heat (such as hard drives and power modules), the air cooling unit in the refrigeration system is required to dissipate heat. Furthermore, the refrigeration system requires a cold liquid distribution unit to distribute the cooling capacity between the liquid cooling unit and the air cooling unit. This makes the configuration of the refrigeration system more complex and increases the deployment cost of the refrigeration system.

[0052] In light of this, embodiments of the present disclosure provide a refrigeration system. In these embodiments, the refrigeration unit directly utilizes the low-temperature refrigerant provided by the cooling unit to perform heat exchange and cooling at the heat exchanger, as well as heat exchange and cooling at the liquid-cooled server. This eliminates the need for the plate heat exchanger in the cold liquid distribution unit to achieve cooling. Consequently, the cold liquid distribution unit is no longer required in the refrigeration system, simplifying its configuration and reducing the deployment cost of the refrigeration system.

[0053] Combine Figure 2 As shown, an embodiment of the present disclosure provides a refrigeration system 200, which includes a cooling unit 201 and a refrigeration unit 202; wherein:

[0054] Combine Figure 3 As shown, the cooling unit 201 is configured to supply refrigerant to the refrigeration unit 202 and is provided with a first refrigerant inlet 31 and a first refrigerant outlet 32. The refrigerant pipeline between the first refrigerant inlet 31 and the first refrigerant outlet 32 is provided with a compressor 33, a condensing device 34, and a refrigerant pump 35. Specifically, the outlet of the compressor 33 is connected to the inlet of the condensing device 34 via a refrigerant pipeline, the outlet of the condensing device 34 is connected to the inlet of the refrigerant pump 35 via a refrigerant pipeline, the outlet of the refrigerant pump 35 is connected to the first refrigerant outlet 32 via a refrigerant pipeline, and the inlet of the compressor 33 is connected to the first refrigerant inlet 31 via a refrigerant pipeline.

[0055] Combine Figure 4 As shown, refrigeration unit 202 is configured to utilize the refrigerant provided by cooling unit 201 for cooling, and is provided with a second refrigerant inlet 41 and a second refrigerant outlet 42. The second refrigerant inlet 41 is connected to the first refrigerant outlet 32, and the second refrigerant outlet 42 is connected to the first refrigerant inlet 31. The refrigerant pipeline between the second refrigerant inlet 41 and the second refrigerant outlet 42 is provided with a first electronic expansion valve 43, a heat exchanger 44, and multiple liquid cooling cabinets 45 connected in parallel. The inlet of the first electronic expansion valve 43 is connected to the second refrigerant inlet 41 via a refrigerant pipeline, and the outlet of the first electronic expansion valve 43 is connected to the inlet of the heat exchanger 44. The outlet of the heat exchanger 44 is connected to each liquid cooling cabinet 45 via a refrigerant pipeline.

[0056] Combine Figure 5 As shown, each liquid-cooling cabinet 45 includes a liquid distribution manifold 451, multiple liquid-cooling components 452, and a gas collection manifold 453. Each liquid-cooling component 452 includes a second electronic expansion valve 46 and a liquid-cooling server 47. The outlet of the second electronic expansion valve 46 is connected to the inlet of the liquid-cooling server 47. The inlet of the liquid distribution manifold 451 is connected to the outlet of the heat exchanger 44 via a refrigerant pipeline. Each outlet of the liquid distribution manifold 451 is connected to the inlet of the second electronic expansion valve 46 in a liquid-cooling component 452. Each inlet of the gas collection manifold 453 is connected to the outlet of the liquid-cooling server 47 in a liquid-cooling component 452. The outlet of the gas collection manifold 453 is connected to the second refrigerant outlet 42 via a refrigerant pipeline.

[0057] In the disclosed embodiment, the compressor 33 in the cooling unit 201 compresses the low-pressure, high-temperature gaseous refrigerant into a high-pressure, high-temperature gaseous refrigerant, which is then fed into the condensing device 34. This high-temperature, high-pressure gaseous refrigerant is then condensed into a low-temperature, high-pressure liquid refrigerant. Under the action of the refrigerant pump 35, the low-temperature, high-pressure liquid refrigerant flows through the first refrigerant outlet 32 into the second refrigerant inlet 41 of the refrigeration unit 202. It then flows through the refrigerant pipeline into the first electronic expansion valve 43 for throttling. The throttled refrigerant absorbs heat in the heat exchanger 44 before being converted into a medium-temperature refrigerant. The medium-temperature refrigerant then flows through the refrigerant pipeline into each liquid-cooled cabinet 45. The second electronic expansion valve 46 within the liquid-cooled cabinet 45 throttles the medium-temperature refrigerant. The throttled medium-temperature refrigerant then absorbs heat again within the liquid-cooled server 47 before being converted into a low-pressure, high-temperature refrigerant. The low-pressure, high-temperature refrigerant flows in the refrigerant pipeline, flows through the second refrigerant outlet 42 of the refrigeration unit 202, and flows back to the first refrigerant inlet 31 of the cooling unit 201, and then flows back to the compressor 33 through the refrigerant pipeline. Thus, the refrigeration process of the refrigeration system is completed.

[0058] In the refrigeration system provided by the embodiments of the present disclosure, refrigeration unit 202 directly utilizes the low-temperature refrigerant provided by cooling unit 201 to perform heat exchange and cooling at heat exchanger 44 and at liquid-cooled server 47. This eliminates the need for the plate heat exchanger in the cold liquid distribution unit to achieve cooling in refrigeration unit 202. Therefore, the cold liquid distribution unit is no longer required in the refrigeration system, simplifying the configuration of the refrigeration system and reducing the deployment cost of the refrigeration system.

[0059] Optionally, in the embodiment of the present disclosure, the refrigerant flowing in the refrigerant pipeline is Freon.

[0060] The refrigerant used in cold plate liquid cooling servers is typically deionized water, ethylene glycol, and propylene glycol. Thus, if the refrigerant is deionized water, the refrigerant pipelines are prone to corrosion after the liquid cooling server is used for a long time. The corroded refrigerant pipelines will leak deionized water. The leaked deionized water is not easy to volatilize and will adhere to the interior of the liquid cooling server for a long time, easily becoming conductive and causing damage to the liquid cooling server. In the case of flammable refrigerants such as ethylene glycol or propylene glycol, if the refrigerant pipelines leak after corrosion, the leaked ethylene glycol or propylene glycol will easily burn inside the liquid cooling server, causing damage to the liquid cooling server and even a fire. Thus, in this embodiment, the use of non-flammable, explosive, non-conductive, and easily volatile Freon as a refrigerant can improve the safety of the liquid cooling server 47.

[0061] Optionally, in the embodiment of the present disclosure, the condensing device 34 may be an air-cooled condenser or an evaporative condenser. Specifically, in the case where the condensing device 34 is an air-cooled condenser, the cooling unit 201 may refer to Figure 6 shown.

[0062] Optionally, when the condensing device 34 is an evaporative condenser, the cooling unit 201 may refer to Figure 7 As shown. The evaporative condenser includes a condenser body 71, a cooling water line 72, a first circulating water pump 73, a spray device 74, a filler 75, and a fan 76. The spray device 74 and filler 75 are disposed inside the condenser body 71. The cooling water line 72, the first circulating water pump 73, and the fan 74 are disposed outside the condenser body 71. One end of the cooling water line 72 is connected to the spray device 74, and the other end is connected to the bottom of the condenser body 71. The first circulating water pump 73 is disposed in the cooling water line 72 and is configured to provide power for the cooling water circulation.

[0063] In this embodiment, the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33 flows into the inlet of the evaporative condenser, exchanges heat with the cooling water sprayed by the spray device 74, and is converted into a low-temperature, high-pressure liquid refrigerant, which then flows out through the outlet of the evaporative condenser. After heat exchange, the cooling water inside the evaporative cooler is converted into high-temperature cooling water. When the high-temperature cooling water accumulates in the packing 75, it is dissipated by the high-speed air flow under the action of the fan 76 and converted into low-temperature cooling water. The low-temperature cooling water flows into the cooling water pipeline 72 at the bottom of the condenser body 71. The first circulating water pump 73 provided on the cooling water pipeline 72 causes the low-temperature cooling water to flow to the spray device 74. Thus, the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33 is cooled.

[0064] Optionally, in the embodiment of the present disclosure, the condensing device 34 may also be a hybrid condensing device. Specifically, when the condensing device 34 is a hybrid condensing device, the cooling unit 201 may refer to Figure 8 As shown. The hybrid condensing device includes a water-cooled condenser 81, a cooling tower 82, and a second circulating water pump 83. The water-cooled condenser 81 includes a first branch 811 and a second branch 812. The first branch 811 connects the second circulating water pump 83 and the cooling tower 82, respectively, while the second branch 812 connects to the refrigerant pipeline; the cooling water in the first branch 811 and the refrigerant in the second branch 812 exchange heat. The cooling tower 82 is configured to provide cooling water to the first branch 811 of the water-cooled condenser 81. The second circulating water pump 83 is configured to provide power for the cooling water circulation.

[0065] In this embodiment, the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33 flows through the second branch 812, exchanges heat with the cooling water in the first branch 811, and is converted into a low-temperature, high-pressure liquid refrigerant. The cooling water in the first branch 811 is converted into high-temperature cooling water, which is then returned to the cooling tower 82 for cooling under the action of the second circulating water pump 83. This completes the cooling of the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33.

[0066] Optionally, combined Figure 9 As shown, in the disclosed embodiment, a first pressure sensor 441 and a first temperature sensor 442 are provided at the outlet of the heat exchanger 44. The first pressure sensor 441 is configured to detect a first pressure at the outlet of the heat exchanger 44. The first temperature sensor 442 is configured to detect a first temperature at the outlet of the heat exchanger 44. The superheat of the heat exchanger 44 is determined based on the first pressure and first temperature, and the opening of the first electronic expansion valve 43 is adjusted based on the superheat of the heat exchanger 44.

[0067] In this embodiment, the process for adjusting the opening of the first electronic expansion valve 43 can be as follows: Based on the first pressure, the evaporation temperature of the refrigerant flowing through the heat exchanger 44 is calculated. The temperature difference between the first temperature and the evaporation temperature of the refrigerant flowing through the heat exchanger 44 is calculated as the superheat of the heat exchanger 44. The opening of the first electronic expansion valve 43 is adjusted based on the relationship between the superheat of the heat exchanger 44 and the first target superheat. Specifically, when the superheat of the heat exchanger 44 exceeds the first target superheat, the opening of the first electronic expansion valve 43 is increased. When the superheat of the heat exchanger 44 is less than the first target superheat, the opening of the first electronic expansion valve 43 is decreased. When the superheat of the heat exchanger 44 equals the first target superheat, the opening of the first electronic expansion valve 43 remains unchanged. In this way, by adjusting the opening of the first electronic expansion valve 43, the superheat of the heat exchanger 44 can be adjusted to meet the first target superheat requirement. Thus, the cooling effect of the heat exchanger 44 meets user needs.

[0068] Optionally, the first target superheat degree ranges from 0°C to 2°C.

[0069] Optionally, combined Figure 10As shown, in the embodiment of the present disclosure, a temperature and humidity sensor 48 is provided in the liquid cooling cabinet 45. A second pressure sensor 471 and a second temperature sensor 472 are provided at the outlet of the liquid cooling server 47. The temperature and humidity sensor 472 is configured to detect the temperature and humidity in the liquid cooling cabinet 45. The second pressure sensor 471 is configured to detect a second pressure at the outlet of the liquid cooling server 47. The second temperature sensor 472 is configured to detect a second temperature at the outlet of the liquid cooling server 47. The dew point temperature in the liquid cooling cabinet 45 is determined based on the temperature and humidity in the liquid cooling cabinet 45. The superheat degree of the liquid cooling server 47 is determined based on the second pressure and the second temperature. The opening degree of the second electronic expansion valve 46 is adjusted based on the dew point temperature in the liquid cooling cabinet 45 and the superheat degree of the liquid cooling server 47.

[0070] In this embodiment, the process for adjusting the opening of the second electronic expansion valve 46 can be as follows: based on the temperature and humidity within the liquid cooling cabinet 45, the dew point temperature within the liquid cooling cabinet 45 is calculated. Based on the second pressure, the second evaporation temperature of the refrigerant flowing through the liquid cooling server 47 is calculated. The temperature difference between the second temperature and the evaporation temperature of the refrigerant flowing through the liquid cooling server 47 is calculated as the superheat of the liquid cooling server 47. The opening of the second electronic expansion valve 46 is adjusted based on the dew point temperature within the liquid cooling cabinet 45, the superheat of the liquid cooling server 47, and the second target superheat.

[0071] Specifically, when the evaporation temperature of the liquid-cooled server 47 is lower than the dew point temperature, the opening of the second electronic expansion valve 46 is increased to raise the evaporation temperature of the liquid-cooled server 47 above the dew point temperature, thereby reducing condensation or even frost formation on the liquid-cooled server 47 and, in turn, reducing the failure rate of the liquid-cooled server 47. When the evaporation temperature of the liquid-cooled server 47 is higher than the dew point temperature and higher than the second target superheat, the opening of the second electronic expansion valve 46 is increased to raise the evaporation temperature of the liquid-cooled server 47, thereby reducing the superheat of the liquid-cooled server 47. When the evaporation temperature of the liquid-cooled server 47 is higher than the dew point temperature and lower than the second target superheat, the opening adjustment amount of the second electronic expansion valve 46 can be determined based on the temperature difference between the evaporation temperature and the dew point temperature. Based on the opening adjustment amount, the opening of the second electronic expansion valve 46 is decreased to lower the evaporation temperature of the liquid-cooled server 47, thereby ensuring that the evaporation temperature of the liquid-cooled server 47 remains above the dew point temperature while appropriately reducing the superheat of the liquid-cooled server 47. In this way, the occurrence of condensation or even frost on the liquid-cooled server 47 can be reduced, thereby lowering the failure rate of the liquid-cooled server 47.

[0072] Optionally, the second target superheat ranges from 10°C to 15°C.

[0073] Optionally, combined Figure 10As shown, each liquid cooling assembly 452 further includes a quick connector 454 and a needle valve 455. The quick connector 454 is disposed between the outlet of the second electronic expansion valve 46 and the inlet of the liquid cooling server 47. The needle valve 455 is disposed between the quick connector 454 and the liquid cooling server 47.

[0074] In this embodiment, when the liquid-cooled server 47 is disconnected from the refrigerant circuit, the quick connector 454 is in a blocked state. This facilitates disassembly or replacement of the liquid-cooled server 47 in the liquid-cooled cabinet 45. During this process, the quick connector 454 is in a blocked state, preventing refrigerant leakage. Furthermore, before installing the liquid-cooled server 47 in the liquid-cooled cabinet 45, or while the liquid-cooled server 47 is in use within the liquid-cooled cabinet 45, the user can utilize the needle valve 455 to vacuum the refrigerant piping within the liquid-cooled server 47. This prevents air from mixing with the refrigerant, thereby preventing damage to the compressor 33 caused by air inhalation during the refrigeration system's cooling process.

[0075] Optionally, combined Figure 11 As shown, cooling unit 201 further includes a gas-liquid separator 36, a liquid storage tank 37, a first one-way valve 38, and a second one-way valve 39. Gas-liquid separator 36 is disposed at the inlet of compressor 33. Liquid storage tank 37 is disposed in the refrigerant pipeline between condensing device 34 and refrigerant pump 35. First one-way valve 38 is disposed in the refrigerant pipeline between compressor 33 and condensing device 34. Second one-way valve 39 is connected in parallel to compressor 33 and gas-liquid separator 36 via the refrigerant pipeline. The inlet of second one-way valve 39 is connected to the inlet of gas-liquid separator 36, and the outlet of second one-way valve 39 is connected to the outlet of compressor 33.

[0076] In this embodiment, before the refrigerant flows back to the compressor 33, it passes through the gas-liquid separator 36 to separate the gaseous refrigerant and the liquid refrigerant in the refrigerant, preventing the liquid refrigerant from flowing back to the compressor 33, preventing liquid hammer in the compressor, and reducing the failure rate of the compressor. A first one-way valve 38 is provided at the outlet of the compressor 33 to prevent the refrigerant discharged from the compressor 33 from flowing back into the compressor 33 at the outlet. In other words, the liquid refrigerant condensed by the condensing device 34 cannot flow back into the compressor 33, reducing the possibility of damage to the compressor 33. In addition, the liquid storage tank 37 is used to store liquid refrigerant and can replenish refrigerant to the refrigerant pipeline when the refrigerant pressure or flow rate in the refrigerant pipeline is low. Thus, the refrigeration efficiency of the entire refrigeration system is guaranteed.

[0077] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the words used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to also include plural forms. Similarly, the term "and / or" as used in this application refers to any and all possible combinations of one or more associated listings. In addition, when used in this application, the term "comprise" and its variations "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups of these. In the absence of further restrictions, an element defined by the sentence "comprising a..." does not exclude the presence of other identical elements in the process, method or device that includes the element. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments can be referenced to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can be found in the description of the method part.

[0078] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software may depend on the specific application and design constraints of the technical solution. The technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. The technicians will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0079] In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units can be merely a logical functional division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between each other shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, and can be electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected to implement this embodiment according to actual needs. In addition, the functional units in the embodiments of the present disclosure may be integrated into a processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0080] The flowcharts and block diagrams in the accompanying drawings show the possible implementation architectures, functions and operations of the systems, methods and computer program products according to the embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of the code, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical functions. In some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in an order different from that disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified function or action, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A refrigeration system, characterized in that: include: Cooling units and refrigeration units; wherein: The cooling unit is configured to provide refrigerant to the refrigeration unit and is provided with a first refrigerant inlet and a first refrigerant outlet; the refrigerant pipeline between the first refrigerant inlet and the first refrigerant outlet is provided with a compressor, a condensing device and a refrigerant pump; The refrigeration unit is configured to utilize the refrigerant provided by the cooling unit for refrigeration, and is provided with a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is communicated with the first refrigerant outlet, and the second refrigerant outlet is communicated with the first refrigerant inlet; the refrigerant pipeline between the second refrigerant inlet and the second refrigerant outlet is provided with a first electronic expansion valve, a heat exchanger and a plurality of liquid cooling cabinets connected in parallel; the inlet of the first electronic expansion valve is connected to the second refrigerant inlet through a refrigerant pipeline, the outlet of the first electronic expansion valve is connected to the inlet of the heat exchanger, and the outlet of the heat exchanger is connected to the refrigerant pipe. The refrigerant pipeline is respectively connected to each liquid cooling cabinet; each liquid cooling cabinet includes a liquid distribution manifold, multiple liquid cooling components and a gas collecting manifold; each liquid cooling component includes a second electronic expansion valve and a liquid cooling server, and the outlet of the second electronic expansion valve is connected to the inlet of the liquid cooling server; the inlet of the liquid distribution manifold is connected to the outlet of the heat exchanger through the refrigerant pipeline, each outlet of the liquid distribution manifold is connected to the inlet of the second electronic expansion valve in a liquid cooling component, each inlet of the gas collecting manifold is connected to the outlet of the liquid cooling server in a liquid cooling component, and the outlet of the gas collecting manifold is connected to the second refrigerant outlet through the refrigerant pipeline.

2. The system according to claim 1, wherein: The condensing device is an air-cooled condenser or an evaporative condenser.

3. The system according to claim 2, characterized in that The evaporative condenser includes a condenser body, cooling water pipeline, first circulating water pump, spray device, filler and fan; wherein: The spray device and filler are arranged inside the condenser body; the cooling water pipeline, the first circulating water pump and the fan are arranged outside the condenser body; one end of the cooling water pipeline is connected to the spray device, and the other end is connected to the bottom of the condenser body; the first circulating water pump is arranged in the cooling water pipeline and is configured to provide power for cooling water circulation.

4. The system according to claim 1, wherein: The condensing device includes a second circulating water pump, a cooling tower and a water-cooled condenser forming a cooling water loop; wherein: The water-cooled condenser includes a first branch and a second branch; the first branch is connected to the second circulating water pump and the cooling tower respectively, and the second branch is connected to the refrigerant pipeline; the cooling water in the first branch and the refrigerant in the second branch perform heat exchange; a cooling tower configured to provide cooling water to a first branch of the water-cooled condenser; The second circulating water pump is configured to provide power for the circulation of cooling water.

5. The system according to claim 1, wherein: The outlet of the heat exchanger is provided with a first pressure sensor and a first temperature sensor; a first pressure sensor configured to detect a first pressure at an outlet of the heat exchanger; a first temperature sensor configured to detect a first temperature at an outlet of the heat exchanger; The superheat of the heat exchanger is determined according to the first pressure and the first temperature, and the opening of the first electronic expansion valve is adjusted according to the superheat of the heat exchanger.

6. The system according to claim 1, wherein: A temperature and humidity sensor is provided in the liquid cooling cabinet; a second pressure sensor and a second temperature sensor are provided at the outlet of the liquid cooling server; wherein: a temperature and humidity sensor configured to detect temperature and humidity within the liquid cooling cabinet; a second pressure sensor configured to detect a second pressure at an outlet of the liquid cooling server; a second temperature sensor configured to detect a second temperature at an outlet of the liquid cooling server; Among them, the dew point temperature inside the liquid cooling cabinet is determined according to the temperature and humidity inside the liquid cooling cabinet; the superheat of the liquid cooling server is determined according to the second pressure and the second temperature; and the opening of the second electronic expansion valve is adjusted according to the dew point temperature inside the liquid cooling cabinet and the superheat of the liquid cooling server.

7. The system according to claim 1, wherein: Each liquid cooling assembly also includes: A quick connector is provided between the outlet of the second electronic expansion valve and the inlet of the liquid cooling server; Among them, when the liquid-cooled server is disconnected from the refrigerant circuit, the quick connector is in a blocked state.

8. The system according to claim 1, wherein: The cooling unit also includes: The gas-liquid separator is installed at the inlet of the compressor.

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