Thick film patch fuse

Abstract

The utility model discloses a thick film patch fuse, which comprises a substrate, a glass layer borne on the substrate and a fuse body borne on the glass layer, the substrate is provided with a cavity located below the glass layer, and the cavity is also located below the melt. The cavity can release excess energy when the fuse body is fused, the arc discharge phenomenon of the fuse body is reduced, and therefore the fusing performance and the breaking capacity of the fuse are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of fuses, in particular to a thick film chip fuse. Background Art

[0002] In the prior art, circuit breaker disconnection based on the melt-fusing principle is generally achieved by filling arc-extinguishing material. The prerequisite for filling arc-extinguishing material is that the melt needs to be located in a hollow and sealed cavity so that the arc-extinguishing material can be filled and enclosed, and the arc-extinguishing material cannot leak out.

[0003] However, for melt structures that cannot be placed in a sealed cavity, such as a type of fuse product, the melt needs to be covered on a substrate by printing, and then a protective layer structure is printed on the melt. In this case, the melt cannot be wrapped with arc-extinguishing material. During use, if the melt melts instantly, arcing will occur due to the lack of arc-extinguishing protection, thereby affecting the fuse's fusing performance and breaking capacity.

[0004] Therefore, a new technical solution is needed to solve the above technical problems. Utility Model Content

[0005] In view of the above problems, the purpose of the present invention is to provide a thick film chip fuse to reduce the arcing phenomenon of the fuse body and improve the fusing performance and breaking capacity of the fuse.

[0006] To achieve the above-mentioned target functions, the thick-film chip fuse of the present invention can adopt the following technical solutions:

[0007] A thick film chip fuse comprises a substrate, a glass layer carried on the substrate, and a melt carried on the glass layer; the substrate is provided with a cavity located below the glass layer, and the cavity is also below the melt.

[0008] Furthermore, the upper surface of the substrate is recessed downward to form a groove, the glass layer covers the groove, and the groove and the bottom surface of the glass layer together form a cavity.

[0009] Furthermore, the substrate includes a bottom plate and an upper plate covering the bottom plate, the glass layer covers the upper plate, the upper surface of the bottom plate is concave downward to form a groove, and the groove and the bottom surface of the upper plate together form a cavity.

[0010] Furthermore, the cavity runs through both sides of the substrate.

[0011] Furthermore, the cavity is a square cavity.

[0012] Furthermore, a plurality of parallel or wavy grooves are provided inside the cavity.

[0013] Furthermore, the cavity is a parallelogram cavity.

[0014] Furthermore, the cavity is a trapezoidal cavity.

[0015] Beneficial effect: In the technical solution provided by the utility model, the cavity of the base body located below the melt can release excess energy when the melt is melted, reduce the arcing phenomenon of the melt, and thus improve the fusing performance and breaking capacity of the fuse. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the first embodiment of the medium-thick film chip fuse of the present utility model;

[0017] Figure 2 It is a schematic diagram of the three-dimensional structure of the second embodiment of the medium-thick film chip fuse of the present utility model. DETAILED DESCRIPTION

[0018] The following is a detailed description of the embodiments of the present invention.

[0019] Example 1

[0020] See also Figure 1 As shown, the thick-film chip fuse provided in this embodiment includes a substrate 1, a glass layer 2 supported on the substrate 1, and a melt 3 supported on the glass layer 2. The upper surface of the substrate 1 is recessed to form a groove, and the glass layer 2 covers the groove. The groove and the bottom surface of the glass layer 2 together form a cavity 4. The cavity 4 runs through both sides of the substrate 1. The melt 3 and the glass layer 2 are also covered with a protective layer 5.

[0021] In this embodiment, the shape of the cavity is not limited, for example, it can be a square cavity, a parallelogram cavity or a trapezoidal cavity, etc., or a plurality of parallel or wavy grooves are provided inside the cavity.

[0022] When the thick-film chip fuse of this embodiment is in use, the instantaneous high-temperature energy generated when the fuse 3 melts can penetrate the glass layer 2 and enter the cavity 4. The cavity 4 runs through both sides of the substrate to quickly discharge the energy to release the excess energy caused by the instantaneous melting, thereby reducing the arcing phenomenon of the fuse.

[0023] The preparation method of the thick film chip fuse in this embodiment is as follows:

[0024] (a) A substrate 1 is prepared, and a groove with an upward opening is cut into the substrate 1.

[0025] (b) Filling the groove with a filler (not shown, for example, an alloy), wherein the upper surface of the filler is flush with the upper surface of the substrate 1 .

[0026] (c) Covering the substrate 1 with a glass layer 2 by printing, wherein the length of the glass layer 2 is greater than the length of the groove, so that both ends of the glass layer 2 cover the upper surface of the substrate 1 and the middle portion of the glass layer 2 covers the upper surface of the filler; and drying and sintering the glass layer 2 to fix it to the upper surface of the substrate 1.

[0027] (d) The melt 3 is applied on the upper surface of the glass layer 2 by printing. The melt 3 can be formed by printing silver paste to form a silver melt. The melt 3 is dried and sintered to be fixed on the upper surface of the glass layer 2.

[0028] (e) Covering the melt with a protective layer 5 by printing; and drying and sintering the protective layer 5 to fix it on the glass layer 2 and the upper surface of the melt 3.

[0029] (f) The filler is removed by etching, for example, to form a cavity 4.

[0030] Example 2

[0031] Please combine Figure 2 As shown, the thick-film chip fuse provided in this embodiment includes a substrate, a glass layer 2 supported on the substrate, and a melt 3 supported on the glass layer 2. The substrate includes a bottom plate 1 and an upper plate 5 overlying the bottom plate 1. The glass layer 2 overlies the upper plate 5. The bottom plate 1 is a relatively thick ceramic plate, while the upper plate 5 is a relatively thin ceramic plate. A protective layer 4 is also provided over the melt 3 and the glass layer 2.

[0032] The upper surface of the bottom plate 1 is sunken downward to form a groove, and the groove and the bottom surface of the upper plate together form a cavity 6. In this embodiment, the shape of the cavity 6 is not limited.

[0033] In the thick-film chip fuse of this embodiment, the thickness of the upper plate 5 should be as thin as possible while maintaining structural strength. This allows the instantaneous high-temperature energy generated when the fuse 3 melts to penetrate the glass layer 2 and the upper plate 5 and enter the cavity 6. The cavity 6 runs through both sides of the bottom plate 1 to quickly discharge the energy, releasing excess energy from the instantaneous melting and reducing the arcing phenomenon of the fuse.

[0034] The preparation method of the thick film chip fuse in this embodiment is as follows:

[0035] (a) Prepare a bottom plate 1 and cut a groove with an upward opening on the bottom plate 1.

[0036] (b) Cover the upper plate 5 with a glass layer 2 by printing, wherein the length of the glass layer 2 is greater than the length of the groove. The glass layer 2 is dried and sintered to be fixed to the upper surface of the upper plate 5.

[0037] (c) The melt 3 is laid on the upper surface of the glass layer 2 by printing; the melt 3 is dried and sintered to be fixed on the upper surface of the glass layer 2, the length of the melt 3 is greater than the length of the glass layer 2, and both ends of the melt 3 cover the upper plate 5.

[0038] (d) Covering the melt 3 with a protective layer 4 by printing; and drying and sintering the protective layer 4 to fix it on the glass layer 2 and the upper surface of the melt 3.

[0039] (e) Cover and attach the upper plate 5 to the bottom plate 1 to form a cavity.

Claims

1. A thick film chip fuse, comprising a substrate, characterized in that: It also includes a glass layer supported on a substrate, and a melt supported on the glass layer; The substrate is provided with a cavity below the glass layer and below the melt; The upper surface of the substrate is concave downward to form a groove, the glass layer covers the groove, and the groove and the bottom surface of the glass layer together form a cavity; Alternatively, the substrate includes a bottom plate and an upper plate covering the bottom plate, the glass layer covers the upper plate, the upper surface of the bottom plate is recessed downward to form a groove, and the groove and the bottom surface of the upper plate together form a cavity.

2. The thick film chip fuse according to claim 1, wherein: The cavity passes through both sides of the substrate.

3. The thick film chip fuse according to claim 1, wherein: The cavity is a square cavity.

4. The thick film chip fuse according to claim 1, wherein: A plurality of parallel or wavy grooves are arranged inside the cavity.

5. The thick film chip fuse according to claim 1, wherein: The cavity is a parallelogram cavity.

6. The thick film chip fuse according to claim 1, wherein: The cavity is a trapezoidal cavity.

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