Lead frame for radio frequency power device shell

Abstract

The utility model discloses a lead frame for a radio frequency power device shell, the radio frequency power device shell comprises a heat sink, a ceramic piece and a lead, self-positioning connection is carried out through a brazing mold, and the lead frame is used for assisting the brazing mold to carry out brazing and electroplating on the radio frequency power device shell. The lead frame comprises lead pins and an auxiliary peripheral frame, and the auxiliary peripheral frame half wraps the periphery of the radio frequency power device shell, is connected with two leads of the radio frequency power device shell from the two sides, supports the heat sink from the two sides of the upper surface of the ceramic piece, positions the leads during brazing and is electrically connected during electroplating. Outer chamfers are arranged on the outer sides of the auxiliary peripheral frames according to size characteristics and used for reducing the gold plating area of the lead frame. According to the lead frame provided by the utility model, through the design of the outer chamfer of the lead frame, the gold plating area during electroplating is reduced, so that the production cost is reduced, meanwhile, scratches caused by misoperation of operators are effectively reduced, and the production safety is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic packaging shells, in particular to a lead frame for a radio frequency power device shell. Background Art

[0002] In the current field of electronic packaging technology, RF power devices are crucial components in key areas such as wireless communications, radar systems, satellite communications, and microwave heating. Their performance and reliability are directly related to the overall system's operating efficiency and stability. RF power tube housings have distinct characteristics, typically consisting of a heat sink, ceramic components, and leads.

[0003] During the production process, in order to achieve precise mounting and electroplating of the three parts, a lead frame is usually designed as an auxiliary. The lead frame is mostly made of metal materials, such as copper alloy or stainless steel. A layer of gold or other precious metal is plated on its surface through an electroplating process to improve its conductivity, corrosion resistance and solderability. After the electroplating is completed, the lead frame is cut off.

[0004] Electroplating inevitably adds gold to the leadframe, increasing production costs. Furthermore, leadframes are primarily made of thin, hard metal sheets, making them prone to scratches if handled improperly. However, the considerable width of the leadframe not only serves the purpose of electroplating but also provides support and positioning during the brazing process. Reducing leadframe plating costs and improving production safety are crucial amidst the increasingly competitive domestic and international housing market. Utility Model Content

[0005] The problem to be solved by the utility model is to provide a lead frame for a radio frequency power device housing, which is used to reduce the production cost of the radio frequency power device housing and improve production safety.

[0006] The utility model adopts the following technical solution: a lead frame for a radio frequency power device housing, comprising: lead pins and an auxiliary peripheral frame; the auxiliary peripheral frame is connected to two leads of the radio frequency power device housing from both sides to assist in supporting and positioning the radio frequency power device housing.

[0007] The RF power device housing comprises a heat sink, a ceramic component, and two leads, which are self-positioned and connected via a brazing mold. The lead frame assists the brazing mold in brazing and electroplating. The auxiliary peripheral frame is semi-wrapped around the periphery of the RF power device housing, and the two leads are connected respectively. The heat sink is supported from both sides of the upper surface of the ceramic component, the leads are positioned during brazing, and electrical connections are made during electroplating. The outer sides of the auxiliary peripheral frame are chamfered.

[0008] Preferably, the width of the upper surface of the auxiliary peripheral frame is set in the range of 1 / 5 to 1 / 4 of the length of the longest side of the auxiliary peripheral frame, so as to ensure the support of the lead frame and facilitate the positioning of the soldering mounting.

[0009] Preferably, the outer chamfer is set according to the size characteristics of the auxiliary peripheral frame, the outer chamfer part is smaller than the width of the upper surface of the auxiliary peripheral frame, and the setting range is 1 / 3-1 / 2 of the length of the smaller line segment of the two sides connected by the outer chamfer, which is used to reduce the gold plating area of the lead frame.

[0010] Preferably, the outer chamfer is a rounded corner with a smooth transition to reduce the sharp surface of the lead frame.

[0011] Preferably, the lead frame is a thin metal structure and is mounted on the surface of the ceramic component.

[0012] Preferably, both leads are square, with length and width smaller than those of the heat sink, and one of the leads is provided with a notch on a side not close to the heat sink for identifying the signal input and output terminals.

[0013] Furthermore, a ceramic component is mounted on the upper surface of the heat sink, and the leads are mounted on the upper surface of the ceramic component for signal input and output.

[0014] Furthermore, the brazing mold is used to weld the heat sink, the ceramic component and the lead frame into one.

[0015] Compared with the prior art, the above technical solution adopted by the present invention has the following technical effects:

[0016] 1. The lead frame for the radio frequency power device housing of the present invention effectively reduces the gold plating area during electroplating by designing the outer chamfer of the lead frame, thereby reducing production costs.

[0017] The utility model discloses a lead frame for a radio frequency power device housing, which effectively reduces scratches on operators caused by improper operation by designing an outer chamfer of the lead frame, thereby improving production safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the lead frame structure for the radio frequency power device housing of the utility model;

[0019] Figure 2 This is a schematic diagram of the heat sink structure of the radio frequency power device housing of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the porcelain component of the utility model;

[0021] Figure 4 Schematic diagram of the traditional lead frame structure;

[0022] Figure 5This is a schematic diagram of the structure of the lead frame after rounding;

[0023] Figure 6 This is a schematic diagram of the brazing die of the utility model;

[0024] Figure 7 This is a schematic diagram of the electroplating of the shell of the utility model;

[0025] Explanation of symbols in the figure: 1-lead frame; 2-ceramic part; 3-heat sink; 4-auxiliary peripheral frame; 5-lead. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] In one embodiment of the present invention, a lead frame for a radio frequency power device housing is provided. Figure 1 As shown, the lead frame 1 includes: lead pins and an auxiliary peripheral frame 4; the auxiliary peripheral frame 4 is connected to two leads 5 of the RF power device housing from both sides to assist in supporting and positioning the RF power device housing.

[0028] The RF power device housing includes a heat sink 3, a ceramic part 2, and two leads 5. The shape of the heat sink 3 is as follows: Figure 2 As shown, the ceramic part 2 is shaped as Figure 3 As shown, the ceramic component 2 is mounted on the upper surface of the heat sink 3 , and the lead 5 is mounted on the ceramic component 2 .

[0029] The RF power device housing is self-positioned and connected through a brazing mold. The lead frame 1 is used to assist the brazing mold in brazing and electroplating. It is half-wrapped around the outer periphery of the RF power device housing through an auxiliary peripheral frame 4, and supports the heat sink 3 from both sides of the upper surface of the ceramic part 2 through the two leads 5. The leads are positioned during brazing and electrical connections are made during electroplating.

[0030] The lead frame 1 is mounted on the surface of the ceramic part 2, and the lead pins serve as signal input and output. The ceramic part 2 is mounted on the heat sink 3, which is a top-down structure.

[0031] In particular, the outer sides of the lead frame 1 described in this embodiment are designed with external chamfers. According to the dimensional characteristics of the auxiliary outer frame 4, the outer chamfers of corresponding sizes are designed. On the one hand, the lead frame 1 needs to ensure the accuracy of positioning during brazing and mounting, and at the same time play the role of electrical connection during electroplating. On the other hand, by involving chamfers in the auxiliary outer frame 4, the purpose of reducing the production cost of the shell and improving production safety is achieved.

[0032] Furthermore, the width of the upper surface of the auxiliary peripheral frame 4 is set in the range of 1 / 5 to 1 / 4 of the length of the longest side of the auxiliary peripheral frame, so as to ensure the support of the lead frame and facilitate the positioning of the soldering mounting.

[0033] The outer chamfer is set according to the size characteristics of the auxiliary outer frame 4. The size of the outer chamfer part should be smaller than the width of the upper surface of the auxiliary outer frame 4 to facilitate the brazing and mounting positioning. On the other hand, the outer chamfer should not be too large to ensure the support of the lead to avoid deformation of the lead and affect the mounting effect.

[0034] In this embodiment, the outer chamfer is set within a range of 1 / 3 to 1 / 2 the length of the smaller of the two sides connected by the outer chamfer, to reduce the lead frame's gold plating area. For example, if the lengths of the two sides connecting the outer chamfer are 6 cm and 9 cm respectively, the outer chamfer is recommended to be designed to be 1 / 3 to 1 / 2 of 6 cm, i.e., a chamfer of 2 cm to 3 cm.

[0035] At the same time, the external chamfer should have a smooth transition during machining to reduce sharp surfaces and burrs and improve production safety.

[0036] Furthermore, the lead frame 1 should also facilitate the electrical connection of the electroplating, leaving enough operating space for electroplating bundling, and should not excessively reduce the size of the lead frame to ensure the electroplating operation.

[0037] Furthermore, the lead frame of this embodiment is a metal part with high hardness and is not easily deformed.

[0038] After the production is completed, the auxiliary outer frame 4 is disconnected from the connection between the two leads 5 of the auxiliary outer frame 4 and the RF power device housing to obtain a complete RF power device housing.

[0039] Traditional RF power device housings use lead frame structures, such as Figure 4 As shown in the figure, the surface area of the wire frame structure can be measured to be 166mm 2 .

[0040] The lead frame for the RF power device housing of this embodiment is used to transform the above-mentioned traditional lead frame, such as Figure 5 As shown in the figure, all the external right angles of the lead frame are rounded. According to the dimensions in the figure, its surface area can be measured to be 161mm 2, reducing the lead frame gold plating area by about 3%.

[0041] The improved lead frame is applied to the brazing die, e.g. Figure 6 As shown, the leads are positioned during soldering and the electrical connections are made during electroplating, as shown in Figure 7 As shown, the lead frame is connected to the power supply through the pin lead, which not only reduces the gold plating area of the lead frame and reduces the production cost, but also effectively reduces the sharp surface of the lead frame and improves the safety of production.

[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A lead frame for a radio frequency power device housing, characterized in that: The lead frame (1) comprises: lead pins and an auxiliary peripheral frame (4); the auxiliary peripheral frame (4) is connected to two leads (5) of a radio frequency power device housing from both sides, and assists in supporting and positioning the radio frequency power device housing; The radio frequency power device housing comprises a heat sink (3), a ceramic component (2), and two leads (5), which are self-positioned and connected via a brazing die; the lead frame (1) assists the brazing die in brazing and electroplating, and is semi-wrapped around the periphery of the radio frequency power device housing via the auxiliary peripheral frame (4), respectively connecting the two leads (5), supporting the heat sink (3) from both sides of the upper surface of the ceramic component (2), positioning the leads during brazing, and performing electrical connection during electroplating; and the outer sides of the auxiliary peripheral frame (4) are all chamfered.

2. The lead frame for a radio frequency power device housing according to claim 1, wherein: The width of the upper surface of the auxiliary peripheral frame (4) is set within a range of 1 / 5 to 1 / 4 of the length of the longest side of the auxiliary peripheral frame (4), so as to ensure support for the lead frame and facilitate soldering and mounting positioning.

3. The lead frame for a radio frequency power device housing according to claim 2, wherein: The outer chamfer is set according to the size characteristics of the auxiliary peripheral frame (4), the outer chamfer portion is smaller than the width of the upper surface of the auxiliary peripheral frame (4), and the setting range is 1 / 3-1 / 2 of the length of the smaller line segment of the two sides connected by the outer chamfer, so as to reduce the gold plating area of the lead frame.

4. The lead frame for a radio frequency power device housing according to claim 3, wherein: The outer chamfer is a rounded corner with a smooth transition, which reduces the sharp surface of the lead frame (1).

5. The lead frame for a radio frequency power device housing according to claim 1, wherein: The lead frame (1) is a thin metal structure and is mounted on the surface of the ceramic component (2).

6. The lead frame for a radio frequency power device housing according to claim 1, wherein: The two leads (5) are both square, with length and width smaller than the length and width of the heat sink (3), and one of the leads (5) is provided with a notch on a side not close to the heat sink (3) for identifying signal input and output terminals.

7. The lead frame for a radio frequency power device housing according to claim 6, wherein: The ceramic component (2) is mounted on the upper surface of the heat sink (3); the two leads (5) are respectively mounted on both sides of the upper surface of the ceramic component (2) for signal input and output.

8. The lead frame for a radio frequency power device housing according to claim 1, wherein: The brazing mold is used to weld the heat sink (3), the ceramic part (2) and the lead frame (1) into one body.

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