Lamp-drive integrated LED packaging structure and light-emitting device

Abstract

The utility model discloses a lamp-drive integrated LED packaging structure and a light-emitting device, the lamp-drive integrated LED packaging structure comprises a substrate, a bonding pad assembly, a drive IC and a first light-emitting chip, and the bonding pad assembly comprises a positive electrode bonding pad, a negative electrode bonding pad, a data input bonding pad and a first drive output bonding pad which are arranged on the substrate. The first driving output bonding pad comprises two first welding parts arranged at an interval and a first connecting part connecting the two first welding parts, and the width of the first connecting part is smaller than that of any first welding part in the width direction of the first driving output bonding pad; the width direction of the first driving output bonding pad is perpendicular to the connecting direction of the two first welding parts; the driving IC is electrically connected with the positive electrode bonding pad, the negative electrode bonding pad, the data input bonding pad and a first welding part respectively; the first light-emitting chip is electrically connected with the positive electrode bonding pad and the other first welding part. According to the technical scheme of the utility model, the production yield of products can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp beads, in particular to a lamp-driver integrated LED packaging structure and a light-emitting device. Background Art

[0002] LEDs (light-emitting diodes), as efficient and environmentally friendly lighting components, are widely used in a variety of applications. To enhance LED performance and functionality, modern LED packages often incorporate integrated driver ICs (ICs). These ICs not only control the LED's brightness and color but also enable more complex functions such as serial communication and intelligent control. This integrated design significantly enhances LED application flexibility and system simplicity.

[0003] In an exemplary LED packaging technology, a single-width driver output pad is provided between the driver IC and the light-emitting chip. The driver IC and the light-emitting chip are then soldered to the pad to achieve electrical connection. However, this design with a single-width driver output pad is prone to a "siphon effect" during high-temperature soldering. The siphon effect refers to the microscopic phenomenon in which liquid solder flows along the surface of the pad due to surface tension and capillary action. This effect can cause solder to flow away from the intended soldering area, resulting in poor connections or short circuits, which in turn affects the reliability and production yield of the LED.

[0004] It should be noted that the exemplary technologies are only used to understand the solutions and do not constitute an admission that they are prior arts. Utility Model Content

[0005] The main purpose of the utility model is to provide a lamp-driver integrated LED packaging structure, aiming to solve the technical problem of low production yield of the existing lamp-driver integrated LED packaging structure.

[0006] To achieve the above-mentioned purpose, the utility model proposes an integrated lamp-driven LED packaging structure, including a substrate, a pad assembly, a driver IC and a first light-emitting chip, the pad assembly including a positive electrode pad, a negative electrode pad, a data input pad and a first driving output pad arranged on the substrate, the first driving output pad including two first welding portions arranged at intervals and a first connecting portion connecting the two first welding portions, in the width direction of the first driving output pad, the width of the first connecting portion is smaller than the width of any first welding portion; the width direction of the first driving output pad is a direction perpendicular to the connection direction of the two first welding portions; the driver IC is electrically connected to the positive electrode pad, the negative electrode pad, the data input pad and one of the first welding portions respectively; the first light-emitting chip is electrically connected to the positive electrode pad and another of the first welding portions respectively.

[0007] Optionally, the pad assembly includes a data output pad provided on the substrate, and the driver IC is electrically connected to the data output pad.

[0008] Optionally, the lamp-driven integrated LED packaging structure further includes a second light-emitting chip and a third light-emitting chip, the second light-emitting chip and the third light-emitting chip are electrically connected to the positive electrode pad, and the second light-emitting chip and the third light-emitting chip are electrically connected to the driver IC, respectively.

[0009] Optionally, the pad assembly includes a second driving output pad and a third driving output pad provided on the substrate;

[0010] The second driving output pad includes two second welding portions spaced apart and a second connecting portion connecting the two second welding portions. In a width direction of the second driving output pad, the width of the second connecting portion is smaller than a width of any of the second welding portions. The width direction of the second driving output pad is perpendicular to a connection direction of the two second welding portions.

[0011] The third driving output pad includes two third welding portions spaced apart and a third connecting portion connecting the two third welding portions. In the width direction of the third driving output pad, the width of the third connecting portion is smaller than the width of any of the third welding portions. The width direction of the third driving output pad is perpendicular to the connection direction of the two third welding portions.

[0012] The driver IC is electrically connected to the second welding portion and the third welding portion respectively;

[0013] The second light emitting chip is electrically connected to another second soldering portion, and the third light emitting chip is electrically connected to another third soldering portion.

[0014] Optionally, six IC welding parts are provided at the bottom of the driver IC, and the six IC welding parts correspond one by one to the positive electrode pad, the negative electrode pad, the data input pad, the first welding part, the second welding part and the third welding part, and the IC welding parts are welded to the corresponding pads or welding parts.

[0015] Optionally, three of the six IC soldering portions are arranged in a row along the first direction to form a first row;

[0016] The other three IC soldering portions of the six IC soldering portions are arranged in a row along the first direction to form a second row;

[0017] The first column extends parallel to the second column.

[0018] Optionally, a packaging glue is provided on the substrate, and the material of the packaging glue is a light-transmitting material. The packaging glue wraps the positive electrode pad, the negative electrode pad, the data input pad, the first drive output pad, the second drive output pad, the third drive output pad, the driver IC, the first light-emitting chip, the second light-emitting chip and the third light-emitting chip.

[0019] Optionally, the substrate includes a backlight surface, on which a positive pin, a negative pin and a data input pin are provided, the positive pin is electrically connected to the positive pad, the negative pin is electrically connected to the negative pad, and the data input pin is electrically connected to the data input pad.

[0020] Optionally, the data input pin includes a first input pin, a second input pin and a connecting pin, the positive pin, the first input pin, the second input pin and the negative pin are arranged in a rectangular array, and the first input pin and the second input pin are located at the diagonal positions of the rectangle, and the connecting pin is arranged between the first input pin and the second input pin, and is respectively connected to the first input pin and the second input pin.

[0021] The present utility model also proposes a light-emitting device, including an LED packaging structure with an integrated lamp driver, the LED packaging structure with an integrated lamp driver includes a substrate, a pad assembly, a driver IC and a first light-emitting chip, the pad assembly includes a positive electrode pad, a negative electrode pad, a data input pad and a first driving output pad arranged on the substrate, the first driving output pad includes two first welding portions arranged at intervals and a first connecting portion connecting the two first welding portions, in the width direction of the first driving output pad, the width of the first connecting portion is smaller than the width of any first welding portion; the width direction of the first driving output pad is a direction perpendicular to the connection direction of the two first welding portions; the driver IC is electrically connected to the positive electrode pad, the negative electrode pad, the data input pad and one of the first welding portions respectively; the first light-emitting chip is electrically connected to the positive electrode pad and another of the first welding portions respectively.

[0022] The lamp-driven integrated LED packaging structure of the present invention's technical solution effectively solves the problem of liquid solder being sucked away by the siphon effect during the welding process by providing two spaced first welding parts and a first connecting part connecting them on the first driver output pad, and making the width of the first connecting part smaller than the width of the first welding part. This unique design creates a sudden change in the width of the pad, forming a surface tension difference on a microscopic scale, and effectively preventing the liquid solder from excessively flowing along the pad surface during high-temperature welding. Specifically, the narrower first connecting part increases the resistance to solder flow, while the wider first welding part provides sufficient welding area for the solder. This structure makes it easier for the solder to stay in the intended welding area, i.e., the first welding part, thereby greatly reducing the risk of poor connection and short circuit. In this way, the present invention significantly improves the reliability and production yield of the lamp-driven integrated LED packaging structure, overcomes the limitations of the single-width pad design in the prior art, and provides technical support for the large-scale production of high-performance lamp-driven integrated LED packaging structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0024] Figure 1 This is a structural diagram of an embodiment of a lamp-driver integrated LED packaging structure of the present invention;

[0025] Figure 2 for Figure 1 Schematic diagram of the structure after omitting the packaging glue;

[0026] Figure 3 for Figure 2 Schematic diagram of the structure after omitting some structures;

[0027] Figure 4 This is a structural diagram of another embodiment of the LED packaging structure with integrated lamp and driver of the present invention;

[0028] Figure 5 Schematic diagram of the structure of the backlight surface of the substrate;

[0029] Figure 6 A schematic diagram of the back structure of the driver IC.

[0030] Description of Figure Numbers:

[0031] 1. Substrate; 2. Pad assembly; 21. Positive pad; 22. Negative pad; 23. Data input pad; 24. First drive output pad; 241. First welding portion; 242. First connecting portion; 25. Second drive output pad; 251. Second welding portion; 252. Second connecting portion; 26. Third drive output pad; 261. Third welding portion; 262. Third connecting portion; 27. Positive pin; 28. Negative pin; 29. Data input pin; 291. First input pin; 292. Second input pin; 293. Connecting pin; 3. Driver IC; 31. IC welding portion; 32. First column; 33. Second column; 4. First light-emitting chip; 5. Second light-emitting chip; 6. Third light-emitting chip; 7. Packaging glue.

[0032] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, the descriptions of "first", "second", etc. in this utility model are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, and must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0036] The utility model provides a LED packaging structure integrated with a lamp and a driver.

[0037] In the embodiment of the present utility model, Figures 1 to 6 As shown, the LED packaging structure with integrated lamp drive includes a substrate 1, a pad assembly 2, a driver IC3 and a first light-emitting chip 4, the pad assembly 2 includes a positive pad 21, a negative pad 22, a data input pad 23 and a first drive output pad 24 arranged on the substrate 1, the first drive output pad 24 includes two first welding portions 241 arranged at intervals and a first connecting portion 242 connecting the two first welding portions 241, in the width direction of the first drive output pad 24, the width of the first connecting portion 242 is smaller than the width of any first welding portion 241; the width direction of the first drive output pad 24 is a direction perpendicular to the connection direction of the two first welding portions 241; the driver IC3 is electrically connected to the positive pad 21, the negative pad 22, the data input pad 23 and one of the first welding portions 241 respectively; the first light-emitting chip 4 is electrically connected to the positive pad 21 and another of the first welding portions 241 respectively.

[0038] Specifically, substrate 1 is a structure used to support and secure other components. Substrate 1 can be a ceramic substrate 1, a fiberglass substrate 1, or other materials. Pad assembly 2 refers to a collection of various functional pads formed on substrate 1. Driver IC 3 is an integrated circuit used to control the brightness, color, or other functions of the integrated LED package structure. First light-emitting chip 4 is a semiconductor chip capable of emitting light and can be an LED chip of different colors or specifications.

[0039] The various pads in the pad assembly 2 are disposed on the substrate 1 and can be formed by printing, etching, or other suitable circuit fabrication processes. The electrical connection between the driver IC 3 and the first light-emitting chip 4 and the pads can be achieved in a variety of ways, such as soldering, conductive adhesive bonding, or crimping. Specifically, the driver IC 3 can be directly soldered to the corresponding pads using flip-chip technology, or connected to the pads via wire bonding. The first light-emitting chip 4 can also be electrically connected to the pads using either a flip-chip or face-up method.

[0040] The structural dimensions of the two first welding portions 241 may be the same or different, and this application does not impose any specific restrictions thereon. The same applies to the two second welding portions 251 and the two third welding portions 261 below, and will not be described in detail here.

[0041] As can be understood, the lamp-driven integrated LED package structure of the present invention effectively solves the problem of liquid solder being drawn away by the siphon effect during the soldering process by providing two spaced first soldering portions 241 and a first connecting portion 242 connecting them on the first driver output pad 24, with the width of the first connecting portion 242 being smaller than that of the first soldering portion 241. This unique design creates a sudden change in pad width, creating a surface tension difference on a microscopic scale, effectively preventing excessive flow of liquid solder along the pad surface during high-temperature soldering. Specifically, the narrower first connecting portion 242 increases resistance to solder flow, while the wider first soldering portion 241 provides sufficient soldering area. This structure makes it easier for solder to stay in the intended soldering area, namely the first soldering portion 241, thereby significantly reducing the risk of poor connection and short circuit. In this way, the present invention significantly improves the reliability and production yield of the lamp-driven integrated LED package structure, overcomes the limitations of the single-width pad design in the prior art, and provides technical support for the large-scale production of high-performance lamp-driven integrated LED package structures.

[0042] Optionally, the pad assembly 2 includes a data output pad provided on the substrate 1, and the driver IC 3 is electrically connected to the data output pad. It is not difficult to understand that by providing a data output pad, the LED package structure with integrated lamp driver can transmit the processed data signal to the next-level device or other external system, thereby realizing more complex control and communication functions. This design enables multiple LED package structures with integrated lamp driver to be used in series or in parallel to form a larger-scale intelligent lighting system or display system. At the same time, the data output function also makes it possible to remotely control, monitor the status, and diagnose faults of the LED package structure with integrated lamp driver, thereby enhancing the intelligence level and maintainability of the product.

[0043] Optionally, the LED packaging structure with integrated lamp driver also includes a second light-emitting chip 5 and a third light-emitting chip 6, and the second light-emitting chip 5 and the third light-emitting chip 6 are electrically connected to the positive electrode pad 21 respectively, and the second light-emitting chip 5 and the third light-emitting chip 6 are electrically connected to the driver IC3 respectively.

[0044] Specifically, the second light-emitting chip 5 and the third light-emitting chip 6 are both additional light-emitting elements with similar functions to the first light-emitting chip 4 but are independently provided. These light-emitting chips can be LED chips of the same or different wavelengths, for example, red, green, and blue chips, used to achieve full-color display or color adjustment functions.

[0045] The electrical connection between the second light-emitting chip 5 and the third light-emitting chip 6 and the positive electrode pad 21 can be achieved in a variety of ways. For example, the positive electrode of the chip can be directly welded to the positive electrode pad 21 using a flip-chip process, or the positive electrode of the chip can be connected to the positive electrode pad 21 through a metal wire (such as a gold wire).

[0046] The addition of a second light-emitting chip 5 and a third light-emitting chip 6 expands the functionality of the integrated lamp-driver LED package. The multiple light-emitting chips enable the integrated lamp-driver LED package to achieve more complex lighting effects, such as multi-color display or adjustable color temperature. Furthermore, because each chip is directly connected to the driver IC 3, this design improves the system's control accuracy and response speed, enabling the integrated lamp-driver LED package to achieve richer and more refined lighting effect control, thereby providing better performance and user experience in applications such as display and lighting.

[0047] The second light-emitting chip 5 and the third light-emitting chip 6 can be connected to the driver IC 3 respectively through conductive wires, or can be connected through the following implementation: the pad assembly 2 includes a second driving output pad 25 and a third driving output pad 26 provided on the substrate 1;

[0048] The second driving output pad 25 includes two second welding portions 251 spaced apart and a second connecting portion 252 connecting the two second welding portions 251. In the width direction of the second driving output pad 25, the width of the second connecting portion 252 is smaller than the width of any second welding portion 251. The width direction of the second driving output pad 25 is perpendicular to the connection direction of the two second welding portions 251.

[0049] The third driving output pad 26 includes two third welding portions 261 spaced apart and a third connecting portion 262 connecting the two third welding portions 261. In the width direction of the third driving output pad 26, the width of the third connecting portion 262 is smaller than the width of any of the third welding portions 261. The width direction of the third driving output pad 26 is perpendicular to the connection direction of the two third welding portions 261.

[0050] The driver IC 3 is electrically connected to the second soldering portion 251 and the third soldering portion 261 respectively;

[0051] The second light emitting chip 5 is electrically connected to another second soldering portion 251 , and the third light emitting chip 6 is electrically connected to another third soldering portion 261 .

[0052] It should be noted that in the traditional LED structure, the driver IC3 is usually connected to the light-emitting chip using a conductive wire. In the process of soldering the conductive wire, there are usually two soldering sequences: one is to first solder one end of the conductive wire to the driver IC3, and then solder the other end of the conductive wire to the light-emitting chip. In this soldering sequence, the driver IC3 serves as the "first soldering point" and the light-emitting chip serves as the "second soldering point". The other is to first solder one end of the conductive wire to the light-emitting chip, and then solder the other end of the conductive wire to the driver IC3. In this soldering sequence, the light-emitting chip serves as the "first soldering point" and the driver IC3 serves as the "second soldering point".

[0053] There are fundamental differences between single- and double-solder joint welding methods. In single-solder joints, an electric current is used to melt one end of a conductive wire into a sphere, which is then directly bonded to the corresponding component's electrode using ultrasonic bonding. In contrast, a special porcelain nozzle is used to cut the other end of the conductive wire into a specific shape, with the cutting and bonding process occurring simultaneously. This double-solder joint welding method applies greater power and pressure to the solder joint, generating additional mechanical stress. Furthermore, the heat generated during the welding process causes thermal stress, further exacerbating the effects of mechanical stress. This increased mechanical and thermal stress can have a significant impact on thin, fragile light-emitting chips (especially red light-emitting chips) and driver ICs. For light-emitting chips, these stresses can easily create shear forces between the two electrodes, leading to chip cracking or internal damage. For driver ICs, excessive stress can damage the IC's electrodes or underlying circuitry, compromising proper functionality. These issues directly impact the performance, reliability, and lifespan of integrated LED packages.

[0054] The lamp-driven integrated LED packaging structure of the technical solution of the present invention introduces a first driving output pad 24 as a connector between the driving IC3 and the first light-emitting chip 4, introduces a second driving output pad 25 as a connector between the driving IC3 and the second light-emitting chip 5, and introduces a third driving output pad 26 as a connector between the driving IC3 and the third light-emitting chip 6. Even if a conductive wire is used to achieve electrical connection, only the corresponding driving output pad will be used as the second soldering point, and the driving IC3 or the corresponding light-emitting chip will not be used as the second soldering point. This effectively avoids the generation of additional mechanical stress and thermal stress on the fragile driving IC3 and the light-emitting chip, significantly reduces the risk of chip cracking, electrode damage or internal structure damage, thereby improving the reliability and service life of the lamp-driven integrated LED packaging structure.

[0055] Optionally, six IC welding parts 31 are provided at the bottom of the driving IC 3, and the six IC welding parts 31 correspond one by one to the positive electrode pad 21, the negative electrode pad 22, the data input pad 23, the first welding part 241, the second welding part 251 and the third welding part 261, and the IC welding part 31 is welded to the corresponding pad or welding part.

[0056] Directly soldering the driver IC3 reduces the number of additional connecting components and simplifies the package structure. Furthermore, the one-to-one connection ensures that each functional signal has a dedicated connection channel, reducing the possibility of signal interference and improving the operating stability of the integrated LED package structure.

[0057] See also Figure 3 In some embodiments of the present application, the negative electrode pad 22 and the data input pad 23 are both designed in the shape of an "I". The pads of this shape are large at both ends and small in the middle, which can effectively prevent the liquid solder from excessively flowing along the surface of the pad during high-temperature welding.

[0058] Also, please continue reading Figure 3 In some embodiments of the present application, the size of the portion on the positive electrode pad 21 used for welding with the light-emitting chip 3 and the portion used for welding with the driver IC 3 are both set to be relatively large. This design is also to prevent the liquid solder from excessively flowing along the surface of the pad during high-temperature welding.

[0059] Optionally, three IC soldering portions 31 of the six IC soldering portions 31 are arranged in a row along the first direction to form a first row 32;

[0060] The other three IC soldering portions 31 of the six IC soldering portions 31 are arranged in a row along the first direction to form a second row 33;

[0061] The first column 32 and the second column 33 extend in parallel.

[0062] Specifically, the first direction in this embodiment can be understood as a specific direction on the driver IC 3, such as the long side direction or the short side direction, and the column arrangement means that the three pad portions are arranged in sequence on the same straight line.

[0063] The primary advantage of this layout design is that it optimizes space utilization and signal transmission. By dividing the six IC pads into two columns, a compact and orderly layout is achieved. This arrangement not only reduces the overall size of the driver IC3 but also simplifies the PCB wiring design. The two parallel columns shorten the signal transmission path, reducing signal interference and attenuation. This symmetrical layout promotes even heat distribution and improves heat dissipation efficiency. From a manufacturing perspective, this regular arrangement facilitates automated production, improving production efficiency and soldering quality.

[0064] Optionally, a packaging glue 7 is provided on the substrate 1, and the material of the packaging glue 7 is a light-transmitting material. The packaging glue 7 wraps the positive electrode pad 21, the negative electrode pad 22, the data input pad 23, the first drive output pad 24, the second drive output pad 25, the third drive output pad 26, the driver IC3, the first light-emitting chip 4, the second light-emitting chip 5 and the third light-emitting chip 6.

[0065] Specifically, the encapsulant 7 is a protective material, usually made of a transparent or translucent polymer, such as epoxy resin, silicone, etc. The encapsulant 7 can be applied by various methods, such as molding, dispensing, potting, etc.

[0066] The primary advantage of this packaging design is that it comprehensively improves the reliability and performance of the integrated lamp-driven LED package structure. First, the encapsulant 7 provides physical protection for all key components, preventing damage to the internal structure of the integrated lamp-driven LED package structure from external environmental factors (such as moisture, dust, and mechanical shock), significantly improving the durability and service life of the integrated lamp-driven LED package structure. Second, the use of translucent materials ensures efficient light transmission. The color and quality of the light can be adjusted by adding materials such as phosphors, improving the optical performance of the integrated lamp-driven LED package structure. Furthermore, the encapsulant 7 acts as a heat dissipator, helping to evenly distribute heat, reduce hot spots, and further extend the service life of the integrated lamp-driven LED package structure.

[0067] Optionally, the substrate 1 includes a backlight surface, on which a positive pin 27, a negative pin 28 and a data input pin 29 are provided, the positive pin 27 is electrically connected to the positive pad 21, the negative pin 28 is electrically connected to the negative pad 22, and the data input pin 29 is electrically connected to the data input pad 23.

[0068] Specifically, the positive pin 27 , the negative pin 28 and the data input pin 29 refer to electrical connection terminals provided on the backlight surface of the substrate 1 , and these pins may be in various forms, such as metal pads, metal columns or other conductive structures.

[0069] The electrical connection between the positive pin 27 and the positive pad 21, the negative pin 28 and the negative pad 22, and the data input pin 29 and the data input pad 23 can be achieved in a variety of ways. For example, a conductive path, such as a metallized hole or conductive filler, can be provided within the substrate 1 to directly connect the pins on the backlight side to the pads on the light-emitting side of the substrate 1. Another approach is to provide a conductive layer at the edge of the substrate 1 to connect the pins on the backlight side to the pads on the light-emitting side. Alternatively, a flexible circuit board or metal wire can be used to bypass the edge of the substrate 1 to connect the pins on the backlight side to the pads on the light-emitting side.

[0070] By placing these pins on the backlight side of substrate 1, this design facilitates the connection of the integrated LED package structure with external circuitry. This structure allows the product to be easily soldered or inserted into a circuit board, simplifying the product installation process. Furthermore, placing the pins on the backlight side keeps the light-emitting surface clean and flat, which helps improve the product's light output efficiency and heat dissipation performance. Furthermore, this design increases the flexibility of the product package, making it easier to adapt to different application scenarios and installation requirements.

[0071] Optionally, the data input pin 29 includes a first input pin 291, a second input pin 292 and a connecting pin 293, the positive pin 27, the first input pin 291, the second input pin 292 and the negative pin 28 are arranged in a rectangular array, and the first input pin 291 and the second input pin 292 are located at the diagonal positions of the rectangle, and the connecting pin 293 is arranged between the first input pin 291 and the second input pin 292, and is respectively connected to the first input pin 291 and the second input pin 292.

[0072] It can be understood that the rectangular array arrangement provides a stable support structure, which is conducive to the balance of the LED package structure with integrated lamp driver during welding or installation. Secondly, setting the two data input pins 29 at diagonal positions can maximize the distance between them and reduce signal interference. The setting of the connection pin 293 provides a redundant path for the data signal, enhancing the reliability of the connection. If there is a problem with one data input pin 29, the other can still work normally. In addition, this layout also provides greater flexibility for PCB design. Designers can choose which data input pin 29 to use as needed, thereby optimizing the circuit layout. In general, this design improves the reliability, signal integrity and flexibility of use of the LED package structure with integrated lamp driver.

[0073] The present utility model also proposes a light-emitting device, which includes an LED packaging structure with an integrated lamp driver. The specific structure of the LED packaging structure with an integrated lamp driver refers to the above-mentioned embodiment. Since the light-emitting device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0074] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A LED packaging structure with integrated lamp and driver, characterized in that: include: base(1); A pad assembly (2), the pad assembly (2) comprising a positive pad (21), a negative pad (22), a data input pad (23), and a first drive output pad (24) provided on the substrate (1); the first drive output pad (24) comprising two first welding portions (241) spaced apart and a first connecting portion (242) connecting the two first welding portions (241); in a width direction of the first drive output pad (24), the width of the first connecting portion (242) is smaller than the width of any of the first welding portions (241); the width direction of the first drive output pad (24) is a direction perpendicular to the connection direction of the two first welding portions (241); A driving IC (3), wherein the driving IC (3) is electrically connected to the positive electrode pad (21), the negative electrode pad (22), the data input pad (23), and the first welding portion (241); A first light-emitting chip (4), wherein the first light-emitting chip (4) is electrically connected to the positive electrode pad (21) and another first welding portion (241) respectively.

2. The LED package structure with integrated lamp and driver according to claim 1, characterized in that: The pad assembly (2) comprises a data output pad provided on the substrate (1), and the driver IC (3) is electrically connected to the data output pad.

3. The LED package structure with integrated lamp and driver according to claim 1, characterized in that: The lamp-driven integrated LED packaging structure further comprises a second light-emitting chip (5) and a third light-emitting chip (6), wherein the second light-emitting chip (5) and the third light-emitting chip (6) are electrically connected to the positive electrode pad (21) respectively, and the second light-emitting chip (5) and the third light-emitting chip (6) are electrically connected to the driver IC (3) respectively.

4. The LED package structure with integrated lamp and driver according to claim 3, characterized in that: The pad assembly (2) comprises a second drive output pad (25) and a third drive output pad (26) provided on the substrate (1); The second drive output pad (25) comprises two second welding portions (251) spaced apart and a second connecting portion (252) connecting the two second welding portions (251); in the width direction of the second drive output pad (25), the width of the second connecting portion (252) is smaller than the width of any second welding portion (251); the width direction of the second drive output pad (25) is a direction perpendicular to the connection direction of the two second welding portions (251); The third drive output pad (26) comprises two third welding portions (261) spaced apart and a third connecting portion (262) connecting the two third welding portions (261); in the width direction of the third drive output pad (26), the width of the third connecting portion (262) is smaller than the width of any of the third welding portions (261); the width direction of the third drive output pad (26) is a direction perpendicular to the connection direction of the two third welding portions (261); The driver IC (3) is electrically connected to the second welding portion (251) and the third welding portion (261) respectively; The second light-emitting chip (5) is electrically connected to another second welding portion (251), and the third light-emitting chip (6) is electrically connected to another third welding portion (261).

5. The LED package structure with integrated lamp and driver according to claim 4, characterized in that: The bottom of the driver IC (3) is provided with six IC welding parts (31), and the six IC welding parts (31) correspond one to one with the positive electrode pad (21), the negative electrode pad (22), the data input pad (23), the first welding part (241), the second welding part (251) and the third welding part (261), and the IC welding parts (31) are welded to the corresponding pads or welding parts.

6. The LED package structure with integrated lamp and driver according to claim 5, characterized in that: Three IC soldering portions (31) of the six IC soldering portions (31) are arranged in a row along a first direction to form a first row (32); The other three IC soldering portions (31) of the six IC soldering portions (31) are arranged in a row along the first direction to form a second row (33); The first column (32) and the second column (33) extend in parallel.

7. The LED package structure with integrated lamp and driver according to claim 4, characterized in that: The substrate (1) is provided with a packaging glue (7), the packaging glue (7) being made of a light-transmitting material, and the packaging glue (7) wraps the positive electrode pad (21), the negative electrode pad (22), the data input pad (23), the first drive output pad (24), the second drive output pad (25), the third drive output pad (26), the driver IC (3), the first light-emitting chip (4), the second light-emitting chip (5), and the third light-emitting chip (6).

8. The LED package structure with integrated lamp and driver according to claim 1, characterized in that: The substrate (1) comprises a backlight surface, on which a positive electrode pin (27), a negative electrode pin (28) and a data input pin (29) are provided, the positive electrode pin (27) being electrically connected to the positive electrode pad (21), the negative electrode pin (28) being electrically connected to the negative electrode pad (22), and the data input pin (29) being electrically connected to the data input pad (23).

9. The LED package structure integrated with lamp and driver according to claim 8, characterized in that: The data input pins (29) include a first input pin (291), a second input pin (292) and a connecting pin (293); the positive pin (27), the first input pin (291), the second input pin (292) and the negative pin (28) are arranged in a rectangular array, and the first input pin (291) and the second input pin (292) are located at diagonal positions of the rectangle; the connecting pin (293) is located between the first input pin (291) and the second input pin (292), and is connected to the first input pin (291) and the second input pin (292) respectively.

10. A light emitting device, characterized in that: The invention comprises a lamp-driver integrated LED packaging structure as claimed in any one of claims 1 to 9.

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