Bipolar current collector, bipolar pole piece and solid-state battery

Abstract

The utility model relates to a bipolar current collector, a bipolar pole piece and a solid-state battery. The bipolar current collector comprises a substrate electrode layer and a sputtering electrode layer, a plurality of first deposition grooves are distributed in the first side face of the substrate electrode layer, the inner walls of the first deposition grooves are gradually narrowed in the direction from the groove bottoms to the groove openings, and the sputtering electrode layer is deposited on the first side face. The sputtering electrode layer comprises a filling part filled in the first deposition groove and a main body part located outside the first deposition groove, a process groove is formed in the position, corresponding to the first deposition groove, of the side, away from the substrate electrode layer, of the main body part, and the inner wall of the process groove is gradually narrowed in the direction from the groove bottom to the groove opening. The sputtering electrode layer and the substrate electrode layer are mutually clamped and locked and are not easy to separate from each other, the sputtering electrode layer can also form a process groove on one side far away from the substrate electrode layer, and the inner wall is gradually narrowed in the direction from the groove bottom to the groove opening, so that a layer subsequently deposited on the sputtering electrode layer can also be mutually clamped and locked with the sputtering electrode layer, and the interlayer binding force is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electrochemical energy storage, in particular to a bipolar current collector, a bipolar pole piece and a solid-state battery. Background Art

[0002] In traditional lithium-ion liquid batteries, positive electrode active material layers are coated on both sides of the positive current collector to form a positive electrode sheet, and negative electrode active material layers are coated on the surface of the negative current collector to form a negative electrode sheet. The electrochemical structural units inside the battery cell form an internal circuit in parallel. When making a battery pack, it is necessary to achieve the target voltage by connecting the battery cells in series. The structural parts and connectors introduced in this process increase the inactive mass and reduce the mass energy density of the battery pack. In solid-state batteries, lithium ions are conducted through solid-state electrolytes to ensure that electrochemical reactions occur between the positive and negative electrodes on both sides of the solid-state electrolyte. Therefore, by designing a bipolar current collector, the positive electrode active material layer and the negative electrode active material layer can be coated on both sides of the current collector respectively, and a solid electrolyte layer can be used to form a laminated structure, thereby realizing internal series connection in the solid-state battery, which can improve the mass energy density.

[0003] In traditional technology, the negative electrode current collector and the positive electrode current collector are stacked to form a bipolar current collector. However, the negative electrode current collector and the positive electrode current collector are easily separated from each other, and during the electrochemical cycle, the electrode material will undergo volume changes, thereby generating stress and strain at the interface, resulting in separation between the active material layer and the current collector, affecting current transmission and causing a drop in battery performance. Utility Model Content

[0004] Based on this, it is necessary to provide a bipolar current collector, a bipolar pole piece and a solid-state battery to solve the problem of easy separation between bipolar current collector layer structures.

[0005] A bipolar current collector includes a base electrode layer and a sputtering electrode layer, wherein a plurality of first deposition grooves are distributed on the first side surface of the base electrode layer, and the inner wall of the first deposition groove gradually narrows from the bottom of the groove to the groove mouth, and the sputtering electrode layer is deposited on the first side surface, and the sputtering electrode layer includes a filling portion filled in the first deposition groove and a main body portion located outside the first deposition groove, and a process groove is formed on the side of the main body away from the base electrode layer at a position corresponding to the first deposition groove, and the inner wall of the process groove gradually narrows from the bottom of the groove to the groove mouth.

[0006] In one embodiment, one of the base electrode layer and the sputtering electrode layer is a copper layer, a nickel layer or a stainless steel layer, and the other is an aluminum layer.

[0007] In one embodiment, a plurality of second deposition grooves are distributed on the second side surface of the base electrode layer, and the inner walls of the second deposition grooves gradually narrow from the groove bottom to the groove mouth.

[0008] In one embodiment, the bipolar current collector further includes a first corrosion-resistant metal layer, which is disposed on a side of the base electrode layer away from the sputtering electrode layer, and the first corrosion-resistant metal layer includes at least one of a first platinum layer, a first tantalum layer, a first palladium layer, a first iridium layer, and a first rhodium layer.

[0009] In one embodiment, the bipolar current collector further includes a second corrosion-resistant metal layer, which is disposed on a side of the sputtered electrode layer away from the base electrode layer, and the second corrosion-resistant metal layer includes at least one of a second platinum layer, a second tantalum layer, a second palladium layer, a second iridium layer, and a second rhodium layer.

[0010] A bipolar pole piece includes a first electrode active material layer, a second electrode active material layer and the bipolar current collector, wherein the first electrode active material layer is arranged on a side of the base electrode layer away from the sputtering electrode layer, and the second electrode active material layer is arranged on a side of the sputtering electrode layer away from the base electrode layer.

[0011] A solid-state battery comprises a plurality of the bipolar pole pieces and a plurality of solid electrolyte layers, wherein the plurality of the bipolar pole pieces and the plurality of the solid electrolyte layers are alternately stacked.

[0012] Compared with traditional technologies, the above-mentioned bipolar current collector, bipolar pole piece and solid-state battery have the following beneficial effects:

[0013] The sputtering electrode layer is deposited on the first side of the base electrode layer by magnetron sputtering. The first side of the base electrode layer is distributed with multiple first deposition grooves whose inner walls gradually narrow from the bottom of the groove to the groove mouth. In this way, the sputtering electrode layer and the base electrode layer are locked with each other, making it difficult for the two to separate from each other. At the same time, the sputtering electrode layer will form a process groove corresponding to the position of the first deposition groove on the side away from the base electrode layer. The shape of the process groove obtained by magnetron sputtering deposition can be kept basically consistent with the shape of the first deposition groove, and its inner wall gradually narrows from the bottom of the groove to the groove mouth. This allows the subsequent layers deposited on the surface of the sputtering electrode layer, such as the active material layer, to also be locked with the sputtering electrode layer, thereby improving the interlayer bonding force.

[0014] A bipolar current collector comprises a base conductive layer, a first sputtering electrode layer and a second sputtering electrode layer;

[0015] A plurality of first deposition grooves are distributed on a first side surface of the base conductive layer, wherein inner walls of the first deposition grooves gradually narrow from the groove bottom to the groove opening; a first sputtering electrode layer is deposited on the first side surface, and the first sputtering electrode layer includes a first filling portion filled in the first deposition grooves and a first main body portion located outside the first deposition grooves; a first process groove is formed on a side of the first main body portion away from the base conductive layer at a position corresponding to the first deposition groove; and an inner wall of the first process groove gradually narrows from the groove bottom to the groove opening;

[0016] And / or, a plurality of second deposition grooves are distributed on the second side surface of the base conductive layer, the inner wall of the second deposition groove gradually narrows from the bottom of the groove to the groove mouth, the second sputtering electrode layer is deposited on the second side surface, the second sputtering electrode layer includes a second filling portion filled in the second deposition groove and a second main body portion located outside the second deposition groove, a second process groove is formed on the side of the second main body portion away from the base conductive layer at a position corresponding to the second deposition groove, and the inner wall of the second process groove gradually narrows from the bottom of the groove to the groove mouth.

[0017] In one embodiment, the base conductive layer includes at least one of a conductive polymer layer, a metal layer, and a conductive carbon material layer.

[0018] In one embodiment, one of the first sputtering electrode layer and the second sputtering electrode layer is a copper layer, a nickel layer or a stainless steel layer, and the other is an aluminum layer; or, the first sputtering electrode layer is an aluminum layer, and the second sputtering electrode layer is a copper layer, a nickel layer or a stainless steel layer.

[0019] In one embodiment, the bipolar current collector further includes a first corrosion-resistant metal layer, which is disposed on a side of the first sputtered electrode layer away from the base conductive layer, and the first corrosion-resistant metal layer includes at least one of a first platinum layer, a first tantalum layer, a first palladium layer, a first iridium layer, and a first rhodium layer.

[0020] In one embodiment, the bipolar current collector further includes a second corrosion-resistant metal layer, which is disposed on a side of the second sputtered electrode layer away from the base conductive layer, and the second corrosion-resistant metal layer includes at least one of a second platinum layer, a second tantalum layer, a second palladium layer, a second iridium layer, and a second rhodium layer.

[0021] A bipolar pole piece includes a first electrode active material layer, a second electrode active material layer and the bipolar current collector, wherein the first electrode active material layer is arranged on a side of the first sputtering electrode layer away from the base conductive layer, and the second electrode active material layer is arranged on a side of the second sputtering electrode layer away from the base conductive layer.

[0022] A solid-state battery comprises a plurality of the bipolar pole pieces and a plurality of solid electrolyte layers, wherein the plurality of the bipolar pole pieces and the plurality of the solid electrolyte layers are alternately stacked.

[0023] Compared with traditional technologies, the above-mentioned bipolar current collector, bipolar pole piece and solid-state battery have the following beneficial effects:

[0024] The first sputtered electrode layer is deposited on the first side of the base conductive layer by magnetron sputtering. The first side of the base conductive layer is distributed with multiple first deposition grooves whose inner walls gradually narrow from the bottom of the groove to the groove mouth. In this way, the first sputtered electrode layer and the base conductive layer are locked with each other, making it difficult for the two to separate from each other. At the same time, the first sputtered electrode layer will form a first process groove corresponding to the position of the first deposition groove on the side away from the base conductive layer. The shape of the first process groove obtained by magnetron sputtering deposition can remain basically consistent with the shape of the first deposition groove, and its inner wall gradually narrows from the bottom of the groove to the groove mouth. This allows the subsequent layers deposited on the surface of the first sputtered electrode layer, such as the active material layer, to also be locked with the first sputtered electrode layer, thereby improving the interlayer bonding force and ensuring the cycle stability of the battery. The second sputtered electrode layer is similar. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the structure of a bipolar current collector according to one embodiment;

[0026] Figure 2 for Figure 1 Schematic diagram of the structure of the base electrode layer in the bipolar current collector shown;

[0027] Figure 3 is a schematic structural diagram of a bipolar current collector according to another embodiment;

[0028] Figure 4 To include Figure 3 A schematic structural diagram of a bipolar pole piece of the bipolar current collector shown;

[0029] Figure 5 To include Figure 4 Schematic diagram of the structure of a solid-state battery with a bipolar current collector shown;

[0030] Figure 6 Schematic diagram of the structure of a bipolar current collector according to another embodiment;

[0031] Figure 7 for Figure 6 Schematic diagram of the structure of the base conductive layer in the bipolar current collector shown;

[0032] Figure 8 Schematic diagram of the structure of a bipolar current collector according to another embodiment;

[0033] Figure 9 To include Figure 8 Schematic diagram of the structure of the bipolar pole piece of the bipolar current collector shown. DETAILED DESCRIPTION

[0034] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are for the purpose of describing specific embodiments only and are not intended to limit this invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0038] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0039] like Figure 1 and Figure 2 As shown, the bipolar current collector 100 of one embodiment of the present invention includes a substrate electrode layer 110 and a sputtering electrode layer 120. A plurality of first deposition grooves 111 are distributed on the first side 1101 of the substrate electrode layer 110. The inner wall of the first deposition groove 111 gradually narrows from the bottom of the groove to the groove mouth. The sputtering electrode layer 120 is deposited on the first side 1101. The sputtering electrode layer 120 includes a filling portion 121 filled in the first deposition groove 111 and a main body 122 located outside the first deposition groove 111. A process groove 123 is formed on the side of the main body 122 away from the substrate electrode layer 110 at a position corresponding to the first deposition groove 111. The inner wall of the process groove 123 gradually narrows from the bottom of the groove to the groove mouth.

[0040] The sputtering electrode layer 120 is deposited on the first side surface 1101 of the base electrode layer 110 by magnetron sputtering. The first side surface 1101 of the base electrode layer 110 is distributed with multiple first deposition grooves 111 whose inner walls gradually narrow from the bottom of the groove to the groove mouth. In this way, the sputtering electrode layer 120 and the base electrode layer 110 are locked with each other, making it difficult for the two to separate from each other. At the same time, the sputtering electrode layer 120 will form a process groove 123 corresponding to the position of the first deposition groove 111 on the side away from the base electrode layer 110. The shape of the process groove 123 obtained by magnetron sputtering deposition can be kept basically consistent with the shape of the first deposition groove 111, and its inner wall gradually narrows from the bottom of the groove to the groove mouth. This allows the subsequent layers deposited on the surface of the sputtering electrode layer 120, such as the active material layer, to also be locked with the sputtering electrode layer 120, thereby improving the interlayer bonding force and ensuring the cycle stability of the battery.

[0041] In some examples, a plurality of second deposition grooves 112 are distributed on the second side surface 1102 of the base electrode layer 110. The inner walls of the second deposition grooves 112 gradually narrow from the bottom to the groove opening.

[0042] In some examples, the base electrode layer 110 is a copper layer, a nickel layer, or a stainless steel layer, and the sputtered electrode layer 120 is an aluminum layer. Furthermore, the base electrode layer 110 has a thickness of 4.5-6 μm, and the sputtered electrode layer 120 has a thickness of 1-4 μm.

[0043] In some other examples, the base electrode layer 110 is an aluminum layer, and the sputtered electrode layer 120 is a copper layer, a nickel layer, or a stainless steel layer. Furthermore, the base electrode layer 110 has a thickness of 9-12 μm, and the sputtered electrode layer 120 has a thickness of 1-4 μm.

[0044] like Figure 3 As shown, in some examples, the bipolar current collector 100 further includes a first corrosion-resistant metal layer 130. The first corrosion-resistant metal layer 130 is disposed on a side of the base electrode layer 110 away from the sputtering electrode layer 120. The first corrosion-resistant metal layer 130 includes at least one of a first platinum layer, a first tantalum layer, a first palladium layer, a first iridium layer, and a first rhodium layer.

[0045] The first anti-corrosion metal layer 130 can prevent corrosion by corrosive gases or substances, and can protect the inner base electrode layer 110 to a certain extent, thereby preventing corrosion of the base electrode layer 110 .

[0046] like Figure 3 As shown, in some examples, the bipolar current collector 100 further includes a second anti-corrosion metal layer 140. The second anti-corrosion metal layer 140 is disposed on a side of the sputtering electrode layer 120 away from the base electrode layer 110. The second anti-corrosion metal layer 140 includes at least one of a second platinum layer, a second tantalum layer, a second palladium layer, a second iridium layer, and a second rhodium layer.

[0047] The second anti-corrosion metal layer 140 can prevent corrosion by corrosive gases or substances, and can protect the inner sputtering electrode layer 120 to a certain extent, thereby preventing the sputtering electrode layer 120 from being corroded.

[0048] like Figure 3 As shown, in some examples, the bipolar current collector 100 further includes a first connection reinforcement layer 150. The first connection reinforcement layer 150 is disposed between the first corrosion-resistant metal layer 130 and the base electrode layer 110. The first connection reinforcement layer 150 contains the same metal as the first corrosion-resistant metal layer 130 and the same metal as the base electrode layer 110. In the first connection reinforcement layer 150, the content of the metal identical to the first corrosion-resistant metal layer 130 gradually decreases, while the content of the metal identical to the base electrode layer 110 gradually increases, in a direction from the first corrosion-resistant metal layer 130 to the base electrode layer 110.

[0049] By providing the first connection enhancing layer 150 , the bonding force between the first anti-corrosion metal layer 130 and the base electrode layer 110 can be improved.

[0050] like Figure 3As shown, in some examples, the bipolar current collector 100 further includes a second connection enhancing layer 160. The second connection enhancing layer 160 is disposed between the second corrosion-resistant metal layer 140 and the sputtering electrode layer 120. The second connection enhancing layer 160 contains the same metal as the second corrosion-resistant metal layer 140 and the same metal as the sputtering electrode layer 120. In the second connection enhancing layer 160, the content of the metal identical to the second corrosion-resistant metal layer 140 gradually decreases, and the content of the metal identical to the sputtering electrode layer 120 gradually increases in a direction from the second corrosion-resistant metal layer 140 to the sputtering electrode layer 120.

[0051] By providing the second connection enhancing layer 160 , the bonding force between the second anti-corrosion metal layer 140 and the sputtering electrode layer 120 can be improved.

[0052] like Figure 4 As shown, the bipolar pole piece 10 of one embodiment of the present invention includes the bipolar current collector 100 described above, a first electrode active material layer 11, and a second electrode active material layer 12. The first electrode active material layer 11 is disposed on a side of the base electrode layer 110 away from the sputtering electrode layer 120, and the second electrode active material layer 12 is disposed on a side of the sputtering electrode layer 120 away from the base electrode layer 110.

[0053] like Figure 5 As shown, a solid-state battery 1 according to one embodiment of the present invention includes a plurality of bipolar pole pieces 10 and a plurality of solid electrolyte layers 2. The plurality of bipolar pole pieces 10 and the plurality of solid electrolyte layers 2 are alternately stacked. The two sides of the solid electrolyte layer 2 are respectively connected to a first electrode active material layer 11 of a bipolar pole piece 10 and a second electrode active material layer 12 of another bipolar pole piece 10.

[0054] The number of the bipolar pole pieces 10 is greater than or equal to 3, for example, 3 to 10. A solid electrolyte layer 2 is disposed between adjacent bipolar pole pieces 10.

[0055] The solid electrolyte layer 2 is, for example, a sulfide electrolyte layer, an oxide electrolyte layer, a halide electrolyte layer, or a composite solid electrolyte layer.

[0056] like Figure 6 and Figure 7 As shown, a bipolar current collector 200 according to another embodiment of the present invention includes a base conductive layer 210 , a first sputtering electrode layer 220 and a second sputtering electrode layer 230 .

[0057] In some examples, a plurality of first deposition grooves 211 are distributed on the first side surface of the base conductive layer 210. The inner wall of the first deposition groove 211 gradually narrows from the bottom of the groove to the groove mouth. The first sputtering electrode layer 220 is deposited on the first side surface. The first sputtering electrode layer 220 includes a first filling portion 221 filled in the first deposition groove 211 and a first main body portion 222 located outside the first deposition groove 211. A first process groove 223 is formed on the side of the first main body portion 222 away from the base conductive layer 210 at a position corresponding to the first deposition groove 211. The inner wall of the first process groove 223 gradually narrows from the bottom of the groove to the groove mouth.

[0058] In some examples, a plurality of second deposition grooves 212 are distributed on the second side surface 2102 of the base conductive layer 210. The inner wall of the second deposition groove 212 gradually narrows from the groove bottom to the groove opening. The second sputtering electrode layer 230 is deposited on the second side surface 2102. The second sputtering electrode layer 230 includes a second filling portion 231 filled in the second deposition groove 212 and a second main body portion 232 located outside the second deposition groove 212. A second process groove 233 is formed on the side of the second main body portion 232 away from the base conductive layer 210 at a position corresponding to the second deposition groove 212. The inner wall of the second process groove 233 gradually narrows from the groove bottom to the groove opening.

[0059] The first sputtered electrode layer 220 is deposited on the first side surface 2101 of the base conductive layer 210 via magnetron sputtering. The first side surface 2101 of the base conductive layer 210 is distributed with multiple first deposition grooves 211 whose inner walls gradually narrow from the bottom to the top. This allows the first sputtered electrode layer 220 and the base conductive layer 210 to interlock, preventing them from separating. Simultaneously, the first sputtered electrode layer 220 forms first process grooves 223 on the side away from the base conductive layer 210, corresponding to the positions of the first deposition grooves 211. The shape of the first process grooves 223 deposited by magnetron sputtering can remain substantially consistent with that of the first deposition grooves 211, with their inner walls gradually narrowing from the bottom to the top. This allows subsequent layers deposited on the surface of the first sputtered electrode layer 220, such as the active material layer, to interlock with the first sputtered electrode layer 220, thereby improving interlayer bonding and ensuring battery cycling stability. The same applies to the second sputtered electrode layer 230.

[0060] In some examples, the base conductive layer 210 is at least one of a conductive polymer layer, a metal layer, and a conductive carbon material layer.

[0061] The conductive polymer layer facilitates forming the first deposition groove 211 and the second deposition groove 212 thereon. For example, the conductive polymer layer can be formed by a mold to facilitate forming the first deposition groove 211 and the second deposition groove 212 thereon.

[0062] In some examples, the conductive polymer layer includes a polymer matrix and conductive particles dispersed in the polymer matrix, wherein the mass ratio of the polymer matrix to the conductive particles is, for example, 75:35.

[0063] Conductive polymers include, but are not limited to, one or more of polypyrrole (PPy), polyaniline (PANI), poly(3,4-ethylenedioxythiophene) (PEDOT), 3-hexylthiophene (P3HT), poly(3-dodecylthiophene-2,5-diyl) (P3DDT), poly(3-dodecylthiophene-3-hexyl-3-triethylene glycol) (PDDHEO), and poly(3-octylpyrrole):poly(styrenesulfonic acid) (P3OPy:PSS).

[0064] The conductive particles include, but are not limited to, one or more of conductive carbon black, acetylene black, carbon nanotubes, and vapor-grown carbon fibers.

[0065] The metal layer includes, for example, but is not limited to, at least one of an Ag layer, an Au layer, a copper-based alloy layer, an aluminum-based alloy layer, and a nickel-based alloy layer.

[0066] The conductive carbon material layer includes, for example, but is not limited to, at least one of a graphite layer and a MXene layer.

[0067] In some examples, the first sputtering electrode layer 220 is a copper layer, a nickel layer, or a stainless steel layer, and the second sputtering electrode layer 230 is an aluminum layer.

[0068] In some other examples, the first sputtering electrode layer 220 is an aluminum layer, and the second sputtering electrode layer 230 is a copper layer, a nickel layer, or a stainless steel layer.

[0069] In some examples, the thickness of the base conductive layer 210 is 4-10 μm, and the thickness of the first sputtering electrode layer 220 and the second sputtering electrode layer 230 is 1-4 μm.

[0070] like Figure 8 As shown, in some examples, the bipolar current collector 200 further includes a first corrosion-resistant metal layer 240. The first corrosion-resistant metal layer 240 is disposed on a side of the first sputtered electrode layer 220 away from the base conductive layer 210. The first corrosion-resistant metal layer 240 includes at least one of a first platinum layer, a first tantalum layer, a first palladium layer, a first iridium layer, and a first rhodium layer.

[0071] The first anti-corrosion metal layer 240 can prevent corrosion by corrosive gases or substances, and can protect the inner first sputtering electrode layer 220 to a certain extent, thereby preventing the first sputtering electrode layer 220 from being corroded.

[0072] like Figure 8As shown, in some examples, the bipolar current collector 200 further includes a first connection enhancing layer 260. The first connection enhancing layer 260 is disposed between the first corrosion-resistant metal layer 240 and the first sputtering electrode layer 220. The first connection enhancing layer 260 contains the same metal as the first corrosion-resistant metal layer 240 and the same metal as the first sputtering electrode layer 220. In the first connection enhancing layer 260, the content of the metal identical to the first corrosion-resistant metal layer 240 gradually decreases, and the content of the metal identical to the first sputtering electrode layer 220 gradually increases in a direction from the first corrosion-resistant metal layer 240 to the first sputtering electrode layer 220.

[0073] By providing the first connection enhancing layer 260 , the bonding force between the first anti-corrosion metal layer 240 and the first sputtering electrode layer 220 can be improved.

[0074] like Figure 8 As shown, in some examples, the bipolar current collector 200 further includes a second anti-corrosion metal layer 250. The second anti-corrosion metal layer 250 is disposed on a side of the second sputtered electrode layer 230 away from the base conductive layer 210. The second anti-corrosion metal layer 250 includes at least one of a second platinum layer, a second tantalum layer, a second palladium layer, a second iridium layer, and a second rhodium layer.

[0075] The second anti-corrosion metal layer 250 can prevent corrosion by corrosive gases or substances, and can protect the inner second sputtering electrode layer 230 to a certain extent, thereby preventing corrosion of the second sputtering electrode layer 230 .

[0076] like Figure 8 As shown, in some examples, the bipolar current collector 200 further includes a second connection enhancing layer 270. The second connection enhancing layer 270 is disposed between the second corrosion-resistant metal layer 250 and the second sputtering electrode layer 230. The second connection enhancing layer 270 contains the same metal as the second corrosion-resistant metal layer 250 and the same metal as the second sputtering electrode layer 230. In the second connection enhancing layer 270, the content of the metal identical to the second corrosion-resistant metal layer 250 gradually decreases, while the content of the metal identical to the second sputtering electrode layer 230 gradually increases in a direction from the second corrosion-resistant metal layer 250 to the second sputtering electrode layer 230.

[0077] By providing the second connection enhancing layer 270 , the bonding force between the second anti-corrosion metal layer 250 and the second sputtering electrode layer 230 can be improved.

[0078] like Figure 9As shown, the bipolar pole piece 20 of one embodiment of the present invention includes the bipolar current collector 200 described above, a first electrode active material layer 21, and a second electrode active material layer 22. The first electrode active material layer 21 is disposed on a side of the first sputtering electrode layer 220 away from the base conductive layer 210, and the second electrode active material layer 22 is disposed on a side of the second sputtering electrode layer 230 away from the base conductive layer 210.

[0079] A solid-state battery according to one embodiment of the present invention includes multiple bipolar pole pieces 20 and multiple solid electrolyte layers. The multiple bipolar pole pieces 20 and the multiple solid electrolyte layers are alternately stacked. The two sides of the solid electrolyte layers are connected to a first electrode active material layer 21 of a bipolar pole piece 20 and a second electrode active material layer 22 of another bipolar pole piece 20, respectively.

[0080] The number of the bipolar pole pieces 20 is greater than or equal to 3, for example, 3 to 10. A solid electrolyte layer is disposed between adjacent bipolar pole pieces 20.

[0081] The solid electrolyte layer is, for example, a sulfide electrolyte layer, an oxide electrolyte layer, a halide electrolyte layer, or a composite solid electrolyte layer.

[0082] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be based on the appended claims, and the specification may be used to interpret the content of the claims.

Claims

1. A bipolar current collector, characterized in that: It includes a base electrode layer and a sputtering electrode layer, and a plurality of first deposition grooves are distributed on the first side of the base electrode layer. The inner wall of the first deposition groove gradually narrows from the bottom of the groove to the groove mouth. The sputtering electrode layer is deposited on the first side. The sputtering electrode layer includes a filling part filled in the first deposition groove and a main body part located outside the first deposition groove. A process groove is formed on the side of the main body away from the base electrode layer at a position corresponding to the first deposition groove, and the inner wall of the process groove gradually narrows from the bottom of the groove to the groove mouth.

2. The bipolar current collector according to claim 1, wherein One of the base electrode layer and the sputtering electrode layer is a copper layer, a nickel layer or a stainless steel layer, and the other is an aluminum layer.

3. The bipolar current collector according to claim 1, wherein A plurality of second deposition grooves are distributed on the second side surface of the base electrode layer, and the inner walls of the second deposition grooves gradually narrow from the groove bottom to the groove opening.

4. The bipolar current collector according to any one of claims 1 to 3, wherein: The bipolar current collector further includes a first corrosion-resistant metal layer, which is disposed on a side of the base electrode layer away from the sputtering electrode layer, and the first corrosion-resistant metal layer includes at least one of a first platinum layer, a first tantalum layer, a first palladium layer, a first iridium layer, and a first rhodium layer; and / or The bipolar current collector also includes a second corrosion-resistant metal layer, which is arranged on a side of the sputtering electrode layer away from the base electrode layer, and the second corrosion-resistant metal layer includes at least one of a second platinum layer, a second tantalum layer, a second palladium layer, a second iridium layer and a second rhodium layer.

5. A bipolar current collector, characterized in that: comprising a base conductive layer, a first sputtering electrode layer and a second sputtering electrode layer; A plurality of first deposition grooves are distributed on the first side surface of the base conductive layer, and the inner walls of the first deposition grooves gradually narrow from the bottom of the groove to the groove mouth; the first sputtering electrode layer is deposited on the first side surface, and the first sputtering electrode layer includes a first filling portion filled in the first deposition groove and a first main body portion located outside the first deposition groove; a first process groove is formed on a side of the first main body portion away from the base conductive layer at a position corresponding to the first deposition groove, and the inner wall of the first process groove gradually narrows from the bottom of the groove to the groove mouth; and / or A plurality of second deposition grooves are distributed on the second side surface of the base conductive layer, and the inner wall of the second deposition groove gradually narrows from the bottom of the groove to the groove mouth. The second sputtering electrode layer is deposited on the second side surface. The second sputtering electrode layer includes a second filling portion filled in the second deposition groove and a second main body portion located outside the second deposition groove. A second process groove is formed on the side of the second main body portion away from the base conductive layer at a position corresponding to the second deposition groove, and the inner wall of the second process groove gradually narrows from the bottom of the groove to the groove mouth.

6. The bipolar current collector according to claim 5, wherein: The base conductive layer includes at least one of a conductive polymer layer, a metal layer and a conductive carbon material layer.

7. The bipolar current collector according to claim 5, wherein: One of the first sputtering electrode layer and the second sputtering electrode layer is a copper layer, a nickel layer or a stainless steel layer, and the other is an aluminum layer; or the first sputtering electrode layer is an aluminum layer, and the second sputtering electrode layer is a copper layer, a nickel layer or a stainless steel layer.

8. The bipolar current collector according to any one of claims 5 to 7, wherein: The bipolar current collector further includes a first corrosion-resistant metal layer, which is disposed on a side of the first sputtered electrode layer away from the base conductive layer, and the first corrosion-resistant metal layer includes at least one of a first platinum layer, a first tantalum layer, a first palladium layer, a first iridium layer, and a first rhodium layer; and / or The bipolar current collector also includes a second corrosion-resistant metal layer, which is arranged on a side of the second sputtered electrode layer away from the base conductive layer, and the second corrosion-resistant metal layer includes at least one of a second platinum layer, a second tantalum layer, a second palladium layer, a second iridium layer and a second rhodium layer.

9. A bipolar pole piece, characterized in that: comprising a first electrode active material layer and a second electrode active material layer; The bipolar pole piece further comprises a bipolar current collector according to any one of claims 1 to 4, wherein the first electrode active material layer is arranged on a side of the base electrode layer away from the sputtering electrode layer, and the second electrode active material layer is arranged on a side of the sputtering electrode layer away from the base electrode layer; Alternatively, the bipolar pole piece further includes a bipolar current collector according to any one of claims 5 to 8, the first electrode active material layer is arranged on a side of the first sputtered electrode layer away from the base conductive layer, and the second electrode active material layer is arranged on a side of the second sputtered electrode layer away from the base conductive layer.

10. A solid-state battery, characterized in that: It comprises a plurality of bipolar pole pieces according to claim 9 and a plurality of solid electrolyte layers, wherein the plurality of bipolar pole pieces and the plurality of solid electrolyte layers are alternately stacked.

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