Novel COB light source packaging structure easy to dissipate heat

Abstract

The utility model discloses a novel COB light source packaging structure easy to dissipate heat, which relates to the technical field of COB light source packaging, and comprises a substrate, a plurality of groups of mounting grooves which are arranged in a matrix and used for mounting LED lamp beads are arranged on the substrate, a power distribution mechanism used for supplying power to the LED lamp beads is arranged on the substrate, and each group of mounting grooves is matched with the power distribution mechanism. The LED lamp beads can generate a large amount of heat in the using process, the heat can be guided into the heat collection plate and transmitted to the heat conduction block, the connecting plate and the heat dissipation plate through the heat collection plate, and the heat collection plate, the heat conduction block, the connecting plate and the heat dissipation plate are all made of metal with low specific heat capacity. The heat conduction block, the connecting plate and the heat dissipation plate can guarantee the heat transfer speed, meanwhile, heat can be transferred to the outside through all the heat collection plates, the heat conduction block, the connecting plate and the heat dissipation plate, the heat dissipation area is large, and therefore the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light source packaging, and specifically relates to a novel COB light source packaging structure with easy heat dissipation. Background Art

[0002] Compared with the traditional light source packaging structure, the novel COB (Chip On Board) light source packaging structure shows significant differences and advantages. The COB packaging directly fixes the LED chips on the substrate to form an integrated structure. Compared with the traditional packaging where the chips are encapsulated in epoxy resin and fixed on the bracket, the COB packaging structure is more compact, smaller in size, and convenient for integrated applications.

[0003] Chinese Patent with publication number CN117410428B discloses an LED chip packaging structure for COB light sources. The working principle of this solution is as follows: First, fixative glue is dropped into the rectangular groove, and the height of the glue does not exceed the surface of the rectangular groove. Subsequently, the user puts multiple LED chips into the rectangular groove, and the lower ends of the LED chips contact the glue. The multiple LED chips are electrically connected using the first wire. Then, the first wire and the second wire are electrically connected to two electrode plates. At this time, the multiple LED chips are electrically connected. Multiple groups of first heat dissipation grooves corresponding to the respective rectangular grooves are provided at the bottom of the substrate. Copper sheets are arranged in the first heat dissipation grooves, and the copper sheets can play the role of a heat dissipation medium. At the same time, the heat sink installed below the substrate can achieve a better heat dissipation effect, thereby improving the heat dissipation capacity of the overall substrate during operation after packaging.

[0004] The deficiencies of the above prior art solutions are as follows: The LED chips are fixed in the rectangular grooves, the first heat dissipation grooves are provided at the bottom of the substrate, the copper sheets are arranged inside the first heat dissipation grooves, and there is a layer of substrate between the copper sheets and the LED chips. The heat conduction effect of the substrate is less than that of the copper sheets, thereby reducing the heat conduction effect. Content of the Utility Model

[0005] The purpose of the present utility model is to provide a novel COB light source packaging structure with easy heat dissipation, so as to solve the technical problem in the prior art that the LED chips are fixed in the rectangular grooves, the first heat dissipation grooves are provided at the bottom of the substrate, the copper sheets are arranged inside the first heat dissipation grooves, and there is a layer of substrate between the copper sheets and the LED chips, and the heat conduction effect of the substrate is less than that of the copper sheets, thereby reducing the heat conduction effect.

[0006] The technical problem to be solved by the present utility model can be achieved through the following technical solutions:

[0007] The heat dissipation device is a novel COB light source packaging structure that is easy to dissipate heat, comprising a substrate, wherein the substrate is provided with multiple groups of mounting grooves arranged in a matrix for mounting LED lamp beads, the substrate is provided with a power distribution mechanism for supplying power to the LED lamp beads, and each group of the mounting grooves cooperates with the power distribution mechanism. The device also includes a heat dissipation mechanism for dissipating heat from the LED lamp beads and a heat collecting plate for conducting heat, the heat dissipation mechanism comprises a connecting plate and a heat dissipation plate, the connecting plate and the heat dissipation plate are provided with multiple groups, the multiple groups of connecting plates are arranged at equal distances, the multiple groups of heat dissipation plates are arranged at equal distances, each group of the heat collecting plates is fixedly connected to the multiple groups of connecting plates, the heat collecting plates are provided with multiple groups, each group of the heat collecting plates is embedded in a corresponding column of mounting grooves, a heat conduction port penetrating the substrate is provided at the bottom of the mounting groove, a heat conduction block that cooperates with the heat conduction port is fixedly connected to the connecting plate, the heat conduction block is in contact with the corresponding heat collecting plate, and the components of the heat collecting plate, the heat conduction block, the connecting plate and the heat dissipation plate are all made of metal with low specific heat capacity.

[0008] As a further solution of the present invention: a heat plate groove for accommodating a heat collecting plate is provided inside each group of the installation grooves.

[0009] As a further solution of the present utility model: the power distribution mechanism includes a first main line and a second main line arranged on the substrate, at least one group of first branch lines is arranged on the first main line, and at least one group of second branch lines is arranged on the second main line, each group of the first branch lines and the second branch lines are fixedly connected to multiple groups of pole plates, each group of the mounting grooves is provided with a first branch line on one side and a second branch line on the other side, the two sides inside each group of the mounting grooves are respectively connected with the corresponding pole plates, and the pole plates located on both sides inside each group of the mounting grooves are respectively fixedly connected with the corresponding first branch line and the second branch line.

[0010] As a further solution of the present invention: the first main line, the first branch line, the second main line, and the second branch line are all embedded in the substrate.

[0011] As a further solution of the present invention: a transparent heat-conductive epoxy resin is provided between the LED lamp bead and the mounting groove.

[0012] As a further solution of the present invention: the heat collecting plate, heat conducting block, connecting plate and heat dissipating plate are all made of metal copper.

[0013] Beneficial effects of the utility model:

[0014] During the use of the LED lamp beads of the present utility model, a large amount of heat will be generated. These heats will be introduced into the inside of the heat collecting plate, and the heat collecting plate will transfer the heat to the heat conducting block, the connecting plate, and the heat dissipating plate. The constituent materials of the heat collecting plate, the heat conducting block, the connecting plate, and the heat dissipating plate are all metals with relatively low specific heat capacities, enabling the heat conducting block, the connecting plate, and the heat dissipating plate to ensure the heat transfer speed. At the same time, the heat can be transferred to the outside through all the heat collecting plates, heat conducting blocks, connecting plates, and heat dissipating plates, with a relatively large heat dissipation area, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present utility model will be further described below with reference to the accompanying drawings.

[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 is a schematic diagram of the substrate structure of the present utility model;

[0018] Figure 3 is a schematic diagram of the heat dissipation mechanism structure of the present utility model;

[0019] Figure 4 is a schematic diagram of the heat collecting plate structure of the present utility model.

[0020] In the figure: 1. Substrate; 2. Installation groove; 3. Heat plate groove; 4. Heat conducting port; 5. Heat collecting plate; 6. Heat dissipation mechanism; 601. Connecting plate; 602. Heat conducting block; 603. Heat dissipating plate; 7. Power distribution mechanism; 701. First main line; 702. First branch line; 703. Second main line; 704. Second branch line; 705. Plate; 8. LED lamp bead. SPECIFIC EMBODIMENTS

[0021] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0022] Such as Figures 1 - 4As shown, a new COB light source packaging structure that is easy to dissipate heat includes a substrate 1, on which are provided multiple groups of mounting grooves 2 arranged in a matrix for mounting LED lamp beads 8, a power distribution mechanism 7 for supplying power to the LED lamp beads 8 is provided on the substrate 1, and each group of mounting grooves 2 cooperates with the power distribution mechanism 7. The device also includes a heat dissipation mechanism 6 for dissipating heat from the LED lamp beads 8 and a heat collecting plate 5 for conducting heat, the heat dissipation mechanism 6 includes a connecting plate 601 and a heat dissipation plate 603, and the connecting plate 601 and the heat dissipation plate 603 are provided in multiple groups, the multiple groups of connecting plates 601 are arranged at equal distances, and the multiple groups of heat dissipation plates 603 are arranged at equal distances, each group of heat dissipation plates 603 is fixedly connected to the multiple groups of connecting plates 601, and the extension directions of the connecting plates 601 and the heat dissipation plates 603 are perpendicular to each other. The connecting plate 601 is used to fix all the heat dissipation plates 603. There are multiple groups of heat collecting plates 5. Each group of heat collecting plates 5 is embedded in a corresponding column of mounting grooves 2. The heat collecting plates 5 extend along the inner wall of the mounting groove 2 and the surface of the substrate 1. A heat conduction port 4 is provided at the bottom of the mounting groove 2 and penetrates the substrate 1. A heat conduction block 602 is fixedly connected to the connecting plate 601 and matches the heat conduction port 4. The heat conduction block 602 is in contact with the corresponding heat collecting plate 5. The components of the heat collecting plate 5, the heat conduction block 602, the connecting plate 601 and the heat dissipation plate 603 are all metals with low specific heat capacity. Heat is transferred to the heat conduction block 602 through the heat collecting plate 5, and the heat conduction block 602 transfers heat to the connecting plate 601 and the heat dissipation plate 603, which can accelerate the heat conduction speed, expand the heat dissipation area, and improve the heat dissipation effect.

[0023] In some specific embodiments, in order to facilitate the fixation of the heat collecting plate 5, a heat plate groove 3 for accommodating the heat collecting plate 5 is opened inside each group of mounting grooves 2. The heat plate groove 3 can fix the heat collecting plate 5 and also reduce the space occupied by the heat collecting plate 5 inside the mounting groove 2.

[0024] In some specific embodiments, in order to supply power to the LED lamp beads 8, the power distribution mechanism 7 includes a first main line 701 and a second main line 703 provided on the substrate 1. At least one group of first branch lines 702 is provided on the first main line 701, and at least one group of second branch lines 704 is provided on the second main line 703. Multiple groups of electrode plates 705 are fixedly connected to each group of first branch lines 702 and second branch lines 704. The electrode plates 705 fixed on the first branch lines 702 are power-receiving positive electrode plates, and the electrode plates 705 fixed on the second branch lines 704 are power-receiving negative electrode plates. One side of each installation groove 2 is provided with a first branch line 702, and the other side is provided with a second branch line 704. The two sides inside each installation groove 2 are respectively in mating connection with the corresponding electrode plates 705. The electrode plates 705 located on both sides inside each installation groove 2 are fixedly connected to the corresponding first branch lines 702 and second branch lines 704 respectively. The first main line 701 is connected to the positive electrode of the power supply, and the second main line 703 is connected to the negative electrode of the power supply. The current sequentially passes through the first main line 701, the first branch line 702, the power-receiving positive electrode plate, the LED lamp beads 8, the power-receiving negative electrode plate, the second branch line 704, and the second main line 703, thereby realizing the power supply to the LED lamp beads 8.

[0025] In some specific embodiments, in order to minimize the influence of the power distribution mechanism 7 on the light source performance while maintaining the flatness and aesthetics of the substrate 1, the first main line 701, the first branch line 702, the second main line 703, and the second branch line 704 can all be embedded inside the substrate 1, that is, the power distribution mechanism 7 is all embedded and encapsulated inside the substrate 1, which can reduce the influence of the outside world on the power distribution mechanism 7 and also avoid the power distribution mechanism 7 from affecting the light source performance.

[0026] In some specific embodiments, in order to fix the LED lamp beads 8, a transparent thermally conductive epoxy resin is provided between the LED lamp beads 8 and the installation groove 2. The transparent thermally conductive epoxy resin has good thermal conductivity and has no influence on the light source, thereby ensuring the fixing effect and implementation effect of the LED lamp beads 8.

[0027] In some specific embodiments, in order to ensure the heat dissipation effect, the heat collecting plate 5, the heat conducting block 602, the connecting plate 601, and the heat dissipating plate 603 are all made of metal copper. Copper has good thermal conductivity, enabling the heat collecting plate 5 to quickly disperse the heat on the LED lamp beads 8 to the heat conducting block 602, the connecting plate 601, and the heat dissipating plate 603, making the device have a large heat dissipation area, thereby ensuring the overall heat dissipation effect of the device.

[0028] To facilitate the understanding of the embodiments of this solution by those skilled in the art, the working principle of the embodiments of this solution will now be described in combination with a specific application scenario:

[0029] During installation, first fix the heat dissipation mechanism 6 on the substrate 1 so that each heat conduction block 602 is fitted inside the heat conduction port 4. Then, place all the heat collecting plates 5 into the heat plate grooves 3 in the corresponding column. Drop transparent heat-conducting epoxy resin into the installation groove 2, and place the LED lamp beads 8 into the installation groove 2, ensuring that the positive and negative electrodes on the LED lamp beads 8 are in contact with the corresponding electrode plates 705 inside the installation groove 2. The LED lamp beads 8 are fixed through the transparent heat-conducting epoxy resin. During use, the LED lamp beads 8 generate a large amount of heat, which is introduced into the heat collecting plates 5 and transferred to the heat conduction blocks 602, connecting plates 601, and heat dissipation plates 603 through the heat collecting plates 5. The heat conduction blocks 602, connecting plates 601, and heat dissipation plates 603 can ensure the speed of heat transfer, and the heat can be transferred to the outside through all the heat collecting plates 5, heat conduction blocks 602, connecting plates 601, and heat dissipation plates 603, with a relatively large heat dissipation area, thus improving the heat dissipation efficiency.

[0030] One embodiment of the present invention has been described in detail above, but the content described is only the preferred embodiment of the present invention and cannot be considered as limiting the scope of implementation of the present invention. Any equivalent changes and improvements made within the scope of the application of the present invention shall still fall within the scope covered by the patent of the present invention.

Claims

1. A novel COB light source packaging structure that is easy to dissipate heat, comprising a substrate (1), the substrate (1) being provided with a plurality of mounting grooves (2) arranged in a matrix for mounting LED lamp beads (8), the substrate (1) being provided with a power distribution mechanism (7) for supplying power to the LED lamp beads (8), each group of the mounting grooves (2) being matched with the power distribution mechanism (7), and characterized in that , also includes: A heat dissipation mechanism (6) for dissipating heat from LED lamp beads (8) and a heat collecting plate (5) for conducting heat, wherein the heat dissipation mechanism (6) comprises a connecting plate (601) and a heat dissipation plate (603), wherein the connecting plate (601) and the heat dissipation plate (603) are provided in multiple groups, wherein the multiple groups of connecting plates (601) are arranged at equal intervals, and the multiple groups of heat dissipation plates (603) are arranged at equal intervals, and each group of heat dissipation plates (603) is fixedly connected to the multiple groups of connecting plates (601). The heat collecting plate (5) is provided There are multiple groups, and each group of heat collecting plates (5) is embedded in a corresponding row of mounting grooves (2). The bottom of the mounting groove (2) is provided with a heat conduction port (4) penetrating the base plate (1). The connecting plate (601) is fixedly connected with a heat conduction block (602) that matches the heat conduction port (4). The heat conduction block (602) is in contact with the corresponding heat collecting plate (5). The components of the heat collecting plate (5), the heat conduction block (602), the connecting plate (601) and the heat dissipation plate (603) are all metals with low specific heat capacity.

2. A novel COB light source packaging structure with easy heat dissipation according to claim 1, characterized in that: Each group of the installation grooves (2) is provided with a heat plate groove (3) for accommodating a heat collecting plate (5).

3. The novel COB light source packaging structure with easy heat dissipation according to claim 1, characterized in that: The power distribution mechanism (7) comprises a first main line (701) and a second main line (703) arranged on a substrate (1); at least one group of first branch lines (702) is arranged on the first main line (701); at least one group of second branch lines (704) is arranged on the second main line (703); multiple groups of electrode plates (705) are fixedly connected to each group of the first branch lines (702) and the second branch lines (704); one side of each group of the mounting slots (2) is provided with the first branch line (702), and the other side is provided with the second branch line (704); both sides inside each group of the mounting slots (2) are respectively connected to corresponding electrode plates (705); and the electrode plates (705) located on both sides inside each group of the mounting slots (2) are respectively fixedly connected to corresponding first branch lines (702) and second branch lines (704).

4. The novel COB light source packaging structure with easy heat dissipation according to claim 3, characterized in that: The first main line (701), the first branch line (702), the second main line (703), and the second branch line (704) are all embedded in the interior of the substrate (1).

5. The novel COB light source packaging structure with easy heat dissipation according to claim 1, characterized in that: A transparent heat-conducting epoxy resin is provided between the LED lamp bead (8) and the mounting groove (2).

6. The novel COB light source packaging structure with easy heat dissipation according to claim 1, characterized in that: The heat collecting plate (5), heat conducting block (602), connecting plate (601), and heat dissipating plate (603) are all made of metal copper.

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