Device for adjusting levelness of dispensing head
By designing a device for adjusting the level of the dispensing head, the problem of difficult adjustment of the dispensing head position in the semiconductor packaging field is solved, the dispensing accuracy and combination quality are improved, and it is easy to install and maintain, and is suitable for semiconductor packaging and chip assembly.
Patent Information
- Application Number
- CN202422261794.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-09-14
AI Technical Summary
In the chip loading section in the field of semiconductor packaging, due to equipment tolerances and raw material tolerances, the position accuracy and size inclination of the dispensing point are unstable, and the relative working position of the dispensing head is not easy to adjust, which affects the quality of the bonding point and the back of the chip.
A device for adjusting the level of the dispensing head is designed, including a base, a fixing plate, a fixing base of the rubber rod, a fine-tuning seat of the rubber rod, a adjusting rod and a dispensing head. By combining the bolts and screws, the horizontal and vertical adjustment of the rubber rod is achieved, enhancing the adjustability of the dispensing head position.
It improves the accuracy and stability of the position of the dispensing head, improves the quality of the bonding point and the back of the chip, is easy to install and maintain by on-site engineers, and the overall structure is compact, making it easy to adjust the position and replenish raw materials.
Smart Images
Figure CN223197359U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor clothing auxiliary devices, in particular to a device for adjusting the horizontality of a dispensing head. Background Art
[0002] The die loading process is a crucial step in the semiconductor packaging process. It involves removing the cut chips from the dicing film and accurately placing them onto a lead frame or package substrate (or base) strip, preparing for subsequent bonding and encapsulation steps. The primary purpose of the die loading process is to remove individual chips from the diced silicon wafer and safely and accurately place them onto the package substrate or lead frame, ensuring their stability and reliability during the subsequent packaging process.
[0003] Currently, in the semiconductor packaging field, due to equipment tolerances, raw material tolerances and other issues, the position accuracy and size inclination of the glue dots are unstable, and the relative working position of the glue dispensing head is difficult to adjust, which affects the bonding quality between the glue dots and the back of the chip. Therefore, it is particularly important to design a device for adjusting the levelness of the glue dispensing head to solve the above technical problems. Utility Model Content
[0004] The purpose of the utility model is to solve the problems of equipment tolerance and raw material tolerance in the chip loading section in the field of semiconductor packaging, and to propose a device for adjusting the horizontality of a dispensing head.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a device for adjusting the horizontality of a dispensing head, comprising a base, a fixing plate is installed on the base via fasteners, a dispensing rod fixing base is movably connected to the base, a dispensing rod fine-tuning seat is installed above the dispensing rod fixing base via a hand-tightened bolt, a dispensing rod is installed on the dispensing rod fine-tuning seat, an adjusting rod is installed at the end of the dispensing rod via a locking nut, the end of the adjusting rod is movably connected to the dispensing head, and a screw is threadedly connected to the right end of the dispensing rod fixing base on the base.
[0006] Preferably, the glue discharging rod fine-adjusting seat and the glue discharging rod fixed base are positioned by a pin shaft.
[0007] Preferably, a concave gasket is installed on the glue discharging rod fixed base, and the concave gasket is located directly below the glue discharging rod fine-tuning seat.
[0008] Preferably, a spring is installed between the screw and the base, and the spring is located on the outer wall of the screw.
[0009] Preferably, a glue outlet joint is also installed at the upper right end of the glue outlet rod.
[0010] Compared with the prior art, the advantages and positive effects of the present invention are:
[0011] 1. In the utility model, during use, the glue dispensing rod is installed on the glue dispensing rod fine-tuning seat, and then the glue dispensing rod fixing base and the hand-tightening bolt are used to adjust the lateral relative position of the glue dispensing rod fine-tuning seat. Compared with the conventional glue dispensing head, the relative position is not easy to adjust, which affects the product processing quality. The technical solution adopted by the utility model can facilitate on-site engineering personnel to adjust the position of the glue dispensing head and the contact posture of the product in time after discovering the abnormality, thereby increasing quality control and improvement. The overall structure is compact and easy for staff to install and maintain. It solves the existing problems in the semiconductor packaging field. In the chip loading section, due to equipment tolerance, raw material tolerance and other problems, the glue point position accuracy and size inclination are unstable, the relative working position of the glue dispensing head is not easy to adjust, and the quality of the bonding between the glue point and the back of the chip is affected.
[0012] 2. In the present invention, during use, the concave gasket structure design makes it easy for the staff to make adaptive adjustments to the position of the glue rod fine-tuning seat relative to the glue rod base, and the structural design of the glue joint makes it easy for the staff to add material at the glue rod position. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the explosion state of the device for adjusting the levelness of the dispensing head of the utility model;
[0014] Figure 2 This is an overall diagram of the device for adjusting the levelness of the dispensing head of the utility model;
[0015] Legend: 1. Base; 101. Fixing plate; 2. Fixing base of dispensing rod; 201. Thumb-tightening bolt; 3. Fine-adjusting seat of dispensing rod; 301. Pin; 302. Concave gasket; 4. Dispensing rod; 401. Locking nut; 402. Adjusting rod; 403. Dispensing head; 5. Screw; 501. Spring; 6. Dispensing joint. DETAILED DESCRIPTION
[0016] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.
[0017] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.
[0018] The utility model provides a device for adjusting the horizontality of a dispensing head, comprising a base 1, a fixing plate 101 being installed on the base 1 through fasteners, a dispensing rod fixing base 2 being movably connected to the base 1, a dispensing rod fine-adjusting seat 3 being installed above the dispensing rod fixing base 2 through a hand-tightening bolt 201, a dispensing rod 4 being installed on the dispensing rod fine-adjusting seat 3, an adjusting rod 402 being installed at the end of the dispensing rod 4 through a locking nut 401, the end of the adjusting rod 402 being movably connected to a dispensing head 403, a screw 5 being threadedly connected to the right end of the dispensing rod fixing base 2 on the base 1, the dispensing rod fine-adjusting seat 3 and the dispensing rod 4 fixing base 2 being positioned through a pin 301, a spring 501 being further installed between the screw 5 and the base 1, the spring 501 being located on the outer wall of the screw 5 to prevent the screw 5 from being over-adjusted;
[0019] When the device for adjusting the horizontality of the dispensing head is actually used, the dispensing head 403 is installed and limited on the dispensing rod 4 through the adjusting rod 402 and the locking nut 401. At the same time, a dispensing joint 6 is installed at the upper right end of the dispensing rod 4 to facilitate the supply of raw materials. The overall structure of the dispensing rod 4 is installed on the dispensing rod fine-tuning seat 3. The overall structure of the dispensing rod fine-tuning seat 3 is installed above the dispensing rod fixed base 2 above the base 1. The hand-tightening bolt 201 is used to make adaptive adjustments to the relative position of the dispensing rod fine-tuning seat above the dispensing rod fixed base 2. The above completes the adjustment work in the longitudinal direction. When the relative position of the dispensing rod fine-tuning seat 3 needs to be adjusted When the device makes lateral movement, the operating screw 5 cooperates with the spring 501 to complete the lateral adjustment. By installing the glue dispensing rod 4 on the glue dispensing rod fine-tuning seat 3, and then cooperating with the glue dispensing rod fixed base 2 and the hand-tightening bolt 201, the lateral relative position adjustment of the glue dispensing rod fine-tuning seat 3 is completed. Compared with the conventional glue dispensing head 403, the relative position is not easy to adjust, which affects the product processing quality. The technical solution adopted by the utility model can facilitate on-site engineering personnel to adjust the position of the glue dispensing head 403 and the contact posture of the product in time after discovering the abnormality, thereby increasing quality control and improvement. The overall structure is compact and easy for staff to install and maintain.
[0020] like Figure 1-2 As shown, a concave gasket 302 is installed on the glue rod fixed base 2, and the concave gasket 302 is located just below the glue rod fine-tuning seat 3. A glue joint 6 is also installed at the upper right end of the glue rod 4.
[0021] The effect achieved by the entire embodiment 1 is that, during use, the structural design of the concave gasket 302 makes it easy for the staff to make adaptive adjustments to the position of the glue rod fine-tuning seat 3 relative to the base 1 of the glue rod 4, and the structural design of the glue joint 6 makes it easy for the staff to add material at the position of the glue rod 4.
[0022] Working principle: The dispensing head is installed and limited on the dispensing rod through the adjusting rod and the locking nut. At the same time, a dispensing joint is installed at the upper right end of the dispensing rod to facilitate the supply of raw materials. The overall structure of the dispensing rod is installed on the dispensing rod fine-tuning seat. The overall structure of the dispensing rod fine-tuning seat is installed above the dispensing rod fixed base above the base. The hand-tightening bolts are used to make adaptive adjustments to the relative position of the dispensing fine-tuning seat above the dispensing rod fixed base. The above completes the adjustment work in the longitudinal direction. When the relative position of the dispensing rod fine-tuning seat needs to be moved horizontally, the operating screw and the spring can complete the horizontal adjustment.
Claims
1. A device for adjusting the levelness of a dispensing head, comprising a base (1), a fixing plate (101) being mounted on the base (1) via fasteners, characterized in that: The base (1) is movably connected to a glue rod fixed base (2), a glue rod fine-tuning seat (3) is installed above the glue rod fixed base (2) through a hand-tightening bolt (201), a glue rod (4) is installed on the glue rod fine-tuning seat (3), an adjusting rod (402) is installed at the end of the glue rod (4) through a locking nut (401), the end of the adjusting rod (402) is movably connected to a glue head (403), and a screw (5) is threadedly connected to the right end of the glue rod fixed base (2) on the base (1).
2. The device for adjusting the levelness of a dispensing head according to claim 1, characterized in that: The glue-discharging rod fine-adjusting seat (3) and the glue-discharging rod fixed base (2) are positioned via a pin (301).
3. The device for adjusting the levelness of a dispensing head according to claim 1, characterized in that: A concave gasket (302) is installed on the glue-discharging rod fixed base (2), and the concave gasket (302) is located directly below the glue-discharging rod fine-tuning seat (3).
4. The device for adjusting the levelness of a dispensing head according to claim 1, characterized in that: A spring (501) is also installed between the screw (5) and the base (1), and the spring (501) is located on the outer wall of the screw (5).
5. The device for adjusting the levelness of a dispensing head according to claim 1, characterized in that: A glue outlet joint (6) is also installed at the upper right end of the glue outlet rod (4).