LED semiconductor packaging dispensing detection device

Abstract

The invention discloses an LED semiconductor packaging dispensing detection device which comprises a fixed mounting table, a base frame, a round supporting plate, a sealing cover, an LED semiconductor storage box and an LED semiconductor body, the round supporting plate and the fixed mounting table are installed at the two ends of the top of the base frame respectively, and an equipment mounting frame is fixedly arranged on the outer surface of the fixed mounting table. A detection equipment body used for detecting the dispensing quantity is mounted at the top of the equipment mounting rack, and the size detection mechanism comprises a bearing reversing table used for bearing an LED semiconductor body, and a main clamping plate and an auxiliary clamping plate which are arranged at the two ends of the LED semiconductor body respectively. Through the size detection mechanism, infrared correlation, mechanical clamping and a multi-angle steering mechanism, size detection and position correction can be automatically completed while the dispensing number of an LED semiconductor body is detected, and the problem of inaccurate measurement caused by semiconductor position deviation or size errors in traditional manual detection is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED semiconductor technology, and particularly relates to a LED semiconductor packaging point gluing detection device. BACKGROUND

[0002] The LED semiconductor is a light emitting diode device made of semiconductor material, and the core structure is formed by the PN structure of the P-type semiconductor and the N-type semiconductor. When the forward voltage is applied, the electrons and holes in the junction region recombine and release energy through spontaneous radiation to produce photons. The wavelength of the light is determined by the band gap of the semiconductor material, covering the ultraviolet to infrared band. The LED semiconductor has the characteristics of high-efficiency electric-optical conversion, long service life, environmental protection and energy saving, and is widely used in lighting, display, backlight, indication and other fields. In order to ensure the optical performance and reliability of the LED device, the point gluing process must be used in the packaging process to realize the functions of chip protection, light extraction enhancement and stress buffering. Since the accuracy, uniformity and curing effect of the glue distribution in the point gluing process directly affect the light efficiency, color temperature consistency and service life of the finished product, it is necessary to detect the packaging point gluing quality efficiently to ensure the product performance.

[0003] At present, in the LED semiconductor packaging process, point gluing detection is a key link to ensure product quality. In the traditional technology, the point gluing detection device usually adopts a fixed structure or manual operation, which causes the LED semiconductor body to be easily deviated in position or size during the detection process, and cannot realize accurate size measurement and position correction, thereby reducing the detection accuracy. The device relies on manual intervention for position adjustment and sorting, which is low in efficiency and easy to introduce human error, making the detection result unreliable. At the same time, the traditional device lacks automatic sorting and classification storage mechanism, and the error rate is high during the sorting process of unqualified semiconductors. Moreover, no physical protection measures are provided during storage, and the products are easy to be damaged by collision during transfer and storage. Therefore, the present application provides a LED semiconductor packaging point gluing detection device. SUMMARY

[0004] In order to overcome the shortcomings of the prior art, the present application provides a LED semiconductor packaging point gluing detection device.

[0005] In order to solve the above technical problems, the basic technical scheme of the present application is as follows: The utility model provides a kind of LED semiconductor encapsulation point gum detection device, including fixed installation platform, and base frame, and round supporting plate, and cover, and LED semiconductor storage box, and LED semiconductor body, the round supporting plate and fixed installation platform are respectively installed in the top of the two ends of base frame, the outer surface of fixed installation platform is fixedly provided with equipment mounting bracket, and the top of equipment mounting bracket is equipped with the detection equipment body for detecting the number of point gum, the cover is arranged above the round supporting plate, further comprising: the size detection mechanism for turning and measuring LED semiconductor body, the size detection mechanism includes the carrying reversing platform for carrying LED semiconductor body, and the main clamping plate and the auxiliary clamping plate are respectively arranged at the two ends of LED semiconductor body.

[0006] Preferably, the inner wall of the main clamping plate is rotatably mounted with a main pressing plate through a main adapter shaft, and a straight-infrared emission end is installed at equal intervals away from the position of the LED semiconductor body at the right end of the main clamping plate, and the left end of the main pressing plate is connected and assembled with the output end of an external main cylinder, the inner wall of the auxiliary clamping plate is rotatably mounted with an auxiliary pressing plate through an auxiliary adapter shaft, and a straight-infrared receiving end is installed at equal intervals away from the position of the LED semiconductor body at the left end of the auxiliary clamping plate, and the right end of the auxiliary pressing plate is connected and assembled with the output end of an external auxiliary cylinder, the straight-infrared receiving end corresponds to the position of the straight-infrared emission end, a main supporting tray is installed on one side of the fixed installation platform, and an auxiliary supporting tray is installed on the other side of the fixed installation platform.

[0007] Preferably, the main adapter shaft is connected with the main pressing plate, and a main shaft torsion spring is wound around the top of the main adapter shaft, the auxiliary adapter shaft is connected with the auxiliary pressing plate, and an auxiliary shaft torsion spring is wound around the top of the auxiliary adapter shaft, a reversing platform support is arranged at the middle of the bottom end of the carrying reversing platform, the top end of the reversing platform support is connected with the bottom end of the carrying reversing platform, and the reversing platform support is rotatably connected with the fixed installation platform through a bearing.

[0008] Preferably, a support gear is installed at the middle of the outer wall of the reversing platform support, an intermittent gear is arranged outside the support gear, and the intermittent gear is meshingly arranged with the support gear, a gear driving shaft is arranged at the middle of the bottom end of the intermittent gear, the top end of the gear driving shaft is connected with the bottom end of the intermittent gear, and the bottom end of the gear driving shaft is connected and assembled with the output end of an external driving shaft motor through a shaft coupling, the size detection mechanism further comprises a logic control module arranged outside the fixed installation platform, a buzzer is installed outside the logic control module, and the logic control module, the driving shaft motor, the straight-infrared emission end and the straight-infrared receiving end are electrically connected.

[0009] Preferably, the negative pressure suction mechanism for fastening the LED semiconductor body in the turning and measuring process comprises a suction pipe arranged in the middle of the carrying reversing table, and a vacuum pump mounted on the top end of the fixing table, a contact sealing ring is arranged in the middle of the top end of the suction pipe, a gas conveying hose is arranged at the bottom of the suction pipe, one end of the gas conveying hose is connected with the suction pipe, and the other end of the gas conveying hose is connected with the air inlet end of the vacuum pump.

[0010] Preferably, the LED semiconductor storage box is arranged in a ring shape and is slidably arranged between the cover and the circular supporting plate, the LED semiconductor storage box is arranged in a fan shape, a rack is detachably mounted on the middle of the lower end surface of the LED semiconductor storage box, the rack is slidably arranged in the inner wall of the upper end surface of the circular supporting plate, a partition shaft is arranged in the middle of the upper end surface of the circular supporting plate, one end of the partition shaft is connected with the circular supporting plate, and the other end of the partition shaft is connected with the cover, a plurality of synchronous gears are arranged in a ring shape and at equal intervals in the inner wall of the upper end surface of the circular supporting plate, the synchronous gears are rotatably connected with the circular supporting plate through gear shafts, a gear ring is arranged outside the circular supporting plate at the position of the synchronous gears, and the gear ring and the rack are arranged in meshing relationship with the synchronous gears.

[0011] Preferably, a rotating column is rotatably mounted on the middle of the lower end surface of the circular supporting plate through a bearing, a plurality of follow-up rods are arranged in a ring shape and at equal intervals on the outer wall of the rotating column, one end of each follow-up rod is connected with the gear ring, and the other end of each follow-up rod is connected with the rotating column, a handle is fixedly mounted on the middle of the bottom end of the rotating column, a guide key is fixedly arranged on the middle of the upper end surface of the LED semiconductor storage box, a cover is rotatably arranged in the interior of the LED semiconductor storage box through a cover shaft, and a return torsion spring is wound on the outer wall of the cover shaft.

[0012] Preferably, a buffer pad is arranged on the inner wall of the bottom end of the LED semiconductor storage box, a cotton pressing part is arranged on the lower end surface of the cover, a positioning shaft is detachably mounted on the middle of the upper end surface of the cover, a storage rope winding wheel is arranged on the outer part of the positioning shaft, a return coil spring is arranged between the positioning shaft and the storage rope winding wheel, the storage rope winding wheel is elastically connected with the positioning shaft through the return coil spring, a tweezers storage rope is wound on the outer wall of the storage rope winding wheel, and an LED semiconductor tweezers is arranged at the end of the tweezers storage rope, a storage rope ear is detachably arranged on the upper end surface of the cover at the position of the storage rope winding wheel.

[0013] The present application has the following advantages: By the size detection mechanism, by infrared pair shot, mechanical clamping and multi-angle steering mechanism, the quantity of LED semiconductor body dispensing can be detected, and the size detection and position correction can be automatically completed, the problem of inaccurate measurement caused by semiconductor position deviation or size error in traditional manual detection is solved, the artificial intervention is eliminated, and the detection precision and efficiency are improved;Through a plurality of LED semiconductor storage boxes, the annular sliding and elastic pressing mechanism is used to realize the classification storage and physical protection of unqualified LED semiconductor bodies, and the manual sorting error is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the overall structure schematic diagram of the present application; Figure 2 It is the overall structure side view of the present application; Figure 3 It is the structure schematic diagram of the present application's fixing table; Figure 4 It is the structure schematic diagram of the present application's size detection mechanism Figure 1 ; Figure 5 It is the structure schematic diagram of the present application's negative pressure adsorption mechanism; Figure 6 It is the structure schematic diagram of the present application's size detection mechanism Figure 2 ; Figure 7 It is the structure schematic diagram of the present application's cover, round supporting plate and LED semiconductor storage box; Figure 8 It is the structure schematic diagram of the present application's round supporting plate Figure 1 ; Figure 9 It is the structure schematic diagram of the present application's round supporting plate Figure 2 ; Figure 10 It is the structure schematic diagram of the present application's cover and LED semiconductor storage box; Figure 11 It is the structure schematic diagram of the present application's Figure 10 The structure enlarged view of A in the present application;

[0015] BRIEF DESCRIPTION OF DRAWINGS 100, fixed mounting table; 101, main supporting tray; 102, auxiliary supporting tray; 103, equipment mounting rack; 104, detection equipment body; 200, LED semiconductor body; 300, size detection mechanism; 301, main clamping plate; 302, auxiliary clamping plate; 303, bearing reversing table; 304, reversing table support; 305, main air cylinder; 306, auxiliary air cylinder; 307, intermittent gear; 308, support gear; 309, gear driving shaft; 310, driving shaft motor; 311, logic control module; 312, main pressing plate; 313, main switching shaft; 314, main shaft torsion spring; 315, direct infrared emission end; 316, auxiliary shaft torsion spring; 317, auxiliary pressing plate; 318, auxiliary switching shaft; 319, direct infrared receiving end; 400, negative pressure suction mechanism; 401, suction pipe; 402, contact sealing ring; 403, gas conveying hose; 404, vacuum pump; 500, cover; 501, LED semiconductor tweezers; 502, storage rope through ear; 503, tweezers storage rope; 504, storage rope winding wheel; 505, positioning shaft; 506, reset coil spring; 600, round supporting plate; 601, tooth ring; 602, synchronous gear; 603, gear shaft; 604, buffer pad; 605, rack; 606, guide key; 607, gland; 608, cotton pressing; 609, cover shaft; 610, reset torsion spring; 611, follow-up rod; 612, rotating column; 613, rotating handle; 700, LED semiconductor storage box; 800, spacer shaft; 900, base frame. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings Figure 1 to the accompanying drawings Figure 11 The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings

[0017] This invention provides a technical solution: an LED semiconductor packaging dispensing inspection device, comprising a mounting stage 100, a base frame 900, a circular tray 600, a cover 500, an LED semiconductor storage box 700, and an LED semiconductor body 200. The circular tray 600 and the mounting stage 100 are respectively mounted at both ends of the top of the base frame 900. The LED semiconductor body 200 is located above the center of the mounting stage 100. An equipment mounting frame 103 is fixedly provided on the outer surface of the mounting stage 100. A detection equipment body 104 for detecting the dispensing quantity is mounted on the top of the equipment mounting frame 103. The detection equipment body 104 corresponds to the position of the LED semiconductor body 200. The device further includes: a device for detecting... The dimension inspection mechanism 300, which turns and measures the LED semiconductor body 200, performs inspection on the LED semiconductor body 200 using the inspection equipment body 104. If the inspection result is qualified, an external robot arm picks it up and transfers it to the conveyor belt. If the inspection result is unqualified, the robot arm places the LED semiconductor body 200 into the corresponding LED semiconductor storage box 700 for classified storage. Specifically, the dimension inspection mechanism 300 includes a bearing reversing table 303 for supporting the LED semiconductor body 200, and a main clamping plate 301 and a secondary clamping plate 302 respectively disposed at both ends of the LED semiconductor body 200. The main clamping plate 301 and the auxiliary clamping plate 302 are symmetrically arranged about the left and right sides of the LED semiconductor body 200. Both the main clamping plate 301 and the auxiliary clamping plate 302 are used to clamp and correct the LED semiconductor body 200. The LED semiconductor body 200 is placed on top of the bearing reversing stage 303, which corresponds to the mounting stage 100. The lower end face of the main clamping plate 301 and the lower end face of the auxiliary clamping plate 302 are flush with the upper end face of the bearing reversing stage 303. The inner wall of the main clamping plate 301 is rotatably mounted with a main pressure plate 312 through the main adapter shaft 313, which is used to apply pressure to one end of the LED semiconductor body 200 in conjunction with the main clamping plate 301. The main adapter shaft 313 is connected to the main pressure plate 312, and the top of the main adapter shaft 313 is wound with a material for... A main shaft torsion spring 314 resets the main pressure plate 312. One end of the main shaft torsion spring 314 is connected to the main adapter shaft 313, and the other end is connected to the main clamping plate 301. Direct infrared emitters 315 are installed at equal intervals on the right end of the main clamping plate 301 away from the LED semiconductor body 200. The left end of the main pressure plate 312 is connected to the output end of the external main cylinder 305. A secondary pressure plate 317 is rotatably mounted on the inner wall of the secondary clamping plate 302 via a secondary adapter shaft 318. This secondary pressure plate 317 is used to apply pressure to the other end of the LED semiconductor body 200 in conjunction with the secondary clamping plate 302. The secondary adapter shaft 318 is connected to the secondary pressure plate 317, and a secondary shaft torsion spring 316 for resetting the secondary pressure plate 317 is wound around the top of the secondary adapter shaft 318.One end of the auxiliary shaft torsion spring 316 is connected with the auxiliary adapter shaft 318, and the other end of the auxiliary shaft torsion spring 316 is connected with the auxiliary clamping plate 302, the left end of the auxiliary clamping plate 302 is equidistantly installed with the direct infrared receiving end 319 away from the position of the LED semiconductor body 200, the direct infrared receiving end 319 corresponds to the position of the direct infrared emitting end 315, and the direct infrared receiving end 319 and the direct infrared emitting end 315 are used for size detection of the LED semiconductor body 200, the right end of the auxiliary pressing plate 317 is connected and assembled with the output end of the external auxiliary air cylinder 306, one side of the fixing table 100 is installed with the main supporting tray 101 used for supporting and fixing the main air cylinder 305, and the other side of the fixing table 100 is installed with the auxiliary supporting tray 102 used for supporting and fixing the auxiliary air cylinder 306.

[0018] Specifically, the bottom middle part of the bearing reversing table 303 is provided with the reversing table support 304 used for reversing the bearing reversing table 303, the bottom end of the reversing table support 304 extends to the inside of the fixing table 100, the top end of the reversing table support 304 is connected with the bottom end of the bearing reversing table 303, the reversing table support 304 is rotationally connected with the fixing table 100 through a bearing, the middle part of the outer wall of the reversing table support 304 is installed with the support gear 308, the outside of the support gear 308 is provided with the intermittent gear 307, which is used for cooperating with the support gear 308 to reverse the bearing reversing table 303 by 90 degrees, the intermittent gear 307 is meshed with the support gear 308, the bottom middle part of the intermittent gear 307 is provided with the gear driving shaft 309, the top end of the gear driving shaft 309 is connected with the bottom end of the intermittent gear 307, and the bottom end of the gear driving shaft 309 is connected and assembled with the output end of the external driving shaft motor 310 through a shaft coupling, the size detection mechanism 300 further comprises the logic control module 311 provided outside the fixing table 100 and used for receiving and transmitting signals, and the outside of the logic control module 311 is installed with a buzzer, the logic control module 311, the driving shaft motor 310, the direct infrared emitting end 315 and the direct infrared receiving end 319 are electrically connected, in order to cooperate with the size detection mechanism 300, the present application further comprises the negative pressure adsorption mechanism 400 used for fastening the LED semiconductor body 200 during reversing and measuring, specifically, the negative pressure adsorption mechanism 400 comprises the suction pipe 401 provided in the middle part of the bearing reversing table 303 and used for adsorbing the LED semiconductor body 200, and the vacuum pump 404 installed at the top end of the fixing table 100, the top middle part of the suction pipe 401 is provided with the contact sealing ring 402 used for sealing the joint, the bottom of the suction pipe 401 is provided with the gas conveying hose 403, one end of the gas conveying hose 403 is connected with the suction pipe 401, and the other end of the gas conveying hose 403 is connected with the gas inlet end of the vacuum pump 404, and the inner cavity of the suction pipe 401 is in communication with the inner cavity of the gas conveying hose 403.

[0019] According to the above, by means of the size detection mechanism 300, in use, by means of infrared transmission and reception, mechanical clamping and multi-angle turning mechanism, the number of dispensing of the LED semiconductor body 200 can be detected, and the size detection and position correction can be automatically completed, the problem of inaccurate measurement caused by the position deviation or size error of the semiconductor in the traditional manual detection is solved, the manual intervention is eliminated, and the detection precision and efficiency are improved; by means of the negative pressure adsorption mechanism 400, the vacuum adsorption and sealing connection technology is used to realize the reliable fixing of the LED semiconductor body 200 in the size detection and turning process, and prevent the displacement or falling of the LED semiconductor body 200 caused by vibration or external force during mechanical clamping or turning.

[0020] Specifically, the cover 500 is arranged above the circular supporting plate 600, and the cover 500 and the circular supporting plate 600 are coaxial, the LED semiconductor storage box 700 is arranged in a fan shape, and the LED semiconductor storage box 700 is arranged in a ring shape and at equal intervals between the cover 500 and the circular supporting plate 600, for storing LED semiconductors with different defect conditions, the cover 500 is used for shielding the top opening of the LED semiconductor storage box 700, the circular supporting plate 600 is used for bearing the LED semiconductor storage box 700, the middle part of the upper end surface of the circular supporting plate 600 is provided with a partition shaft 800, one end of the partition shaft 800 is connected with the circular supporting plate 600, and the other end of the partition shaft 800 is connected with the cover 500, the middle part of the upper end surface of the LED semiconductor storage box 700 is fixedly provided with a guide key 606, for guiding and limiting the LED semiconductor storage box 700 in the sliding process, the inner wall bottom end of the LED semiconductor storage box 700 is provided with a buffer pad 604, for buffering the falling LED semiconductor, the inside of the LED semiconductor storage box 700 is rotationally provided with a gland 607 through a cover shaft 609, a reset torsional spring 610 is wound on the outer wall of the cover shaft 609, for providing torsional force for the gland 607, one end of the reset torsional spring 610 is connected with the gland 607, and the other end of the reset torsional spring 610 is connected with the LED semiconductor storage box 700, the outer wall of the gland 607 is gap-fitted with the inner wall of the LED semiconductor storage box 700, the lower end surface of the gland 607 is provided with a pressing cotton 608, for cooperating with the reset torsional spring 610 and the gland 607 to press the LED semiconductor, so as to avoid mutual collision of the LED semiconductor during switching, the middle part of the lower end surface of the LED semiconductor storage box 700 is detachably installed with a rack 605, and the rack 605 is slidingly arranged in the inner wall of the upper end surface of the circular supporting plate 600, the inner wall of the upper end surface of the circular supporting plate 600 is annularly and equally spacedly provided with a synchronous gear 602, for cooperating with the rack 605 to expand and close the LED semiconductor storage box 700, the synchronous gear 602 is rotationally connected with the circular supporting plate 600 through a gear shaft 603, the outer part of the circular supporting plate 600 at the position of the synchronous gear 602 is provided with a gear ring 601, for driving the rack 605 in cooperation with the synchronous gear 602, and the gear ring 601 and the circular supporting plate 600 are coaxial, and the gear ring 601 is located below the rack 605, the gear ring 601 and the rack 605 are both meshingly arranged with the synchronous gear 602, the middle part of the lower end surface of the circular supporting plate 600 is rotationally installed with a rotating column 612 through a bearing, the outer wall of the rotating column 612 is annularly and equally spacedly provided with a follower rod 611, for supporting the gear ring 601, one end of the follower rod 611 is connected with the gear ring 601, and the other end of the follower rod 611 is connected with the rotating column 612, and the bottom end middle part of the rotating column 612 is fixedly installed with a rotating handle 613.

[0021] Specifically, the upper end face of the cover 500 is detachably mounted with a positioning shaft 505, and the outside of the positioning shaft 505 is provided with a storage rope winding wheel 504, and a return coil spring 506 is arranged between the positioning shaft 505 and the storage rope winding wheel 504, which is used for resetting the rotated storage rope winding wheel 504, the storage rope winding wheel 504 and the positioning shaft 505 are elastically connected through the return coil spring 506, the outer wall of the storage rope winding wheel 504 is wound with a clamp storage rope 503, and the end of the clamp storage rope 503 is provided with an LED semiconductor clamp 501, which is used for grabbing the LED semiconductor, one end of the clamp storage rope 503 is tied on the LED semiconductor clamp 501, and the other end of the clamp storage rope 503 is tied on the storage rope winding wheel 504, and the upper end face of the cover 500 is detachably provided with a storage rope ear 502 at the position of the storage rope winding wheel 504, which is used for limiting and guiding the clamp storage rope 503, avoiding the clamp storage rope 503 from being scattered, and the advantages of such arrangement are that the LED semiconductor clamp 501, the storage rope ear 502, the clamp storage rope 503, the storage rope winding wheel 504, the positioning shaft 505 and the return coil spring 506 are cooperated with each other, so as to facilitate the operator to grab the LED semiconductor in the LED semiconductor storage box 700, avoiding the secondary damage of the LED semiconductor.

[0022] According to the above, through the plurality of LED semiconductor storage boxes 700, the annular sliding and elastic pressing mechanism is used to realize the classified storage and physical protection of the unqualified LED semiconductor body 200, and avoid the manual sorting error; through the cooperation of the LED semiconductor clamp 501, the storage rope ear 502, the clamp storage rope 503, the storage rope winding wheel 504, the positioning shaft 505 and the return coil spring 506, the safe grabbing and orderly recycling of the LED semiconductor are realized, and the operation convenience and component protection are improved.

[0023] According to the disclosure and teaching of the above description, those skilled in the art of the present application can also make changes and modifications to the above embodiments. Therefore, the present application is not limited to the specific embodiments disclosed and described above, and some modifications and changes of the present application should also fall within the protection scope of the claims of the present application. In addition, although some specific terms are used in the specification, these terms are only for convenience of description and do not constitute any limitation on the present application.

Claims

1. An LED semiconductor packaging dispensing and testing device, comprising a mounting stage (100), a base frame (900), a circular tray (600), a cover (500), an LED semiconductor storage box (700), and an LED semiconductor body (200), characterized in that, The circular support plate (600) and the mounting table (100) are respectively installed at both ends of the top of the base frame (900). The outer surface of the mounting table (100) is fixedly provided with an equipment mounting frame (103), and the top of the equipment mounting frame (103) is provided with a detection equipment body (104) for detecting the amount of glue dispensing. The cover (500) is located above the circular support plate (600). It also includes a size detection mechanism (300) for turning and measuring the LED semiconductor body (200). The size detection mechanism (300) includes a bearing reversing platform (303) for bearing the LED semiconductor body (200), and a main clamping plate (301) and a secondary clamping plate (302) respectively located at both ends of the LED semiconductor body (200).

2. The LED semiconductor packaging dispensing inspection device according to claim 1, characterized in that: The inner wall of the main clamping plate (301) is rotatably mounted with a main pressure plate (312) via a main adapter shaft (313). A direct infrared emitter (315) is equidistantly mounted on the right end of the main clamping plate (301) away from the LED semiconductor body (200). The left end of the main pressure plate (312) is connected to the output end of an external main cylinder (305). The inner wall of the auxiliary clamping plate (302) is rotatably mounted with a secondary pressure plate (317) via a secondary adapter shaft (318). A direct infrared receiver (319) is installed at equal intervals on the left end of the LED semiconductor body (200) away from the LED semiconductor body (200), and the right end of the sub-pressure plate (317) is connected and assembled with the output end of the external sub-cylinder (306). The direct infrared receiver (319) and the direct infrared emitter (315) are positioned opposite each other. A main support tray (101) is installed on one side of the mounting table (100), and a secondary support tray (102) is installed on the other side of the mounting table (100).

3. The LED semiconductor packaging dispensing inspection device according to claim 2, characterized in that: The main adapter shaft (313) is connected to the main pressure plate (312), and a main shaft torsion spring (314) is wound around the top of the main adapter shaft (313). The auxiliary adapter shaft (318) is connected to the auxiliary pressure plate (317), and an auxiliary shaft torsion spring (316) is wound around the top of the auxiliary adapter shaft (318). A reversing table support (304) is provided at the bottom center of the bearing reversing table (303), and the top of the reversing table support (304) is connected to the bottom of the bearing reversing table (303). The reversing table support (304) and the fixed mounting table (100) are rotatably connected by bearings.

4. The LED semiconductor packaging dispensing inspection device according to claim 3, characterized in that: A support gear (308) is installed in the middle of the outer wall of the reversing stage support (304), and an intermittent gear (307) is provided on the outside of the support gear (308). The intermittent gear (307) meshes with the support gear (308). A gear drive shaft (309) is provided in the middle of the bottom end of the intermittent gear (307). The top end of the gear drive shaft (309) is connected to the bottom end of the intermittent gear (307). The bottom end of the gear drive shaft (309) is connected to the output end of the external drive shaft motor (310) through a coupling. The dimension detection mechanism (300) also includes a logic control module (311) located outside the mounting table (100). A buzzer is installed on the outside of the logic control module (311). The logic control module (311), drive shaft motor (310), direct infrared transmitter (315), and direct infrared receiver (319) are electrically connected.

5. The LED semiconductor packaging dispensing inspection device according to claim 1, characterized in that: It also includes a negative pressure adsorption mechanism (400) for securing the LED semiconductor body (200) during the turning and measurement process. The negative pressure adsorption mechanism (400) includes a suction tube (401) disposed in the middle of the bearing reversing stage (303) and a vacuum pump (404) installed on the top of the mounting stage (100). A contact sealing ring (402) is provided in the middle of the top of the suction tube (401). A gas delivery hose (403) is provided at the bottom of the suction tube (401). One end of the gas delivery hose (403) is connected to the suction tube (401), and the other end of the gas delivery hose (403) is connected to the air inlet of the vacuum pump (404).

6. The LED semiconductor packaging dispensing inspection device according to claim 1, characterized in that: The LED semiconductor storage box (700) is slidably disposed in a ring between the cover (500) and the circular support plate (600) at equal intervals. The LED semiconductor storage box (700) has a fan-shaped structure. A rack (605) is detachably installed in the middle of the lower end face of the LED semiconductor storage box (700), and the rack (605) is slidably disposed in the inner wall of the upper end face of the circular support plate (600). A spacer (800) is provided in the middle of the upper end face of the circular support plate (600), and one end of the spacer (800) is connected to... A circular support plate (600) is connected, and the other end of the spacer shaft (800) is connected to the cover (500). The inner wall of the upper surface of the circular support plate (600) is provided with synchronous gears (602) at equal intervals in an annular shape. The synchronous gears (602) and the circular support plate (600) are rotatably connected through a gear shaft (603). A toothed ring (601) is provided on the outside of the circular support plate (600) at the position of the synchronous gear (602). Both the toothed ring (601) and the rack (605) are meshed with the synchronous gear (602).

7. The LED semiconductor packaging dispensing inspection device according to claim 1, characterized in that: A rotating column (612) is rotatably mounted on the lower end face of the circular support plate (600) via a bearing. Follower rods (611) are arranged in annular intervals on the outer wall of the rotating column (612). One end of the follower rod (611) is connected to the toothed ring (601), and the other end of the follower rod (611) is connected to the rotating column (612). A rotating handle (613) is fixedly mounted on the bottom center of the rotating column (612). A guide key (606) is fixedly mounted on the upper end face of the LED semiconductor storage box (700). A pressure cover (607) is rotatably mounted inside the LED semiconductor storage box (700) via a cover shaft (609). A reset torsion spring (610) is wound on the outer wall of the cover shaft (609).

8. The LED semiconductor packaging dispensing inspection device according to claim 7, characterized in that: The LED semiconductor storage box (700) has a buffer pad (604) at the bottom of its inner wall, and a pressure pad (608) is provided on the lower end face of the cover (607). A positioning shaft (505) is detachably installed in the middle of the upper end face of the cover (500), and a storage rope wheel (504) is provided on the outside of the positioning shaft (505). A reset coil spring (506) is provided between the positioning shaft (505) and the storage rope wheel (504). The storage rope wheel (504) and the positioning shaft (505) are elastically connected by the reset coil spring (506). A tweezer storage rope (503) is wound on the outer wall of the storage rope wheel (504), and an LED semiconductor tweezer (501) is provided at the end of the tweezer storage rope (503). A storage rope through-ear (502) is detachably provided on the upper end face of the cover (500) at the position of the storage rope wheel (504).

Images