Solder ball flattening device for semiconductor packaging

Abstract

The utility model relates to a solder ball flattening device used for semiconductor packaging, comprising a lifting platen, the upper surface of the lifting platen is a smooth horizontal plane, and two sides of the lifting platen are respectively and symmetrically provided with ear parts; the heating device is fixedly arranged below the lifting table plate, and the heating device is used for heating the lifting table plate; and the two lead screw pairs are arranged on the two sides of the lifting table plate correspondingly, the lead screw pairs are located below the lug parts, the lead screw pairs can lift the height of the lifting table plate in the vertical direction through a driving motor, and the driving motor is fixedly arranged on the working table top.

Description

Technical Field

[0001] This utility model relates to a device for semiconductor packaging, specifically a solder ball flattening device for semiconductor packaging. Background Technology

[0002] During the DPC ceramic substrate packaging process, the DPC ceramic substrate must be flattened to ensure packaging performance and usability.

[0003] During the packaging process, solder balls are typically used for soldering. This is because the solder balls melt when heated during processes such as reflow soldering, forming a strong metal connection between the pads on the DPC ceramic substrate and the pins of the chip or other electronic components. This ensures that current can be stably transmitted between the components, thereby enabling the entire circuit to function properly.

[0004] As mentioned above, in order to achieve a tighter and more precise fit between the solder balls and other components or substrates, and because some DPC ceramic substrates also require the use of solder balls for heat dissipation or to meet certain specific requirements, the solder balls need to be flattened during the packaging process.

[0005] In the existing technology, during the solder ball flattening process, a robotic arm is usually used to first grab the ceramic substrate, then heat the ceramic substrate, and then move the ceramic substrate into the flattening machine for flattening. This makes the robotic arm program highly demanding. At the same time, during the solder ball flattening process, the temperature of the solder ball drops, which can easily damage the solder ball or cause it to fall off. Utility Model Content

[0006] The main purpose of this invention is to provide a solder ball flattening device for semiconductor packaging, so as to prevent the solder balls from being damaged or falling off during the flattening process.

[0007] To achieve the above objectives, this utility model provides a solder ball flattening device for semiconductor packaging, comprising:

[0008] The lifting platform has a smooth horizontal surface on its upper surface, and ears are symmetrically arranged on both sides of the lifting platform.

[0009] A heating device is fixedly installed below the lifting platform and is used to heat the lifting platform.

[0010] Two sets of lead screw pairs are respectively set on both sides of the lifting platform, and the lead screw pairs are located below the ears. The lead screw pairs can lift the height of the lifting platform in the vertical direction through the drive motor. The drive motor is fixedly set on the worktable.

[0011] Preferably, the screw rod pair comprises a screw rod and a support, the screw rod has a cylindrical rod at both ends and an external thread in the middle part, the support is screwed with the screw rod through the external thread, and the top end of the support abuts against the ear.

[0012] Further preferably, the middle part of the ear is provided with a through hole, the top end of the screw rod passes through the through hole, and the cylindrical rod of the top end of the screw rod is in sliding connection with the ear through the through hole.

[0013] Preferably, a stop ring is arranged on the lower cylindrical rod of the screw rod, a support plate is arranged below the stop ring, and the support plate is in sliding connection with the screw rods of the left and right screw rod pairs at both ends.

[0014] Further preferably, a rubber pad is arranged below the support plate, the top end of the rubber pad abuts against the support plate, and the bottom end of the rubber pad is fixedly arranged on the workbench plate.

[0015] Preferably, the heating device comprises a heating wire and a shell, the shell and the lifting platform form a containing groove, and the heating wire is spirally arranged in the containing groove.

[0016] The utility model discloses the beneficial effects are:

[0017] 1, accurate control pressure height:

[0018] Through the cooperation of the two screw rod pairs and the driving motor, the height of the lifting platform in the vertical direction can be accurately controlled, so that the accurate control of the solder ball pressure height is realized, which makes each solder ball be pressed to the unified height meeting the process requirements, improves the consistency and reliability of the semiconductor package, and ensures the stability of the electrical connection.

[0019] 2, stable support and guide

[0020] The top end of the screw rod of the screw rod pair passes through the through hole of the ear of the lifting platform, and the two are in sliding connection, the structure provides a stable guide function for the lifting of the lifting platform, makes the lifting platform more stable in the process of moving up and down, and is not easy to deviate or shake, is favorable to the accuracy and uniformity of the pressure flattening process, prevents the solder ball from being pressed poorly due to the instability of the lifting platform.

[0021] The cooperation of the stop ring on the screw rod and the support plate further enhances the structural stability of the screw rod pair, prevents the screw rod from being excessively displaced or falling off when being stressed, ensures the reliability of the whole device in the long-term use process, and reduces the risk of affecting the production efficiency and product quality due to device failure.

[0022] 3, good buffering and shock absorption

[0023] The rubber pad under the support plate can play a role of buffering and shock absorption, effectively absorbing the vibration and impact force generated during the operation of the device. Especially when the driving motor drives the screw pair to lift the lifting platform, the rubber pad can reduce the influence of vibration on the lifting platform and the entire device, avoid the movement or uneven flattening of the solder balls due to vibration, and also help to reduce the noise generated during the operation of the device and improve the working environment.

[0024] 4, efficient heating function

[0025] The heating wire coil in the heating device is spirally arranged in the accommodating groove formed by the shell and the lifting platform, which can uniformly heat the lifting platform. During the solder ball flattening process, appropriate heating can make the solder ball deform more easily, reduce the pressure required for flattening, and also help to improve the flowability of the solder, make the combination between the solder ball and the substrate more closely, improve the welding quality and electrical connection performance, and reduce the probability of defects such as false welding and cold welding. BRIEF DESCRIPTION OF DRAWINGS

[0026] The utility model will be further described in detail below in combination with the drawings and specific embodiments.

[0027] Figure 1 is the three-dimensional structure schematic diagram of the solder ball flattening device of the utility model;

[0028] Figure 2 is the structure schematic diagram of the heating device of the solder ball flattening device of the utility model.

[0029] EXPLANATION OF REFERENCE NUMERALS

[0030] 1, workbench plate;

[0031] 10, lifting platform;20, shell;30, heating wire;

[0032] 40, screw pair;41, top support;42, screw rod;50, driving motor;

[0033] 60, rubber pad. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. In the following description, a lot of specific details are set forth in order to fully understand the utility model, but the utility model can also be implemented in other ways different from the description, and those skilled in the art can make similar generalization without departing from the connotation of the utility model, therefore, the utility model is not limited by the following disclosed specific embodiments.

[0035] As Figure 1As shown in the figure, the embodiment provides a solder ball flattening device for semiconductor packaging, which comprises a lifting platform 10, a heating device, two sets of screw rod pairs 40, a driving motor 50 and a workbench 1. The upper surface of the lifting platform 10 is a smooth horizontal surface. The heating device is fixedly arranged below the lifting platform 10 and is used for heating the lifting platform 10 so as to heat the solder ball. The two sets of screw rod pairs 40 are respectively arranged on the left and right sides of the lifting platform 10. The screw rod pairs 40 lift or lower the height of the lifting platform 10 in the vertical direction through the driving motor 50. The driving motor 50 is fixedly arranged on the workbench.

[0036] Specifically, in the embodiment, an ear part is symmetrically arranged on each side of the lifting platform 10, and the screw rod pair 40 is arranged below the ear part. In the embodiment, the screw rod pair 42 comprises a screw rod 42 and a top support 41. The two ends of the screw rod 42 are cylindrical rods. The middle part of the screw rod 42 is provided with external threads. The top support 41 is screwed with the screw rod through the external threads. The top end of the top support 41 abuts against the ear part. Preferably, the screw rod pair 42 adopts a ball screw. The specific selection is made according to the stroke of the top support 41.

[0037] In the embodiment, the middle part of the ear part is provided with a through hole. The top end of the screw rod 42 penetrates through the through hole. The cylindrical rod at the top end of the screw rod is slidably connected with the ear part through the through hole. In addition, a stop ring is arranged on the cylindrical rod below the screw rod 42. A support plate is arranged below the stop ring. The two ends of the support plate are slidably connected with the screw rods 42 of the screw rod pairs 40 on the left and right sides respectively. A rubber pad 60 is arranged below the support plate. The top end of the rubber pad 60 abuts against the support plate (fixedly arranged by gluing). The bottom end of the rubber pad 60 is fixedly arranged on the workbench 1.

[0038] In the embodiment, as shown in the figure, Figure 2 The heating device comprises a heating wire 30 and a shell 20. The shell 20 and the lifting platform 10 form a containing groove therebetween. The shell 20 is fixedly connected with the lifting platform 10 in extension. The heating wire 30 is spirally arranged in the containing groove. The heating wire 30 is heated by electric heating, so that heat is transmitted to the lifting platform 10.

[0039] Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

Claims

1. A solder ball flattening device for semiconductor packaging, characterized in that, include: A lifting platform, the upper surface of which is a smooth horizontal surface, and ears are symmetrically arranged on both sides of the lifting platform; A heating device is fixedly installed below the lifting platform, and the heating device is used to heat the lifting platform. Two sets of lead screw pairs are respectively arranged on both sides of the lifting platform, and the lead screw pairs are located below the ear. The lead screw pairs can lift the height of the lifting platform in the vertical direction through the drive motor. The drive motor is fixedly arranged on the worktable.

2. The solder ball flattening device for semiconductor packaging according to claim 1, characterized in that, The lead screw assembly includes a lead screw and a top support. The two ends of the lead screw are cylindrical rods, and the middle part of the lead screw is provided with external threads. The top support is screwed to the lead screw through the external threads, and the top end of the top support abuts against the lug.

3. The solder ball flattening device for semiconductor packaging according to claim 2, characterized in that, The middle part of the ear is provided with a perforation, the top end of the lead screw passes through the perforation, and the cylindrical rod at the top end of the lead screw is slidably connected to the ear through the perforation.

4. The solder ball flattening device for semiconductor packaging according to claim 3, characterized in that, The lead screw has a stop ring on the lower cylindrical rod, and a support plate is provided below the stop ring. The two ends of the support plate are slidably connected to the lead screws of the lead screw pairs on the left and right sides, respectively.

5. The solder ball flattening device for semiconductor packaging according to claim 4, characterized in that, A rubber pad is provided below the support plate. The top of the rubber pad abuts against the support plate, and the bottom of the rubber pad is fixedly mounted on the workbench.

6. The solder ball flattening device for semiconductor packaging according to claim 1, characterized in that, The heating device includes a heating wire and a housing, with a receiving groove formed between the housing and the lifting platform, and the heating wire coiled within the receiving groove.

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